CN203215311U - High-brightness light-emitting diode lamp structure having heat radiation unit - Google Patents
High-brightness light-emitting diode lamp structure having heat radiation unit Download PDFInfo
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- CN203215311U CN203215311U CN2012206570452U CN201220657045U CN203215311U CN 203215311 U CN203215311 U CN 203215311U CN 2012206570452 U CN2012206570452 U CN 2012206570452U CN 201220657045 U CN201220657045 U CN 201220657045U CN 203215311 U CN203215311 U CN 203215311U
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Abstract
The utility model relates to a high brightness light-emitting diode lamp structure having a heat radiation unit. The high brightness light-emitting diode lamp structure comprises a reflection cup, a COB unit, a cover body and a heat radiation unit, wherein the reflection cup is provided with an inner bottom surface, a reflecting surface, an outer bottom surface and a light emitting hole. The COB unit conducts heat and is fixed on the inner bottom surface, the COB unit is covered by the cover body, and the heat radiation unit is combined with the outer bottom surface in a heat conducting manner. The high-brightness light-emitting diode lamp structure having the heat radiation unit not only improves the lighting efficiency of the light-emitting diode, but also enables good heat radiation performance of the light-emitting diode lamp structure.
Description
Technical field
The utility model relates to a kind of high brightness LED lamp structure of signing an undertaking, and particularly relates to a kind of high brightness LED lamp with heat-sink unit structure of signing an undertaking.
Background technology
In recent years, promote owing to increase the continuous research and development of brightness and light extraction efficiency technology, light emitting diode (LED) is adopted on the illumination related application in large quantities.No matter be backlight, large, medium and small liquid crystal panel backlight of handheld apparatus, or the light source applications of projector etc., all use LED mostly instead and replaced conventional bulb or cold-cathode tube.More owing to the improvement of colour temperature control and frequency stabilization and coloured light mixing efficiency, LED is widely used in again on the daily life illumination.
When so using LED in large quantities, if the light beam that can send LED is again done effective concentrating and increased its light extraction efficiency and consider to give better heat radiating effect, then use saving the energy and increase, more can produce extra progressive effect.
Take a broad view of existing LED lighting engineering, the design of reflector (Reflecting lamp cup, lampshade) has become a big innovation emphasis.Yet, existing known lampshade design, the novelty and the marketability that only terminate in outward appearance are mostly considered, and very few motive is added planning to ray refraction.In the light that is emitted by light source, very big some is arranged because do not assembled by the lampshade reflection, and directly scattering to all the winds can't really reach effective utilization of the energy.Therefore, how to develop a kind of dynamical lampshade and adjust the light direction of led light source, in the light active set that will can not pass through the lampshade reflection originally or assemble, and strengthening heat radiation with when increasing service life, and then reach the effect that promotes whole light extraction efficiency, just become an important problem on lampshade or the Design of Luminaires.
Summary of the invention
The purpose of this utility model is, overcomes the problem that existing LED lighting engineering exists, and a kind of high brightness LED lamp with heat-sink unit structure of signing an undertaking is provided, and it comprises: a reflector; A COB unit; A lid and a heat-sink unit.Problem to be solved comprises: by the sign an undertaking invention of structure of the high brightness LED lamp with heat-sink unit, not only improve the light extraction efficiency of led lamp, more make LED lamp structure have good heat dissipation.
For reaching above-mentioned effect, the utility model provides a kind of high brightness LED lamp with heat-sink unit structure of signing an undertaking, and it comprises: a reflector, and it has an inner bottom surface, a reflecting surface, an outer bottom and a light-emitting window; A COB unit, heat conduction and being fixedly arranged on the inner bottom surface; A lid covers the COB unit; And a heat-sink unit, operative connection is in outer bottom.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this reflector is formed by the material of reflectivity more than 80%.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this reflector is formed less than 80% material by reflectivity, and this inner bottom surface and this reflecting surface are formed with one deck plated film.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this plated film is formed greater than 80% material by reflectivity.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this COB unit is made up of at least one monochromatic LED chip.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this COB unit is made up of a plurality of not homochromy led chips.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this lid is a hollow lid and does not contact with this COB unit.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this lid is a solid lid and directly contacts with this COB unit.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this lid is the yellow fluorescence powder, and this COB unit is blue-light LED chip or ultraviolet leds chip or is made up of blue-light LED chip and red LED chip.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this lid is first fluorescent powder, and this COB unit is blue-light LED chip or is made up of blue-light LED chip and red LED chip that wherein this first fluorescent powder is the fluorescent powder that yellow fluorescent powder and red fluorescence powder are formed.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this lid is second fluorescent powder, and this COB unit is blue-light LED chip or is made up of blue-light LED chip and red LED chip, wherein this second fluorescent powder fluorescent powder that to be yellow fluorescent powder form with red fluorescence powder and green emitting phosphor.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this lid is transparent cover body, and this COB unit comprises blue-light LED chip, red LED chip and green light LED chip.
The aforesaid high brightness LED lamp structure of signing an undertaking, wherein this reflector and this heat-sink unit are a kind of integrated formed structure of high heat radiation material.
By enforcement of the present utility model, can reach following progressive effect at least:
One, by the setting of height reflection material or high reflection plated film reflector, to reach the effect that increases amount of light, promotes illumination efficiency.
Two, by heat-sink unit the raising heat-sinking capability is set, increase the service life of high brightness LED lamp tool.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes of the present utility model, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is a kind of high brightness LED lamp with heat-sink unit of the utility model embodiment structure cutaway view of signing an undertaking.
Fig. 2 A is a kind of reflector stereogram of the utility model embodiment.
Fig. 2 B is a kind of reflector cutaway view of the utility model embodiment.
The high brightness LED lamp that Fig. 3 has a heat-sink unit for the another kind of the utility model embodiment structure cutaway view of signing an undertaking.
Fig. 4 is led chip distribution map in a kind of COB unit of the utility model embodiment.
Fig. 5 A is a kind of lid cutaway view of the utility model embodiment.
Fig. 5 B is the another kind of lid cutaway view of the utility model embodiment.
The high brightness LED lamp that Fig. 6 has a heat-sink unit for another of the utility model embodiment structure cutaway view of signing an undertaking.
The high brightness LED lamp that Fig. 7 has a heat-sink unit for another of the utility model embodiment structure cutaway view of signing an undertaking.
[main element symbol description]
100,100 ' the high brightness LED lamp structure of signing an undertaking
200,200 ' the high brightness LED lamp structure of signing an undertaking
10 reflectors, 11 inner bottom surfaces
12 reflectings surface, 13 outer bottoms
14 light-emitting windows, 20 COB unit
21,22,23 led chips, 30 heat-sink units
40 lids, 50 plated films
60 integrated formed structure D inner bottom surfaces are to the light-emitting window distance
D COB element thickness
The specific embodiment
For further set forth the utility model be reach technological means that predetermined goal of the invention takes with and effect, below in conjunction with accompanying drawing and preferred embodiment, to the specific embodiment, structure, flow process, feature and the effect thereof of the structure of signing an undertaking according to the high brightness LED lamp with heat-sink unit that the utility model proposes, describe in detail as after.
Fig. 1 is a kind of high brightness LED lamp with heat-sink unit of the utility model embodiment structure cutaway view of signing an undertaking.Fig. 2 A is a kind of reflector stereogram of the utility model embodiment.Fig. 2 B is a kind of reflector cutaway view of the utility model embodiment.The high brightness LED lamp that Fig. 3 has a heat-sink unit for the another kind of the utility model embodiment structure cutaway view of signing an undertaking.Fig. 4 is led chip distribution map in a kind of COB unit of the utility model embodiment.Fig. 5 A is a kind of lid cutaway view of the utility model embodiment.Fig. 5 B is the another kind of lid cutaway view of the utility model embodiment.The high brightness LED lamp that Fig. 6 has a heat-sink unit for another of the utility model embodiment structure cutaway view of signing an undertaking.The high brightness LED lamp that Fig. 7 has a heat-sink unit for another of the utility model embodiment structure cutaway view of signing an undertaking.
As shown in Figure 1, present embodiment is a kind of high brightness LED lamp with heat-sink unit 30 structure 100 of signing an undertaking, and it comprises: a reflector 10; A COB unit 20; A lid 40 and a heat-sink unit 30.Wherein reflector 10 has an inner bottom surface 11, a reflecting surface 12, an outer bottom 13 and a light-emitting window 14; COB unit 20 heat conduction and being fixedly arranged on the inner bottom surface 11; Lid 40 covers COB unit 20; And heat-sink unit 30 operative connection are in outer bottom 13.The light that reflector 10 can be emitted to light source reflects and penetrates from light-emitting window 14, and the thermal transpiration that heat-sink unit 30 can produce light source is to air.The inner face height of reflector 10 wherein, that is inner bottom surface 11 again needs greater than COB element thickness d, in order to reach the reflecting effect of reflector 10 to the distance B of light-emitting window 14.
Shown in Fig. 2 A and Fig. 2 B, inner bottom surface 11 and reflecting surface 12 can reflect the light of COB unit 20 emissions and penetrate from light-emitting window 14.Reflector 10 can be the material of reflectivity more than 80% and forms, its light to incident has the effect of high reflection, can will expose to reflecting surface 12 the light reflection and penetrate from light-emitting window 14, promote the sign an undertaking light extraction efficiency of structure 100 of whole high brightness LED lamp.
As shown in Figure 3, present embodiment is a kind of high brightness LED lamp with heat-sink unit 30 structure 100 ' of signing an undertaking, reflector 10 embodiment illustrated in fig. 3 can be reflectivity and forms less than 80% material, when the material of using reflectivity less than 80% forms reflector 10, inner bottom surface 11 and reflecting surface 12 at reflector 10 are formed with one deck plated film 50 again, and plated film 50 is formed greater than 80% material by reflectivity, can will expose to plated film 50 the light reflection and penetrate from light-emitting window 14, promote the sign an undertaking whole light extraction efficiency of structure 100 of high brightness LED lamp.
As shown in Figure 4, present embodiment is a COB unit 20, and it is heat conduction and is fixedly arranged on the inner bottom surface 11.COB unit 20 can be made up of at least one monochromatic LED chip, also can be made up of a plurality of not homochromy led chips.COB unit 20 embodiment as shown in Figure 4 by use be respectively three kinds of colors led chip 21,22, and 23 each three rearranged.When the led chip in the COB unit 20 by R, G, COB unit 20 can send white light when three kinds of colors of B were formed.
Shown in Fig. 5 A and Fig. 5 B, lid 40 covers the COB unit 20 that is positioned at inner bottom surface 11.Lid 40 can be the lid 40 shown in Fig. 5 A, and it is a hollow lid and does not contact with COB unit 20, and it is less that its advantage is that lid 40 is subjected to the heating effect of COB unit 20.Lid 40 also can be the lid 40 shown in Fig. 5 B, and it is a solid lid and directly contacts with COB unit 20.
Refer again to as Fig. 1 and high brightness LED lamp shown in Figure 3 sign an undertaking structure 100 and 100 ' embodiment, wherein heat-sink unit 30 is that operative connection is in outer bottom 13, and heat-sink unit 30 is formed by height heat radiation material, and the thermal transpiration that the structure 100 or 100 ' of whole high brightness LED lamp can being signed an undertaking produces is to air.
As Figure 6 and Figure 7, Fig. 6 embodiment is a kind of high brightness LED lamp structure 200 of signing an undertaking, Fig. 7 embodiment is a kind of high brightness LED lamp structure 200 ' of signing an undertaking, and wherein the integrated formed structure 60 that is made of one piece of a kind of high heat radiation material has comprised as Fig. 1 or high brightness LED lamp shown in Figure 3 sign an undertaking reflector 10 and heat-sink unit 30 in structure 100 or 100 '.The inner face height of integrated formed structure 60 wherein, that is inner bottom surface 11 again needs greater than COB element thickness d, in order to reach reflecting effect to the distance B of light-emitting window 14.
High brightness LED lamp is as shown in Figure 6 signed an undertaking among structure 200 embodiment, integrated formed structure 60 is formed by the material of reflectivity more than 80%, its reflectivity has reached the effect of high reflection, the light reflection back of being penetrated by COB unit 20 to reflecting surface 12 can be penetrated by light-emitting window 14.
And for example high brightness LED lamp shown in Figure 7 is signed an undertaking among the structure 200 ' embodiment, integrated formed structure 60 is formed less than 80% material by reflectivity, inner bottom surface 11 and reflecting surface 12 are formed with one deck plated film 50, and plated film 50 is formed greater than 80% material by reflectivity, same, penetrate to the light of plated film 50 back from light-emitting window 14 ejaculations by plated film 50 reflections by COB unit 20.
As the high brightness LED lamp of the Figure 6 and Figure 7 structure 200 and 200 ' of signing an undertaking, wherein COB unit 20 is also formed by at least one monochromatic LED chip or by a plurality of not homochromy led chips.And lid wherein 40 is a hollow lid and do not contact (shown in Fig. 5 A) with COB unit 20, or lid 40 is a solid lid and directly contacts (shown in Fig. 5 B) with COB unit 20.
Above-described each high brightness LED lamp is signed an undertaking among structure 100,100 ', the 200 and 200 ' embodiment, wherein lid 40 is to be doped into lid 40 with fluorescent material to use required different colours and the light of tone with COB unit 20 in conjunction with sending again with the major function of COB unit 20 combinations, and in industry and daily life, white light is sent in being applied in of plurality.
The lid 40 that sends white light can be following various various combinations with COB unit 20: lid 40 is that yellow fluorescence powder and COB unit 20 are blue-light LED chip; Lid 40 is that first fluorescent powder and COB unit 20 are blue-light LED chip; Lid 40 is that second fluorescent powder and COB unit 20 are blue-light LED chip; Lid 40 comprises blue-light LED chip and red LED chip for yellow fluorescence powder and COB unit 20; Lid 40 is that first fluorescent powder and COB unit 20 comprise blue-light LED chip and red LED chip; Lid 40 is that second fluorescent powder and COB unit 20 comprise blue-light LED chip and red LED chip; Lid 40 comprises blue-light LED chip, red LED chip and green light LED chip for transparent cover body and COB unit 20; Or lid 40 is that yellow fluorescence powder and COB unit 20 are the ultraviolet leds chip; Wherein first fluorescent powder is the fluorescent powder that yellow fluorescent powder and red fluorescence powder are formed, second fluorescent powder fluorescent powder that to be yellow fluorescent powder form with red fluorescence powder and green emitting phosphor.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in not breaking away from the technical solutions of the utility model scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, any simple modification that foundation technical spirit of the present utility model is done above embodiment, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (13)
1. the high brightness LED lamp with heat-sink unit structure of signing an undertaking is characterized in that comprising:
A reflector, it has an inner bottom surface, a reflecting surface, an outer bottom and a light-emitting window;
A COB unit, heat conduction and being fixedly arranged on this inner bottom surface;
A lid is covered in this COB unit; And
A heat-sink unit, operative connection is in this outer bottom.
2. the high brightness LED lamp as claimed in claim 1 structure of signing an undertaking is characterized in that wherein this reflector is formed by the material of reflectivity more than 80%.
3. the high brightness LED lamp as claimed in claim 1 structure of signing an undertaking is characterized in that this reflector is wherein formed less than 80% material by reflectivity, and this inner bottom surface and this reflecting surface are formed with one deck plated film.
4. the high brightness LED lamp as claimed in claim 3 structure of signing an undertaking is characterized in that this plated film is wherein formed greater than 80% material by reflectivity.
5. the high brightness LED lamp as claimed in claim 1 structure of signing an undertaking is characterized in that wherein this COB unit is made up of at least one monochromatic LED chip.
6. the high brightness LED lamp as claimed in claim 1 structure of signing an undertaking is characterized in that wherein this COB unit is made up of a plurality of not homochromy led chips.
7. the high brightness LED lamp as claimed in claim 1 structure of signing an undertaking is characterized in that wherein this lid is a hollow lid and does not contact with this COB unit.
8. the high brightness LED lamp as claimed in claim 1 structure of signing an undertaking is characterized in that wherein this lid is a solid lid and directly contacts with this COB unit.
9. the high brightness LED lamp as claimed in claim 1 structure of signing an undertaking is characterized in that wherein this lid is the yellow fluorescence powder, and this COB unit is blue-light LED chip or ultraviolet leds chip or is made up of blue-light LED chip and red LED chip.
10. the high brightness LED lamp as claimed in claim 1 structure of signing an undertaking, it is characterized in that wherein this lid is first fluorescent powder, and this COB unit is blue-light LED chip or is made up of blue-light LED chip and red LED chip that wherein this first fluorescent powder is the fluorescent powder that yellow fluorescent powder and red fluorescence powder are formed.
The structure 11. high brightness LED lamp as claimed in claim 1 is signed an undertaking, it is characterized in that wherein this lid is for being second fluorescent powder, and this COB unit is blue-light LED chip or is made up of blue-light LED chip and red LED chip, wherein this second fluorescent powder fluorescent powder that to be yellow fluorescent powder form with red fluorescence powder and green emitting phosphor.
The structure 12. high brightness LED lamp as claimed in claim 1 is signed an undertaking it is characterized in that wherein this lid is transparent cover body, and this COB unit comprises blue-light LED chip, red LED chip and green light LED chip.
13. as the structure of signing an undertaking of the described high brightness LED lamp of arbitrary claim in the claim 1 to 12, it is characterized in that wherein this reflector and this heat-sink unit are a kind of integrated formed structure of high heat radiation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206570452U CN203215311U (en) | 2012-12-03 | 2012-12-03 | High-brightness light-emitting diode lamp structure having heat radiation unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206570452U CN203215311U (en) | 2012-12-03 | 2012-12-03 | High-brightness light-emitting diode lamp structure having heat radiation unit |
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| Publication Number | Publication Date |
|---|---|
| CN203215311U true CN203215311U (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012206570452U Expired - Fee Related CN203215311U (en) | 2012-12-03 | 2012-12-03 | High-brightness light-emitting diode lamp structure having heat radiation unit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108458260A (en) * | 2017-02-17 | 2018-08-28 | 法雷奥照明公司 | The light emitting module of volume with reduction |
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- 2012-12-03 CN CN2012206570452U patent/CN203215311U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108458260A (en) * | 2017-02-17 | 2018-08-28 | 法雷奥照明公司 | The light emitting module of volume with reduction |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130925 Termination date: 20141203 |
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| EXPY | Termination of patent right or utility model |