CN213424989U

CN213424989U - RGB packaging body based on 3030 support

Info

Publication number: CN213424989U
Application number: CN202021809126.0U
Authority: CN
Inventors: 李秀富
Original assignee: Suzhou Dongyan Electronic Technology Co ltd
Current assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Priority date: 2020-08-26
Filing date: 2020-08-26
Publication date: 2021-06-11
Anticipated expiration: 2030-08-26

Abstract

The utility model provides a RGB packaging body based on 3030 support, including 3030 support, red LED chip, green LED chip, blue LED chip, stratum lucidum and diffusion compound layer, 3030 support middle part has the recess, red LED chip green LED chip blue LED chip is fixed the recess bottom, the stratum lucidum is located inside the recess, just the stratum lucidum covers red LED chip green LED chip blue LED chip top, diffusion compound layer covers the stratum lucidum top. Through setting up diffusion compound layer, can reduce the positive light-emitting luminance of packaging body, improve inside effect of mixing light.

Description

RGB packaging body based on 3030 support

Technical Field

The utility model relates to a show backlight unit technical field, more accurate say so and relate to a RGB packaging body based on 3030 support.

Background

Along with the continuous development of display technology, the backlight unit market is exploded day by day, also the demand to backlight unit display color gamut in the market is higher and higher, and this is further promoted the colour gamut that requires granule LED. White light sources based on LED lamps are widely used in the field of backlights such as liquid crystal displays, and in recent years, in the field of indoor and outdoor lighting. The white light LED has the advantages of small size, high luminous efficiency, long service life, energy conservation, environmental protection and the like, and is a new generation solid-state lighting source for replacing the traditional incandescent lamp and fluorescent lamp. In the prior art, there are three main technical schemes for realizing white light LED: the first is to mix light by a red, green and blue (RGB) tricolor LED chip to obtain white light; the second is to excite the three-color fluorescent powder by an ultraviolet chip to realize white light; the third is to excite the yellow KSF fluorescent powder to realize white light through a blue light chip. The third solution is a common solution on the market at present, but the color gamut of the third solution cannot meet the market demand. The first over-red, green and blue (RGB) three-primary-color LED chip mixes light to obtain white light, and has good development prospect due to the advantages of high efficiency, controllable color temperature and good color rendering property, and can meet the requirement of high color gamut. In the prior art, a package body of an RGB chip is packaged by using a 3030 support, as shown in fig. 1 and 2, the package body includes a 3030 support 1 and three-

color LED chips

21, 22 and 23 of red, green and blue, a groove 11 is formed in the middle of the support 1, and the three-

color LED chips

21, 22 and 23 of red, green and blue are disposed on the bottom surface of the groove. Because the light emitted by the LED chip is concentrated and unidirectional, and the arrangement of the chips is combined, monochromatic light appears at two sides or corners, the light mixing effect is not ideal enough, so that white light observed from different angles has different primary colors, and the light emitting effect is influenced.

SUMMERY OF THE UTILITY MODEL

In view of this, the main object of the present invention is to provide an RGB package based on 3030 support, the bottom of the groove of 3030 support is provided with red, green and blue three-color LED chips, the inner point of the groove is transparent and the forming transparent layer is baked, and the surface of the transparent layer is provided with a diffusion compound layer.

In order to achieve the above object, the utility model provides a RGB packaging body based on 3030 support, including 3030 support, red LED chip, green LED chip, blue LED chip, stratum lucidum and diffusion compound layer, 3030 support middle part has the recess, red LED chip green LED chip blue LED chip is fixed the recess bottom, the stratum lucidum is located inside the recess, just the stratum lucidum covers red LED chip green LED chip blue LED chip top, diffusion compound layer covers the stratum lucidum top.

Preferably, the diffusion compound layer includes a matrix and diffusion particles, the diffusion particles are inorganic particles, and the inorganic particles are: SiO2, TiO2 and Al2O 3.

Preferably, the red LED chip, the green LED chip, and the blue LED chip are white light mixed by three primary colors after penetrating through the diffusion compound layer.

Preferably, a lens is fittingly arranged above the RGB package based on the 3030 support.

Preferably, the red LED chip, the green LED chip, and the blue LED chip are mounted on the bottom of the groove in a die bonding and wire bonding or flip chip structure.

Preferably, the thickness of the transparent layer is less than the depth of the groove.

Preferably, the diffusion compound layer is located inside the groove, and the entire thickness of the transparent layer and the diffusion compound layer is equal to or less than the depth of the groove.

Preferably, the groove bottom is planar.

Compared with the prior art, the utility model discloses an advantage of RGB packaging body based on 3030 support lies in: through setting up the diffusion compound layer, reduced the positive light-emitting luminance of packaging body, weakened R, G, B monochromatic light phenomenon to improve the inside mixed light effect of R, G, B three-colour LED chip, more can form effectual excitation white light, can obtain better application in backlight unit.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 shows a top view of a prior art RGB package based on 3030 support.

Fig. 2 shows a top view of a prior art RGB package based on 3030 support.

Fig. 3 is a top view of an RGB package based on 3030 bracket according to the present invention.

Fig. 4 is a top view of an RGB package based on 3030 bracket according to the present invention.

Fig. 5 is a front cross-sectional view of an RGB package according to the present invention based on 3030 bracket.

Fig. 6 is a schematic view of the RGB package based on 3030 bracket according to the present invention after a lens is combined.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 3 to 5, the utility model relates to a based on the RGB packaging body of 3030 support includes 3030 support 1, red LED chip 21, green LED chip 22, blue LED chip 23, stratum lucidum 31 and diffusion compound layer 32, 3030 support 1 middle part has recess 11, recess 11 bottom is the plane, red LED chip 21, green LED chip 22, blue LED chip 23 are fixed in recess 11 bottom, stratum lucidum 31 is located inside recess 11, stratum lucidum 31 covers at red LED chip 21, green LED chip 22, blue LED chip 23 top, diffusion compound layer 32 covers at stratum lucidum 31 top. Through setting up diffusion compound layer 31, reduced the positive light-emitting luminance of packaging body, weakened red, green, blue monochromatic light phenomenon to can improve the inside mixed light effect of red, green, blue three-colour LED chip, can form pure white light.

Specifically, the diffusion compound layer 32 includes a matrix and diffusion particles, the diffusion particles are inorganic particles, and the inorganic particles are: SiO2, TiO2 and Al2O3, the diameter of the diffusion particles is 10um, and the content of the diffusion particles in the matrix is 3 percent.

The red LED chip 21, the green LED chip 22 and the blue LED chip are mounted at the bottom of the groove 11 in a die bonding and wire bonding or flip chip structure. The red LED chips 21, the green LED chips 22, and the blue LED chips may be arranged in a triangular shape in the form of fig. 3, or may be arranged side by side one by one in the form of fig. 4.

The transparent layer 31 is located in the groove 11, and the thickness of the transparent layer 31 is smaller than the depth of the groove 11. The diffusion compound layer 32 is located inside the groove 11, and the entire thickness of the transparent layer 31 and the diffusion compound layer 32 is equal to or less than the depth of the groove 11.

As shown in fig. 6, the lens 40 is disposed on the top of the RGB package based on the 3030 bracket, and white light is emitted through the lens 40, so that the phenomenon that color spots are formed on the light source diffusion plate by three color light does not occur.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An RGB package based on 3030 support is characterized by comprising 3030 support, a red LED chip, a green LED chip, a blue LED chip, a transparent layer and a diffusion compound layer, wherein a groove is formed in the middle of the 3030 support, the red LED chip, the green LED chip and the blue LED chip are fixed at the bottom of the groove, the transparent layer is located inside the groove and covers the tops of the red LED chip, the green LED chip and the blue LED chip, and the diffusion compound layer covers the top of the transparent layer.

2. A RGB package based on 3030 the holder, according to claim 1, wherein the diffusion compound layer includes a matrix and diffusion particles, the diffusion particles being inorganic particles.

3. The RGB package 3030 based on the support according to claim 1, wherein the red LED chip, the green LED chip and the blue LED chip are mixed white light of three primary colors after passing through the diffusion compound layer.

4. A support 3030 based RGB package according to claim 1, wherein a lens is fittingly attached over the support 3030 based RGB package.

5. The support-based RGB package of claim 1, wherein said red LED die, said green LED die, said blue LED die bond wire, or flip chip structure is mounted at the bottom of said recess.

6. An RGB package based on 3030 the holder, according to claim 5, wherein the thickness of the transparent layer is less than the depth of the recess.

7. A support-based RGB package according to claim 3030, wherein the diffusion compound layer is located inside the recess, and the overall thickness of the transparent layer and the diffusion compound layer is equal to or less than the depth of the recess.

8. The RGB package based on 3030, according to claim 1, wherein the bottom of the recess is planar.