CN204879543U - LED lamp module group convenient to heat dissipation - Google Patents
LED lamp module group convenient to heat dissipation Download PDFInfo
- Publication number
- CN204879543U CN204879543U CN201520554006.3U CN201520554006U CN204879543U CN 204879543 U CN204879543 U CN 204879543U CN 201520554006 U CN201520554006 U CN 201520554006U CN 204879543 U CN204879543 U CN 204879543U
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- CN
- China
- Prior art keywords
- pcb board
- led lamp
- led
- lamp module
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 238000004020 luminiscence type Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000002270 dispersing agent Substances 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 6
- 229910021389 graphene Inorganic materials 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 4
- 230000005855 radiation Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
LED lamp module group convenient to heat dissipation includes a plurality of LED luminescence units on the upper surface that is fixed in the PCB board, its characterized in that: the coating has one deck heat dissipation coating on the back of PCB board, the heat dissipation coating is graphene materials, the below of heat dissipation coating is equipped with the bottom plate, bottom plate and PCB board fixed connection. This LED lamp module group dispels the heat through graphene materials, and not only simple structure, processing are convenient, and with low costs, the radiating effect is good moreover, can be fast effectively with the quick effluvium of heat of LED lamp module group, do not influence life -span of LED lamp module group, improved the luminous effect that LED lamp module organized.
Description
Technical field
The utility model relates to a kind of LED module.
Background technology
The lighting field that develops into of LED technology brings revolution, and the efficient luminescent properties of LED and more and more lower manufacturing cost make it progress into large-scale extensive use.Optimal design reasonable employment, at utmost excavates LED potentiality, becomes the important business of current Design of Luminaires.
Energy-conservation due to LED, the feature such as long-life and easy care, people were to the concern of LED technology in recent years, and LED illumination technology obtains continuous development, but for high-powered LED lamp, the quality of LED heat radiation is most important for whole lamp, if heat can not shed, can aging, light decay, the color shift of speed-up chip, the life-span of shortening LED, reduce light fixture light efficiency etc., in other words heat dissipation problem determines the life-span length of light fixture, seriously governs the development of LED illumination.Also there is impact in the life-span of temperature on LED itself, temperature more the high life shorter.The heat radiation solving LED will reduce the junction temperature of LED itself exactly.Heat dissipation problem is the technical barrier of restriction LED development always, the radiating mode of current LED mainly contains: Natural Heat Convection, install fan forced heat radiation, heat pipe and loop heat pipe heat radiation etc. additional, install fan forced heat radiation mode system complex additional, reliability is low, heat pipe and loop heat pipe radiating mode cost high, Natural Heat Convection then emphasizes the radiating effect of heat abstractor itself.Natural Heat Convection device general at present, the structure of heat abstractor changes to some extent according to the power of LED, generally speaking, the LED that power is higher requires better radiating effect, therefore, it is very large that radiator structure often does, thus affect exquisiteness and the volume of whole product itself.
Structure selected by present LED street lamp light source fin, at a large aluminium sheet block back, endways a lot of heat radiation laminated structure, it is the poorest structure of a kind of Natural Heat Convection performance, cause the complex structure that the waterproof of LED chip is damp proof, be not suitable for again power supply heat sinking and rainwater-proof, increase the weight of whole street lamp weight, improve cost, is the problem causing current LED street lamp comparatively serious.Therefore, the heat radiation better realizing light fixture by be at present faced by one of technological challenge.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of LED module being convenient to dispel the heat.
The utility model solves the problems of the technologies described above adopted technical scheme: be convenient to the LED module dispelled the heat, comprise the multiple LED luminescence units be fixed on the upper surface of pcb board, it is characterized in that: the back side of described pcb board is coated with one deck thermal dispersant coatings, described thermal dispersant coatings is grapheme material, the below of described thermal dispersant coatings is provided with base plate, and described base plate is fixedly connected with pcb board.
In order to make radiating effect better, described pcb board is provided with multiple through hole, and described multiple LED luminescence unit is fixed in described through hole and the back side of described multiple LED luminescence unit and contacts with described thermal dispersant coatings.
Compared with prior art, the utility model has the advantage of this LED module, dispelled the heat by grapheme material, not only structure is simple, easy to process, cost is low, and good heat dissipation effect, can fast and effeciently be shed fast by the heat of LED module, do not affect the life-span of LED module, improve the illumination effect of LED module.
Accompanying drawing explanation
Fig. 1 is the sectional view of the LED module of the utility model embodiment.
Fig. 2 is the sectional view of the LED module of another embodiment of the utility model.
Fig. 3 is the top view of the utility model LED module.
Detailed description of the invention
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail.
As Figure 1-3, the LED module of the utility model embodiment, comprise a pcb board 1, and the multiple LED luminescence units 2 be positioned on pcb board 1, this pcb board 1 is also provided with the circuit of LED luminescence unit 2, the back side of this pcb board 1 is coated with one deck thermal dispersant coatings 3, this thermal dispersant coatings 3 is grapheme material, the below of described thermal dispersant coatings 3 is base plate 4, and this base plate 4 is also irony or other metal materials.And this base plate 4 is fixedly connected with pcb board 1.
Because Graphene has good thermolysis, and Graphene is sandwiched between pcb board 1 and base plate 4, and the heat from pcb board 1 that Graphene is absorbed can scatter along Graphene to periphery.
Preferably, as shown in Figure 1, the back side of this LED luminescence unit 2 directly contacts with thermal dispersant coatings 3, and namely this pcb board 1 is provided with the hole 11 of fixed L ED luminescence unit 2.
Or also can as shown in Figure 2, this LED luminescence unit 2 is fixed on the upper surface of pcb board 1, and the lower surface of pcb board 1 applies thermal dispersant coatings, and LED luminescence unit 2 does not directly contact with thermal dispersant coatings 3.
As shown in Figure 3, this LED module can be the multiple LED luminescence units 2 arranged on pcb board 1.
This LED module, is dispelled the heat by grapheme material, and not only structure is simple, easy to process, cost is low, and good heat dissipation effect, can fast and effeciently be shed fast by the heat of LED module, do not affect the life-span of LED module, improve the illumination effect of LED module.
Although more than describe in detail preferred embodiment of the present utility model, should be expressly understood that, for a person skilled in the art, the utility model can have various modifications and variations.All do within spirit of the present utility model and principle any amendment, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (2)
1. be convenient to the LED module dispelled the heat, comprise be fixed on pcb board (1) upper surface on multiple LED luminescence units (2), it is characterized in that: the back side of described pcb board (1) is coated with one deck thermal dispersant coatings (3), described thermal dispersant coatings (3) is grapheme material, the below of described thermal dispersant coatings (3) is provided with base plate (4), and described base plate (4) is fixedly connected with pcb board (1).
2. LED module as claimed in claim 1, it is characterized in that: described pcb board (1) is provided with multiple through hole (11), described multiple LED luminescence unit (2) is fixed in described through hole (11) and the back side of described multiple LED luminescence unit (2) and contacts with described thermal dispersant coatings (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520554006.3U CN204879543U (en) | 2015-07-28 | 2015-07-28 | LED lamp module group convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520554006.3U CN204879543U (en) | 2015-07-28 | 2015-07-28 | LED lamp module group convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204879543U true CN204879543U (en) | 2015-12-16 |
Family
ID=54823912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520554006.3U Expired - Fee Related CN204879543U (en) | 2015-07-28 | 2015-07-28 | LED lamp module group convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204879543U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105351774A (en) * | 2015-12-21 | 2016-02-24 | 朱惠冲 | LED module and lamp splicing structure |
| CN107272259A (en) * | 2017-07-13 | 2017-10-20 | 武汉天马微电子有限公司 | LED lamp strip and backlight unit |
| CN115390312A (en) * | 2022-08-31 | 2022-11-25 | 京东方科技集团股份有限公司 | Light source module and display device |
-
2015
- 2015-07-28 CN CN201520554006.3U patent/CN204879543U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105351774A (en) * | 2015-12-21 | 2016-02-24 | 朱惠冲 | LED module and lamp splicing structure |
| CN105351774B (en) * | 2015-12-21 | 2019-02-22 | 朱惠冲 | LED module and lamps and lanterns split structure |
| CN107272259A (en) * | 2017-07-13 | 2017-10-20 | 武汉天马微电子有限公司 | LED lamp strip and backlight unit |
| CN115390312A (en) * | 2022-08-31 | 2022-11-25 | 京东方科技集团股份有限公司 | Light source module and display device |
| CN115390312B (en) * | 2022-08-31 | 2024-04-02 | 京东方科技集团股份有限公司 | Light source module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191216 Address after: 310000 3 households, group 13, Xinjiang village, Hezhuang street, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee after: Zhu Jinfu Address before: 1705 room 315040, building 2, Jade Bay, hi tech Zone, Zhejiang, Ningbo Patentee before: Wu Gang |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 |