CN202955658U - Installation structure of light-emitting diode (LED) lamp - Google Patents

Installation structure of light-emitting diode (LED) lamp Download PDF

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Publication number
CN202955658U
CN202955658U CN2012205429772U CN201220542977U CN202955658U CN 202955658 U CN202955658 U CN 202955658U CN 2012205429772 U CN2012205429772 U CN 2012205429772U CN 201220542977 U CN201220542977 U CN 201220542977U CN 202955658 U CN202955658 U CN 202955658U
Authority
CN
China
Prior art keywords
led lamp
heat dissipating
heat
installation
boss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012205429772U
Other languages
Chinese (zh)
Inventor
陶海霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TONGLING KEHAI PHOTOELECTRIC TECHNOLOGY Co Ltd
Original Assignee
TONGLING KEHAI PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TONGLING KEHAI PHOTOELECTRIC TECHNOLOGY Co Ltd filed Critical TONGLING KEHAI PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority to CN2012205429772U priority Critical patent/CN202955658U/en
Application granted granted Critical
Publication of CN202955658U publication Critical patent/CN202955658U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an installation structure of an LED lamp. The installation structure comprises a circuit board and a heat dissipating board, wherein a heat dissipating boss is arranged at the center of the heat dissipating board, a through-hole is arranged on the circuit board, the heat dissipating boss penetrates through the through-hole of the circuit board, the circuit board is fixedly connected with the heat dissipating board, an LED lamp source is fixedly installed above the heat dissipating boss, and heat-conducting glue is applied between the LED lamp source and the heat dissipating boss, so that the firmness of the installation of the LED lamp source is improved, and the heat dissipating effect is improved. The installation structure is simple, reasonable in design, convenient to process, simple to install, good in heat dissipating effect and capable of prolonging the service life.

Description

A kind of mounting structure of LED lamp
Technical field
The utility model relates to the LED technical field, relates in particular to a kind of mounting structure of LED lamp.
Background technology
The LED lamp of LED lamp, particularly relatively high power of the prior art, its caloric value can't realize great heat radiation effect by general circuit, the LED lamp pearl as power more than 0.5W easily makes the lamp pearl damage, and finally makes the LED light fixture damage, and can not normally use.The solution of routine in prior art, adopt aluminium base to be dispelled the heat, but the aluminium base entire plate all can be conducted electricity, if being directly installed on this aluminium base, can't realize the haptic element of LED lamp pearl the differentiation of both positive and negative polarity, can't realize normal mounting, thereby now adopt special technique to be connected LED lamp pearl in industry, although solved the normal mounting of heat radiation and LED lamp pearl, but, due to the aluminium base high cost that this technique is made, production firm and consumer are difficult to bear.
The utility model content
The utility model purpose is exactly in order to make up the defect of prior art, and a kind of mounting structure of LED lamp of good heat dissipation effect is provided.
The utility model is achieved through the following technical solutions:
A kind of mounting structure of LED lamp, include wiring board and heat sink, described heat sink center is provided with the heat radiation boss, open hole on wiring board, described heat radiation boss is through the through hole of wiring board, and wiring board is fixedly connected with heat sink, described heat radiation boss top is installed with LED lamp source, scribble heat-conducting glue between described LED lamp source and heat radiation boss, not only strengthen the fastness that install in LED lamp source, also improved radiating effect.
Described heat radiation boss is cylindrical, and contact area is large, good heat dissipation effect.
Described heat sink is aluminium sheet or copper coin.
The utility model has the advantages that: the utility model is simple in structure, reasonable in design, easy to process, installs simply, and good heat dissipation effect, increase the service life.
The accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
The specific embodiment
As shown in Figure 1, a kind of mounting structure of LED lamp, include wiring board 1 and heat sink 2, described heat sink 2 centers are provided with heat radiation boss 3, on wiring board 1, open hole, described heat radiation boss 3 is through the through hole of wiring board 1, wiring board 1 is fixedly connected with heat sink 2, and described heat radiation boss 3 tops are installed with LED lamp source 4, between described LED lamp source 4 and heat radiation boss 3, scribbles heat-conducting glue 5, not only strengthen the fastness that install in LED lamp source 4, also improved radiating effect.
Described heat radiation boss 3 is cylindrical, and contact area is large, good heat dissipation effect.
Described heat sink 2 is aluminium sheet or copper coin.

Claims (3)

1. the mounting structure of a LED lamp, it is characterized in that: include wiring board and heat sink, described heat sink center is provided with the heat radiation boss, open hole on wiring board, described heat radiation boss is through the through hole of wiring board, wiring board is fixedly connected with heat sink, and described heat radiation boss top is installed with LED lamp source, between described LED lamp source and heat radiation boss, scribbles heat-conducting glue.
2. the mounting structure of a kind of LED lamp according to claim 1, it is characterized in that: described heat radiation boss is cylindrical.
3. the mounting structure of a kind of LED lamp according to claim 1, it is characterized in that: described heat sink is aluminium sheet or copper coin.
CN2012205429772U 2012-10-22 2012-10-22 Installation structure of light-emitting diode (LED) lamp Expired - Fee Related CN202955658U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012205429772U CN202955658U (en) 2012-10-22 2012-10-22 Installation structure of light-emitting diode (LED) lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012205429772U CN202955658U (en) 2012-10-22 2012-10-22 Installation structure of light-emitting diode (LED) lamp

Publications (1)

Publication Number Publication Date
CN202955658U true CN202955658U (en) 2013-05-29

Family

ID=48461228

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012205429772U Expired - Fee Related CN202955658U (en) 2012-10-22 2012-10-22 Installation structure of light-emitting diode (LED) lamp

Country Status (1)

Country Link
CN (1) CN202955658U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244581A (en) * 2013-06-06 2014-12-24 致茂电子(苏州)有限公司 High heat conduction apparatus for multilayer circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244581A (en) * 2013-06-06 2014-12-24 致茂电子(苏州)有限公司 High heat conduction apparatus for multilayer circuit

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130529

Termination date: 20131022