KR100872140B1 - Led lamp module - Google Patents

Led lamp module Download PDF

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Publication number
KR100872140B1
KR100872140B1 KR1020070140975A KR20070140975A KR100872140B1 KR 100872140 B1 KR100872140 B1 KR 100872140B1 KR 1020070140975 A KR1020070140975 A KR 1020070140975A KR 20070140975 A KR20070140975 A KR 20070140975A KR 100872140 B1 KR100872140 B1 KR 100872140B1
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KR
South Korea
Prior art keywords
light emitting
emitting diode
main body
heat dissipation
lamp module
Prior art date
Application number
KR1020070140975A
Other languages
Korean (ko)
Inventor
김병삼
Original Assignee
(주)블루글라스코리아
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)블루글라스코리아 filed Critical (주)블루글라스코리아
Priority to KR1020070140975A priority Critical patent/KR100872140B1/en
Application granted granted Critical
Publication of KR100872140B1 publication Critical patent/KR100872140B1/en

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The light emitting diode lamp module is provided to prevent the deterioration of the light emitting diode and to achieve the light emitting diode of the high brightness and the simple structure for setting up a plurality of light emitting diodes. The light emitting diode lamp module(10) comprises the light emitting diode mounting unit(21), the main body(20), the connecting member(30), the bonding wire. The light emitting diode(100) is installed on the light emitting diode mounting unit. The main body comprises the reflecting body which is formed along the edge of the light emitting diode mounting unit. The main body has the joint(23) formed in the central part. The connecting member is combined with the joint of the main body. The connecting member comprises the first and second lead terminals(31, 32) insulated by the insulating member. The bonding wire connects the light emitting diodes and the first and second lead terminal to supply the power source.

Description

Light Emitting Diode Lamp Module {LED lamp module}

The present invention relates to a light emitting diode lamp, and more particularly to a light emitting diode lamp module with improved heat dissipation characteristics.

Typically, lamps used in homes, public places, signs, ornaments, luminaires for creating three-dimensional art spaces in structures of various designs emit light using filaments or plasma discharges and phosphors. Since such lamps generally consume high power and have a limited lifetime, they require a lot of cost due to maintenance. Recently, lamps using light emitting diodes have been used.

 However, the illuminance distribution characteristic of such a light emitting diode lamp varies with each light emitting element. Furthermore, since the heat radiation characteristic is not as good as that of the package of the single light emitting element, there is a problem in that the light emitting diode lamp is deteriorated by heat, thereby shortening the lifespan.

In view of this point, the LED module has a heat sink or heat sink to directly discharge heat generated therefrom. However, the light emitting diode lamp module has a structure in which heat radiation is directly in contact with one or the light emitting diode devices, so that design freedom during manufacturing decreases and the size thereof becomes relatively large.

In particular, in the case of a high-brightness lamp module in which many light emitting diodes are directly directed, the surface area due to heat dissipation should be widened.

The present invention is to solve the problems described above, to improve the emission characteristics of the heat generated from the high-brightness LED device and to provide a light emitting diode lamp module that can increase the luminous brightness using a plurality of LED devices. There is a purpose.

Another object of the present invention is to increase the design freedom due to heat dissipation, and to provide a large light emitting diode lamp module.

The light emitting diode lamp module of the present invention to achieve the above object

A main body including a light emitting diode mounting portion in which a plurality of light emitting diodes are installed, a reflecting portion formed along an edge of the light emitting diode mounting portion, and a coupling portion formed at a central portion thereof;

A connection member coupled to the coupling part of the main body and having first and second lead terminals insulated by an insulating member;

It characterized in that it comprises a bonding wire for connecting the light emitting diodes and the first and second lead terminals provided in the mounting portion.

In the present invention, the connection member is provided with a heat dissipation member screwed thereto and in close contact with the main body.

The light emitting diode lamp module according to the present invention can improve the heat dissipation characteristics to prevent deterioration of the light emitting diodes, and the structure for installing a plurality of light emitting diodes can be relatively simple to realize a high brightness light emitting diode.

The light emitting diode lamp module according to the present invention can prevent deterioration of a high brightness light emitting diode by improving heat dissipation characteristics, and in particular, it can be used as a lighting or module of a luminaire, and one embodiment thereof is shown in FIGS. 1 to 2. .

Referring to the drawings, the light emitting diode module 10 is used as a light source of a lamp, and the main body 20 in which the light emitting diodes 100 are installed, and the main body 20 is screwed and screwed to the first and second lead terminals 31. And a connecting member 30 having 32.

Each component of the LED module 10 configured as described above will be described in more detail as follows.

The main body 20 is provided with a mounting portion 21 on which the light emitting diodes 100 are installed, and the reflecting portion 22 and the main body 20 extending upward and extending outwards at edges of the mounting portion 21. Coupling portion 23 formed in the center of the is provided. The mounting portion 21 is formed in a planar shape, but is not limited thereto, and may be formed stepwise in the circumferential direction. The outer circumferential surface of the main body 20 may be provided with a heat radiation fan for widening the surface area. In addition, the light emitting diodes 100 installed in the mounting portion 21 should be disposed so as not to cause interference with the first and second lead terminals 31 and 32. Here, when the main body 20 is made of a conductive metal, the main body may be used as one terminal.

The connection member 30 may be formed in a tubular shape or may be formed with through holes in which the first and second lead terminals 31 and 32 are installed in the longitudinal direction. The first and second lead terminals 31 and 32 are insulated by the insulating member 33 inserted into the through hole or the hollow. And a screw is formed on the outer circumferential surface of the connecting member 30, the left and right screws may be formed around the boundary that is coupled to the coupling portion 23 of the main body 20.

Meanwhile, end portions of the first and second lead terminals 31 and 32 are wire bonded by the light emitting diodes 100 and the bonding wires 101.

3 and 4, the connection member 30 is provided with a heat dissipation member 40 which is screwed with and closely adhered to the main body 20. As shown in FIG. The heat dissipation member 40 is in contact with the body 20 to dissipate heat generated from the light emitting diodes 100, and a fastening portion 41 coupled to the connection member at the central portion of the heat dissipation member 40 is provided. It is formed, and the heat dissipation fin 43 for increasing the surface area is provided on the outer peripheral surface. The heat dissipation member 40 may be further provided with a plate-shaped contact portion 44 to be in contact with the lower surface of the main body 20, the heat dissipation fan may be installed on the contact portion 44. Here, the heat radiation is not limited by the above-described embodiment.

Although not shown in the drawing, the main body 20 may be formed with a cap mounting part for mounting a cap to implement a lamp, and a socket may be coupled to the connection member 30 or the heat dissipation member 40. The cap may be formed with a plurality of protrusions that can scatter light on the inner circumferential surface, it can be produced in a variety of forms, such as spherical, oval, square depending on the purpose of use. The second lead terminal 32 is electrically connected to the main body 20 (see FIG. 2), and the first lead terminal 31 is connected to a terminal formed separately in the socket.

The light emitting diode lamp module 10 according to the present invention configured as described above is provided with a plurality of light emitting diodes 100 in the mounting portion 21 of the main body 22 can obtain a relatively high light intensity.

In addition, since the heat dissipation member 40 supported by the connection member 30 is installed in the mounting portion 21 of the main body 20, the heat dissipation characteristics of the heat generated from the light emitting diodes 100 fixed to the mounting portion 21 are increased. Degradation of the light emitting diodes 100 may be prevented.

In particular, since the heat dissipation member can be coupled to and separated from the connection member 30, it is easy to replace the heat dissipation member in consideration of the heat dissipation characteristics and the lamp.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent embodiments are possible.

Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

1 is an exploded perspective view of a light emitting diode lamp module according to the present invention;

2 is a cross-sectional view of the light emitting diode lamp module shown in FIG.

3 is an exploded perspective view showing another embodiment of a light emitting diode according to the present invention;

4 is a cross-sectional view of the light emitting diode shown in FIG. 3.

<Description of the symbols for the main parts of the drawings>

20; main body

30; Connecting member

31; first lead terminal

32; Second lead terminal

40; heat radiating member

Claims (3)

A main body including a light emitting diode mounting portion in which a plurality of light emitting diodes are installed, a reflecting portion formed along an edge of the light emitting diode mounting portion, and a coupling portion formed at a central portion thereof; A connection member coupled to the coupling part of the main body and having first and second lead terminals insulated by an insulating member; And a bonding wire for supplying power to the light emitting diodes by connecting each of the light emitting diodes and the first and second lead terminals respectively installed in the mounting unit. The method of claim 1, The light emitting diode lamp module, characterized in that the connection member is provided with a heat dissipation member screwed to the contact with the main body. The method of claim 1, The heat dissipation member includes a plate-shaped contact portion in close contact with the main body, and a plurality of heat dissipation beams provided in the contact portion.
KR1020070140975A 2007-12-28 2007-12-28 Led lamp module KR100872140B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070140975A KR100872140B1 (en) 2007-12-28 2007-12-28 Led lamp module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070140975A KR100872140B1 (en) 2007-12-28 2007-12-28 Led lamp module

Publications (1)

Publication Number Publication Date
KR100872140B1 true KR100872140B1 (en) 2008-12-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070140975A KR100872140B1 (en) 2007-12-28 2007-12-28 Led lamp module

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KR (1) KR100872140B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200445485Y1 (en) * 2009-03-20 2009-08-04 서정호 Led lighting lamp
KR101237280B1 (en) 2011-06-10 2013-02-27 팬 짓 인터내셔날 인크 Manufacturing method of a heat conductive device for a light-emitting diode

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522710A (en) 1978-08-04 1980-02-18 Fujitsu Ltd Photo semiconductor element package
JPS62224986A (en) 1986-03-27 1987-10-02 Toyoda Gosei Co Ltd Led lamp and manufacture thereof
KR19980015062U (en) * 1996-09-05 1998-06-25 이동진 LED Display Device for Panel
KR20040093686A (en) * 2001-12-29 2004-11-08 항조우 후양 신잉 띠앤즈 리미티드 A LED and LED lamp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522710A (en) 1978-08-04 1980-02-18 Fujitsu Ltd Photo semiconductor element package
JPS62224986A (en) 1986-03-27 1987-10-02 Toyoda Gosei Co Ltd Led lamp and manufacture thereof
KR19980015062U (en) * 1996-09-05 1998-06-25 이동진 LED Display Device for Panel
KR20040093686A (en) * 2001-12-29 2004-11-08 항조우 후양 신잉 띠앤즈 리미티드 A LED and LED lamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200445485Y1 (en) * 2009-03-20 2009-08-04 서정호 Led lighting lamp
KR101237280B1 (en) 2011-06-10 2013-02-27 팬 짓 인터내셔날 인크 Manufacturing method of a heat conductive device for a light-emitting diode

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