CN201110527Y - High power LED light source device - Google Patents
High power LED light source device Download PDFInfo
- Publication number
- CN201110527Y CN201110527Y CNU2007201917117U CN200720191711U CN201110527Y CN 201110527 Y CN201110527 Y CN 201110527Y CN U2007201917117 U CNU2007201917117 U CN U2007201917117U CN 200720191711 U CN200720191711 U CN 200720191711U CN 201110527 Y CN201110527 Y CN 201110527Y
- Authority
- CN
- China
- Prior art keywords
- semiconductor thermoelectric
- light source
- heat dissipation
- source device
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 238000005057 refrigeration Methods 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 10
- 238000001816 cooling Methods 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 6
- 238000012544 monitoring process Methods 0.000 abstract description 5
- 230000002238 attenuated effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a large power LED light source device, which comprises a plurality of LEDs and a semiconductor thermoelectric refrigerator, wherein the outer surface of a cold end of the semiconductor thermoelectric refrigerator is provided with a plurality of electrodes, the LEDs are installed and fixed on the electrodes, and a hot end of the semiconductor thermoelectric refrigerator is provided with a heating panel. The technical scheme directly fixes the LEDs through arranging the electrodes on the outer surface of the cold end of the semiconductor thermoelectric refrigerator, thereby the semiconductor thermoelectric refrigerator is not only used as a fixed base seat of an LED chip, but also used as a heat dissipation component to cool the LED chip directly, the limits of the heat dissipation effect due to a separated heat dissipation base plate are avoided, the problem which is commonly existed in the practical use process of the large power LED light source device that the radiation light intensity is attenuated over fast due to the non-ideal cooling heat dissipation problem is effectively solved, and a practical and advanced technical scheme is provided for the practicality of the large power LEDs in various lighting sources and in an infrared exploration and monitoring system.
Description
Technical field
The utility model belongs to the LED lighting field, particularly relates to a kind of high-power LED light source device.
Background technology
The high-power LED light source device is mainly used in general visible at the illumination of various different places and shot-light and various landscape ornamental lamp, light of stage at a distance, also can be applied to remote monitoring, detection and the remote security protection camera monitoring system of infrared light at safety-protection system, fields such as illumination are surveyed in fire-fighting fire smoke detection system and military monitoring at a distance.At present, on the market existing high-power LED light source a kind of be to adopt the LED of common trimmed size to be welded in a conventional manner in the printed board with combining form, therefore not only its heat radiation cooling effect is poor, and the light source volume is also relatively large.Though another kind is that led chip directly is fixed on the heat-radiating substrate of metal or pottery, but because it is to lean on the heat conductivility of these substrates under nature to realize (the passive heat radiation) of dispelling the heat, therefore its radiating effect is still undesirable, thereby still can't effectively solve the semiconductor LED chip and descend too high its problem that occurs the very fast decay of output optical radiation power easily that causes of temperature rise in working order, how effectively solve the bottleneck problem of chip cooling thereby also restricted the extensive use in practice of high power semi-conductor led light source so present high-power LED light source product all is faced with.
Publication number is that the patent documentation of CN200941391 discloses " a kind of LED heat abstractor ", it adopts the semiconductor refrigerating principle, the heat-radiating substrate of the above-mentioned second way is installed in the cold junction of semiconductor thermoelectric refrigeration device, thereby improve the radiating effect of heat-radiating substrate, but, this kind mode is because be subjected to heat-radiating substrate self restriction, and its radiating effect is still not ideal.
Summary of the invention
In order to solve above-mentioned technical problem, the purpose of this utility model provides a kind of with the high-power LED light source device of semiconductor thermoelectric refrigeration device as heat dissipation base, solves the difficult problem of high-power LED light source device in the too fast decay of radiation light intensity of the ubiquitous led chip output that causes owing to the cooling heat dissipation problem is undesirable of actual use effectively thereby greatly improve radiating effect.
To achieve the above object, the utility model has adopted following technical scheme:
A kind of high-power LED light source device comprises some LED, the semiconductor thermoelectric refrigeration device, and the cold junction outer surface of semiconductor thermoelectric refrigeration device is provided with some electrodes, installs and fixes described LED on the electrode, and the hot junction of described semiconductor thermoelectric refrigeration device is provided with heat sink.
As preferably, above-mentioned LED directly is fixed on the electrode by the LED bare chip and makes.
Above-mentioned heat sink is the heat dissipation metal piece.
The utility model is owing to adopted above technical scheme, by cold junction outer surface the direct fixed L ED of electrode is set at the semiconductor thermoelectric refrigeration device, like this, the semiconductor thermoelectric refrigeration device had not only directly cooled off led chip as the firm banking of led chip but also as thermal component, avoided being restricted because of interval heat-radiating substrate radiating effect, solved the difficult problem of high-power LED light source device effectively in the radiation light intensity too fast decay of the ubiquitous led chip output that causes owing to the cooling heat dissipation problem is undesirable of actual use, for great power LED in various lighting sources and infra-red detection, practicability in the monitoring system provides a kind of advanced person's of practicality technical scheme.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The specific embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present utility model is made a detailed explanation.
Embodiment 1:
A kind of high-power LED light source device as shown in Figure 1, comprise some LED1, semiconductor thermoelectric refrigeration device 6, cold junction 5 outer surfaces of semiconductor thermoelectric refrigeration device 6 are laid with several electrodes 4, directly install and fix LED1 on the electrode 4, the hot junction 8 of described semiconductor thermoelectric refrigeration device 6 is provided with heat sink 9; Wherein, above-mentioned LED1 directly is fixed on the electrode 4 by LED bare chip 3, and LED bare chip 3 another utmost points connect another electrode by gold thread 2 and make LED nation through encapsulating and decide; Above-mentioned heat sink 9 is the heat dissipation metal piece.
The lead-out wire of semiconductor thermoelectric refrigeration device 6 conducting strips 7 is connected power supply respectively with the lead-out wire of LED1 electrode 4, when after adding suitable voltage on the lead-out wire of semiconductor thermoelectric refrigeration device electricity sheet 7, its cold junction 5 just can produce powerful cooling performance and siphon away the heat that semiconductor LED chip is on its outer surface sent, and this heat is discharged to heat dissipation metal piece 9 mounted thereto, thereby reach effect to the efficient cooling heat dissipation of semiconductor led chip by the hot junction 8 of semiconductor thermoelectric refrigeration device.In use can require the corresponding electronic temperature control circuit of configuration according to actual temperature control, reach reliable and effective cooling effect and reduce the purpose of system power dissipation by the operating current of regulating the semiconductor thermoelectric refrigeration device, when hanging down, also can be adopted as heat dissipation metal piece increase radiator fan and further improve radiating effect for the chilling temperature of having relatively high expectations at temperature control.
Claims (3)
1. high-power LED light source device, comprise some LED (1), it is characterized in that, also comprise semiconductor thermoelectric refrigeration device (6), cold junction (5) outer surface of semiconductor thermoelectric refrigeration device (6) is provided with some electrodes (4), install and fix described LED (1) on the electrode (4), the hot junction (8) of described semiconductor thermoelectric refrigeration device (6) is provided with heat sink (9).
2. a kind of high-power LED light source device according to claim 1 is characterized in that, described LED (1) directly is fixed on the electrode (4) by LED bare chip (3) and makes.
3. a kind of high-power LED light source device according to claim 1 and 2 is characterized in that described heat sink (9) is the heat dissipation metal piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201917117U CN201110527Y (en) | 2007-11-09 | 2007-11-09 | High power LED light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201917117U CN201110527Y (en) | 2007-11-09 | 2007-11-09 | High power LED light source device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201110527Y true CN201110527Y (en) | 2008-09-03 |
Family
ID=39895060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201917117U Expired - Fee Related CN201110527Y (en) | 2007-11-09 | 2007-11-09 | High power LED light source device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201110527Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989596A (en) * | 2009-07-30 | 2011-03-23 | 爱信精机株式会社 | Thermoelectric module and optical transmission apparatus |
| CN102194950A (en) * | 2010-03-09 | 2011-09-21 | Lg伊诺特有限公司 | Light emitting device |
| CN102222754A (en) * | 2010-04-14 | 2011-10-19 | 中芯国际集成电路制造(上海)有限公司 | LED (light-emitting diode) chip packaging structure and packaging method thereof |
| CN102222755A (en) * | 2010-04-14 | 2011-10-19 | 中芯国际集成电路制造(上海)有限公司 | Encapsulation structure and encapsulation method for light emitting diode (LED) chip |
| CN102297408A (en) * | 2011-08-26 | 2011-12-28 | 陈志明 | Heat-radiating method for LED (Light Emitting Diode) light source and device thereof |
| CN103644554A (en) * | 2013-12-23 | 2014-03-19 | 袁曦明 | System and device of intelligent heat dissipation for super-power LEDs |
| CN105240812A (en) * | 2015-09-21 | 2016-01-13 | 重庆星河光电科技有限公司 | Led module |
-
2007
- 2007-11-09 CN CNU2007201917117U patent/CN201110527Y/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989596B (en) * | 2009-07-30 | 2012-10-10 | 爱信精机株式会社 | Thermoelectric module and optical transmission apparatus |
| CN101989596A (en) * | 2009-07-30 | 2011-03-23 | 爱信精机株式会社 | Thermoelectric module and optical transmission apparatus |
| CN102194950A (en) * | 2010-03-09 | 2011-09-21 | Lg伊诺特有限公司 | Light emitting device |
| US8546835B2 (en) | 2010-03-09 | 2013-10-01 | Lg Innotek Co., Ltd. | Light emitting device |
| CN102222755B (en) * | 2010-04-14 | 2013-01-02 | 中芯国际集成电路制造(上海)有限公司 | Encapsulation structure and encapsulation method for light emitting diode (LED) chip |
| CN102222755A (en) * | 2010-04-14 | 2011-10-19 | 中芯国际集成电路制造(上海)有限公司 | Encapsulation structure and encapsulation method for light emitting diode (LED) chip |
| CN102222754B (en) * | 2010-04-14 | 2013-01-02 | 中芯国际集成电路制造(上海)有限公司 | LED (light-emitting diode) chip packaging structure and packaging method thereof |
| CN102222754A (en) * | 2010-04-14 | 2011-10-19 | 中芯国际集成电路制造(上海)有限公司 | LED (light-emitting diode) chip packaging structure and packaging method thereof |
| CN102297408A (en) * | 2011-08-26 | 2011-12-28 | 陈志明 | Heat-radiating method for LED (Light Emitting Diode) light source and device thereof |
| CN103644554A (en) * | 2013-12-23 | 2014-03-19 | 袁曦明 | System and device of intelligent heat dissipation for super-power LEDs |
| CN103644554B (en) * | 2013-12-23 | 2015-09-02 | 袁曦明 | A kind of super-high-power LED intelligent heat dissipation system and device |
| CN105240812A (en) * | 2015-09-21 | 2016-01-13 | 重庆星河光电科技有限公司 | Led module |
| CN105240812B (en) * | 2015-09-21 | 2019-03-19 | 重庆星河光电科技股份有限公司 | LED module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090109 Address after: Hangzhou City, Zhejiang Province, 870 Moganshan Road, the new building five floor, zip code: 310016 Patentee after: Hangzhou Hanling Photoelectric Technology Co., Ltd. Address before: Ascot garden Hangzhou Wenyi road in 1-201 city of Zhejiang Province, zip code: 310012 Patentee before: Sun Haicheng |
|
| ASS | Succession or assignment of patent right |
Owner name: HANGZHOU HANLING PHOTOELECTRIC TECHNOLOGY CO., LTD Free format text: FORMER OWNER: SUN HAICHENG Effective date: 20090109 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080903 Termination date: 20101109 |