CN102297408A - Heat-radiating method for LED (Light Emitting Diode) light source and device thereof - Google Patents

Heat-radiating method for LED (Light Emitting Diode) light source and device thereof Download PDF

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Publication number
CN102297408A
CN102297408A CN2011102484299A CN201110248429A CN102297408A CN 102297408 A CN102297408 A CN 102297408A CN 2011102484299 A CN2011102484299 A CN 2011102484299A CN 201110248429 A CN201110248429 A CN 201110248429A CN 102297408 A CN102297408 A CN 102297408A
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CN
China
Prior art keywords
led light
light source
circuit board
source circuit
heat
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Pending
Application number
CN2011102484299A
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Chinese (zh)
Inventor
陈志明
顾伟
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JIANGSU YUZHONG NEW MATERIAL TECHNOLOGY Co Ltd
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JIANGSU YUZHONG NEW MATERIAL TECHNOLOGY Co Ltd
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Priority to CN2011102484299A priority Critical patent/CN102297408A/en
Publication of CN102297408A publication Critical patent/CN102297408A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a heat-radiating method for an LED (Light Emitting Diode) light source and a device thereof. According to the heat-radiating method and device, an LED light source circuit board (1) provided with an LED (2) is subjected to cooling, heat radiation and heat neutralization; and the LED light source circuit board is directly subjected to cooling, heat radiation and heat neutralization by adopting a mode of mounting a semiconductor refrigeration device on the LED light source circuit board (1) through the semiconductor refrigeration device. The heat-radiating method and device disclosed by the invention have the advantages of favorable temperature-controlled effect, greatly-reduced working temperature of an LED light source, long service life, low use cost, favorable work stability, improved work efficiency of the LED and the like.

Description

A kind of heat dissipating method of led light source and device
Technical field
The present invention relates to a kind of heat dissipating method and device of led light source, belong to LED Light-Emitting Diode illuminating and heat radiating technical field.
Background technology
At present, because the LED Light-Emitting Diode has advantage energy-conservation, that brightness is high, volume is little as light source, be widely used in light source as illumination.But the radiating mode of led light source of the prior art generally adopts the mode of natural air cooled radiator to dispel the heat, though adopt the mode of natural air cooled radiator dispel the heat the surface see have simple in structure, the advantage that does not consume energy during heat radiation, but because its radiating effect is poor, usually make as the LED Light-Emitting Diode of light emitting source and under the high temperature of self, work, sometimes LED Light-Emitting Diode even can work being higher than under 130 ℃ the temperature, thereby make the LED Light-Emitting Diode aging in advance, its luminous efficiency reduces greatly, this has not only increased the energy consumption of LED Light-Emitting Diode, but also shortened its service life greatly, increased use cost; Adopt existing air-cooled radiator to dispel the heat in addition, also exist problems such as volume is big, Heavy Weight.Therefore, existing employing LED Light-Emitting Diode still is not ideal enough as the radiating mode of the led light source of light source, can not give full play to the power savings advantages of existing led light source.
Summary of the invention
The objective of the invention is: a kind of good heat dissipation effect, long service life, good operating stability are provided, and can improve the heat dissipating method and the device of the led light source of LED light emitting diode operating efficiency, to overcome the deficiencies in the prior art.
The present invention is achieved in that the heat dissipating method of a kind of led light source of the present invention is, when the led light source circuit board that the LED Light-Emitting Diode is installed is carried out cooling heat dissipation, the mode of semiconductor cooling device is installed in employing on the led light source circuit board, directly by this semiconductor cooling device to the led light source circuit board cool off, heat radiation and thermo-neutrality.
The heat abstractor of a kind of led light source of the present invention that makes up according to said method is: this device comprises the led light source circuit board that the LED Light-Emitting Diode is installed, be provided with the printed circuit that is used to connect and install semiconductor cold reactor galvanic couple element at the back side of led light source circuit board, be that the led light source circuit board is a double-sided printed-circuit board, on the one side of led light source circuit board, be printed with the led light source circuit, on the another side of led light source circuit board, be printed with and be used to install and control the refrigerated printed circuit of semiconductor cold reactor galvanic couple, on a printed circuit board (PCB) of led light source circuit board, the LED Light-Emitting Diode is installed, the cold junction of semiconductor cold reactor galvanic couple element is connected on the printed circuit board (PCB) of another side of led light source circuit board, on the hot junction of semiconductor cold reactor galvanic couple element, be provided with single-clad board, and the hot junction of semiconductor cold reactor galvanic couple element is connected on the printed circuit of single-clad board.
The radiator that is provided with air-cooling fin is installed on above-mentioned single-clad board.
Above-mentioned being used for is arranged on the led light source circuit board to the light source power link of LED Light-Emitting Diode power supply, is used for cooling power connector end to the power supply of semiconductor cold reactor galvanic couple element and is arranged on the led light source circuit board or is arranged on single-clad board.
Owing to adopted technique scheme, the present invention adopts the mode that semiconductor cooling device is installed on the led light source circuit board, directly by this semiconductor cooling device to the led light source circuit board cool off, heat radiation and thermo-neutrality, the temperature in the time of therefore reducing the work of led light source circuit board greatly.The present invention is when work, only need power supply is connected on light source power link and the cooling power connector end, at this moment the LED Light-Emitting Diode on the led light source circuit board will be normally luminous, and semiconductor cold reactor galvanic couple element can begin to carry out refrigeration work, during the work of semiconductor cold reactor galvanic couple element, the cold junction of semiconductor cold reactor galvanic couple element carries out thermo-neutrality to the led light source circuit board, and the heat that send in the hot junction of semiconductor cold reactor galvanic couple element by the heat sink radiates on the single-clad board in air.After tested, when the led light source circuit board is 100 watts of power, and adopt that mode of the present invention is cooled off, when heat radiation and thermo-neutrality, under 1000 hours situation of continuous operation, the substrate temperature of the LED Light-Emitting Diode on its led light source circuit board generally can not surpass 10~20 ℃ of room temperatures; And when the power of led light source circuit board less than 30 watt-hours, as adopt mode of the present invention to carry out cooling heat dissipation, under 1000 hours situation of continuous operation, the substrate temperature of the LED Light-Emitting Diode on its led light source circuit board is usually less than 5~15 ℃ of room temperatures; And after tested, the light decay phenomenon does not appear in the LED Light-Emitting Diode of continuous operation after 1000 hours that adopts the present invention to dispel the heat.Therefore, the present invention compared with prior art, the present invention not only has good heat dissipation effect, can reduce the advantage of the operating temperature of led light source greatly, but also has that long service life, use cost are low, good operating stability, and can improve advantage such as LED light emitting diode operating efficiency.
Description of drawings
Fig. 1 is a structural representation of the present invention.
The specific embodiment
Below in conjunction with drawings and Examples the present invention is done further to say in detail.
Embodiments of the invention: when making led light source, adopt the heat dissipating method of a kind of led light source of the present invention that it is dispelled the heat, promptly the led light source circuit board 1 that LED Light-Emitting Diode 2 is installed is cooled off, when heat radiation and thermo-neutrality, the mode of semiconductor cooling device is installed in employing on led light source circuit board 1, directly by this semiconductor cooling device to led light source circuit board 1 cool off, heat radiation and thermo-neutrality.
The heat abstractor of a kind of led light source of the present invention that makes up according to said method is: this device comprises the led light source circuit board 1 that LED Light-Emitting Diode 2 is installed, during making, be provided for connecting and installing the printed circuit of semiconductor cold reactor galvanic couple element 3 at the back side of led light source circuit board 1, be about to led light source circuit board 1 and be made as double-sided printed-circuit board, printing the led light source circuit on the one side of led light source circuit board 1, printing the printed circuit that is used to install and control semiconductor cold reactor galvanic couple element 3 refrigeration on the another side of led light source circuit board 1, the printed circuit of its led light source circuit and control semiconductor cold reactor galvanic couple element 3 refrigeration all can adopt traditional printed circuit, on a printed circuit board (PCB) of led light source circuit board 1, install LED Light-Emitting Diode 2, the cold junction of semiconductor cold reactor galvanic couple element 3 is connected on the printed circuit board (PCB) of another side of led light source circuit board 1, on the hot junction of semiconductor cold reactor galvanic couple element 3, be provided with single-clad board 4, and the hot junction of semiconductor cold reactor galvanic couple element 3 is connected on the printed circuit of single-clad board 4, printed circuit on printed circuit on the double-sided printed-circuit board of its led light source circuit board 1 or the single-clad board 4 all can be made by the refrigeration drive circuit of traditional led light source drive circuit and semiconductor cold reactor galvanic couple element, and LED Light-Emitting Diode 2 and semiconductor cold reactor galvanic couple element 3 can directly adopt the finished product element of selling on the market; In order to reach better radiating effect, can on single-clad board 4, install the radiator 5 that is provided with air-cooling fin, this radiator 5 can adopt existing fan-cooled radiator; Be used for to be produced on led light source circuit board 1 to the light source power link 6 of LED Light-Emitting Diode 2 power supplies; Be used for conveniently to be arranged on the led light source circuit board 1 or to be arranged on the single-clad board 4 according to what use to the cooling power connector end 7 of semiconductor cold reactor galvanic couple element 3 power supply.

Claims (4)

1. the heat dissipating method of a led light source, it is characterized in that: when the led light source circuit board (1) that LED Light-Emitting Diode (2) is installed is carried out cooling heat dissipation, the mode that employing go up to be installed semiconductor cooling device at led light source circuit board (1) is directly cooled off led light source circuit board (1) by this semiconductor cooling device and is dispelled the heat.
2. the heat abstractor of a led light source, comprise the led light source circuit board (1) that LED Light-Emitting Diode (2) is installed, it is characterized in that: be provided with the printed circuit that is used for connecting and installing semiconductor cold reactor galvanic couple element (3) at the back side of led light source circuit board (1), be that led light source circuit board (1) is a double-sided printed-circuit board, on the one side of led light source circuit board (1), be printed with the led light source circuit, on the another side of led light source circuit board (1), be printed with the printed circuit that is used for installing and controlling semiconductor cold reactor galvanic couple element (3) refrigeration, on a printed circuit board (PCB) of led light source circuit board (1), LED Light-Emitting Diode (2) is installed, the cold junction of semiconductor cold reactor galvanic couple element (3) is connected on the printed circuit board (PCB) of another side of led light source circuit board (1), on the hot junction of semiconductor cold reactor galvanic couple element (3), be provided with single-clad board (4), and the hot junction of semiconductor cold reactor galvanic couple element (3) is connected on the printed circuit of single-clad board (4).
3. the heat abstractor of led light source according to claim 2 is characterized in that: the radiator (5) that is provided with air-cooling fin is installed on single-clad board (4).
4. the heat abstractor of led light source according to claim 2, it is characterized in that: be used for being arranged on led light source circuit board (1), be used for being arranged on led light source circuit board (1) and go up or be arranged on single-clad board (4) to the cooling power connector end (7) that semiconductor cold reactor galvanic couple element (3) is powered to the light source power link (6) of LED Light-Emitting Diode (2) power supply.
CN2011102484299A 2011-08-26 2011-08-26 Heat-radiating method for LED (Light Emitting Diode) light source and device thereof Pending CN102297408A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011102484299A CN102297408A (en) 2011-08-26 2011-08-26 Heat-radiating method for LED (Light Emitting Diode) light source and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011102484299A CN102297408A (en) 2011-08-26 2011-08-26 Heat-radiating method for LED (Light Emitting Diode) light source and device thereof

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CN102297408A true CN102297408A (en) 2011-12-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104165290A (en) * 2014-07-25 2014-11-26 深圳市光之谷新材料科技有限公司 LED lamp
WO2014206165A1 (en) * 2013-06-25 2014-12-31 苏州伟源新材料科技有限公司 Low-light-failure high-power led road lamp and manufacturing method therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201110527Y (en) * 2007-11-09 2008-09-03 孙海城 High power LED light source device
CN101477981A (en) * 2008-01-03 2009-07-08 富士迈半导体精密工业(上海)有限公司 Light source module and manufacturing process thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201110527Y (en) * 2007-11-09 2008-09-03 孙海城 High power LED light source device
CN101477981A (en) * 2008-01-03 2009-07-08 富士迈半导体精密工业(上海)有限公司 Light source module and manufacturing process thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014206165A1 (en) * 2013-06-25 2014-12-31 苏州伟源新材料科技有限公司 Low-light-failure high-power led road lamp and manufacturing method therefor
US9989238B2 (en) 2013-06-25 2018-06-05 Zhiming Chen Low light failure, high power led street lamp and method for manufacturing the same
CN104165290A (en) * 2014-07-25 2014-11-26 深圳市光之谷新材料科技有限公司 LED lamp

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Application publication date: 20111228