CN115113463A - Heat dissipation device for heat source module and electronic equipment - Google Patents
Heat dissipation device for heat source module and electronic equipment Download PDFInfo
- Publication number
- CN115113463A CN115113463A CN202210605162.2A CN202210605162A CN115113463A CN 115113463 A CN115113463 A CN 115113463A CN 202210605162 A CN202210605162 A CN 202210605162A CN 115113463 A CN115113463 A CN 115113463A
- Authority
- CN
- China
- Prior art keywords
- heat
- source module
- module
- heat source
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 72
- 239000004065 semiconductor Substances 0.000 claims abstract description 138
- 238000001514 detection method Methods 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 37
- 239000004020 conductor Substances 0.000 claims description 35
- 239000000919 ceramic Substances 0.000 claims description 28
- 239000004519 grease Substances 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 13
- 239000004964 aerogel Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 238000005496 tempering Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 description 12
- 230000033228 biological regulation Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000005728 strengthening Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat sink and electronic device for heat source module, the heat sink for heat source module includes: the temperature detection module is used for detecting the temperature of the heat source module; the first end of the semiconductor thermoelectric heat exchange module is in heat conduction with the heat source module; the heat dissipation assembly is in heat conduction with the second end of the semiconductor thermoelectric heat exchange module; and the circuit control system is electrically connected with the temperature detection module, the semiconductor thermoelectric heat exchange module and the heat dissipation assembly respectively so as to enable the temperature of the heat source module to be within a preset temperature range. The heat dissipation device can control the numerical value of the steady-state temperature, and the heat source module can rapidly reach the heat steady state.
Description
Technical Field
The invention belongs to the technical field of heat dissipation of electronic products, and particularly relates to a heat dissipation device for a heat source module and electronic equipment with the heat dissipation device.
Background
With the gradual household of projection equipment, the performance requirements of users on projection products are continuously improved, and miniaturization and high brightness are inevitable trends in the development of projection equipment in order to meet the requirements of normal use of products on environment brightness.
However, the main technical factor limiting the brightness improvement of projection products is heat dissipation. At present, a DLP projection light machine mainly takes an LED lamp as a light source, the LED light is taken as a cold light source, the reason for heating is that the electro-optical conversion efficiency is low, about only 20% -30% of electric energy is converted into light energy, and most of the electric energy is converted into heat. Therefore, the brightness of the light source is increased and a large amount of waste heat is generated. This not only reduces the lifetime of the product, but also the high temperature environment causes the LED to be less bright. Therefore, an efficient heat dissipation device is one of the effective ways to solve the above problems.
At present, the mainstream heat dissipation scheme of the projection light machine is to lead out heat in a mode of additionally arranging a radiator, and the heat dissipation scheme mainly has a direct contact type and a heat pipe heat exchange type. The heat pipe radiator applies the phase change latent heat principle, and the heat exchange efficiency is far higher than that of the heat pipe radiator. However, the heat pipe heat exchanger has a large volume and a heat exchange limit, which limits the requirement for miniaturization of the projection product volume.
Semiconductor heat sinks are used in many fields because of their miniaturization, high reliability without moving parts, and temperature control. The cold end and hot end cooling device has the double properties of cooling and heating, the temperature difference of the cold end and the hot end is kept within a certain range, and the temperature difference is constant, so that the cold end temperature can be reduced while the hot end temperature is reduced. However, in the heat dissipation of electronic products, the cold end is easily cooled to the dew point of the environment, which causes short circuit of the equipment.
Therefore, the heat dissipation of the projection optical machine is enhanced, the miniaturization and high brightness of the optical machine product are realized, the problems of high-efficiency heat exchange and condensation of semiconductors and the like are solved, and the key of the further development of the projection optical machine is realized.
Disclosure of Invention
The invention aims to provide a heat dissipation device of a heat source module, which can solve the heat dissipation defect of the prior projection optical machine.
It is still another object of the present invention to provide an electronic device including the heat dissipating apparatus of the above heat source module.
According to a first aspect of the present invention, there is provided a heat dissipating device for a heat source module, comprising: the temperature detection module is used for detecting the temperature of the heat source module; the first end of the semiconductor thermoelectric heat exchange module is in heat conduction with the heat source module; the heat dissipation assembly is in heat conduction with the second end of the semiconductor thermoelectric heat exchange module; and the circuit control system is electrically connected with the temperature detection module, the semiconductor thermoelectric heat exchange module and the heat dissipation assembly respectively so as to enable the temperature of the heat source module to be within a preset temperature range.
Optionally, the heat dissipation device for a heat source module further includes: the heat conducting piece is connected with the semiconductor thermoelectric heat exchange module, so that the semiconductor thermoelectric heat exchange module is respectively in heat conduction with the heat source module and the heat dissipation assembly through the heat conducting piece.
Optionally, the heat conducting member is a heat conducting silicone grease.
Optionally, the semiconductor thermoelectric heat exchange module comprises: the semiconductor structure comprises a plurality of semiconductors, a plurality of semiconductor chips and a plurality of control circuit, wherein the semiconductors are divided into P-type semiconductors and N-type semiconductors, the P-type semiconductors and the N-type semiconductors are alternately arranged in parallel, and a gap is formed between every two adjacent semiconductors; the metal conductors are respectively connected with two ends of the P-type semiconductor and the N-type semiconductor, so that the P-type semiconductor and the N-type semiconductor form an S-shaped structure through the metal conductors; the heat sink module comprises a heat source module, a P-type semiconductor and an N-type semiconductor, wherein the heat source module comprises a heat source module, a heat sink module and a heat sink, the heat sink module comprises a heat source module, a first ceramic body and a second ceramic body, the first ceramic body is connected with the metal conductor on one side of the P-type semiconductor and the N-type semiconductor close to the heat source module, and the second ceramic body is connected with one side of the P-type semiconductor and the N-type semiconductor close to the heat sink module.
Optionally, the heat sink for a heat source module further includes: the sealing cover is positioned between the heat source module and the heat dissipation assembly, a closed cavity is formed in the sealing cover, and the semiconductor thermoelectric heat exchange module is positioned in the closed cavity.
Optionally, the heat dissipation device for a heat source module further includes: an insulating aerogel blanket, at least a portion of the insulating aerogel blanket being located in the gap.
Optionally, the heat dissipation assembly comprises: the fin radiator comprises a plurality of radiating fins, one ends of the radiating fins are close to the second end of the semiconductor thermoelectric heat exchange module, one ends of the radiating fins are connected with each other, and the other ends of the radiating fins are free ends; a tempering fan in heat exchange with the free end.
Optionally, the temperature detection module is a thermistor.
Another aspect of the present invention further provides an electronic device, which includes a heat source module and a heat dissipation apparatus, where the heat dissipation apparatus is the heat dissipation apparatus in any one of the above embodiments.
Optionally, the heat source module is a component on a projector or a wearable device.
The invention has the technical effects that the heat exchange is carried out on the heat source module by a primary heat dissipation mode and a secondary strengthening mode and combining a circuit control system. The primary heat dissipation is the large temperature difference heat conduction of the cold end-heat source module through the refrigeration characteristic of the semiconductor, the heat conduction heat flow density is improved, and the efficient heat dissipation of the heat source module is realized. The secondary strengthening is to control the power of the heat dissipation assembly through an electric signal transmitted by the temperature detection module, to realize cold end temperature regulation and control through controlling the hot end temperature, for example, to control the rotating speed of the fan through an electric signal transmitted by the thermistor, and to realize cold end temperature regulation and control through regulating and controlling the hot end temperature. The heat dissipation device can realize temperature regulation and control of the heat source module, can be applied to the fields of LED heat dissipation, panel heat dissipation, chip heat dissipation and the like of a projection optical machine, and can realize the development of projection equipment towards miniaturization and high brightness by strengthening the heat exchange efficiency in two stages.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a partial cross-sectional view of an electronic device of one embodiment of the invention;
fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Reference numerals
A semiconductor thermoelectric heat exchange module 10; an N-type semiconductor 11; a P-type semiconductor 12; a metal conductor 13; insulating ceramic cold end 14 a; an insulating ceramic hot end 14 b; a seal cover 15; an insulating aerogel blanket 16;
a heat source module 20; a substrate 21; an LED light source 22;
a temperature-adjusting fan 30;
a finned heat sink 40; 50 of heat-conducting silicone grease; a thermistor 60; the circuit control system 70.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The heat dissipation device according to the embodiments of the present application will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 and 2, the heat dissipation device for the heat source module 20 according to the embodiment of the present application includes a temperature detection module, a semiconductor thermoelectric heat exchange module 10, a heat dissipation assembly, and a circuit control system 70.
Specifically, the temperature detection module is used for detecting the temperature of the heat source module 20, the first end of the semiconductor thermoelectric heat exchange module 10 is in heat conduction with the heat source module 20, the heat dissipation assembly is in heat conduction with the second end of the semiconductor thermoelectric heat exchange module 10, and the circuit control system 70 is electrically connected with the temperature detection module, the semiconductor thermoelectric heat exchange module 10 and the heat dissipation assembly respectively, so that the temperature of the heat source module 20 is within a preset temperature range.
In other words, the heat dissipation device according to the embodiment of the present application is used for dissipating heat of the heat source module 20, the heat source module 20 may be a component on an electronic device, such as an LED heat source, and the electronic device may be a projector, an AR device, a VR device, and the like.
The temperature detection module, the semiconductor thermoelectric heat exchange module 10 and the heat dissipation assembly are respectively electrically connected with the circuit control system 70, and the semiconductor thermoelectric conversion module can be directly or indirectly contacted with the heat source module 20 through the cold end and directly or indirectly contacted with the heat dissipation assembly through the hot end. The temperature of the cold end of the semiconductor thermoelectric conversion module is reduced after the semiconductor thermoelectric conversion module is electrified, and the temperature of the hot end of the semiconductor thermoelectric conversion module is increased.
The temperature detection module can receive a temperature signal of the environment around the heat source module 20, and adjusts and controls the heat dissipation assembly in the form of an electrical signal through the control circuit. For example, when the temperature of the heat source module 20 increases, the power of the heat sink assembly may be controlled to increase, the temperature of the hot end may decrease, the temperature of the cold end may also decrease, the heat dissipation gradient of the heat source module 20 increases, the heat dissipation rate may also increase, the temperature may decrease, and finally the thermal steady state may be reached.
In addition, it should be noted that the control circuit of the circuit control system 70 of the present application may be applicable to both automatic temperature control and manual software operation control. Through the cooperation of the temperature detection module, the semiconductor thermoelectric heat exchange module 10, the heat dissipation assembly and the circuit control system 70, the regulation and control of the heat source module 20 are not limited by the ambient temperature, and the control precision is high.
Therefore, the heat dissipation device for the heat source module 20 according to the embodiment of the present application exchanges heat with the heat source module 20 through a primary heat dissipation manner, a secondary heat dissipation manner, and a combination of the circuit control system 70. The primary heat dissipation is the large temperature difference heat conduction of the cold end-heat source module 20 formed by the refrigeration characteristic of the semiconductor, so that the heat conduction heat flow density is improved, and the high-efficiency heat dissipation of the heat source module 20 is realized. The secondary enhancement is to control the power of the heat dissipation assembly through the electric signal transmitted by the temperature detection module, to realize the cold end temperature regulation and control by controlling the hot end temperature, for example, to control the fan speed through the electric signal transmitted by the thermistor 60, and to realize the cold end temperature regulation and control by regulating the hot end temperature.
According to an embodiment of the present application, the heat dissipating device for the heat source module 20 further includes: and the heat conducting piece is connected with the semiconductor thermoelectric heat exchange module 10, so that the semiconductor thermoelectric heat exchange module 10 is respectively in heat conduction with the heat source module 20 and the heat dissipation assembly through the heat conducting piece. For example, the number of the heat conductors may be two, one being located at the upper side of the semiconductor thermoelectric heat exchange module 10 and the other being located at the lower side of the semiconductor thermoelectric heat exchange module 10.
In some embodiments of the present application, the heat conductive member is a heat conductive silicone grease 50, for example, the cold end contacts the heat source module 20 through the heat conductive silicone grease 50.
According to an embodiment of the present application, the semiconductor thermoelectric heat exchange module 10 includes a plurality of semiconductors, a metal conductor 13, a first ceramic body and a second ceramic body, the plurality of semiconductors are divided into P-type semiconductors 12 and N-type semiconductors 11, the P-type semiconductors 12 and the N-type semiconductors 11 are alternately arranged in parallel, a gap is provided between two adjacent semiconductors, the metal conductor 13 is connected to both ends of the P-type semiconductors 12 and the N-type semiconductors 11, respectively, so that the P-type semiconductors 12 and the N-type semiconductors 11 form an S-shaped structure through the metal conductor 13, the first ceramic body is connected to the metal conductor 13 on a side of the P-type semiconductors 12 and the N-type semiconductors 11 close to the heat source module 20, and the second ceramic body is connected to the side of the P-type semiconductors 12 and the N-type semiconductors 11 close to the heat dissipation assembly.
In other words, the semiconductor thermoelectric heat exchange module 10 is mainly composed of a plurality of semiconductors, which may be P-type semiconductors 12 or N-type semiconductors 11, a metal conductor 13, a first ceramic body, and a second ceramic body. The P-type semiconductors 12 and the N-type semiconductors 11 are alternately arranged in parallel, and a gap is formed between two adjacent semiconductors. For example, the total number of semiconductors is 6, and 1#, 2#, 3#, 4#, 5#, and 6# are sequentially arranged from left to right, where 1#, 3#, and 5# are N-type semiconductors 11, and 2#, 4#, and 6# are P-type semiconductors 12. The upper ends of 1# and 2# are connected with the same metal conductor 13, and the lower end of 1# is connected with a single metal conductor 13. The lower ends of 2# and 3# are connected with the same metal conductor 13, the upper ends of 3# and 4# are connected with the same metal conductor 13, the lower ends of 4# and 5# are connected with the same metal conductor 13, the upper ends of 5# and 6# are connected with the same metal conductor 13, the lower end of 6# is connected with a single metal conductor 13, it can be seen that the heads and the tails of a plurality of semiconductors are respectively connected with the single metal conductor 13, the plurality of semiconductors are formed into an S-like structure through the metal conductor 13, for example, when the S-like structure extends along the left-right direction, the metal conductor 13 is positioned above and below the S-like structure.
Furthermore, the first ceramic body, which can be an insulating ceramic hot end 14b, is connected to the upper metal conductor 13 of the S-like structure, and the first ceramic body can be connected to a plurality of metal conductors 13. Likewise, a second ceramic body, which may serve as an insulating ceramic cold end 14a, may be connected to the plurality of metal conductors 13, is connected to the metal conductors 13 on the underside of the S-like structure.
In the semiconductor thermoelectric heat exchange module 10 of the present embodiment, when the power supply operates, the positive and negative electrodes of the power supply can be connected to the corresponding metal conductors 13 of the head and tail semiconductors, so as to realize that the current flows in a S-like manner, for example, the metal conductors 13 receive the current from the P-type semiconductor 12 and conduct the current to the N-type semiconductor 11, at this time, the corresponding metal conductors 13 emit heat to the outside, and similarly, when the metal conductors 13 receive the current from the N-type semiconductor 11 and conduct the current to the P-type semiconductor 12, the metal conductors 13 are in a heat absorption state. The working principle of the P-type semiconductor 12 and the N-type semiconductor 11 follows the peltier effect, and is not described herein. It should be noted that, by using the semiconductor thermoelectric heat exchange module 10 following the peltier effect to cooperate with the circuit control system 70, the heat dissipation assembly, and the like, it is beneficial to realize the control of the temperature of the heat source module 20, so that the temperature of the heat source module 20 is relatively stable.
According to an embodiment of the present application, the heat dissipation device for the heat source module 20 further includes a sealing cover 15, the sealing cover 15 is located between the heat source module 20 and the heat dissipation assembly, a closed chamber is formed in the sealing cover 15, and the semiconductor thermoelectric heat exchange module 10 is located in the closed chamber. Wherein a closed chamber may be formed by the sealing cap 15 in cooperation with the thermally conductive silicone grease 50. That is, the periphery of the semiconductor thermoelectric conversion module is covered with the insulating sealing cover 15 for air-tight. Wherein, the inside of semiconductor thermoelectric conversion module can carry out drying process to avoid the temperature of cold junction to drop to dew point and generate the condensate water, that is to say, can seal through the predrying, can avoid appearing the comdenstion water and lead to the short circuit. Further, since the cold-side contact surface temperature of the semiconductor thermoelectric conversion module is close to the temperature of the substrate 21 of the heat source module 20, it is not necessary to consider the problem of condensation.
According to one embodiment of the present application, the heat sink for the heat source module 20 further comprises an insulating aerogel blanket 16, at least a portion of the insulating aerogel blanket 16 being located in the gap. Further, the insulating aerogel blanket is filled inside the semiconductor thermoelectric conversion module, that is, not only in the gap but also between the adjacent two metal conductors 13. The heat insulation aerogel felt 16 has heat insulation property, and the insulating material is filled in the semiconductor thermoelectric conversion module, so that the heat neutralization in the semiconductor thermoelectric conversion module can be reduced, and the heat unidirectional transmission of the cold end and the hot end is ensured, thereby improving the efficiency of the semiconductor thermoelectric conversion module as a radiator. Therefore, in this embodiment, the semiconductor thermoelectric heat exchange module 10 is filled with an insulating material, so that cold-end heat utilization is further improved.
In some embodiments of the present application, the heat dissipation assembly includes a fin radiator 40 and a temperature adjusting fan 30, the fin radiator 40 includes a plurality of fins, one end of each of the plurality of fins is close to the second end of the semiconductor thermoelectric heat exchange module 10, one end of each of the plurality of fins is connected to each other, the other end of each of the plurality of fins is a free end, and the temperature adjusting fan 30 exchanges heat with the free end.
That is, the heat radiation assembly is mainly composed of the fin radiator 40 and the temperature-adjusting fan 30, and the temperature-adjusting fan 30 can act on the fin radiator 40. The hot side may be connected to the finned heat sink 40 by a thermally conductive silicone grease 50. The temperature adjusting fan 30 can be matched with the control circuit through the temperature detection module to adjust the rotating speed of the temperature adjusting fan 30.
According to one embodiment of the present application, the temperature sensing module is a thermistor 60. For example, the thermistor 60 receives an ambient temperature signal of the heat source module 20, and adjusts the rotation speed of the temperature-adjusting fan 30 in the form of an electrical signal through the control circuit. When the temperature of the heat source module 20 rises, the rotating speed of the temperature adjusting fan 30 rises, the temperature of the hot end drops, the temperature of the cold end drops, the heat dissipation gradient of the heat source module 20 rises, the heat dissipation rate is increased, the temperature drops, and finally the thermal steady state is achieved.
The application also discloses an electronic device including heat source module 20 and heat abstractor, and heat abstractor is the heat abstractor of any preceding embodiment, because heat abstractor has heat exchange efficiency height, temperature is controllable, the cold junction heat loss is few, advantages such as refrigeration COP coefficient height, therefore electronic device also has above-mentioned advantage, does not describe herein again.
According to an embodiment of the present application, the heat source module 20 is a projector or a component on a wearable device, wherein the wearable device may be an AR device or a VR device, for example, the heat source module 20 is an LED light source 22 on the projector. It should be noted that the heat dissipation device of the present application is not limited to dissipating heat from the LED light source 22, and the heat dissipation device can be used for temperature control at any position where heat transfer is required. That is, the invention can be applied to the heat dissipation of projection equipment, VR panel and AR related electronic product fields.
The operation of the heat dissipation device according to an embodiment of the present application will be described in detail with reference to specific embodiments.
In the embodiment, the electronic device is a projector, the heat source module 20 includes an LED light source 22 and a metal substrate 21 on the projector, and the heat source module 20 is used as the heat source module 20.
The heat source module 20 is connected with the semiconductor thermoelectric heat exchange module 10 through the heat-conducting silicone grease 50, the finned radiator 40 is connected with the semiconductor thermoelectric heat exchange module 10 through the heat-conducting silicone grease 50, the temperature-adjusting fan 30 is connected with the finned radiator 40, the heat source module 20 is arranged on the main body of the projection light machine, and the circuit control system 70 is respectively connected with the semiconductor thermoelectric heat exchange module 10, the temperature-adjusting fan 30 and the thermistor 60.
The semiconductor thermoelectric heat exchange module 10 mainly comprises an N-type semiconductor 11, a P-type semiconductor 12, a metal conductor 13, an insulating ceramic cold end 14a, an insulating ceramic hot end 14b, a sealing cover 15 and a heat-insulating aerogel felt 16, wherein the metal conductor 13 is a conductive metal plate.
The equipment is started, the LED light source 22 generates heat, the insulating ceramic cold end 14a refrigerates, the insulating ceramic hot end 14b heats, and the LED light source 22 and the insulating ceramic cold end 14a exchange heat with the heat-conducting silicone grease 50 through the metal substrate 21. The thermistor 60 receives the temperature signal of the heat source module 20, when the temperature rises to exceed the set value, the thermistor 60 converts the temperature signal into an electric signal to act on the temperature adjusting fan 30, the rotating speed of the fan is increased, the temperature of the insulating ceramic hot end 14b is reduced under the action of the fin radiator 40 and the temperature adjusting fan 30, and according to the heat dissipation characteristic of the semiconductor, the temperature of the insulating ceramic cold end 14a is reduced, so that the heat transfer of the heat source module 20 is further enhanced, the temperature is reduced, the thermal stability is finally achieved, and the constant temperature control of the projection equipment is realized.
That is to say, the heat abstractor of this embodiment belongs to the electronic product heat dissipation field, relates to semiconductor heat transfer and forced convection heat transfer technique, strengthens the directional transmission that heat transfer realized the electronic equipment heat through the two-stage. The main structure of the heat dissipation device comprises a semiconductor thermoelectric heat exchange module 10, a temperature adjusting fan 30, a finned radiator 40, heat-conducting silicone grease 50, a thermistor 60 and a circuit control system 70. The primary heat exchange is connected with a heat source through the heat-conducting silicone grease 50 from the cold end of the semiconductor thermoelectric module, and the heat transfer is enhanced by the large temperature gradient; the second-level strengthening is that the hot end of the semiconductor thermoelectric heat exchange module 10 is connected with a heat sink through the heat-conducting silicone grease 50, the temperature-adjusting fan 30 works at different wind speeds through electric signals transmitted by the thermistor 60, and the temperature of the cold end is controlled through adjusting the temperature of the hot end. The semiconductor thermoelectric heat exchange module 10 is internally filled with the heat insulation aerogel felt 16, so that cold and heat isolation at two ends of the module is realized, unidirectional heat transfer is ensured, and the heat exchange efficiency is improved. The device has the advantages of small volume, controllable and adjustable temperature and the like, can realize high-precision temperature control, realize constant temperature of the heat source module 20, and has the advantages of no noise, no vibration and high reliability of the semiconductor thermoelectric heat exchange module 10.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A heat sink for a heat source module, comprising:
the temperature detection module is used for detecting the temperature of the heat source module;
the first end of the semiconductor thermoelectric heat exchange module is in heat conduction with the heat source module;
the heat dissipation assembly is in heat conduction with the second end of the semiconductor thermoelectric heat exchange module;
and the circuit control system is electrically connected with the temperature detection module, the semiconductor thermoelectric heat exchange module and the heat dissipation assembly respectively so as to enable the temperature of the heat source module to be within a preset temperature range.
2. The heat sink for a heat source module as recited in claim 1, further comprising:
the heat conducting piece is connected with the semiconductor thermoelectric heat exchange module, so that the semiconductor thermoelectric heat exchange module is respectively in heat conduction with the heat source module and the heat dissipation assembly through the heat conducting piece.
3. The heat sink for a heat source module as recited in claim 2, wherein the heat conductive member is a heat conductive silicone grease.
4. The heat sink for a heat source module as recited in claim 1, wherein the semiconductor thermoelectric heat exchange module comprises:
the semiconductor structure comprises a plurality of semiconductors, a plurality of semiconductor chips and a plurality of control circuit, wherein the semiconductors are divided into P-type semiconductors and N-type semiconductors, the P-type semiconductors and the N-type semiconductors are alternately arranged in parallel, and a gap is formed between every two adjacent semiconductors;
the metal conductors are respectively connected with two ends of the P-type semiconductor and the N-type semiconductor, so that the P-type semiconductor and the N-type semiconductor form an S-shaped structure through the metal conductors;
the heat sink module comprises a heat source module, a P-type semiconductor and an N-type semiconductor, wherein the heat source module comprises a heat source module, a heat sink module and a heat sink, the heat sink module comprises a heat source module, a first ceramic body and a second ceramic body, the first ceramic body is connected with the metal conductor on one side of the P-type semiconductor and the N-type semiconductor close to the heat source module, and the second ceramic body is connected with one side of the P-type semiconductor and the N-type semiconductor close to the heat sink module.
5. The heat sink for a heat source module as recited in claim 4, further comprising:
the sealing cover is positioned between the heat source module and the heat dissipation assembly, a closed cavity is formed in the sealing cover, and the semiconductor thermoelectric heat exchange module is positioned in the closed cavity.
6. The heat sink for a heat source module as recited in claim 4, further comprising:
an insulating aerogel blanket, at least a portion of the insulating aerogel blanket being located in the gap.
7. The heat sink for a heat source module as claimed in claim 1, wherein the heat dissipation assembly comprises:
the fin radiator comprises a plurality of radiating fins, one ends of the radiating fins are close to the second end of the semiconductor thermoelectric heat exchange module, one ends of the radiating fins are connected with each other, and the other ends of the radiating fins are free ends;
a tempering fan in heat exchange with the free end.
8. The heat sink for a heat source module as claimed in claim 1, wherein the temperature sensing module is a thermistor.
9. An electronic device, comprising:
a heat source module;
a heat sink according to any one of claims 1 to 8.
10. The electronic device of claim 9, wherein the heat source module is a component on a projector or a wearable device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210605162.2A CN115113463A (en) | 2022-05-30 | 2022-05-30 | Heat dissipation device for heat source module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210605162.2A CN115113463A (en) | 2022-05-30 | 2022-05-30 | Heat dissipation device for heat source module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115113463A true CN115113463A (en) | 2022-09-27 |
Family
ID=83325833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210605162.2A Pending CN115113463A (en) | 2022-05-30 | 2022-05-30 | Heat dissipation device for heat source module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115113463A (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873973A (en) * | 2006-06-19 | 2006-12-06 | 朱建钦 | Envelope for luminous elements of semiconductor in large power |
| CN102252200A (en) * | 2011-07-06 | 2011-11-23 | 卢会水 | Semiconductor refrigeration high-power LED lamp |
| CN202521346U (en) * | 2012-04-24 | 2012-11-07 | 山西吉天利半导体照明有限公司 | Light emitting diode (LED) light source module cooled by adopting semiconductor cooler |
| CN103225928A (en) * | 2013-04-03 | 2013-07-31 | 安徽问天量子科技股份有限公司 | Active low-temperature water-proof radiating device and manufacturing method thereof |
| CN204029870U (en) * | 2014-06-10 | 2014-12-17 | 四川航天系统工程研究所 | A kind of semiconductor cooling device |
| CN104964369A (en) * | 2015-07-20 | 2015-10-07 | 华中科技大学 | Semi-conductor radiation air conditioning device driven by solar energy |
| CN105072748A (en) * | 2015-07-31 | 2015-11-18 | 苏州宏展信息科技有限公司 | LED lamp tube heat dissipation control system based on low-noise amplifier |
| US20160064638A1 (en) * | 2014-08-26 | 2016-03-03 | GM Global Technology Operations LLC | Encapsulation of high temperature thermoelectric modules |
| CN207096756U (en) * | 2017-08-21 | 2018-03-13 | 陈玲 | A kind of intelligent constant-temperature electric bicycle saddle |
| CN108014421A (en) * | 2016-11-02 | 2018-05-11 | 北京脑泰科技发展有限公司 | Heat radiator for through cranium stimulation appearance handle |
| CN209246027U (en) * | 2019-01-30 | 2019-08-13 | 成都易明半导体有限公司 | A kind of heat dissipation structure of LED lamp based on semiconductor cooler |
| CN210052065U (en) * | 2019-08-16 | 2020-02-11 | 北京康威能特环境技术有限公司 | Miniature precision temperature control device |
| WO2020034862A1 (en) * | 2018-08-15 | 2020-02-20 | 杭州海康机器人技术有限公司 | Camera |
| CN111830769A (en) * | 2020-08-05 | 2020-10-27 | 成都极米科技股份有限公司 | A novel cooling system for DMD of projecting apparatus |
| CN214707442U (en) * | 2021-01-18 | 2021-11-12 | 深圳市创想三维科技股份有限公司 | A motor intelligence temperature control device and 3D printer for 3D printer |
-
2022
- 2022-05-30 CN CN202210605162.2A patent/CN115113463A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873973A (en) * | 2006-06-19 | 2006-12-06 | 朱建钦 | Envelope for luminous elements of semiconductor in large power |
| CN102252200A (en) * | 2011-07-06 | 2011-11-23 | 卢会水 | Semiconductor refrigeration high-power LED lamp |
| CN202521346U (en) * | 2012-04-24 | 2012-11-07 | 山西吉天利半导体照明有限公司 | Light emitting diode (LED) light source module cooled by adopting semiconductor cooler |
| CN103225928A (en) * | 2013-04-03 | 2013-07-31 | 安徽问天量子科技股份有限公司 | Active low-temperature water-proof radiating device and manufacturing method thereof |
| CN204029870U (en) * | 2014-06-10 | 2014-12-17 | 四川航天系统工程研究所 | A kind of semiconductor cooling device |
| US20160064638A1 (en) * | 2014-08-26 | 2016-03-03 | GM Global Technology Operations LLC | Encapsulation of high temperature thermoelectric modules |
| CN104964369A (en) * | 2015-07-20 | 2015-10-07 | 华中科技大学 | Semi-conductor radiation air conditioning device driven by solar energy |
| CN105072748A (en) * | 2015-07-31 | 2015-11-18 | 苏州宏展信息科技有限公司 | LED lamp tube heat dissipation control system based on low-noise amplifier |
| CN108014421A (en) * | 2016-11-02 | 2018-05-11 | 北京脑泰科技发展有限公司 | Heat radiator for through cranium stimulation appearance handle |
| CN207096756U (en) * | 2017-08-21 | 2018-03-13 | 陈玲 | A kind of intelligent constant-temperature electric bicycle saddle |
| WO2020034862A1 (en) * | 2018-08-15 | 2020-02-20 | 杭州海康机器人技术有限公司 | Camera |
| CN209246027U (en) * | 2019-01-30 | 2019-08-13 | 成都易明半导体有限公司 | A kind of heat dissipation structure of LED lamp based on semiconductor cooler |
| CN210052065U (en) * | 2019-08-16 | 2020-02-11 | 北京康威能特环境技术有限公司 | Miniature precision temperature control device |
| CN111830769A (en) * | 2020-08-05 | 2020-10-27 | 成都极米科技股份有限公司 | A novel cooling system for DMD of projecting apparatus |
| CN214707442U (en) * | 2021-01-18 | 2021-11-12 | 深圳市创想三维科技股份有限公司 | A motor intelligence temperature control device and 3D printer for 3D printer |
Non-Patent Citations (1)
| Title |
|---|
| 孙志利: "《制冷技术与装置实验教程》", 31 August 2018, 天津大学出版社, pages: 30 - 32 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103591730B (en) | Semiconductor refrigerating integrated system | |
| US10115881B2 (en) | Portable lighting device with thermoelectric power source | |
| CN105351899A (en) | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials | |
| CN112748633B (en) | Laser light source and laser projection equipment | |
| US20090167134A1 (en) | Light source module with high heat-dissipation efficiency | |
| CN105916359B (en) | Electronic equipment spontaneous-heating type electric radiator and its optimization method | |
| CN207573145U (en) | A kind of fire-proof motor of service life length | |
| CN105890066A (en) | Cooling device for circuit board of outdoor unit of variable frequency air conditioner and electric control box of outdoor unit of variable frequency air conditioner | |
| CN102299614A (en) | Semiconductor-refrigeration-based inverter radiating system | |
| CN207219278U (en) | A kind of electrical equipment and its radiator structure | |
| CN115113463A (en) | Heat dissipation device for heat source module and electronic equipment | |
| Hsu et al. | Experimental of ultra-high-power multichip COB LED: Thermal dissipation mode using a cycle approach of refrigeration | |
| CN204665201U (en) | A kind of thermo power generating heat radiator for LED lamp | |
| CN214477404U (en) | Heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and control loop thereof | |
| CN217062830U (en) | Wide temperature range laser instrument temperature control device | |
| CN209842547U (en) | High-efficiency energy-saving combined radiator | |
| CN212587489U (en) | Power module with good heat dissipation performance and electronic product | |
| CN112130644A (en) | Optical module heat dissipation equipment and server | |
| CN112968009A (en) | Heat pipe-semiconductor refrigeration combined electronic chip heat dissipation device and control loop thereof | |
| CN209451874U (en) | Semiconductors At Low Temperatures test case apparatus | |
| Liu et al. | Thermal analysis and comparison of heat dissipation methods on high-power LEDs | |
| CN108738281B (en) | Enhanced heat dissipation device and control method | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| KR200240139Y1 (en) | thermoelectric use of heating and cooling with realization unit | |
| CN217181118U (en) | High-power integrated LED light source temperature control heat dissipation experimental device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |