CN209451874U - Semiconductors At Low Temperatures test case apparatus - Google Patents
Semiconductors At Low Temperatures test case apparatus Download PDFInfo
- Publication number
- CN209451874U CN209451874U CN201821572814.2U CN201821572814U CN209451874U CN 209451874 U CN209451874 U CN 209451874U CN 201821572814 U CN201821572814 U CN 201821572814U CN 209451874 U CN209451874 U CN 209451874U
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- China
- Prior art keywords
- heater element
- semiconductor refrigerating
- micro
- control unit
- semiconductors
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Abstract
Semiconductors At Low Temperatures provided by the utility model test case apparatus, including infrared thermal imaging sensor, the input terminal of infrared thermal imaging sensor connection micro-control unit, the output end of micro-control unit is connected with one end of semiconductor refrigerating component, the other end of semiconductor refrigerating component is connected to heater element by being oriented to cold pipe, the cold pipe of guiding is equipped with the first spacing between one end and heater element of heater element, further includes the power supply unit to infrared thermal imaging sensor, micro-control unit and semiconductor refrigerating assembly power supply.It is taken pictures by infrared thermal imaging sensor to heater element, the photo for representing heater element different zones heat condition is transmitted to micro-control unit, the heat condition that micro-control unit is reacted according to photo, control semiconductor refrigerating component carries out refrigeration and generates cold wind, the cold wind of generation is transmitted to heater element by cold pipe is oriented to, cool down in such a way that Cryogenic air is blown over to heater element, to reduce the heat condition of heater element.
Description
Technical field
The utility model belongs to semiconductor field, in particular to Semiconductors At Low Temperatures test case apparatus.
Background technique
Traditional low-temperature test chamber is made of the principle based on compressor refrigeration, mainly by refrigerant, compressor, condenser
Equal components are constituted, and have many advantages, such as that principle is simple, technology maturation, suitable for occasions such as household electrical appliances application, large-scale industrial applications, but
It is to be not suitable for since structure is complicated, component is heavy in the occasion having higher requirements to volume, weight etc..
Various high/low temperature cold-traps based on conductor refrigeration principle pass through biography generally using semiconductor devices as cold source
The PID controller of system controls refrigerator.This device is suitable for the refrigeration applications under laboratory environment, has temperature control essence
The advantages that degree is high, no electromagnetic interference, but since power consumption is larger, be unfavorable for working in outdoor environment, while cost is compared to biography
The cold low-temperature test chamber of controlling obviously increases.
Utility model content
In order to solve shortcoming and defect existing in the prior art, the utility model provides Semiconductors At Low Temperatures chamber dress
It sets, for cooling down by the mode of semiconductor refrigerating to chamber.
In order to reach above-mentioned technical purpose, Semiconductors At Low Temperatures provided by the utility model test case apparatus, described device packet
It includes:
For obtaining the infrared thermal imaging sensor of the infrared image of heater element, the output end of infrared thermal imaging sensor
It is connected with the input terminal of micro-control unit, the output end of micro-control unit is connected with one end of semiconductor refrigerating component, semiconductor
The other end of cooling assembly is connected to heater element, the one end and hair of the cold pipe of guiding close to heater element by being oriented to cold pipe
It is equipped with the first spacing between thermal element, is equipped with motor being oriented in cold, flabellum is equipped on machine shaft；
It further include the power supply unit to infrared thermal imaging sensor, micro-control unit and semiconductor refrigerating assembly power supply.
Optionally, the semiconductor refrigerating component includes the refrigeration array being made of preset quantity semiconductor refrigerating element.
Optionally, between micro-control unit and semiconductor refrigerating component, it is additionally provided with system without deaerator unit.
Optionally, the system without deaerator unit includes the switch arrays being made of preset quantity noncontacting switch；
Wherein, each noncontacting switch controls the on-off in circuit locating for each semiconductor refrigerating element.
Optionally, noncontacting switch is p-type metal-oxide-semiconductor.
Technical solution provided by the utility model has the benefit that
By combining infrared thermal imaging sensor dynamic analysis by the heterogeneity phantom of cooling assembly, and using based on nerve net
The FUZZY ALGORITHMS FOR CONTROL of network is realized with digital signal processing chip and is controlled the contactless direct current of semiconductor chilling plate, dropped significantly
Low system power dissipation improves refrigeration effect, realizes and is existed in the field environment by small-power energy-storage system to power test instrument
The purpose that interior heater element is freezed rapidly.
Detailed description of the invention
It, below will be to needed in embodiment description in order to illustrate more clearly of the technical solution of the utility model
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are merely some embodiments of the present invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram of Semiconductors At Low Temperatures test case apparatus provided by the utility model；
Fig. 2 is the partial schematic diagram of Semiconductors At Low Temperatures test case apparatus provided by the utility model.
Specific embodiment
To keep the structure and advantage of the utility model clearer, make below in conjunction with structure of the attached drawing to the utility model
It is further described through.
Embodiment one
Semiconductors At Low Temperatures provided by the utility model test case apparatus, and described device includes:
For obtaining the infrared thermal imaging sensor of the infrared image of heater element, the output end of infrared thermal imaging sensor
It is connected with the input terminal of micro-control unit, the output end of micro-control unit is connected with one end of semiconductor refrigerating component, semiconductor
The other end of cooling assembly is connected to heater element, the one end and hair of the cold pipe of guiding close to heater element by being oriented to cold pipe
It is equipped with the first spacing between thermal element, is equipped with motor being oriented in cold, flabellum is equipped on machine shaft；
It further include the power supply unit to infrared thermal imaging sensor, micro-control unit and semiconductor refrigerating assembly power supply.
In an implementation, infrared thermal imaging sensor takes pictures to heater element for each prefixed time interval, will generation
The photo of table heater element different zones heat condition is transmitted to micro-control unit, the fever that micro-control unit is reacted according to photo
Situation, control semiconductor refrigerating component carry out refrigeration and generate cold wind, and the cold wind of generation is transmitted to fever member by cold pipe is oriented to
Part cools down to heater element in such a way that Cryogenic air is blown over, to reduce the heat condition of heater element.
In order to enhance the refrigeration effect to heater element, spy, which will lead, is spaced first between the end of forced air cooled tube and heater element
Spacing, and end is not directly attached to heater element surface.Processing in this way is to enable leading flabellum in forced air cooled tube and rotating and blow
Cold wind out generates the sinuous flow of random direction after contact heating element surface, increases the contact of cold air and heater element surface
Area enhances the heat dissipation effect to heater element.
Optionally, the semiconductor refrigerating component includes the refrigeration array being made of preset quantity semiconductor refrigerating element.
In an implementation, in order to improve the refrigerating efficiency of semiconductor refrigerating component, single semiconductor refrigerating component is replaced
For the refrigeration array of multiple semiconductor refrigerating elements composition.It, can be only open-minded in this way if the heating area of heater element is smaller
Part semiconductor cooling module can also save the energy consumption of power supply unit while meeting cooling demand, in a disguised form extend system
Cool time.
Optionally, between micro-control unit and semiconductor refrigerating component, it is additionally provided with system without deaerator unit.
In an implementation, in order to control semiconductor cooling assembly, micro-control unit and semiconductor refrigerating component it
Between be equipped with the system without deaerator unit of on-off action.Specific system without deaerator unit includes by preset quantity noncontacting switch
The switch arrays of composition；Each noncontacting switch controls the on-off in circuit locating for each semiconductor refrigerating element.
Here why system without deaerator unit is used, contact is easy to produce when on off operating mode switches in order to prevent
Tip electrion phenomenon extends the service life of semiconductor refrigerating component.
In addition under the premise of semiconductor refrigerating component is using refrigeration array, system without deaerator unit also uses switch arrays
Building form, and each noncontacting switch is made to control the on-off in circuit locating for each semiconductor refrigerating element.
Can be enabled after being arranged in this way micro-control unit by noncontacting switch to the work of each semiconductor refrigerating element into
The accurate control of row, thus partly leading according to the degree of heat of heater element even heating region selection corresponding position or corresponding number
Body cooling module carries out refrigerating operation, and energy consumption is equally reduced while meeting refrigeration demand.
Optionally, noncontacting switch is p-type metal-oxide-semiconductor.
Semiconductors At Low Temperatures provided by the utility model test case apparatus, including infrared thermal imaging sensor, infrared thermal imaging
The input terminal of the output end connection micro-control unit of sensor, the output end of micro-control unit are connected with semiconductor refrigerating component
One end, the other end of semiconductor refrigerating component are connected to heater element by being oriented to cold pipe, and the cold pipe of guiding is close to fever member
It is equipped with the first spacing between one end and heater element of part, further includes to infrared thermal imaging sensor, micro-control unit and half
The power supply unit of conductor cooling assembly power supply.It is taken pictures by infrared thermal imaging sensor to heater element, is generated heat representing
The photo of element different zones heat condition is transmitted to micro-control unit, the heat condition that micro-control unit is reacted according to photo,
Control semiconductor refrigerating component carries out refrigeration and generates cold wind, and the cold wind of generation is transmitted to heater element by cold pipe is oriented to, with
The mode that Cryogenic air is blown over cools down to heater element, to reduce the heat condition of heater element.
Each serial number in above-described embodiment is for illustration only, the assembling for not representing each component or the elder generation in use process
Sequence afterwards.
The above description is only the embodiments of the present invention, is not intended to limit the utility model, all in the utility model
Spirit and principle within, any modification, equivalent replacement, improvement and so on should be included in the protection model of the utility model
Within enclosing.
Claims (5)
1. Semiconductors At Low Temperatures test case apparatus, which is characterized in that described device includes:
For obtaining the infrared thermal imaging sensor of the infrared image of heater element, the output end connection of infrared thermal imaging sensor
There is the input terminal of micro-control unit, the output end of micro-control unit is connected with one end of semiconductor refrigerating component, semiconductor refrigerating
The other end of component is connected to heater element, the one end and fever member of the cold pipe of guiding close to heater element by being oriented to cold pipe
It is equipped with the first spacing between part, is equipped with motor being oriented in cold, flabellum is equipped on machine shaft；
It further include the power supply unit to infrared thermal imaging sensor, micro-control unit and semiconductor refrigerating assembly power supply.
2. Semiconductors At Low Temperatures according to claim 1 test case apparatus, which is characterized in that the semiconductor refrigerating component packet
Include the refrigeration array being made of preset quantity semiconductor refrigerating element.
3. Semiconductors At Low Temperatures according to claim 2 test case apparatus, which is characterized in that in micro-control unit and semiconductor
Between cooling assembly, it is additionally provided with system without deaerator unit.
4. Semiconductors At Low Temperatures according to claim 3 test case apparatus, which is characterized in that the system without deaerator unit packet
Include the switch arrays being made of preset quantity noncontacting switch；
Wherein, each noncontacting switch controls the on-off in circuit locating for each semiconductor refrigerating element.
5. Semiconductors At Low Temperatures according to claim 4 test case apparatus, which is characterized in that noncontacting switch is p-type MOS
Pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821572814.2U CN209451874U (en) | 2018-09-26 | 2018-09-26 | Semiconductors At Low Temperatures test case apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821572814.2U CN209451874U (en) | 2018-09-26 | 2018-09-26 | Semiconductors At Low Temperatures test case apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209451874U true CN209451874U (en) | 2019-10-01 |
Family
ID=68036330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821572814.2U Expired - Fee Related CN209451874U (en) | 2018-09-26 | 2018-09-26 | Semiconductors At Low Temperatures test case apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209451874U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109107627A (en) * | 2018-09-26 | 2019-01-01 | 国网浙江省电力有限公司宁波供电公司 | Semiconductors At Low Temperatures test case apparatus |
-
2018
- 2018-09-26 CN CN201821572814.2U patent/CN209451874U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109107627A (en) * | 2018-09-26 | 2019-01-01 | 国网浙江省电力有限公司宁波供电公司 | Semiconductors At Low Temperatures test case apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191001 Termination date: 20200926 |