CN112923600A - Semiconductor thermoelectric material refrigeration platform - Google Patents
Semiconductor thermoelectric material refrigeration platform Download PDFInfo
- Publication number
- CN112923600A CN112923600A CN202110268303.1A CN202110268303A CN112923600A CN 112923600 A CN112923600 A CN 112923600A CN 202110268303 A CN202110268303 A CN 202110268303A CN 112923600 A CN112923600 A CN 112923600A
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- Prior art keywords
- refrigeration
- platform
- semiconductor
- temperature
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D1/00—Devices using naturally cold air or cold water
- F25D1/02—Devices using naturally cold air or cold water using naturally cold water, e.g. household tap water
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of refrigeration, relates to refrigeration equipment of an open working platform, and particularly relates to a semiconductor thermoelectric material refrigeration platform. In order to solve the prior art problem, a semiconductor thermoelectric material refrigeration platform is provided, including semiconductor refrigeration potsherd, water circulation cooling system, temperature monitoring and control system, work platform, semiconductor refrigeration potsherd top surface and work platform contact, semiconductor refrigeration potsherd bottom surface and water circulation cooling system contact, temperature monitoring and control system are connected with work platform, semiconductor refrigeration potsherd respectively. The device has the advantages of energy conservation, environmental protection, low cost, small occupied space and suitability for open space, and can provide a working platform with a temperature range from room temperature to minus 40 ℃ and capable of freely adjusting the temperature for users to use.
Description
Technical Field
The invention belongs to the technical field of refrigeration, relates to refrigeration equipment of an open working platform, and particularly relates to a semiconductor thermoelectric material refrigeration platform.
Background
Refrigeration is an indispensable link in both life and industrial production. Cooling means are also increasingly widespread, for example: freon used in the early stage of a common household refrigerator air-conditioning compressor is used as a refrigerant, and cooling tower water cooling is used in industrial production. However, the common refrigeration equipment in the market is closed equipment, and some work needs to be performed on an open platform with lower temperature, so that the equipment in the market is too large, not environment-friendly and higher in cost. A small refrigeration device that provides an open platform would greatly reduce the cost of research and production processes.
Disclosure of Invention
The invention provides a refrigeration device applied to an open working platform, aiming at solving the technical problems of huge volume, high cost and environmental pollution of the existing refrigeration device, and the invention researches and develops a semiconductor thermoelectric material refrigeration platform which can provide an open low-temperature working platform with the temperature kept between minus 40 ℃ and 0 ℃, and the temperature can be customized by a user according to the use requirement and can be accurately controlled.
The semiconductor thermoelectric material refrigeration platform comprises a semiconductor refrigeration ceramic wafer, a water circulation cooling system, a temperature monitoring and control system and a working platform, wherein the top surface of the semiconductor refrigeration ceramic wafer is contacted with the working platform, the bottom surface of the semiconductor refrigeration ceramic wafer is contacted with the water circulation cooling system, and the temperature monitoring and control system is respectively connected with the working platform and the semiconductor refrigeration ceramic wafer.
The temperature monitoring and controlling system comprises a direct current power supply, a DC voltage current regulator, a temperature sensor and a temperature control chip, wherein the temperature sensor is arranged on the working platform and is electrically connected with the temperature control chip, and the DC voltage current regulator is electrically connected with the semiconductor refrigeration ceramic chip.
The working voltage range of the semiconductor refrigeration ceramic plate is 12V-18V, and the working current range is 1A-5A.
The working temperature of the working platform is-40 ℃ to 0 ℃, and the temperature control precision is +/-0.05 ℃.
The semiconductor refrigeration ceramic chip is a semiconductor refrigeration ceramic chip group arranged in an array.
The water circulation cooling system comprises a pressurizing silent water pump or a submersible pump.
The lower surface of the working platform is provided with heat insulation cotton.
The invention has the beneficial effects that:
the refrigeration platform is suitable for an open working platform, and the semiconductor refrigeration ceramic plate is used as a special cold source, so that the refrigeration platform has the advantages of no need of any refrigerant, continuous working, no pollution source, no vibration and no noise during working and the like;
the water circulation cooling system is in direct contact with the hot end of the semiconductor refrigeration ceramic piece to dissipate heat of the semiconductor refrigeration ceramic piece, so that the whole equipment is not overheated in the operation process, and the operation stability and safety of the equipment are ensured;
the semiconductor refrigeration ceramic wafer is a semiconductor refrigeration ceramic wafer group arranged in an array. The semiconductor refrigeration ceramic plates are main refrigeration components and are in close contact with the water circulation cooling system, and a plurality of semiconductor refrigeration ceramic plates can be adopted to form an array if necessary, so that the working area is increased;
the water circulation cooling system comprises a pressurizing silent water pump or a submersible pump, and can complete the heat dissipation work of the semiconductor refrigeration ceramic wafer with high efficiency and low noise;
the lower surface of the working platform is wrapped by heat insulation cotton, so that the influence of the ambient air temperature on the temperature of the working platform is reduced;
the semiconductor refrigeration ceramic chip is refrigerated during working, and the water circulation cooling system supplies water through the water pump to cool and radiate the semiconductor refrigeration ceramic chip, so that the semiconductor refrigeration ceramic chip is maintained at a stable working temperature, and the normal work of the semiconductor refrigeration ceramic chip is ensured. The temperature monitoring and control system monitors the temperature of the working platform in real time through the temperature sensor fixed on the working platform, and the stability and the accuracy of the temperature are guaranteed. Meanwhile, the temperature monitoring and controlling system can enable a user to self-define the working temperature and the temperature control precision according to the use requirement of the user. The temperature control chip controls and maintains the temperature stability of the working platform, and the use requirement is met.
The present invention will be described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the work platform, the semiconductor refrigeration ceramic plate and the water circulation cooling system in FIG. 1;
in the attached drawing, 1 is a working platform, 2 is a semiconductor refrigeration ceramic wafer, 3 is a water circulation cooling system, 4 is a direct current power supply, 5 is a DC voltage current regulator, 6 is a temperature sensor, 7 is a temperature control chip, and 8 is heat insulation cotton.
Detailed Description
As shown in fig. 1 and 2, a semiconductor thermoelectric material refrigeration platform comprises a semiconductor refrigeration ceramic wafer 2, a water circulation cooling system 3, a temperature monitoring and control system and a working platform 1, wherein the top surface of the semiconductor refrigeration ceramic wafer 2 is in contact with the working platform 1, and the bottom surface of the semiconductor refrigeration ceramic wafer 2 is in contact with the water circulation cooling system 3. When the semiconductor refrigeration ceramic wafer 2 is placed, the cold end temperature is directly contacted with the working platform 1 to cool the working platform 1; the hot end temperature and the water circulation cooling system 3 are directly contacted for heat dissipation, so that the forward and reverse heat transfer are prevented from being offset, and the temperature is lower. The temperature monitoring and controlling system is respectively connected with the working platform 1 and the semiconductor refrigeration ceramic plate 2.
The temperature monitoring and controlling system comprises a direct current power supply 4, a DC voltage current regulator 5, a temperature sensor 6 and a temperature control chip 7, wherein the temperature sensor 6 is arranged on the working platform 1 and is electrically connected with the temperature control chip 7; the temperature sensor 6 can monitor the temperature condition of the working platform 1 in real time and transmit data to the temperature control chip 7. The working temperature of the working platform 1 is-40 ℃ to 0 ℃, and the temperature control precision is +/-0.05 ℃. The temperature control chip 7 can enable a user to define the working temperature and the temperature control precision of the working platform 1, and provide a working platform with stable temperature for the user.
The DC voltage regulator 5 is electrically connected with the semiconductor refrigeration ceramic plate 2; the DC voltage current regulator 5 can enable a user to customize the working voltage and current of the semiconductor refrigeration ceramic plate 2, thereby controlling the working power. The working voltage range of the semiconductor refrigeration ceramic plate 2 is 12V-18V, the working current range is 1A-5A, and different working powers can be used within the usable power range according to different use requirements.
The semiconductor refrigeration ceramic wafer 2 is a semiconductor refrigeration ceramic wafer group arranged in an array. The semiconductor refrigeration ceramic chip 2 is a main refrigeration component and is in close contact with the water circulation cooling system 3, and a plurality of semiconductor refrigeration ceramic chips 2 can be adopted to form an array if necessary, so that the working area is increased.
The water circulation cooling system 3 comprises a pressurizing silent water pump or a submersible pump, and can complete the heat dissipation work of the semiconductor refrigeration ceramic wafer 2 with high efficiency and low noise.
The lower surface of the working platform 1 is provided with heat insulation cotton 8, so that the influence of the ambient temperature on the temperature of the working platform 1 is weakened.
When the equipment works, the semiconductor refrigeration ceramic wafer 2 continuously refrigerates the working platform 1, the temperature monitoring and control system monitors the temperature of the working platform 1 in real time and ensures stable temperature, and the water circulation cooling system 3 ensures that the whole equipment is not overheated in the operation process and ensures the operation stability and safety of the equipment. The device can provide a working platform 1 with a temperature range of-40 ℃ to 0 ℃ and capable of freely adjusting the temperature for users to use.
The invention, in particular use: when the semiconductor refrigeration ceramic plate 2 works, the water circulation cooling system 3 is started simultaneously, and the temperature sensor 6 transmits the temperature of the working platform 1 to the temperature control chip 7. The user can adjust the working power of the semiconductor refrigeration ceramic wafer 2 through the DC voltage regulator 5, the DC voltage regulator 5 is provided with a voltage and current control knob, and the user can manually adjust and control the working power of the semiconductor refrigeration ceramic wafer 2 within the working voltage range and the current range according to the use requirement. The temperature of the working platform 1 is controlled by the temperature control chip 7, and finally the temperature of the working platform 1 meets the use requirement of a user.
The direct current power supply 4 supplies power for the temperature monitoring and control system, a user defines the working temperature and the temperature control precision required by the working platform 1 through the temperature control chip 7, and the power of the semiconductor refrigeration ceramic wafer 2 is controlled through the DC voltage current regulator 5. The user sets for the operating temperature and the temperature control precision of work platform 1 through temperature control chip 7, and temperature sensor 6 obtains data transfer for temperature control chip 7, and when work platform 1 actual temperature was higher than the settlement temperature (the temperature difference is greater than the temperature control precision), temperature control chip 7 guaranteed that semiconductor refrigeration potsherd 2 lasts the work until reaching the temperature of settlement. If the actual temperature of the working platform 1 is lower than the set temperature (the temperature difference is greater than the temperature control precision), the temperature control chip 7 cuts off the power of the semiconductor refrigeration ceramic wafer 2 until the temperature reaches the set temperature. The DC voltage and current regulator 5 is responsible for regulating the magnitude of the working voltage and the magnitude of the working current, and ensures that the equipment works stably. In some use scenes, the working efficiency can be improved by increasing the working current and voltage and increasing the power of the semiconductor refrigeration ceramic plate 2.
Claims (7)
1. A semiconductor thermoelectric material refrigeration platform is characterized in that: the semiconductor refrigeration ceramic wafer temperature monitoring and controlling system comprises a semiconductor refrigeration ceramic wafer (2), a water circulation cooling system (3), a temperature monitoring and controlling system and a working platform (1), wherein the top surface of the semiconductor refrigeration ceramic wafer (2) is in contact with the working platform (1), the bottom surface of the semiconductor refrigeration ceramic wafer (2) is in contact with the water circulation cooling system (3), and the temperature monitoring and controlling system is respectively connected with the working platform (1) and the semiconductor refrigeration ceramic wafer (2).
2. A semiconductor thermoelectric material refrigeration platform as recited in claim 1 wherein: the temperature monitoring and controlling system comprises a direct current power supply (4), a DC voltage current regulator (5), a temperature sensor (6) and a temperature control chip (7), wherein the temperature sensor (6) is arranged on the working platform (1) and is electrically connected with the temperature control chip (7), and the DC voltage current regulator (5) is electrically connected with the semiconductor refrigerating ceramic plate (2).
3. A semiconductor thermoelectric material refrigeration platform as recited in claim 1 wherein: the working voltage range of the semiconductor refrigeration ceramic plate (2) is 12V-18V, and the working current range is 1A-5A.
4. A semiconductor thermoelectric material refrigeration platform as recited in claim 1 wherein: the working temperature of the working platform (1) is-40-0 ℃, and the temperature control precision is +/-0.05 ℃.
5. A semiconductor thermoelectric material refrigeration platform as recited in claim 1 wherein: the semiconductor refrigeration ceramic chip (2) is a semiconductor refrigeration ceramic chip group arranged in an array.
6. A semiconductor thermoelectric material refrigeration platform as recited in claim 1 wherein: the water circulation cooling system (3) comprises a pressurizing silent water pump or a submersible pump.
7. A semiconductor thermoelectric material refrigeration platform as recited in claim 1 wherein: the lower surface of the working platform (1) is provided with heat insulation cotton (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110268303.1A CN112923600A (en) | 2021-03-11 | 2021-03-11 | Semiconductor thermoelectric material refrigeration platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110268303.1A CN112923600A (en) | 2021-03-11 | 2021-03-11 | Semiconductor thermoelectric material refrigeration platform |
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| Publication Number | Publication Date |
|---|---|
| CN112923600A true CN112923600A (en) | 2021-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110268303.1A Pending CN112923600A (en) | 2021-03-11 | 2021-03-11 | Semiconductor thermoelectric material refrigeration platform |
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| CN (1) | CN112923600A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230189483A1 (en) * | 2021-12-15 | 2023-06-15 | Johnson Controls Tyco IP Holdings LLP | Reprogrammable smart actuator or refrigerated cabinet with web server |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10153373A (en) * | 1996-11-22 | 1998-06-09 | Mitsubishi Heavy Ind Ltd | Cooler/heater |
| CN203629178U (en) * | 2013-10-23 | 2014-06-04 | 深圳先进技术研究院 | Semiconductor temperature control and storage device |
| CN107763884A (en) * | 2017-11-17 | 2018-03-06 | 陕西启源科技发展有限责任公司 | Semiconductor refrigeration system |
| CN212013385U (en) * | 2020-05-08 | 2020-11-24 | 博斯科技股份有限公司 | Cooling structure and cooling system for semiconductor manufacturing process |
-
2021
- 2021-03-11 CN CN202110268303.1A patent/CN112923600A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10153373A (en) * | 1996-11-22 | 1998-06-09 | Mitsubishi Heavy Ind Ltd | Cooler/heater |
| CN203629178U (en) * | 2013-10-23 | 2014-06-04 | 深圳先进技术研究院 | Semiconductor temperature control and storage device |
| CN107763884A (en) * | 2017-11-17 | 2018-03-06 | 陕西启源科技发展有限责任公司 | Semiconductor refrigeration system |
| CN212013385U (en) * | 2020-05-08 | 2020-11-24 | 博斯科技股份有限公司 | Cooling structure and cooling system for semiconductor manufacturing process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230189483A1 (en) * | 2021-12-15 | 2023-06-15 | Johnson Controls Tyco IP Holdings LLP | Reprogrammable smart actuator or refrigerated cabinet with web server |
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Application publication date: 20210608 |
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