CN203629178U - Semiconductor temperature control and storage device - Google Patents
Semiconductor temperature control and storage device Download PDFInfo
- Publication number
- CN203629178U CN203629178U CN201320656711.5U CN201320656711U CN203629178U CN 203629178 U CN203629178 U CN 203629178U CN 201320656711 U CN201320656711 U CN 201320656711U CN 203629178 U CN203629178 U CN 203629178U
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- Prior art keywords
- semiconductor
- temperature
- water
- storage device
- control
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 68
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 239000004519 grease Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 240000008067 Cucumis sativus Species 0.000 description 1
- 235000010799 Cucumis sativus var sativus Nutrition 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a semiconductor temperature control and storage device. The semiconductor temperature control and storage device comprises a tank. The tank is internally provided with a semiconductor refrigerating system, a water circulation system and a control chip, wherein the semiconductor refrigerating system comprises a semiconductor refrigerating sheet; one end of the semiconductor refrigerating sheet is connected with a water cooler, and heat exchange is achieved between the semiconductor refrigerating sheet and liquid in the water cooler; the other end of the semiconductor refrigerating sheet is connected with a cooling fin, and heat exchange is carried out between the other end of the semiconductor refrigerating sheet and the exterior of the tank; heat exchange is achieved between the water circulation system and the semiconductor refrigerating sheet; the control chip comprises a single chip microcomputer driving the water circulation system and the semiconductor refrigerating system; the volume of the tank ranges from 1 cubic decimeter to 10 cubic decimeters; the temperature in the tank is controlled to be 0-40 DEG C. The semiconductor temperature control and storage device is simple in structure, low in manufacturing cost and suitable for constant-temperature and sealed storage of small articles.
Description
Technical field
The utility model relates to a kind of storage device, relates in particular to a kind of semiconductor temperature-control storage device.
Background technology
The class paper that test strips refers to is impregnated with chemicals, can exist by Cucumber in its change color detecting liquid or gas, the preservation General Requirements of test strips (such as blood sugar test paper bar) is in temperature more than 2 degrees Celsius below 30 degrees Celsius.Not so the general recommendations user of test paper manufacturer can cause test paper to shift to an earlier date expired invalid within test paper is kept to reasonable temperature scope, does not provide preservation equipment but test paper manufacturer etc. are many, so general user is placed on the shady and cool place of family or refrigerator voluntarily.Test paper is kept at domestic refrigerator by a lot of users, but preserving, test paper needs dry lucifuge, and suffocating of need preventing that children from touching that test paper cylinder may cause and suck or swallow the drier in test paper cylinder and the injury that causes, preserves so be generally not suitable for being placed on domestic refrigerator.
Utility model content
For the above-mentioned the deficiencies in the prior art of mentioning, the utility model proposes a kind of semiconductor temperature-control storage device, this temperature control storage device is simple in structure, low cost of manufacture, the constant temperature sealing that is suitable for the article of smaller size smaller is preserved.
To achieve these goals, the utility model has adopted following technical scheme:
A kind of semiconductor temperature-control storage device, comprises a casing, wherein, in described casing, is provided with:
Semiconductor refrigeration system, comprises semiconductor cooling piece, and described semiconductor chilling plate is to connect by a N-type semiconductor material and a P-type semiconductor material thermocouple pair forming; One end of described semiconductor chilling plate is connected with water-cooling head, carries out heat exchange with the liquid in water-cooling head, and the other end is connected with a fin, carries out heat exchange with the outside of described casing;
Water circulation system, comprises water tank, immersible pump, water-cooling head and water row, and the water in water tank provides power to arrange by water-cooling head and water successively by described immersible pump, is finally back in water tank; Described water is arranged in described casing, is purged and provided cold wind or hot blast in described casing by a fan;
Control chip, comprises a single-chip microcomputer, controls described immersible pump and described fan to drive described water circulation system; Control described semiconductor chilling plate, make described thermocouple to realizing heat transmission;
Wherein, the volume scope of described casing is 1～10 cubic decimeter; In described casing, temperature controlling range is 0～40 ℃.
Preferably, the volume scope of described casing is 2～8 cubic decimeters; In described casing, temperature controlling range is 10～37 ℃.
Preferably, one end of described semiconductor chilling plate is connected with described water-cooling head by heat-conducting silicone grease, and the other end is connected with described fin by heat-conducting silicone grease.
Preferably, this device also comprises power module, and it is 12V that voltage is provided, the power supply that electric current is 6A.
Preferably, described control chip is by controlling the sense of current in described semiconductor chilling plate, to control one end that described semiconductor chilling plate is connected with described water-cooling head as cold junction or hot junction.
Preferably, described control chip is by controlling the size of current in described semiconductor chilling plate, to control the temperature of one end that described semiconductor chilling plate is connected with described water-cooling head.
Preferably, this device also comprises a temperature sensor, and described temperature sensor is connected with described control chip, for monitoring the temperature in described casing.
Preferably, this device also comprises a coded lock and numeric keypad.
Preferably, this device also comprises section-type LCD, is connected to described control chip.
Compared with prior art, the utility model heats by semiconductor chilling plate or freezes, and provides cold wind or hot blast by water circulation system to memory space, reaches the object that heats up or lower the temperature, and realizes temperature control; Meanwhile, storage device provided by the invention is also provided with coded lock, prevents children and the uncorrelated personnel article of depositing of by mistake going bail for; This device is also provided with temperature sensor and section-type LCD, can comparatively accurately control the temperature of storage area; This temperature control storage device is simple in structure, low cost of manufacture, and the constant temperature sealing that is suitable for the article of smaller size smaller is preserved.
Accompanying drawing explanation
The structured flowchart that Fig. 1 is the semiconductor temperature-control storage device that provides in the utility model one embodiment.
The specific embodiment
The utility model is described further with embodiment below in conjunction with accompanying drawing.
As previously mentioned, in view of the deficiency that prior art exists, the utility model proposes a kind of semiconductor temperature-control storage device, as shown in Figure 1, this device comprises casing (not expressing in accompanying drawing), wherein, in described casing, is provided with:
Water circulation system 2, comprises water tank 201, immersible pump 202, water-cooling head 203 and water row 204, and the water in water tank 201 provides power successively by water-cooling head 203 and water row 204 by immersible pump 202, is finally back in water tank 201; Described water row 204, in described casing, is purged in described casing cold wind or hot blast is provided by a fan 205, reaches the object that heats up or lower the temperature, and realizes temperature control;
In the present embodiment, the volume of described casing is 8 cubic decimeters; In described casing, temperature controlling range is 10～37 ℃; In some other embodiment, the scope that the volume of casing can be selected is 1～10 cubic decimeter, and in casing, temperature controlling range can be 0～40 ℃.
In the present embodiment, the supply voltage that described temperature control storage device uses is 12V, and electric current is 6A.
In the present embodiment, described temperature control storage device also comprises temperature sensor (not indicating in accompanying drawing), coded lock 4, numeric keypad 6 and section-type LCD 5, is connected respectively to described control chip 1; Wherein, temperature sensor is for monitoring the temperature in described casing, and this temperature can be shown by section-type LCD 5; Can lock 4 password and set the temperature in casing by setting code by numeric keypad 6, these parameters can be shown by section-type LCD 5.
In sum, the semiconductor temperature-control storage device that the utility model provides, is heated or is freezed by semiconductor chilling plate, provides cold wind or hot blast by water circulation system to memory space, reaches the object that heats up or lower the temperature, and realizes temperature control; Meanwhile, the storage device that the utility model provides is also provided with coded lock, prevents children and the uncorrelated personnel article of depositing of by mistake going bail for; This device is also provided with temperature sensor and section-type LCD, can control comparatively accurately the temperature of storage area; This temperature control storage device is simple in structure, low cost of manufacture, and the constant temperature sealing that is suitable for the article of smaller size smaller is preserved.
The above is only the application's the specific embodiment; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the application's protection domain.
Claims (9)
1. a semiconductor temperature-control storage device, comprises a casing, it is characterized in that, in described casing, is provided with:
Semiconductor refrigeration system, comprises semiconductor cooling piece, and described semiconductor chilling plate is to connect by a N-type semiconductor material and a P-type semiconductor material thermocouple pair forming; One end of described semiconductor chilling plate is connected with water-cooling head, carries out heat exchange with the liquid in water-cooling head, and the other end is connected with a fin, carries out heat exchange with the outside of described casing;
Water circulation system, comprises water tank, immersible pump, water-cooling head and water row, and the water in water tank provides power to arrange by water-cooling head and water successively by described immersible pump, is finally back in water tank; Described water is arranged in described casing, is purged and provided cold wind or hot blast in described casing by a fan;
Control chip, comprises a single-chip microcomputer, controls described immersible pump and described fan to drive described water circulation system; Control described semiconductor chilling plate, make described thermocouple to realizing heat transmission;
Wherein, the volume scope of described casing is 1～10 cubic decimeter; In described casing, temperature controlling range is 0～40 ℃.
2. semiconductor temperature-control storage device according to claim 1, is characterized in that, the volume scope of described casing is 2～8 cubic decimeters; In described casing, temperature controlling range is 10～37 ℃.
3. semiconductor temperature-control storage device according to claim 1, is characterized in that, one end of described semiconductor chilling plate is connected with described water-cooling head by heat-conducting silicone grease, and the other end is connected with described fin by heat-conducting silicone grease.
4. semiconductor temperature-control storage device according to claim 1, is characterized in that, this device also comprises power module, and it is 12V that voltage is provided, the power supply that electric current is 6A.
5. semiconductor temperature-control storage device according to claim 4, it is characterized in that, described control chip is by controlling the sense of current in described semiconductor chilling plate, to control one end that described semiconductor chilling plate is connected with described water-cooling head as cold junction or hot junction.
6. semiconductor temperature-control storage device according to claim 5, is characterized in that, described control chip is by controlling the size of current in described semiconductor chilling plate, to control the temperature of one end that described semiconductor chilling plate is connected with described water-cooling head.
7. semiconductor temperature-control storage device according to claim 1, is characterized in that, this device also comprises a temperature sensor, and described temperature sensor is connected with described control chip, for monitoring the temperature in described casing.
8. semiconductor temperature-control storage device according to claim 1, is characterized in that, this device also comprises a coded lock and numeric keypad.
9. according to the arbitrary described semiconductor temperature-control storage device of claim 1-8, it is characterized in that, this device also comprises section-type LCD, is connected to described control chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320656711.5U CN203629178U (en) | 2013-10-23 | 2013-10-23 | Semiconductor temperature control and storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320656711.5U CN203629178U (en) | 2013-10-23 | 2013-10-23 | Semiconductor temperature control and storage device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203629178U true CN203629178U (en) | 2014-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320656711.5U Expired - Lifetime CN203629178U (en) | 2013-10-23 | 2013-10-23 | Semiconductor temperature control and storage device |
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| Country | Link |
|---|---|
| CN (1) | CN203629178U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110470071A (en) * | 2019-08-13 | 2019-11-19 | 森泰英格（成都）数控刀具股份有限公司 | Contact thermal insert knife handle cooling system and method based on semiconductor refrigerating |
| CN112923600A (en) * | 2021-03-11 | 2021-06-08 | 郑州大学 | Semiconductor thermoelectric material refrigeration platform |
-
2013
- 2013-10-23 CN CN201320656711.5U patent/CN203629178U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110470071A (en) * | 2019-08-13 | 2019-11-19 | 森泰英格（成都）数控刀具股份有限公司 | Contact thermal insert knife handle cooling system and method based on semiconductor refrigerating |
| CN112923600A (en) * | 2021-03-11 | 2021-06-08 | 郑州大学 | Semiconductor thermoelectric material refrigeration platform |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140604 |
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| CX01 | Expiry of patent term |