CN114992949B - Refrigerating and freezing device and control method thereof - Google Patents
Refrigerating and freezing device and control method thereof Download PDFInfo
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- CN114992949B CN114992949B CN202110228854.5A CN202110228854A CN114992949B CN 114992949 B CN114992949 B CN 114992949B CN 202110228854 A CN202110228854 A CN 202110228854A CN 114992949 B CN114992949 B CN 114992949B
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- 238000007710 freezing Methods 0.000 title claims abstract description 50
- 230000008014 freezing Effects 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000005057 refrigeration Methods 0.000 claims abstract description 176
- 239000004065 semiconductor Substances 0.000 claims abstract description 160
- 230000006835 compression Effects 0.000 claims description 23
- 238000007906 compression Methods 0.000 claims description 23
- 230000008859 change Effects 0.000 claims description 16
- 239000003507 refrigerant Substances 0.000 claims description 15
- 230000015654 memory Effects 0.000 claims description 9
- 238000004590 computer program Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 description 8
- 238000005265 energy consumption Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 235000013305 food Nutrition 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
- F25D11/022—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures with two or more evaporators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2700/00—Means for sensing or measuring; Sensors therefor
- F25D2700/12—Sensors measuring the inside temperature
- F25D2700/121—Sensors measuring the inside temperature of particular compartments
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- Mechanical Engineering (AREA)
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- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a refrigeration and freezing device and a control method thereof, the refrigeration and freezing device comprises a box body limited with a variable temperature chamber and a semiconductor refrigeration system used for adjusting the temperature of the variable temperature chamber, and the control method comprises the following steps: detecting the actual temperature of the variable-temperature chamber, acquiring the set temperature of the variable-temperature chamber, judging the temperature set range in which the set temperature is located, and controlling the semiconductor refrigeration system according to the temperature set range and the actual temperature. The refrigeration and freezing device and the control method thereof prescribe different temperature setting ranges for the temperature changing chamber, and control the semiconductor refrigeration system according to the actual temperature of the temperature changing chamber and the temperature setting range where the setting temperature is located, thereby realizing wide temperature changing and meeting different storage requirements of users.
Description
Technical Field
The invention relates to the technical field of refrigeration and freezing storage, in particular to a refrigeration and freezing device and a control method thereof.
Background
With the improvement of living standard of people, the demand for diversification of food materials is more and more increased, the long-term storage requirement cannot be met by the low-temperature storage condition of below-35 ℃ and below for some special food materials such as deep-sea fish, and the storage temperature of about 10 ℃ is required for some food materials such as tropical fruits. Therefore, the refrigeration and freezing device with wide variable temperature chambers (20 to minus 45 ℃) can meet the requirements of different users.
The semiconductor refrigeration mode has long been used, and is characterized by that when the forward voltage is switched on, the cold end is used for refrigeration, and the hot end is used for heating. In the existing refrigerating and freezing device, forward voltage is generally applied to the semiconductor refrigerating device to reduce the temperature of the compartment, so that the compartment is maintained at a low temperature, and wide temperature change of the compartment cannot be realized.
Disclosure of Invention
It is an object of the present invention to provide a refrigerating and freezing apparatus and a control method thereof which solve at least the above problems.
A further object of the invention is to reduce energy consumption and to increase refrigeration efficiency.
In particular, according to one aspect of the present invention, there is provided first a control method of a refrigeration and freezing apparatus including a case defining a variable temperature compartment, a semiconductor refrigeration system for adjusting a temperature of the variable temperature compartment, wherein the control method includes:
detecting the actual temperature of the variable-temperature chamber;
acquiring the set temperature of the variable temperature chamber;
judging the temperature setting range of the set temperature;
and controlling the semiconductor refrigeration system according to the temperature setting range and the actual temperature.
Optionally, the step of controlling the semiconductor refrigeration system according to the temperature setting range and the actual temperature comprises:
if the temperature setting range is larger than a first temperature preset value, and the first temperature preset value is larger than or equal to 0 ℃, judging whether the actual temperature is smaller than or equal to a first shutdown temperature;
if so, applying reverse voltage to the semiconductor refrigeration system to enable the semiconductor refrigeration system to provide heat for the temperature-changing chamber;
judging whether the actual temperature is greater than a first starting temperature or not;
if so, stopping supplying power to the semiconductor refrigeration system.
Optionally, the step of controlling the semiconductor refrigeration system according to the temperature setting range and the actual temperature further comprises:
if the temperature setting range is smaller than a second temperature preset value, and the second temperature preset value is smaller than 0 ℃, judging whether the actual temperature is larger than a second starting temperature or not;
if so, applying forward voltage to the semiconductor refrigeration system to enable the semiconductor refrigeration system to provide cold energy for the temperature-changing chamber;
judging whether the actual temperature is less than or equal to a second shutdown temperature;
if so, stopping supplying power to the semiconductor refrigeration system.
Optionally, the semiconductor refrigeration system comprises a hot heat exchanger, a cold heat exchanger, and a semiconductor chip between the hot heat exchanger and the cold heat exchanger, the semiconductor chip having the hot side and the cold side, the hot heat exchanger being partially bonded to the hot side, the cold heat exchanger being partially bonded to the cold side, the cold heat exchanger being configured to provide cooling to the temperature-changing chamber when a forward voltage is applied to the semiconductor chip and to provide heat to the temperature-changing chamber when a reverse voltage is applied to the semiconductor chip;
the refrigerating and freezing device also comprises a compression refrigeration system, the compression refrigeration system comprises a compressor and a capillary tube, and the heat exchanger is arranged between the outlet of the capillary tube and the inlet of the compressor; so that the refrigerant of the compression refrigeration system flows through the hot heat exchanger to exchange heat with the hot end;
the step of controlling the semiconductor refrigeration system according to the temperature setting range and the actual temperature further comprises:
if the temperature setting range is greater than or equal to a second temperature preset value and less than or equal to a first temperature preset value, stopping supplying power to the semiconductor refrigeration system or keeping the power-off state of the semiconductor refrigeration system;
and controlling the semiconductor refrigeration system according to the actual temperature change condition of the temperature change chamber within the preset time.
Optionally, the step of controlling the semiconductor refrigeration system according to the actual temperature change condition of the temperature changing compartment within a preset time includes:
judging whether the actual temperature of the variable-temperature chamber in the preset time reaches a third shutdown temperature or not;
if so, keeping the power-off state of the semiconductor refrigeration system;
if not, judging whether the actual temperature of the variable-temperature chamber in the preset time is always greater than the temperature of the third motor, and if so, applying forward voltage to the semiconductor chip; and judging whether the actual temperature of the variable-temperature chamber in the preset time is always lower than the third shutdown temperature, and if so, applying reverse voltage to the semiconductor chip.
Optionally, the step of controlling the semiconductor refrigeration system according to the actual temperature change condition of the temperature changing compartment within a preset time further includes:
stopping power supply to the semiconductor chip when the actual temperature is detected to be equal to or less than the third shutdown temperature after the forward voltage is applied to the semiconductor chip;
stopping power supply to the semiconductor chip when the actual temperature is detected to be greater than the third switch temperature after applying a reverse voltage to the semiconductor chip.
Optionally, while the semiconductor refrigeration system is controlled according to the temperature setting range and the actual temperature, the compressor is in an on state, and the refrigerant flows through the capillary tube, the hot heat exchanger, and the compressor in sequence.
Optionally, before the step of determining the temperature setting range in which the set temperature is located, the method further includes:
detecting the ambient temperature of the refrigeration and freezing device;
and updating the first temperature preset value and the second temperature preset value according to the environment temperature, wherein the higher the environment temperature is, the higher the first temperature preset value and the second temperature preset value are.
According to another aspect of the present invention, there is also provided a refrigeration and freezing apparatus comprising:
a box body which defines a temperature-changing chamber;
the semiconductor refrigeration system is used for adjusting the temperature of the variable-temperature chamber;
a temperature sensor configured to detect an actual temperature of the variable temperature compartment;
a controller having a memory and a processor, wherein the memory stores a computer program, and the computer program is executed by the processor to implement the method of controlling the refrigeration and freezing apparatus.
Optionally, the semiconductor refrigeration system comprises a hot heat exchanger, a cold heat exchanger, and a semiconductor chip between the hot heat exchanger and the cold heat exchanger, the semiconductor chip having the hot end and the cold end, the hot heat exchanger being partially bonded to the hot end, the cold heat exchanger being partially bonded to the cold end, the cold heat exchanger being configured to provide cold to the temperature-changing chamber when a forward voltage is applied to the semiconductor chip, and to provide heat to the temperature-changing chamber when a reverse voltage is applied to the semiconductor chip;
the refrigerating and freezing device also comprises a compression refrigerating system, the compression refrigerating system comprises a compressor and a capillary tube, and the heat exchanger is arranged between the outlet of the capillary tube and the inlet of the compressor; so that the refrigerant of the compression refrigeration system flows through the hot heat exchanger to exchange heat with the hot end.
The refrigeration and freezing device and the control method thereof prescribe different temperature setting ranges for the temperature changing chamber, and control the semiconductor refrigeration system according to the actual temperature of the temperature changing chamber and the temperature setting range where the setting temperature is located, thereby realizing wide temperature changing and meeting different storage requirements of users.
Furthermore, the refrigeration and freezing device and the control method thereof utilize the compression refrigeration system to reduce the temperature of the hot end of the semiconductor refrigeration system and promote the temperature of the cold end to be further reduced, so that the temperature-changing chamber reaches lower cryogenic temperature; and the compression refrigeration system is combined with the semiconductor refrigeration system, and the semiconductor refrigeration system is controlled based on the actual temperature of the variable-temperature chamber and the temperature setting range of the set temperature, so that excessive energy consumption is avoided, and the use experience of a user is improved.
Furthermore, according to the refrigeration and freezing device and the control method thereof, each temperature setting range of the variable temperature chamber is determined according to the environmental temperature, and the semiconductor refrigeration system is controlled according to the temperature setting range where the current setting temperature of the variable temperature chamber is located and the current actual temperature of the variable temperature chamber, so that the accuracy of temperature control of the variable temperature chamber is improved, the refrigeration efficiency is improved, and the energy consumption is saved.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
fig. 1 is a schematic structural view of a refrigerating and freezing apparatus according to an embodiment of the present invention;
figure 2 is a schematic diagram of a refrigeration system of a refrigerated freezer according to one embodiment of the present invention;
fig. 3 is a schematic diagram of a semiconductor refrigeration system of a refrigeration chiller according to one embodiment of the present invention;
fig. 4 is a schematic diagram of a method of controlling a refrigeration chiller according to one embodiment of the present invention;
fig. 5 is a detailed flow diagram of a method of controlling a refrigeration chiller according to one embodiment of the present invention; and
figure 6 is a schematic diagram of the connection of components of a refrigeration freezer apparatus according to one embodiment of the present invention.
Detailed Description
For convenience of description, the directions of "up", "down", "front", "back", "top", "bottom", "transverse", etc. mentioned in the description are defined according to the spatial position relationship of the refrigeration and refrigeration apparatus 10 in the normal operation state.
The refrigerating and freezing apparatus 10 and the control method thereof according to the present embodiment will be described in detail below with reference to fig. 1 to 6.
The refrigerating and freezing device 10 of the present embodiment may be a device with refrigerating and freezing functions such as a refrigerator, a freezer, etc., and may include a box body defining the variable temperature compartment 110 and a semiconductor refrigerating system 150 for adjusting the temperature of the variable temperature compartment 110.
In some embodiments, the cooling of the temperature swing compartment 110 may be entirely dependent on the semiconductor refrigeration system 150. In other embodiments, the temperature swing compartment 110 may be refrigerated by means of a semiconductor refrigeration system 150 and a compression refrigeration system.
Specifically, referring to fig. 1-3, a semiconductor refrigeration system 150 may include a hot heat exchanger 151, a cold heat exchanger 152, and a semiconductor chip 155 between the hot heat exchanger 151 and the cold heat exchanger 152, the semiconductor chip 155 having a hot side 153 and a cold side 154, the hot heat exchanger 151 partially bonded to the hot side 153, the cold heat exchanger 152 partially bonded to the cold side 154, the cold heat exchanger 152 configured to provide cold to the temperature-changing compartment 110 when a forward voltage is applied to the semiconductor chip 155 and provide heat to the temperature-changing compartment 110 when a reverse voltage is applied to the semiconductor chip 155.
The semiconductor refrigeration system 150 mainly utilizes the peltier effect, when current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be achieved. Semiconductor chip 155 may experience a temperature difference between hot side 153 and cold side 154 after power is applied, and as the temperature of hot side 153 decreases, the temperature of cold side 154 also decreases.
In this embodiment, the hot end 153 of the semiconductor refrigeration system 150 may dissipate heat by means of a compression refrigeration system, specifically, the hot heat exchanger 151 may be disposed between an outlet of the capillary tube 106 of the compression refrigeration system and an inlet of the compressor 101, a refrigerant gas in a high-temperature and high-pressure state discharged from an outlet of the compressor 101 enters the condenser 102, and is condensed by the condenser 102 into a refrigerant liquid in a high-pressure and normal-temperature state, the refrigerant liquid enters the capillary tube 106 and is changed into a low-temperature and low-pressure refrigerant by throttling the capillary tube 106, and the low-temperature and low-pressure refrigerant enters the hot heat exchanger 151 to exchange heat with the hot end 153.
When the semiconductor refrigeration system 150 is applied with forward voltage, the refrigerant evaporates and absorbs heat in the heat exchanger 151 to quickly take away heat of the hot end 153, the hot end 153 is maintained in a low-temperature environment, the temperature of the cold end 154 is further reduced by means of the refrigeration temperature difference of the semiconductor, and deep refrigeration of the variable-temperature chamber 110 is realized by heat exchange between the cold end 154 and the variable-temperature chamber 110 in a contact heat exchange or forced convection mode, so that the cryogenic requirement is met.
When a reverse voltage is applied to the semiconductor refrigeration system 150, the hot end 153 generates cold, the cold end 154 generates heat, the cold generated by the hot end 153 is taken away by the refrigerant in the heat exchanger 151, and the heat generated by the cold end 154 is transferred to the temperature-changing chamber 110, so that the temperature of the temperature-changing chamber 110 is raised, and the requirement of the temperature-changing chamber 110 for wider temperature change is met.
When the semiconductor refrigeration system 150 stops working, if the compression refrigeration system is still running, the refrigerant still flows through the hot heat exchanger 151, the temperature of the cold heat exchanger 152 can be reduced through the heat conduction of the hot heat exchanger 151, so as to achieve the purpose of cooling the temperature-changing chamber 110, at this time, the temperature of the temperature-changing chamber 110 can still be adjusted, and thus, the temperature change range of the temperature-changing chamber 110 is further increased.
As shown in the drawings, in order to accelerate the temperature regulation rate of the temperature-variable compartment 110, the refrigeration and freezing device 10 of the embodiment further includes a blower, and heat or cold around the cold heat exchanger 152 is rapidly introduced into the temperature-variable compartment 110 by the driving of the blower 156, so as to accelerate the temperature regulation of the temperature-variable compartment 110.
As shown in the drawings, the refrigerating and freezing device 10 of the present embodiment may further include a refrigerating chamber 120, a freezing chamber 130, a refrigerating evaporator 103, a freezing evaporator 104, a refrigerating capillary 107 and an electromagnetic valve 105, and in order to avoid confusion between the capillary 106 and the refrigerating capillary 107, the capillary 106 is referred to as a temperature-changing capillary. An inlet end of the electromagnetic valve 105 is communicated with an outlet end of the condenser 102, the electromagnetic valve 105 is provided with a first outlet end and a second outlet end, the first outlet end of the electromagnetic valve 105 is connected with an inlet end of the refrigeration capillary 107, an outlet end of the refrigeration capillary 107 is connected with an inlet end of the refrigeration evaporator 103, the second outlet end of the electromagnetic valve 105 is connected with an inlet end of the temperature-changing capillary, an outlet end of the temperature-changing capillary is connected with an inlet end of the heat exchanger 151, and an outlet end of the heat exchanger 151 is connected with an inlet end of the freezing evaporator 104, so that refrigeration, freezing and temperature-changing compartments 110 are refrigerated through switching of the electromagnetic valve 105.
The refrigerating and freezing apparatus 10 supplies air to the refrigerating compartment 120 and the freezing compartment 130 respectively by air-cooling,
as shown in the drawings, the refrigerating and freezing device 10 of the present embodiment may further include an ice making chamber 140, and the freezing evaporator 104 may provide cooling energy to the ice making chamber 140. One of the distribution patterns of the compartments of the refrigeration and freezing apparatus 10 may be: the ice making chamber 140 and the temperature-changing compartment 110 may be distributed in a transverse direction, the freezing chamber 130 is located below the ice making chamber 140 and the temperature-changing compartment 110, and the refrigerating chamber 120 is located above the ice making chamber 140 and the temperature-changing compartment 110.
As shown in fig. 3, the refrigeration and freezing apparatus 10 according to any of the foregoing embodiments further provides a control method, including:
s402, detecting the actual temperature of the variable-temperature chamber 110;
s404, acquiring the set temperature of the temperature-changing chamber 110;
s406, judging the temperature setting range in which the set temperature is positioned;
and S408, controlling the semiconductor refrigeration system 150 according to the temperature setting range and the actual temperature.
In the refrigeration and freezing apparatus 10 of the present embodiment, different temperature setting ranges are defined for the variable temperature chamber 110, and the semiconductor refrigeration system 150 is controlled according to the actual temperature of the variable temperature chamber 110 and the temperature setting range in which the set temperature is located, so that wide variable temperature is realized, and different storage requirements of users can be met.
While controlling the semiconductor refrigeration system 150 according to the temperature setting range and the actual temperature, the compressor 101 may be in an on state, and the refrigerant flows through the capillary tube, the heat exchanger 151, and the compressor 101 in sequence, so as to take away heat or cold at the hot end 153 of the semiconductor refrigeration system 150 when the semiconductor is refrigerating, or to provide cold for the temperature-changing compartment 110 when the semiconductor is not refrigerating.
The step of controlling the semiconductor cooling system 150 according to the temperature setting range and the actual temperature may include:
if the temperature setting range is larger than a first temperature preset value, and the first temperature preset value is larger than or equal to 0 ℃, judging whether the actual temperature is smaller than or equal to a first shutdown temperature;
if yes, applying a reverse voltage to the semiconductor refrigeration system 150, so that the semiconductor refrigeration system 150 provides heat for the variable temperature chamber 110;
judging whether the actual temperature is greater than the first starting temperature or not;
if so, power supply to the semiconductor refrigeration system 150 is stopped.
If the actual temperature of the variable temperature compartment 110 is less than or equal to the first shutdown temperature, it is indicated that the temperature of the variable temperature compartment 110 may be further reduced, and in order to avoid the temperature of the variable temperature compartment 110 being too low, a reverse voltage may be applied to the semiconductor refrigeration system 150, so that the cold end 154 of the semiconductor refrigeration system 150 releases heat, and the temperature of the variable temperature compartment 110 is increased, and when the actual temperature of the variable temperature compartment 110 is greater than the first startup temperature, power supply to the semiconductor refrigeration system 150 is stopped, so as to maintain the variable temperature compartment 110 at the set temperature.
As mentioned above, in the control process, the compression refrigeration system is in operation, that is, the compressor 101 is in an on state, and when the power supply to the semiconductor refrigeration system 150 is stopped, the cold energy of the hot heat exchanger 151 can be conducted to the cold heat exchanger 152, so as to reduce the temperature of the temperature-changing compartment 110. Therefore, in the foregoing control process, during the operation of the semiconductor refrigeration system 150, when the actual temperature of the temperature-changing compartment 110 is less than or equal to the first shutdown temperature, the semiconductor refrigeration system 150 is prevented from being directly powered off, and further decrease in the temperature of the temperature-changing compartment 110 requires applying a reverse voltage to the semiconductor refrigeration system 150 to raise the temperature of the temperature-changing compartment 110, so as to maintain the set temperature of the temperature-changing compartment 110. Similarly, when the actual temperature of the variable temperature compartment 110 is greater than the first start-up temperature, the actual temperature of the variable temperature compartment 110 can be adjusted to the set temperature by heat conduction of the thermal heat exchanger 151 alone, and thus, power supply to the semiconductor refrigeration system 150 can be stopped at this time. Thus, the energy consumption of the refrigerating and freezing device 10 is reduced while the temperature of the variable temperature chamber 110 is ensured to be at the set temperature.
The control process described above provides a control method for the set temperature of the variable temperature chamber 110 to be higher, and the other control methods for the set temperature of the variable temperature chamber 110 will be described in detail below.
Further, the step of controlling the semiconductor cooling system 150 according to the temperature setting range and the actual temperature further includes:
if the temperature setting range is smaller than a second temperature preset value which is smaller than 0 ℃, judging whether the actual temperature is larger than a second starting temperature;
if yes, applying a forward voltage to the semiconductor refrigeration system 150, so that the semiconductor refrigeration system 150 provides cold energy for the variable temperature chamber 110;
judging whether the actual temperature is less than or equal to a second shutdown temperature;
if so, power supply to the semiconductor refrigeration system 150 is stopped.
When the temperature setting range in which the set temperature is located is smaller than the second temperature preset value, it is indicated that the set temperature of the temperature-changing chamber 110 is in the lower temperature setting range, at this time, if the actual temperature of the temperature-changing chamber 110 is greater than the second startup temperature, it is indicated that the temperature-changing chamber 110 reaches the startup condition, at this time, a forward voltage should be applied to the semiconductor refrigeration system 150, so that the semiconductor refrigeration system 150 provides refrigeration capacity for the temperature-changing chamber 110, and as the temperature of the temperature-changing chamber 110 decreases, when the actual temperature of the temperature-changing chamber 110 decreases to be less than or equal to the second shutdown temperature, the temperature-changing chamber 110 reaches the shutdown condition, at this time, power supply to the semiconductor refrigeration system 150 should be stopped, so that the actual temperature of the temperature-changing chamber 110 is adjusted to the set temperature in a short time. The compression refrigeration system maintains the hot end 153 of the semiconductor refrigeration system 150 in a low-temperature environment, and achieves further temperature reduction of the cold end 154, thereby achieving deep refrigeration of the temperature-varying compartment 110.
Further, the step of controlling the semiconductor cooling system 150 according to the temperature setting range and the actual temperature further includes:
if the temperature setting range is greater than or equal to the second temperature preset value and less than or equal to the first temperature preset value, stopping supplying power to the semiconductor refrigeration system 150 or keeping the power-off state of the semiconductor refrigeration system 150;
and controlling the semiconductor refrigeration system 150 according to the actual temperature change condition of the temperature-changing chamber 110 within a preset time.
When the temperature setting range of the set temperature of the temperature-changing chamber 110 is between the first temperature preset value and the second temperature preset value, it indicates that the set temperature of the temperature-changing chamber 110 is not high or low, the semiconductor refrigeration system 150 does not need to work, and the cold energy of the hot heat exchanger 151 can reduce the temperature of the cold heat exchanger 152 of the semiconductor refrigeration system 150 in the operation process of the compression refrigeration system, so as to achieve the purpose of reducing the temperature of the temperature-changing chamber 110. However, in order to avoid an excessive temperature change in the variable temperature compartment 110, in the present embodiment, the semiconductor refrigeration system 150 needs to be controlled to maintain the actual temperature of the variable temperature compartment 110 at the set temperature according to a change in the actual temperature of the variable temperature compartment 110 over a certain period of time.
Specifically, the step of controlling the semiconductor refrigeration system 150 according to the actual temperature change condition of the temperature-changing compartment 110 within the preset time may include:
judging whether the actual temperature of the variable-temperature chamber 110 within the preset time reaches a third shutdown temperature;
if so, maintaining the power-off state of the semiconductor refrigeration system 150;
if not, judging whether the actual temperature of the variable temperature chamber 110 in the preset time is always greater than the temperature of the third motor, if so, applying a forward voltage to the semiconductor chip 155; and judging whether the actual temperature of the variable temperature chamber 110 in the preset time is always lower than the third shutdown temperature, if so, applying a reverse voltage to the semiconductor chip 155.
During the compression refrigeration operation, if the actual temperature of the variable temperature compartment 110 reaches the third critical temperature within a certain time, which indicates that the temperature of the variable temperature compartment 110 can be reduced to the set temperature by the cold conduction of the heat exchanger 151, the semiconductor refrigeration system 150 does not need to be turned on. If the actual temperature of the temperature-changing chamber 110 does not reach the third off-temperature within a certain time and is always greater than the third on-temperature, it is indicated that the temperature of the temperature-changing chamber 110 cannot be timely reduced by the cold conduction of the heat exchanger 151, and at this time, a forward voltage needs to be applied to the semiconductor chip 155, the heat of the hot end 153 is taken away by the heat exchanger 151, the temperature of the cold end 154 is reduced, and the temperature of the temperature-changing chamber 110 is rapidly reduced under the driving of the blower 156. When the actual temperature is lower than the third shutdown temperature, it is described that the temperature of the temperature-changing chamber 110 is lowered too much by means of the cold conduction of the heat exchanger 151, at this time, a reverse voltage needs to be applied to the semiconductor chip 155, the hot end 153 is cooled, the cold end 154 is heated, the cold of the hot end 153 is taken away by the heat exchanger 151, and the heat of the cold end 154 enters the temperature-changing chamber 110 under the driving of the blower 156 to raise the temperature of the temperature-changing chamber 110.
As described above, when the set temperature of the variable temperature compartment 110 is not high or low, the refrigeration and freezing apparatus 10 first stops the operation of the semiconductor refrigeration system 150, and then controls the semiconductor refrigeration system 150 according to the actual temperature change condition of the variable temperature compartment 110 within a certain time, so as to ensure that the variable temperature compartment 110 is always kept at the set temperature, meet the requirement of the user on the set temperature, avoid excessive energy consumption, and improve the user experience.
Further, after the forward voltage is applied to the semiconductor chip 155, when the actual temperature is detected to be equal to or lower than the third off-temperature, the power supply to the semiconductor chip 155 is stopped;
after the reverse voltage is applied to the semiconductor chip 155, when it is detected that the actual temperature is greater than the third switch temperature, power supply to the semiconductor chip 155 is stopped.
When the actual temperature of the temperature-changing chamber 110 reaches the aforementioned condition, the actual temperature of the temperature-changing chamber 110 reaches the set temperature, and at this time, the power supply to the semiconductor chip 155 needs to be stopped, so as to avoid further lowering or raising of the actual temperature of the temperature-changing chamber 110, and save energy consumption.
As can be seen from the foregoing, in the refrigeration and freezing apparatus 10 of the present embodiment, the semiconductor refrigeration system 150 is controlled according to different temperature setting ranges in which the set temperature of the variable temperature compartment 110 is located, and when the external ambient temperature is different, the thermal load of the variable temperature compartment 110 is different, and the critical temperature of the semiconductor refrigeration system 150 is different in the forward voltage, the reverse voltage, or the non-voltage. That is, the first temperature preset value and the second temperature preset value are different when the external environment temperature is different.
Therefore, in order to precisely adjust the temperature of the variable temperature chamber 110, the control method of the embodiment further includes, before the step of determining the temperature setting range in which the set temperature is located:
detecting the ambient temperature of the refrigeration and freezing device 10;
and updating the first temperature preset value and the second temperature preset value according to the ambient temperature, wherein the higher the ambient temperature is, the higher the first temperature preset value and the second temperature preset value are.
That is, the temperature setting ranges are updated according to the ambient temperature, and before the set temperature of the variable temperature compartment 110 is determined to be within which temperature setting range, the respective temperature setting ranges are determined according to the ambient temperature, so that the semiconductor refrigeration system 150 can be accurately controlled, the accuracy of temperature control of the variable temperature compartment 110 is improved, and undesired energy waste is ensured.
As shown in table 1, the present embodiment exemplarily shows a corresponding relationship between the ambient temperature and the first and second preset temperature values Tc1 and Tc 2.
TABLE 1
| The environment temperature is less than or equal to 13 DEG C | The environmental temperature is more than 13 ℃ and less than or equal to 28 DEG C | The environment temperature is more than 28 ℃ and less than or equal to 38 DEG C | The environment temperature is more than 38 | |
| Tc1 | ||||
| 10 | 8 | 5 | 2 | |
| Tc2 | -18 | -15 | -10 | -5 |
Table 1 is only an example, and the corresponding relationship between the ambient temperature and the first and second preset temperature values is not particularly limited.
To more clearly understand the control method of the present embodiment, as shown in fig. 5, the present embodiment provides a flow of the control method of the refrigeration and freezing apparatus 10, and specifically, the control method includes:
s502, starting the compressor 101, and opening a second outlet end of the electromagnetic valve 105;
s504, detecting the ambient temperature of the refrigeration and freezing apparatus 10 and the actual temperature of the variable temperature chamber 110 in real time, and obtaining the set temperature of the variable temperature chamber 110;
s506, updating the first temperature preset value and the second temperature preset value according to the ambient temperature;
s508, if the set temperature is greater than the first preset temperature value, executing S510, if the set temperature is less than the second preset temperature value, executing S512, if the set temperature is greater than or equal to the second preset temperature value and less than or equal to the first preset temperature value, executing S514;
s510, when the actual temperature is less than or equal to the first shutdown temperature, applying a reverse voltage to the semiconductor refrigeration system 150, and when the actual temperature is greater than the first startup temperature, stopping supplying power to the semiconductor refrigeration system 150;
s512, when the actual temperature is higher than the second startup temperature, applying a forward voltage to the semiconductor refrigeration system 150, and when the actual temperature is lower than or equal to the second shutdown temperature, stopping supplying power to the semiconductor refrigeration system 150;
s514, stopping power supply to the semiconductor refrigeration system 150;
s516, determining whether the actual temperature of the temperature-changing chamber 110 within the preset time reaches a third shutdown temperature, if yes, performing step S518, and if no, performing step S520;
s518, keeping the power-off state of the semiconductor refrigeration system 150;
s520, determining whether the actual temperature of the variable temperature chamber 110 within the preset time is always greater than the third opening temperature, if yes, performing step S522, and if not, performing step S526;
s522, applying a forward voltage to the semiconductor chip 155;
s524, stopping power supply to the semiconductor chip 155 when the actual temperature is detected to be less than or equal to the third shutdown temperature;
s526, when the actual temperature of the temperature-varying chamber 110 within the preset time is always less than the third off-temperature, applying a reverse voltage to the semiconductor chip 155;
s528, when the actual temperature is detected to be higher than the third switch temperature, the power supply to the semiconductor chip 155 is stopped.
The first startup temperature, the first shutdown temperature, the second startup temperature, the second shutdown temperature, the third startup temperature, and the third shutdown temperature may be determined according to each set temperature of the variable temperature compartment 110, which is not specifically limited in this embodiment.
Based on the aforementioned control method of the refrigeration and freezing apparatus 10, as shown in fig. 6, the refrigeration and freezing apparatus 10 of the present embodiment further includes a temperature sensor configured to detect an actual temperature of the variable temperature compartment 110, the controller 160 has a memory 161 and a processor 162, and the memory 161 stores a computer program 1611, and the computer program 1611 is executed by the processor 162 to implement the control method of any one of the foregoing.
In some embodiments, the refrigerator freezer 10 may further include another temperature sensor configured to detect the temperature of the environment in which the refrigerator freezer 10 is located. The aforementioned temperature sensor and the further temperature sensor may be referred to as a first temperature sensor 170 and a second temperature sensor 180, respectively.
The processor 162 may be a Central Processing Unit (CPU), a digital processing unit, or the like. The processor 162 transceives data through the communication interface. The memory 161 is used for storing programs executed by the processor 162. The memory 161 is any medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer, and may be a combination of multiple memories 161. The computer program 1611 described above may be downloaded from a computer readable storage medium to a corresponding computing/processing device or to a computer or external storage device via a network, such as the internet, a local area network, a wide area network, and/or a wireless network.
The computer program 1611 may be executed entirely on the local computing device, as a stand-alone software package, partly on the local computing device and partly on a remote computing device, or entirely on a remote computing device or server (including a cloud-side device).
The refrigeration and freezing apparatus 10 and the control method thereof in this embodiment combine the compression refrigeration system and the semiconductor refrigeration system 150, determine each temperature setting range of the variable temperature compartment 110 according to the ambient temperature, and control the semiconductor refrigeration system 150 according to the temperature setting range in which the current setting temperature of the variable temperature compartment 110 is located and the current actual temperature of the variable temperature compartment 110, thereby implementing wide temperature adjustment of the variable temperature compartment 110, improving the accuracy of temperature control of the variable temperature compartment 110, saving energy consumption, and improving refrigeration efficiency.
Thus, it should be appreciated by those skilled in the art that while various exemplary embodiments of the invention have been shown and described in detail herein, many other variations or modifications which are consistent with the principles of this invention may be determined or derived directly from the disclosure of the present invention without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be understood and interpreted to cover all such other variations or modifications.
Claims (9)
1. A control method of a refrigeration and freezing device, wherein the refrigeration and freezing device comprises a box body which is limited with a variable-temperature chamber, a semiconductor refrigeration system which is used for adjusting the temperature of the variable-temperature chamber, and a compression refrigeration system which dissipates heat of the hot end of the semiconductor refrigeration system, and the control method comprises the following steps:
detecting the actual temperature of the variable-temperature chamber;
acquiring the set temperature of the variable temperature chamber;
judging the temperature setting range of the set temperature;
controlling the semiconductor refrigeration system according to the temperature setting range and the actual temperature;
the step of controlling the semiconductor refrigeration system according to the temperature setting range and the actual temperature comprises:
if the temperature setting range is larger than a first temperature preset value, and the first temperature preset value is larger than or equal to 0 ℃, judging whether the actual temperature is smaller than or equal to a first shutdown temperature;
if so, applying reverse voltage to the semiconductor refrigeration system to enable the semiconductor refrigeration system to provide heat for the temperature-changing chamber;
judging whether the actual temperature is greater than a first starting temperature or not;
if so, stopping supplying power to the semiconductor refrigeration system.
2. The control method according to claim 1, the step of controlling the semiconductor refrigeration system according to the temperature setting range and the actual temperature further comprising:
if the temperature setting range is smaller than a second temperature preset value, and the second temperature preset value is smaller than 0 ℃, judging whether the actual temperature is larger than a second starting temperature or not;
if so, applying forward voltage to the semiconductor refrigeration system to enable the semiconductor refrigeration system to provide cold energy for the temperature-changing chamber;
judging whether the actual temperature is less than or equal to a second shutdown temperature;
if so, stopping supplying power to the semiconductor refrigeration system.
3. The control method according to claim 2, wherein,
the semiconductor refrigeration system comprises a hot heat exchanger, a cold heat exchanger and a semiconductor chip between the hot heat exchanger and the cold heat exchanger, the semiconductor chip has the hot end and the cold end, the hot heat exchanger is partially adhered to the hot end, the cold heat exchanger is partially adhered to the cold end, the cold heat exchanger is configured to provide cold energy to the temperature-changing chamber when a forward voltage is applied to the semiconductor chip and provide heat to the temperature-changing chamber when a reverse voltage is applied to the semiconductor chip;
the compression refrigeration system comprises a compressor and a capillary tube, and the hot heat exchanger is arranged between an outlet of the capillary tube and an inlet of the compressor; so that the refrigerant of the compression refrigeration system flows through the hot heat exchanger to exchange heat with the hot end;
the step of controlling the semiconductor refrigeration system according to the temperature setting range and the actual temperature further comprises:
if the temperature setting range is greater than or equal to a second temperature preset value and less than or equal to a first temperature preset value, stopping supplying power to the semiconductor refrigeration system or keeping the power-off state of the semiconductor refrigeration system;
and controlling the semiconductor refrigeration system according to the actual temperature change condition of the temperature change chamber within the preset time.
4. The control method of claim 3, wherein the step of controlling the semiconductor refrigeration system according to the actual temperature change of the temperature-changing compartment within a preset time comprises the steps of:
judging whether the actual temperature of the variable-temperature chamber in the preset time reaches a third shutdown temperature or not;
if so, keeping the power-off state of the semiconductor refrigeration system;
if not, judging whether the actual temperature of the variable-temperature chamber in the preset time is always greater than the temperature of a third motor, if so, applying forward voltage to the semiconductor chip; and judging whether the actual temperature of the variable-temperature chamber in the preset time is always lower than the third shutdown temperature, if so, applying reverse voltage to the semiconductor chip.
5. The control method of claim 4, wherein the step of controlling the semiconductor refrigeration system according to the actual temperature change of the temperature-changing compartment within a preset time further comprises:
stopping power supply to the semiconductor chip when the actual temperature is detected to be equal to or less than the third shutdown temperature after the forward voltage is applied to the semiconductor chip;
stopping power supply to the semiconductor chip when the actual temperature is detected to be greater than the third switch temperature after applying a reverse voltage to the semiconductor chip.
6. The control method according to claim 3, wherein
And when the semiconductor refrigeration system is controlled according to the temperature setting range and the actual temperature, the compressor is in an open state, and the refrigerant flows through the capillary tube, the heat exchanger and the compressor in sequence.
7. The control method according to claim 2, further comprising, before the step of determining the temperature setting range in which the set temperature is located:
detecting the ambient temperature of the refrigeration and freezing device;
and updating the first temperature preset value and the second temperature preset value according to the environment temperature, wherein the higher the environment temperature is, the higher the first temperature preset value and the second temperature preset value are.
8. A refrigeration freezer apparatus comprising:
a box body which defines a temperature-changing chamber;
the semiconductor refrigeration system is used for adjusting the temperature of the variable-temperature chamber;
a temperature sensor configured to detect an actual temperature of the variable temperature compartment;
a controller having a memory and a processor, and a computer program stored in the memory, the computer program being executable by the processor to implement a method of controlling a refrigeration chiller according to any one of claims 1 to 7.
9. A refrigerator-freezer according to claim 8, wherein
The semiconductor refrigeration system comprises a hot heat exchanger, a cold heat exchanger and a semiconductor chip between the hot heat exchanger and the cold heat exchanger, wherein the semiconductor chip is provided with a hot end and a cold end, the hot heat exchanger is partially adhered to the hot end, the cold heat exchanger is partially adhered to the cold end, and the cold heat exchanger is configured to provide cold energy to the temperature-changing chamber when forward voltage is applied to the semiconductor chip and provide heat to the temperature-changing chamber when reverse voltage is applied to the semiconductor chip;
the refrigerating and freezing device also comprises a compression refrigeration system, the compression refrigeration system comprises a compressor and a capillary tube, and the heat exchanger is arranged between the outlet of the capillary tube and the inlet of the compressor; so that the refrigerant of the compression refrigeration system flows through the hot heat exchanger to exchange heat with the hot end.
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| CN202110228854.5A CN114992949B (en) | 2021-03-02 | 2021-03-02 | Refrigerating and freezing device and control method thereof |
| PCT/CN2022/071765 WO2022183849A1 (en) | 2021-03-02 | 2022-01-13 | Refrigeration and freezing apparatus and control method therefor |
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| CN114992949A (en) | 2022-09-02 |
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