CN210052065U - Miniature precision temperature control device - Google Patents
Miniature precision temperature control device Download PDFInfo
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- CN210052065U CN210052065U CN201921332741.4U CN201921332741U CN210052065U CN 210052065 U CN210052065 U CN 210052065U CN 201921332741 U CN201921332741 U CN 201921332741U CN 210052065 U CN210052065 U CN 210052065U
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Abstract
The utility model discloses a miniature precise temperature control device, wherein a semiconductor refrigeration piece is arranged in a heat insulation cavity, a cold quantity diffusion plate and a heat quantity diffusion plate are arranged outside the heat insulation cavity, the cold quantity diffusion plate is combined with the cold end surface of the semiconductor refrigeration piece, and the heat quantity diffusion plate is combined with the hot end surface of the semiconductor refrigeration piece; a heating device is arranged in the cold quantity diffusion plate, a heat quantity diffusion plate is provided with a heat radiation fan, and a temperature sensor is arranged in the temperature control area; the semiconductor refrigerating sheet, the heating device, the cooling fan and the temperature sensor are respectively connected with the control device. Through the technical scheme of the utility model, need not carry out the adjustment that frequent adjustment can realize the temperature to the semiconductor refrigeration piece, can realize rapid heating up, cooling, temperature control is invariable, accurate, has guaranteed the life of semiconductor refrigeration piece simultaneously, has improved its life and product stability ability greatly, has also reduced use cost.
Description
Technical Field
The utility model relates to a control by temperature change technical field especially relates to a miniature accurate temperature control device.
Background
The temperature precision control technology is more and more important in the field of electronic engineering or scientific research and test conditions, especially in the temperature control of high-precision nanometer precision instruments, most of the constant-temperature clean rooms adopting multiple heat insulation sleeves are adopted at present, the manufacturing cost and the operating cost of the method are extremely high, the occupied space is large, meanwhile, the movement of personnel can bring great difficulty to the temperature precision control, however, only the core module of the relevant instrument is really needed to control the temperature precisely, and therefore, the method has important significance in researching miniature precision temperature control devices.
In the traditional precise temperature control system, one or more heat preservation sleeves and a refrigerating, heating and PLC control system are cooperated together to realize precise temperature control, and besides the high manufacturing cost and operation cost and large occupied space, the service life of a refrigerating (TEC) is greatly shortened due to frequent adjustment of a TEC semiconductor refrigerating module.
SUMMERY OF THE UTILITY MODEL
At least one to the above-mentioned problem, the utility model provides a miniature accurate temperature control device, through combine respectively to set up cold volume diffuser plate and heat diffuser plate on semiconductor refrigeration piece, set up heating device and radiator fan on cold volume diffuser plate and heat diffuser plate respectively, heating device and radiator fan carry out common regulation to the temperature of semiconductor refrigeration piece under controlling means's cooperation, make the accuse temperature district keep in predetermined temperature range, and need not carry out frequent adjustment to semiconductor refrigeration piece and can realize the adjustment of temperature, can realize rapid heating up, the cooling, temperature control is invariable, it is accurate, the life of semiconductor refrigeration piece has been guaranteed simultaneously, the service life and the product stability can be improved greatly, use cost is also reduced.
In order to achieve the above object, the utility model provides a miniature accurate temperature control device, include: the device comprises a heat insulation cavity, a semiconductor refrigerating sheet, a cold quantity diffusion plate, a heating device, a heat quantity diffusion plate, a heat radiation fan, a temperature sensor and a control device; the semiconductor refrigeration piece is arranged in the heat insulation cavity, the cold quantity diffusion plate and the heat quantity diffusion plate are arranged outside the heat insulation cavity, the cold quantity diffusion plate is combined with the cold end face of the semiconductor refrigeration piece, and the heat quantity diffusion plate is combined with the hot end face of the semiconductor refrigeration piece; the heating device is arranged in the cold quantity diffusion plate, the heat quantity diffusion plate is provided with the heat radiation fan, and the temperature sensor is arranged in a temperature control area; the semiconductor refrigerating sheet, the heating device, the cooling fan and the temperature sensor are respectively connected with the control device.
In the above technical solution, preferably, the temperature sensor detects the temperature of the temperature control area and sends a detection signal to the control device, and the control device controls the switching and the operating power of the heating device.
In the above technical solution, preferably, the control device is a PID controller.
In the above technical solution, preferably, the semiconductor refrigeration sheet, the heating device and the cooling fan are connected to an external power supply through the control device.
In the above technical solution, preferably, the heat-insulating cavity is provided with a preformed hole, and the cold quantity diffusion plate is installed on the heat-insulating cavity through the preformed hole.
Compared with the prior art, the beneficial effects of the utility model are that: through combining respectively on semiconductor refrigeration piece and setting up cold volume diffuser plate and heat diffuser plate, set up heating device and radiator fan respectively on cold volume diffuser plate and heat diffuser plate, heating device and radiator fan carry out common regulation to the temperature of semiconductor refrigeration piece under controlling means's cooperation, make the accuse warm area keep in predetermined temperature range, and need not carry out frequent adjustment to semiconductor refrigeration piece and can realize the adjustment of temperature, can realize rapid heating up, the cooling, temperature control is invariable, accurate, the life of semiconductor refrigeration piece has been guaranteed simultaneously, the life and the product stability ability of its are greatly improved, use cost has also been reduced.
Drawings
Fig. 1 is a schematic structural view of a miniature precise temperature control device according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a miniature precise temperature control device according to an embodiment of the present invention.
In the drawings, the correspondence between each component and the reference numeral is:
1. the heat-insulation device comprises a heat-insulation cavity, 2 semiconductor refrigeration pieces, 3 cold diffusion plates, 4 heating devices, 5 heat diffusion plates, 6 heat dissipation fans, 7 temperature sensors and 8 control devices.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The invention is described in further detail below with reference to the accompanying drawings:
as shown in fig. 1, according to the utility model provides a miniature accurate temperature control device, include: the device comprises a heat preservation cavity 1, a semiconductor refrigerating sheet 2, a cold quantity diffusion plate 3, a heating device 4, a heat quantity diffusion plate 5, a heat radiation fan 6, a temperature sensor 7 and a control device 8; a semiconductor refrigerating sheet 2 is arranged in the heat preservation cavity 1, a cold quantity diffusion plate 3 and a heat quantity diffusion plate 5 are arranged outside the heat preservation cavity 1, the cold quantity diffusion plate 3 is combined with the cold end face of the semiconductor refrigerating sheet 2, and the heat quantity diffusion plate 5 is combined with the hot end face of the semiconductor refrigerating sheet 2; a heating device 4 is arranged in the cold quantity diffusion plate 3, a heat quantity diffusion plate 5 is provided with a heat radiation fan 6, and a temperature sensor 7 is arranged in a temperature control area; the semiconductor refrigerating plate 2, the heating device 4, the cooling fan 6 and the temperature sensor 7 are respectively connected with a control device 8.
In this embodiment, specifically, the semiconductor refrigeration does not require a compressor and a refrigerant, and does not pollute the environment, but only requires a semiconductor refrigeration chip 2 of a special structure to be powered on for refrigeration. The semiconductor refrigerating sheet 2 has small volume and light weight, has two functions of refrigerating and heating, can accurately control the temperature under a closed-loop temperature control circuit, has no noise during working, has low requirement on a power supply (can use a conventional direct-current power supply), and is an ideal precise refrigerating element. Due to the requirement of objective conditions of precise control, the traditional mode can lead the semiconductor refrigerating piece 2 to be frequently turned on and off for debugging, so that the service life of the semiconductor refrigerating piece 2 is greatly reduced, the use cost is increased, and the performance of the product is influenced. Therefore, the utility model discloses a semiconductor refrigeration piece 2 is in normal operating condition all the time, and the regulation of temperature is through installing built-in installation heating device 4 on heat diffuser plate 5 to carry out accurate control by controlling means 8, thereby solved frequent break-make, debugging and caused the damage of semiconductor refrigeration piece 2, improved its life and product stability ability greatly, also reduced use cost.
In the above embodiment, preferably, the temperature sensor 7 detects the temperature of the temperature zone and transmits a detection signal to the control device 8, and the control device 8 controls the switching and the operation power of the heating device 4.
In the above embodiment, the control device 8 is preferably a PID controller.
In the above embodiment, preferably, the semiconductor cooling plate 2, the heating device 4 and the cooling fan 6 are connected to an external power source through the control device 8.
In the above embodiment, preferably, the heat-insulating cavity 1 is provided with a prepared hole, and the cold diffusion plate 3 is installed on the heat-insulating cavity 1 through the prepared hole.
As shown in fig. 2, according to the miniature precise temperature control device provided in the above embodiment, in the implementation process, according to the relevant parameters of the core component temperature control area requiring precise control, the matched heat preservation cavity 1 is customized, one or more preformed holes are arranged on the heat preservation cavity 1, so that the cold quantity diffusion plate 3 is convenient to install, the cold quantity diffusion plate 3 is combined with the cold end surface of the semiconductor chilling plate 2, when the power is on, heat transfer can be generated between the two ends of the semiconductor chilling plate 2, the heat can be transferred from one end to the other end, and thereby the temperature difference is generated to form the cold and hot ends. In order to maintain the semiconductor cooling plate 2 with good performance, a heat diffusion plate 5 is mounted on the hot end surface of the semiconductor cooling plate 2, and a heat dissipation fan 6 is mounted on the heat diffusion plate 5.
In order to solve because the life that frequently debugs semiconductor refrigeration piece 2 and lead to reduces the problem by a wide margin, the utility model discloses a built-in installation heating device 4 on cold volume diffuser plate 3, this heating device 4 is unified by the PID controller through relay and semiconductor refrigeration piece 2, through setting up the control logic relation, make semiconductor refrigeration piece 2 be in full load refrigeration state all the time, concrete temperature is through the regulation and the settlement to heating device 4 power by the PID controller, reach the control and the invariant of accurate temperature, realize rapid heating up and rapid cooling, and the accuse temperature is invariable, it is accurate, the accuse temperature precision can reach +/-0.1 ℃.
In the implementation process, the device is connected with an external power supply, a required set value is adjusted through a PID controller, a switch is started, the semiconductor refrigerating sheet 2 works under the condition of full load, when a critical point of a set value is reached, the heating device 4 is automatically started according to an algorithm, heats intermittently, and interacts with the semiconductor refrigerating sheet 2 in cold and hot temperature to reach a constant temperature state. Because the actual heating process is a non-uniform process, a certain time is needed for transferring the heating energy from the semiconductor chilling plate 2 to the temperature control area, and meanwhile, a certain response time is also needed for the temperature sensor 7. In the full-load working process of the semiconductor refrigerating sheet 2, the semiconductor refrigerating sheet refrigerates in a heat dissipation mode, has two functions of refrigerating and heating, the heating device 4 is preferably a heating rod, the heating operation of the heating rod gradually offsets cold and hot temperatures in the process of reducing the refrigerating temperature of the heat radiating plate, and a temperature set value is reached to keep a continuous constant state. When the set value is lower than the standard value, the control device 8 controls the heating device 4 to start heating.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A miniature precision temperature control device is characterized by comprising: the device comprises a heat insulation cavity, a semiconductor refrigerating sheet, a cold quantity diffusion plate, a heating device, a heat quantity diffusion plate, a heat radiation fan, a temperature sensor and a control device;
the semiconductor refrigeration piece is arranged in the heat insulation cavity, the cold quantity diffusion plate and the heat quantity diffusion plate are arranged outside the heat insulation cavity, the cold quantity diffusion plate is combined with the cold end face of the semiconductor refrigeration piece, and the heat quantity diffusion plate is combined with the hot end face of the semiconductor refrigeration piece;
the heating device is arranged in the cold quantity diffusion plate, the heat quantity diffusion plate is provided with the heat radiation fan, and the temperature sensor is arranged in a temperature control area;
the semiconductor refrigerating sheet, the heating device, the cooling fan and the temperature sensor are respectively connected with the control device.
2. The micro precise temperature control device according to claim 1, wherein the temperature sensor detects the temperature of the temperature control region and transmits a detection signal to the control device, and the control device controls the switching and operating power of the heating device.
3. The miniature precision temperature control device of claim 1, wherein the control device is a PID controller.
4. The miniature precise temperature control device according to claim 1, wherein the semiconductor chilling plate, the heating device and the cooling fan are connected with an external power supply through the control device.
5. The miniature precise temperature control device according to claim 1, wherein a prepared hole is formed in the heat-insulating cavity, and the cold quantity diffusion plate is mounted on the heat-insulating cavity through the prepared hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921332741.4U CN210052065U (en) | 2019-08-16 | 2019-08-16 | Miniature precision temperature control device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921332741.4U CN210052065U (en) | 2019-08-16 | 2019-08-16 | Miniature precision temperature control device |
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| CN210052065U true CN210052065U (en) | 2020-02-11 |
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| CN201921332741.4U Active CN210052065U (en) | 2019-08-16 | 2019-08-16 | Miniature precision temperature control device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993229A (en) * | 2021-11-04 | 2022-01-28 | 南昌三瑞智能科技有限公司 | Electronic speed regulator integrating capacitor temperature control, temperature control method and unmanned aerial vehicle |
| CN114265443A (en) * | 2021-12-06 | 2022-04-01 | 广东利扬芯片测试股份有限公司 | Chip test temperature control device capable of reducing cost and having universality |
| CN114924033A (en) * | 2022-04-07 | 2022-08-19 | 中国科学院广州地球化学研究所 | Micro temperature control swelling tester and use method thereof |
-
2019
- 2019-08-16 CN CN201921332741.4U patent/CN210052065U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993229A (en) * | 2021-11-04 | 2022-01-28 | 南昌三瑞智能科技有限公司 | Electronic speed regulator integrating capacitor temperature control, temperature control method and unmanned aerial vehicle |
| CN114265443A (en) * | 2021-12-06 | 2022-04-01 | 广东利扬芯片测试股份有限公司 | Chip test temperature control device capable of reducing cost and having universality |
| CN114924033A (en) * | 2022-04-07 | 2022-08-19 | 中国科学院广州地球化学研究所 | Micro temperature control swelling tester and use method thereof |
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