CN206269294U - A kind of semiconductor refrigerating fan with heat-insulation system - Google Patents
A kind of semiconductor refrigerating fan with heat-insulation system Download PDFInfo
- Publication number
- CN206269294U CN206269294U CN201621356282.XU CN201621356282U CN206269294U CN 206269294 U CN206269294 U CN 206269294U CN 201621356282 U CN201621356282 U CN 201621356282U CN 206269294 U CN206269294 U CN 206269294U
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- China
- Prior art keywords
- heat
- refrigeration
- semiconductor
- insulation system
- fan
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of semiconductor refrigerating fan with heat-insulation system, including refrigeration semiconductor, conduction cooling system and heat-insulation system.Refrigeration semiconductor has refrigeration end and heating end；Conduction cooling system has the fan of the cool-guiding device and cool-guiding device connection being connected with refrigeration end；Heat-insulation system has copper water tank, water pump and the heat exchanger being connected with heating end, and heat exchanger is water heat type heat exchanger, and heat exchanger, copper water tank and water pump are sequentially connected by circulating water pipe.Wherein, a kind of semiconductor refrigerating fan with heat-insulation system that the utility model is provided also has transformer, and the transformer is connected with fan, refrigeration semiconductor and water pump circuit respectively.Wherein, refrigeration semiconductor is double-decker, and cool-guiding device is fin-type cool-guiding device.
Description
Technical field
The utility model belongs to Miniature air cooler technical field, and in particular to a kind of semiconductor refrigerating wind with heat-insulation system
Fan.
Background technology
Refrigeration semiconductor, is also thermoelectric module, is a kind of heat pump.Refrigeration chip semiconductor is an instrument for heat transfer,
When the thermocouple centering that one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to has electric current to pass through, between two ends
Heat will be produced to shift, heat will be transferred to the other end from one end, so as to produce the temperature difference to form cold and hot end.
Refrigeration semiconductor is used as extraordinary low-temperature receiver, it is not necessary to which any refrigerant can continuously work, and does not have pollution sources not rotate
Part, will not produce gyroscopic action, not shaken during work, noise, long lifespan, install easy.The thermal inertia of refrigeration semiconductor
Very small, the cooling and warming time, in the case of the good cold end zero load of hot-side heat dissipation, energization can just reach less than one minute quickly
Maximum temperature difference, the temperature difference at the usual cold and hot end of semiconductor chilling plate can be reached between 40 DEG C~65 DEG C.Refrigeration semiconductor has two
Function is planted, can be freezed, and can heated, therefore can just replace discrete heating system and refrigeration system using a sheet.
Refrigeration semiconductor has cooling rate fast, and installing space is small, noiselessness, the advantages of environmentally friendly.
In the working environment of today, single uniform thermal environment that the central air-conditioning system of traditional design is provided and logical
Wind environment is difficult to meet a Man's Demands and hobby.
Utility model content
To solve the above problems, the utility model employs following technical scheme：
The utility model provides a kind of semiconductor refrigerating fan with heat-insulation system, it is characterised in that including：Refrigeration is partly led
Body, with refrigeration end and heating end；Conduction cooling system, with the fan that the cool-guiding device being connected with refrigeration end and cool-guiding device are connected；Protect
Warm system, with copper water tank, water pump and the heat exchanger being connected with heating end, heat exchanger is water heat type heat exchanger,
Heat exchanger, copper water tank and water pump are sequentially connected by circulating water pipe.
The utility model provides a kind of semiconductor refrigerating fan with heat-insulation system, also with transformer, the transformer point
It is not connected with fan, refrigeration semiconductor and water pump circuit.
The utility model provides a kind of semiconductor refrigerating fan with heat-insulation system, also with following technical characteristic：Wherein,
Refrigeration semiconductor is double-decker.
The utility model provides a kind of semiconductor refrigerating fan with heat-insulation system, also with following technical characteristic：Wherein,
Cool-guiding device is fin-type cool-guiding device.
Utility model is acted on and effect
According to a kind of semiconductor refrigerating fan with heat-insulation system that the utility model is provided, including refrigeration semiconductor, lead
Cooling system and heat-insulation system.Because cold is passed to cool-guiding device by the refrigeration end of refrigeration semiconductor, air connects with the cool-guiding device
Lowered the temperature after touch and blown out by fan, formed refrigerating fan.Because the heating end of refrigeration semiconductor transfers heat to copper water
Case, raises the water temperature in copper water tank, so as to carry out heating and thermal insulation to the article being placed on copper water tank.The utility model
A kind of simple structure of the semiconductor refrigerating fan with heat-insulation system for providing, easy to operate, refrigeration are fast with the speed of heating.
Brief description of the drawings
Fig. 1 is a kind of structural representation of semiconductor refrigerating fan with heat-insulation system of the present utility model.
Specific embodiment
Specific embodiment of the present utility model is illustrated below in conjunction with accompanying drawing.
Fig. 1 is a kind of structural representation of semiconductor refrigerating fan with heat-insulation system of the present utility model.
As shown in figure 1, a kind of semiconductor refrigerating fan 10 with heat-insulation system of the present embodiment, including refrigeration semiconductor 5,
Conduction cooling system and heat-insulation system.
Refrigeration semiconductor 5 has refrigeration end and heating end, and in the present embodiment, refrigeration semiconductor 5 is double-decker.
Conduction cooling system has cool-guiding device 4 and fan 3, and cool-guiding device 4 connects the refrigeration end of fan 3 and refrigeration semiconductor 5 respectively,
In the present embodiment, cool-guiding device 4 is fin-type cool-guiding device.
Heat-insulation system has copper water tank 7, water pump 2 and the heat exchanger 6 being connected with heating end, and heat exchanger 6 is water
Accepting heat exchanger, heat exchanger 6, copper water tank 7 and water pump 2 are sequentially connected by circulating water pipe 8.
A kind of semiconductor refrigerating fan 10 with heat-insulation system of the present embodiment also has transformer 1, and the transformer 1 is distinguished
It is connected with fan 3, refrigeration semiconductor 5 and the circuit of water pump 2.
Below in conjunction with a kind of course of work of semiconductor refrigerating fan 10 with heat-insulation system of brief description of the drawings the present embodiment：
After refrigeration semiconductor 5 switches on power, cold is passed to cool-guiding device 4 by the refrigeration end of refrigeration semiconductor 5, air with should
Cool-guiding device 4 is lowered the temperature after contacting and is blown out by fan 3, forms refrigerating fan.
The heating end of refrigeration semiconductor 5 transfers heat to heat exchanger 6, and heat exchanger 6 passes through circulating water pipe 8 by heat
Copper water tank 7 is passed to, the water temperature in copper water tank 7 is raised, so as to be heated to the article being placed on copper water tank 7
It is incubated, the water temperature drop in subsequent copper water tank 7 is simultaneously entered in water pump 2 by circulating water pipe 8, is finally transmitted back to by water pump 2 again
It is reheated in heat exchanger 6.
Embodiment is acted on and effect
According to a kind of semiconductor refrigerating fan with heat-insulation system that the present embodiment is provided, including refrigeration semiconductor, conduction cooling
System and heat-insulation system.Because cold is passed to cool-guiding device by the refrigeration end of refrigeration semiconductor, air is contacted with the cool-guiding device
Lowered the temperature afterwards and blown out by fan, formed refrigerating fan.Because the heating end of refrigeration semiconductor transfers heat to copper water tank,
Raise the water temperature in copper water tank, so as to carry out heating and thermal insulation to the article being placed on copper water tank.The utility model is carried
A kind of simple structure of the semiconductor refrigerating fan with heat-insulation system for supplying, easy to operate, refrigeration are fast with the speed of heating.
Claims (4)
1. a kind of semiconductor refrigerating fan with heat-insulation system, it is characterised in that including：
Refrigeration semiconductor, with refrigeration end and heating end；
Conduction cooling system, with the fan that the cool-guiding device being connected with the refrigeration end and the cool-guiding device are connected；
Heat-insulation system, with copper water tank, water pump and the heat exchanger being connected with the heating end, the heat exchanger is water
Accepting heat exchanger, the heat exchanger, the copper water tank and the water pump are sequentially connected by circulating water pipe.
2. a kind of semiconductor refrigerating fan with heat-insulation system according to claim 1, it is characterised in that also have：
Transformer, the transformer is connected with the fan, the refrigeration semiconductor and the water pump circuit respectively.
3. a kind of semiconductor refrigerating fan with heat-insulation system according to claim 1, it is characterised in that：
Wherein, the refrigeration semiconductor is double-decker.
4. a kind of semiconductor refrigerating fan with heat-insulation system according to claim 1, it is characterised in that：
Wherein, the cool-guiding device is fin-type cool-guiding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621356282.XU CN206269294U (en) | 2016-12-12 | 2016-12-12 | A kind of semiconductor refrigerating fan with heat-insulation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621356282.XU CN206269294U (en) | 2016-12-12 | 2016-12-12 | A kind of semiconductor refrigerating fan with heat-insulation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206269294U true CN206269294U (en) | 2017-06-20 |
Family
ID=59045045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621356282.XU Expired - Fee Related CN206269294U (en) | 2016-12-12 | 2016-12-12 | A kind of semiconductor refrigerating fan with heat-insulation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206269294U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110030649A (en) * | 2019-04-08 | 2019-07-19 | 中山市菲蒲特电器有限公司 | A kind of fan |
-
2016
- 2016-12-12 CN CN201621356282.XU patent/CN206269294U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110030649A (en) * | 2019-04-08 | 2019-07-19 | 中山市菲蒲特电器有限公司 | A kind of fan |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170620 Termination date: 20171212 |