CN105222393A - A kind of refrigerator type water heater cold-hot integrated device - Google Patents
A kind of refrigerator type water heater cold-hot integrated device Download PDFInfo
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- CN105222393A CN105222393A CN201510693478.1A CN201510693478A CN105222393A CN 105222393 A CN105222393 A CN 105222393A CN 201510693478 A CN201510693478 A CN 201510693478A CN 105222393 A CN105222393 A CN 105222393A
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Abstract
The present invention relates to semiconductor refrigerating and heat technical field, particularly relate to a kind of semiconductor freezer water heater integration apparatus.Comprise heating and cooling semiconductor chip, lead hot linked refrigerating chamber with the cold junction of described heating and cooling semiconductor chip, lead hot linked heating chamber with the hot junction of described heating and cooling semiconductor chip; It is characterized in that: the N-type semiconductor of described heating and cooling semiconductor chip arranges graphene layer, or the P-type semiconductor of described heating and cooling semiconductor chip arranges graphene layer, or the N-type semiconductor of described heating and cooling semiconductor chip and P-type semiconductor all arrange graphene layer.Make the described cold junction of described heating and cooling semiconductor chip continue to produce cold, the hot junction of described heating and cooling semiconductor chip continues to produce heat, improves the temperature difference of the hot cold junction of described heating and cooling semiconductor chip.
Description
Technical field
The present invention relates to semiconductor refrigerating and heat technical field, particularly relate to a kind of refrigerator type water heater cold-hot integrated device.
Background technology
After the logical upper direct current of semiconductor chilling plate, its cold junction, from absorbing heat around, can be used for refrigeration; Its hot junction gives off heat in surrounding environment, can be used for heating.Semiconductor refrigeration system mechanical is rotated, advantages such as having noiselessness, nothing is worn and torn, be reliable, easy to maintenance.But the cold and hot end temperature difference of existing semiconductor chilling plate generally can not be greater than 60 degrees Celsius, refrigeration and heating effect and all very limited.
Summary of the invention
A kind of refrigerator type water heater cold-hot integrated device that the problem that the present invention is directed to prior art proposes, comprises heating and cooling semiconductor chip, leads hot linked refrigerating chamber with the cold junction of described heating and cooling semiconductor chip, leads hot linked heating chamber with the hot junction of described heating and cooling semiconductor chip; It is characterized in that: the N-type semiconductor of described heating and cooling semiconductor chip arranges graphene layer, or the P-type semiconductor of described heating and cooling semiconductor chip arranges graphene layer, or the N-type semiconductor of described heating and cooling semiconductor chip and P-type semiconductor all arrange graphene layer.Graphene in semiconductor has the high electron mobility of high thermal conductivity and conductance, and described P-type semiconductor and described N-type semiconductor can be impelled to form stable P pole or N pole quickly with less energy consumption; Meanwhile, the heat conductivility that Graphene is high can improve transfer of heat speed in described heating and cooling semiconductor chip and ability.Make the described cold junction of described heating and cooling semiconductor chip continue to produce cold, the hot junction of described heating and cooling semiconductor chip continues to produce heat, improves the temperature difference of the hot cold junction of described heating and cooling semiconductor chip.Also it can be protected to burn even if described hot junction does not arrange heating and cooling semiconductor chip described in heat abstractor, ensure that it normally works.
As preferably, described P-type semiconductor arranges graphene layer; Described N-type semiconductor has the graphene layer of Graphene purity higher than the Graphene purity of the graphene layer of described P-type semiconductor.Improve the hot cold junction temperature difference to 150 DEG C of described heating and cooling semiconductor chip, after energising 3S, the temperature of described cold junction can reach to-50 DEG C, the temperature in described hot junction can reach 100 DEG C, can obtain lower cold junction temperature, substantially increase refrigeration under same hot-side temperature.
As preferably, described heating chamber comprises water inlet, delivery port, is arranged in described heating chamber and is communicated with the storage chamber of described water inlet and described delivery port, and described semiconductor refrigerating heating plate is connected by the heat conduction of Graphene heat-conducting piece with described storage chamber.The thermal conductivity of Graphene is tens times of metal, timely the hot-side temperature of described semiconductor refrigerating heating plate is passed to described heating and heats by force.Impel the lifting of described heating and cooling semiconductor chip refrigerating capacity.
As preferably, described refrigerating chamber outer surface arranges heat insulation layer.Prevent the heat losses in described refrigerating chamber.
As preferably, described heating chamber outer surface arranges heat insulation layer.Prevent the heat losses in described heating chamber.
A kind of refrigerator type water heater cold-hot integrated device that the present invention also proposes, comprises heating and cooling semiconductor chip, leads hot linked refrigerating chamber with the cold junction of described heating and cooling semiconductor chip, leads hot linked heating chamber with the hot junction of described heating and cooling semiconductor chip; It is characterized in that: described N-type semiconductor adds Graphene particle, or described P-type semiconductor adds Graphene particle, or described N-type semiconductor and described P-type semiconductor all add Graphene particle.Graphene in semiconductor has the high electron mobility of high thermal conductivity and conductance, and described P-type semiconductor and described N-type semiconductor can be impelled to form stable P pole or N pole quickly with less energy consumption; Meanwhile, the heat conductivility that Graphene is high can improve transfer of heat speed in described heating and cooling semiconductor chip and ability.Make the described cold junction of described heating and cooling semiconductor chip continue to produce cold, the hot junction of described heating and cooling semiconductor chip continues to produce heat, improves the temperature difference of the hot cold junction of described heating and cooling semiconductor chip.Also it can be protected to burn even if described hot junction does not arrange heating and cooling semiconductor chip described in heat abstractor, ensure that it normally works.
As preferably, described N-type semiconductor adds Graphene particle, and described P-type semiconductor adds Graphene particle, and the Graphene purity of the Graphene particle of described N-type semiconductor is higher than the Graphene purity of the graphite granule of described P-type semiconductor.Improve the hot cold junction temperature difference to 150 DEG C of described heating and cooling semiconductor chip, after energising 3S, the temperature of described cold junction can reach to-50 DEG C, the temperature in described hot junction can reach 100 DEG C, can obtain lower cold junction temperature, substantially increase refrigeration under same hot-side temperature.
As preferably, described heating chamber comprises water inlet, delivery port, is arranged in described heating chamber and is communicated with the storage chamber of described water inlet and described delivery port, and described semiconductor refrigerating heating plate is connected by the heat conduction of Graphene heat-conducting piece with described storage chamber.The thermal conductivity of Graphene is tens times of metal, timely the hot-side temperature of described semiconductor refrigerating heating plate is passed to described heating and heats by force.Impel the lifting of described heating and cooling semiconductor chip refrigerating capacity.
As preferably, described refrigerating chamber outer surface arranges heat insulation layer.Prevent the heat losses in described refrigerating chamber.
As preferably, described heating chamber outer surface arranges heat insulation layer.Prevent the heat losses in described heating chamber.
The present invention has following beneficial effect:
1. while refrigeration space is freezed, the water in storage chamber can be heated, improve energy utilization efficiency.
2. the hot cold junction temperature that improve heating and cooling semiconductor chip is poor, thus improves its cooling and warming ability.
3., by improving the cooling and warming ability of heating and cooling semiconductor chip, improve the cooling and warming space of heating and cooling semiconductor chip.
4. adopt the mode of electricity refrigeration to freeze, do not need to use freon as cold-producing medium, environmental protection, safer.
5. adopt the mode of electricity refrigeration to freeze, avoid the refrigeration system using compressor-type, reduce refrigeration noise.
6. adopt the mode of electricity refrigeration to freeze, in refrigeration system, mechanical motion, runs more stable.
7. cooling and warming ability adjusts by current regulation unit.
8. improve the speed of cooling and warming, its temperature can be recovered rapidly at refrigeration space with after heating space and external environment connect, reduce refrigeration space and the temperature fluctuation heating space.
Accompanying drawing explanation
Fig. 1 semiconductor freezer water heater integration apparatus;
Fig. 2 heating and cooling semiconductor chip structure chart one;
Fig. 3 heating and cooling semiconductor chip structure chart two;
Wherein, 1-heating and cooling semiconductor chip, 2-refrigerating chamber, 3-heating chamber, 4-heat insulation layer, 11-cold junction, 12-hot junction, 13-N type semiconductor, 14-P type semiconductor, 15-metallic conductor, 16-power supply, 17-graphene layer, 18-Graphene particle, 31-water inlet, 32-delivery port, 33-storage chamber.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiments of the present invention are described in detail.As shown in Figure 1, a kind of refrigerator type water heater cold-hot integrated device, comprises heating and cooling semiconductor chip 1, leads hot linked refrigerating chamber 2 with the cold junction 11 of heating and cooling semiconductor chip 1, leads hot linked heating chamber 3 with the hot junction 12 of heating and cooling semiconductor chip 1.The structure of heating and cooling semiconductor chip 1 as shown in Figure 2, comprise the cold junction 11 for absorbing heat, for dispel the heat hot junction 12, be arranged on N-type semiconductor 13 between cold junction 11 and hot junction 12 and P-type semiconductor 14, the metallic conductor 15 being connected N-type semiconductor 13 and P-type semiconductor 14, power supply 16.Metallic conductor 15 arranges the positive and negative electrode being used for electric connection of power supply 16.Power supply 16 provides described dc source for heating and cooling semiconductor chip.
As Fig. 2, in N-type semiconductor 13 or P-type semiconductor 14, accompany graphene layer 17.Graphene layer in N-type semiconductor 13 is the N-type doped graphene layer that can increase the impurity of Graphene betatopic ability doped with H2 or other; Graphene layer in P-type semiconductor 14 is can increase doped with NO2 or other P type doped graphene layer that Graphene obtains the impurity of electronic capability.Graphene has the high electron mobility of high thermal conductivity and conductance, and P-type semiconductor 14 or N-type semiconductor 13 can be impelled to form stable P pole or N pole quickly with less energy consumption.Meanwhile, the heat conductivility that Graphene is high can improve transfer of heat speed in described heating and cooling semiconductor chip 1 and ability.Make cold junction 11 continue to produce cold, hot junction 12 continues to produce heat, improves the temperature difference of the hot cold junction of heating and cooling semiconductor chip 1.
In order to make semiconductor refrigerating heating capacity reach best, also graphene layer 17 can be all set in N-type semiconductor 13 and P-type semiconductor 4.Now, need ensure that N-type semiconductor has the N-type doped graphene layer of Graphene purity higher than the Graphene purity of the P type doped graphene layer of P-type semiconductor.Now, the temperature of cold junction can reach-50 DEG C, and hot-side temperature can reach 100 DEG C, and hot cold junction temperature difference reaches 150 DEG C.
Also can adopt heating and cooling semiconductor chip as shown in Figure 3, N-type semiconductor 13 or P-type semiconductor 14 add Graphene particle 18.Graphene particle in N-type semiconductor 3 is the N-type doped graphene particle that can increase the impurity of Graphene betatopic ability doped with H2 or other; Graphene particle in P-type semiconductor 14 is can increase doped with NO2 or other P type doped graphene particle that Graphene obtains the impurity of electronic capability.Graphene has the high electron mobility of high thermal conductivity and conductance, and P-type semiconductor 14 or N-type semiconductor 13 can be impelled to form stable P pole or N pole quickly with less energy consumption.Meanwhile, the heat conductivility that Graphene is high can improve transfer of heat speed in described heating and cooling semiconductor chip 1 and ability.Make cold junction 11 continue to produce cold, hot junction 12 continues to produce heat, improves the temperature difference of the hot cold junction of heating and cooling semiconductor chip 1.
In order to make semiconductor refrigerating heating capacity reach best, also can all add graphene layer particle in N-type semiconductor 3 and P-type semiconductor 4.Now, the Graphene purity of the Graphene purity of the Graphene particle added in N-type semiconductor 3 higher than the Graphene particle added in P-type semiconductor 4 need be ensured.Now, the temperature of cold junction can reach-50 DEG C, and hot-side temperature can reach 100 DEG C, and hot cold junction temperature difference reaches 150 DEG C.
Heating chamber 3 is positioned at the top of refrigerating chamber 2, and heating and cooling semiconductor chip 1 is arranged between heating chamber 3 and refrigerating chamber 2.The hot junction 12 of heating and cooling semiconductor chip 1 is connected with the bottom heat conduction of heating chamber 3, and the hot-air rising of the bottom of heating chamber 3 is full of whole heating chamber 3 and heats the storage chamber 33 being arranged in heating chamber 3.The cold junction 11 of heating and cooling semiconductor chip 1 is connected with the bottom heat conduction of refrigerating chamber 2, and the cold air at the top of heating chamber 2 sinks, and is full of whole refrigerating chamber 2 and freezes to it.
Heating chamber 3 comprises water inlet 31, delivery port 32, is arranged in heating chamber 3 and is communicated with the storage chamber 33 of water inlet 31 and delivery port 32, and semiconductor refrigerating heating plate 1 is connected by Graphene heat-conducting piece 34 heat conduction with storage chamber 33.
In order to reduce the heat transmission inside and outside chamber as far as possible, refrigerating chamber 2 and heating chamber 3 outer surface all arrange heat insulation layer 4.
Although describe embodiments of the present invention by reference to the accompanying drawings, those of ordinary skill in the art can make various distortion or amendment within the scope of the appended claims.
Claims (10)
1. a semiconductor freezer water heater integration apparatus, comprises heating and cooling semiconductor chip (1), leads hot linked refrigerating chamber (2) with the cold junction (11) of described heating and cooling semiconductor chip (1), leads hot linked heating chamber (3) with the hot junction (12) of described heating and cooling semiconductor chip (1); It is characterized in that: the N-type semiconductor (13) of described heating and cooling semiconductor chip (1) arranges graphene layer, or the P-type semiconductor (14) of described heating and cooling semiconductor chip (1) arranges graphene layer, or the N-type semiconductor (13) of described heating and cooling semiconductor chip (1) and P-type semiconductor (14) all arrange graphene layer.
2. a kind of semiconductor freezer water heater integration apparatus according to claim 1, is characterized in that: described P-type semiconductor (14) arranges graphene layer; Described N-type semiconductor (13) has the graphene layer of Graphene purity higher than the Graphene purity of the graphene layer of described P-type semiconductor (14).
3. a kind of semiconductor freezer water heater integration apparatus according to claim 1 and 2, it is characterized in that: described heating chamber (3) comprises water inlet (31), delivery port (32), is arranged in described heating chamber (3) and is communicated with the storage chamber (33) of described water inlet (31) and described delivery port (32), and described semiconductor refrigerating heating plate is connected by the heat conduction of Graphene heat-conducting piece with described storage chamber (33).
4. a kind of semiconductor freezer water heater integration apparatus according to claim 1 and 2, is characterized in that: described refrigerating chamber (2) outer surface arranges heat insulation layer (4).
5. a kind of semiconductor freezer water heater integration apparatus according to claim 1 and 2, is characterized in that: described heating chamber (3) outer surface arranges heat insulation layer (4).
6. a semiconductor freezer water heater integration apparatus, comprises heating and cooling semiconductor chip (1), leads hot linked refrigerating chamber (2) with the cold junction (11) of described heating and cooling semiconductor chip (1), leads hot linked heating chamber (3) with the hot junction (12) of described heating and cooling semiconductor chip (1); It is characterized in that: described N-type semiconductor (13) adds Graphene particle, or described P-type semiconductor (14) adds Graphene particle, or described N-type semiconductor (13) and described P-type semiconductor (14) all add Graphene particle (18).
7. a kind of semiconductor freezer water heater integration apparatus according to claim 6, it is characterized in that: described N-type semiconductor (13) adds Graphene particle, described P-type semiconductor (14) adds Graphene particle, and the Graphene purity of the Graphene particle of described N-type semiconductor is higher than the Graphene purity of the graphite granule of described P-type semiconductor (14).
8. a kind of semiconductor freezer water heater integration apparatus according to claim 6 or 7, it is characterized in that: described heating chamber (3) comprises water inlet (31), delivery port (32), is arranged in described heating chamber (3) and is communicated with the storage chamber (33) of described water inlet (31) and described delivery port (32), and described semiconductor refrigerating heating plate is connected by the heat conduction of Graphene heat-conducting piece with described storage chamber (33).
9. a kind of semiconductor freezer water heater integration apparatus according to claim 6 or 7, is characterized in that: described refrigerating chamber (2) outer surface arranges heat insulation layer (4).
10. a kind of semiconductor freezer water heater integration apparatus according to claim 6 or 7, is characterized in that: described heating chamber (3) outer surface arranges heat insulation layer (4).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510693478.1A CN105222393A (en) | 2015-10-24 | 2015-10-24 | A kind of refrigerator type water heater cold-hot integrated device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510693478.1A CN105222393A (en) | 2015-10-24 | 2015-10-24 | A kind of refrigerator type water heater cold-hot integrated device |
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| CN105222393A true CN105222393A (en) | 2016-01-06 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742473A (en) * | 2016-03-09 | 2016-07-06 | 苏州常合新材料科技有限公司 | Semiconductor cooling and heating assembly graphene material |
| CN105957952A (en) * | 2016-05-26 | 2016-09-21 | 安徽明辉成美科技发展有限公司 | Semiconductor refrigeration graphene chip |
| CN109186161A (en) * | 2018-07-02 | 2019-01-11 | 青岛海尔股份有限公司 | The micro refrigerator that can be heated |
| CN111964302A (en) * | 2020-08-24 | 2020-11-20 | 长春理工大学光电信息学院 | Semiconductor refrigerator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160170A (en) * | 1995-03-02 | 1997-09-24 | 萨墨福尼克斯株式会社 | Thermoelectric conversion arrangement |
| CN201206919Y (en) * | 2008-04-22 | 2009-03-11 | 陈正才 | Refrigeration and heat-production device |
| US20120272666A1 (en) * | 2011-04-28 | 2012-11-01 | Denso Corporation | Magnetic heat pump system |
| WO2013059239A1 (en) * | 2011-10-20 | 2013-04-25 | Sheetak, Inc. | Improved thermoelectric energy converters and manufacturing method thereof |
| CN205208996U (en) * | 2015-10-24 | 2016-05-04 | 唐玉敏 | Cold and hot integrative device of refrigerator water heater |
-
2015
- 2015-10-24 CN CN201510693478.1A patent/CN105222393A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160170A (en) * | 1995-03-02 | 1997-09-24 | 萨墨福尼克斯株式会社 | Thermoelectric conversion arrangement |
| CN201206919Y (en) * | 2008-04-22 | 2009-03-11 | 陈正才 | Refrigeration and heat-production device |
| US20120272666A1 (en) * | 2011-04-28 | 2012-11-01 | Denso Corporation | Magnetic heat pump system |
| WO2013059239A1 (en) * | 2011-10-20 | 2013-04-25 | Sheetak, Inc. | Improved thermoelectric energy converters and manufacturing method thereof |
| CN205208996U (en) * | 2015-10-24 | 2016-05-04 | 唐玉敏 | Cold and hot integrative device of refrigerator water heater |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742473A (en) * | 2016-03-09 | 2016-07-06 | 苏州常合新材料科技有限公司 | Semiconductor cooling and heating assembly graphene material |
| CN105957952A (en) * | 2016-05-26 | 2016-09-21 | 安徽明辉成美科技发展有限公司 | Semiconductor refrigeration graphene chip |
| CN109186161A (en) * | 2018-07-02 | 2019-01-11 | 青岛海尔股份有限公司 | The micro refrigerator that can be heated |
| CN111964302A (en) * | 2020-08-24 | 2020-11-20 | 长春理工大学光电信息学院 | Semiconductor refrigerator |
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Application publication date: 20160106 |