CN217181118U

CN217181118U - High-power integrated LED light source temperature control heat dissipation experimental device

Info

Publication number: CN217181118U
Application number: CN202220907473.XU
Authority: CN
Inventors: 刘佳辉; 袁士东
Original assignee: CHANGZHOU INSTITUTE OF OPTOELECTRONIC TECHNOLOGY
Current assignee: CHANGZHOU INSTITUTE OF OPTOELECTRONIC TECHNOLOGY
Priority date: 2022-04-19
Filing date: 2022-04-19
Publication date: 2022-08-12
Anticipated expiration: 2032-04-19

Abstract

The utility model discloses a high-power integrated LED light source temperature control and heat dissipation experimental device, which comprises a PID temperature controller, a TEC drive circuit, an LED light source, a light source substrate, a semiconductor refrigerator and a heat dissipation assembly, wherein the LED light source, the light source substrate, the semiconductor refrigerator and the heat dissipation assembly are sequentially and fixedly arranged from top to bottom; the PID temperature controller is suitable for receiving signals of the temperature sensor and controlling the refrigerating capacity of the semiconductor refrigerator through the TEC driving circuit. The utility model overcomes current testing arrangement's is not enough, can not only set up the temperature of light source base plate, can conveniently guarantee light source base plate constancy of temperature on the setting value rapidly simultaneously.

Description

High-power integrated LED light source temperature control heat dissipation experimental device

Technical Field

The utility model relates to a LED light source experimental apparatus field especially relates to a high-power integrated LED light source accuse temperature heat dissipation experimental apparatus.

Background

In recent years, LEDs have attracted attention as new illumination light sources. LED light sources are the most likely to replace the traditional light sources in the world today due to their advantages over the traditional lighting sources, such as lower power requirements, better driving characteristics, faster response speed, higher shock resistance, longer lifetime, environmental friendliness, and ever-increasing luminous efficiency. With the rapid breakthrough of compound semiconductor technology and the continuous improvement of packaging technology, the application of high-power integrated LED light sources in the field of lighting is beginning to be developed and gradually expanded.

Like conventional light sources, LED light sources also generate heat during operation. Under the action of external electric energy, electrons and holes are radiated and combined to generate electroluminescence, and light radiated near a PN junction can reach the outside only through a semiconductor medium and a packaging medium of the chip. By integrating the current injection efficiency, the radiant luminescence quantum efficiency, the chip external light extraction efficiency and the like, only 30-40% of input electric energy is converted into light energy, and the rest 60-70% of energy is mainly converted into heat energy in a lattice vibration mode generated by non-radiative recombination. Heat is concentrated in a chip with a small size, and the temperature of the chip rises, causing non-uniform distribution of thermal stress, and reduction of the light emitting efficiency of the chip and the lasing efficiency of the fluorescent powder. When the temperature exceeds a certain value, the failure rate of the device increases exponentially. Statistics show that the reliability of the LED element decreases by 10% every 2 ℃ rise in temperature. The high-power integrated LED light source chips are densely arranged, so that the problem of heat dissipation is more serious.

At present, most of testing devices for LED light sources do not comprise a temperature control system, and only start testing after the light sources are preheated to reach a thermal equilibrium state. However, in some special detection processes, the temperature of the substrate where the light source is located needs to be set, and the temperature of the substrate needs to be stabilized at the set temperature, which cannot be achieved by the existing testing device.

SUMMERY OF THE UTILITY MODEL

The utility model aims at prior art's weak point and provide a high-power integrated LED light source accuse temperature heat dissipation experimental apparatus, overcome current testing arrangement's not enough, can not only set up the temperature of light source base plate, can conveniently guarantee light source base plate constancy of temperature on the setting value rapidly simultaneously.

Realize the utility model discloses purpose technical scheme is:

a high-power integrated LED light source temperature control and heat dissipation experimental device comprises a PID temperature controller, a TEC driving circuit, an LED light source, a light source substrate, a semiconductor refrigerator and a heat dissipation assembly, wherein the LED light source, the light source substrate, the semiconductor refrigerator and the heat dissipation assembly are sequentially and fixedly arranged from top to bottom; the PID temperature controller is suitable for receiving signals of the temperature sensor and controlling the refrigerating capacity of the semiconductor refrigerator through the TEC driving circuit.

Furthermore, the TEC drive circuit comprises an MOS transistor switch circuit, and a single chip microcomputer and a regulated power supply which are respectively electrically connected with the MOS transistor switch circuit, wherein an input end of the single chip microcomputer is connected with the PID temperature controller, an output end of the MOS transistor switch circuit is connected with the semiconductor refrigerator, and the single chip microcomputer is adapted to receive the current analog quantity transmitted by the PID temperature controller to collect and calculate the analog signal and output the PWM wave to the MOS transistor switch circuit.

Furthermore, the heat dissipation assembly comprises a heat dissipation fan and a fin-shaped heat sink fixedly mounted on the top of the heat dissipation fan.

Furthermore, the cold end face and the hot end face of the semiconductor refrigerator are respectively contacted with the light source substrate and the fin-shaped radiator, and heat conducting grease is coated on the two contact faces.

Further, the aluminum substrate of the light source substrate.

Further, the temperature sensor is a PT100 platinum thermistor.

Further, the upper surface of the semiconductor refrigerator is provided with a first positive terminal and a first negative terminal.

Further, the upper surface of the light source substrate is provided with a second positive terminal and a second negative terminal.

By adopting the technical scheme, the utility model discloses following beneficial effect has:

(1) the utility model discloses a temperature sensor real-time supervision light source base plate's temperature to feedback to PID temperature controller, calculate through PID fuzzy algorithm, real-time comparison feedback temperature and set up the temperature, and through TEC drive circuit control semiconductor cooler's refrigerating output, finally make the temperature of light source base plate reach the setting value and continuously keep stable on the setting value.

(2) The utility model discloses TEC drive circuit carries out PID temperature controller's analog signal's collection, operation and to MOS pipe switch circuit output PWM ripples through the singlechip to control MOS pipe switch circuit and input semiconductor cooler's electric current, constantly change its refrigerating output, finally make light source base plate temperature reach the setting value and continuously keep stable on the setting value.

(3) The utility model discloses radiator unit is through setting up the fin type radiator that contacts with semiconductor cooler to enlarge heat radiating area, realize better radiating effect, set up radiator fan at fin type radiator simultaneously, blow off the heat immediately, further improve the radiating effect.

(4) The utility model discloses all coating has the heat conduction fat on fin type radiator and light source base plate and semiconductor cooler's the contact surface, improves heat transfer speed to further improve radiating effect and refrigeration effect.

(5) The utility model discloses the light source base plate adopts aluminium base board, and coefficient of thermal conductivity is high, can transmit away the heat that the LED light source produced immediately, avoids the heat gathering around the LED light source, leads to the light decay seriously or die the lamp.

(6) The utility model discloses temperature sensor is PT100 platinum resistance, and measurement accuracy is high, and stability is good.

(7) The utility model discloses a all be equipped with the wiring end on semiconductor cooler and the light source base plate, the semiconductor cooler of being convenient for and TEC drive circuit's being connected realize controlling the refrigerating output to and light source base plate and external power source's being connected, realize lightening the LED light source.

Drawings

In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is provided in connection with the accompanying drawings, in which:

FIG. 1 is a schematic view of the present invention;

fig. 2 is a schematic diagram of the TEC driving circuit of the present invention.

The reference numbers in the drawings are:

the LED temperature control device comprises a PID temperature controller 1, a TEC drive circuit 2, an MOS tube switch circuit 2-1, a single chip microcomputer 2-2, a stabilized voltage power supply 2-3, an LED light source 3, a light source substrate 4, a second positive terminal 4-1, a second negative terminal 4-2, a semiconductor refrigerator 5, a first positive terminal 5-1, a first negative terminal 5-2, a heat dissipation assembly 6, a heat dissipation fan 6-1, a fin-shaped heat sink 6-2 and a temperature sensor 7.

Detailed Description

In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.

(example 1)

The high-power integrated LED light source temperature-controlling and heat-dissipating experimental apparatus shown in fig. 1 to 2 includes a PID temperature controller 1, a TEC driving circuit 2, an LED light source 3, a light source substrate 4, a semiconductor refrigerator 5, a heat-dissipating component 6, and a temperature sensor 7. The LED light source 3, the light source substrate 4, the semiconductor cooler 5 and the heat dissipation assembly 6 are sequentially and fixedly arranged from top to bottom, the temperature sensor 7 is fixedly installed on the upper surface of the light source substrate 4, and the temperature sensor 7, the PID temperature controller 1 and the TEC driving circuit 2 are sequentially and electrically connected with the semiconductor cooler 5. The temperature of the light source substrate 4 is monitored in real time through the temperature sensor 7 and fed back to the PID temperature controller 1, the feedback temperature and the set temperature are compared in real time through PID fuzzy algorithm calculation, the refrigerating capacity of the semiconductor refrigerator 5 is controlled through the TEC driving circuit 2, and finally the temperature of the light source substrate 4 reaches a set value and is continuously kept stable on the set value.

Specifically, the TEC driving circuit 2 comprises an MOS tube switching circuit 2-1, a single chip microcomputer 2-2 and a stabilized voltage power supply 2-3, wherein the input end of the single chip microcomputer 2-2 is connected with a PID temperature controller 1, the output end of the single chip microcomputer is connected with the input end of the MOS tube switching circuit 2-1, the upper surface of the semiconductor refrigerator 5 is provided with the semiconductor cooler, and the output end of the MOS tube switching circuit 2-1 is connected with the positive electrode and the negative electrode of the semiconductor refrigerator 5 through a first positive electrode wiring end 5-1 and a first negative electrode wiring end 5-2, so that the connection is convenient. The stabilized voltage power supply 2-3 is electrically connected with the MOS tube switch circuit 2-1. The single chip microcomputer 2-2 is used for collecting and calculating the analog signal of the PID temperature controller 1 and outputting PWM wave to the MOS tube switch circuit 2-1, so that the current input to the semiconductor refrigerator 5 by the MOS tube switch circuit 2-1 is controlled, the refrigerating capacity of the semiconductor refrigerator is continuously changed, and finally the temperature of the light source substrate 4 reaches a set value and is continuously kept stable on the set value.

The light source substrate 4 is an aluminum substrate, so that the heat conductivity coefficient is high, heat generated by the LED light source 3 can be transferred out in time, and the phenomenon that the heat is accumulated around the LED light source to cause serious light attenuation or lamp death is avoided. Meanwhile, the upper surface of the light source substrate 4 is provided with a second positive terminal 4-1 and a second negative terminal 4-2, which are convenient for connecting an external power supply and lighting the LED light source 3.

The heat dissipation assembly 6 comprises a heat dissipation fan 6-1 and a fin-shaped heat sink 6-2, the fin-shaped heat sink 6-2 is tightly attached to the hot end face of the semiconductor refrigerator 5, and heat conduction grease is coated on the contact face of the fin-shaped heat sink 6-2, so that the heat dissipation area is enlarged, and the heat transfer speed from the semiconductor refrigerator 5 to the fin-shaped heat sink 6-2 is increased. The heat radiation fan 6-1 is fixedly arranged right below the fin-shaped radiator 6-2 and blows heat instantly, so that the heat radiation effect is further improved. The cold end face of the semiconductor refrigerator 5 is tightly attached to the light source substrate 4, and the contact face is coated with heat conducting grease, so that the refrigerating effect of the semiconductor refrigerator 5 on the light source substrate 4 is improved.

The temperature sensor 7 is a PT100 platinum thermal resistor, and has high measurement precision and good stability.

This embodiment structural design is succinct, through the output of PID temperature controller 1 control TEC drive circuit 2, through the feedback of PT100 platinum resistance, the size of real time control TEC drive circuit 2 output voltage to this refrigeration capacity of controlling semiconductor cooler 5, thereby realize controlling light source base plate 4 temperature, overcome current testing arrangement's not enough, can not only set up the temperature of light source base plate 4, can conveniently guarantee light source base plate 4 constancy of temperature on the set value rapidly simultaneously.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A high-power integrated LED light source accuse temperature heat dissipation experimental apparatus which characterized in that: the LED light source module comprises a PID temperature controller (1), a TEC driving circuit (2), and an LED light source (3), a light source substrate (4), a semiconductor refrigerator (5) and a heat dissipation assembly (6) which are sequentially and fixedly arranged from top to bottom, wherein a temperature sensor (7) is fixedly installed on the light source substrate (4), and the temperature sensor (7), the PID temperature controller (1), the TEC driving circuit (2) and the semiconductor refrigerator (5) are sequentially and electrically connected; the PID temperature controller (1) is suitable for receiving signals of the temperature sensor and controlling the refrigerating capacity of the semiconductor refrigerator (5) through the TEC driving circuit (2).

2. The temperature-controlling and heat-dissipating experimental device for the high-power integrated LED light source as claimed in claim 1, wherein: the TEC driving circuit (2) comprises an MOS tube switching circuit (2-1), a single chip microcomputer (2-2) and a voltage stabilizing power supply (2-3), wherein the single chip microcomputer (2-2) and the voltage stabilizing power supply (2-3) are respectively electrically connected with the MOS tube switching circuit (2-1), the input end of the single chip microcomputer (2-2) is connected with a PID temperature controller (1), the output end of the MOS tube switching circuit (2-1) is connected with a semiconductor refrigerator (5), and the single chip microcomputer (2-2) is suitable for receiving current analog quantity transmitted by the PID temperature controller (1) to collect and calculate analog signals and output PWM waves to the MOS tube switching circuit (2-1).

3. The temperature-controlling and heat-dissipating experimental device for the high-power integrated LED light source as claimed in claim 1, wherein: the heat dissipation assembly (6) comprises a heat dissipation fan (6-1) and a fin-shaped heat sink (6-2) fixedly mounted at the top of the heat dissipation fan (6-1).

4. The temperature-controlling and heat-dissipating experimental device for the high-power integrated LED light source as claimed in claim 3, wherein: the cold surface end and the hot surface end of the semiconductor refrigerator (5) are respectively contacted with the light source substrate (4) and the fin-shaped radiator (6-2), and heat conducting grease is coated on the two contact surfaces.

5. The temperature-controlling and heat-dissipating experimental device for the high-power integrated LED light source as claimed in claim 1, wherein: an aluminum substrate of the light source substrate (4).

6. The temperature-controlling and heat-dissipating experimental device for the high-power integrated LED light source as claimed in claim 1, wherein: the temperature sensor (7) is a PT100 platinum thermal resistor.

7. The temperature-controlling and heat-dissipating experimental device for the high-power integrated LED light source as claimed in claim 1, wherein: the upper surface of the semiconductor refrigerator (5) is provided with a first positive terminal (5-1) and a first negative terminal (5-2).

8. The temperature-controlling and heat-dissipating experimental device for the high-power integrated LED light source as claimed in claim 1, wherein: and a second positive terminal (4-1) and a second negative terminal (4-2) are arranged on the upper surface of the light source substrate (4).