CN207834354U

CN207834354U - A kind of chip on board encapsulating structure

Info

Publication number: CN207834354U
Application number: CN201721565955.7U
Authority: CN
Inventors: 谷亚
Original assignee: Suzhou Thunder Photoelectric Technology Co Ltd
Current assignee: Suzhou Thunder Photoelectric Technology Co Ltd
Priority date: 2017-11-13
Filing date: 2017-11-13
Publication date: 2018-09-07
Anticipated expiration: 2027-11-13

Abstract

The utility model provides a kind of chip on board encapsulating structure, including substrate, several luminescent wafers for being uniformly arranged on the substrate side, the heat-sink unit that is set to the radiator base of the substrate another side and is connected with the radiator base.The good aluminum material of heat conduction may be used in the radiator base or alloy material is made, the radiator base is used to the heat of the substrate being transferred to the multi-layer heat dissipation on piece by the multiple copper pipe, and heat is distributed by the multiple cooling fin, reach automatic dissipating heat function, to reach the light decay for reducing luminescent wafer, prevent color drift phenomenon.

Description

A kind of chip on board encapsulating structure

Technical field

The utility model is related to LED production technical fields more particularly to a kind of chip on board encapsulating structures.

Background technology

LED light has luminous efficiency height, energy conservation and environmental protection and longevity as a kind of new energy product compared with conventional illumination device Order the features such as long.The high-power LED surface light source of multi-chip COB (chip on board encapsulation) encapsulation is capable of providing very high luminous flux, It is a development trend of current LED illumination industry.In the case where the light extraction efficiency of current LED light is also not bery high, LED's Luminous efficiency (ratio of luminous flux and power) considerably beyond conventional light source, but since efficiency of light extraction is not also high, produce by LED chip Raw many photons cannot effectively be emitted to outside, and leading to it, portion reflects and become thermal energy by chip absorption and made repeatedly in the chip Chip temperature increases, and the excessively high performance that will have a direct impact on photoelectric device of temperature and service life, therefore the heat dissipation research of LED light is aobvious It obtains critically important.For the LED area light source of multi-chip COB encapsulation, integrated chip density is high and power is big, and package substrate has temperature The case where being evenly distributed, resulting thermal stress may lead to the poor contact phenomenon that chip is removed.

Currently, high-power COB LED, mainly use aluminum substrate, the encapsulated wafer of aluminum substrate Surface L ED to arrange closeer Collection, the heat that LED is sent out cannot conduct in time, and radiator uses the material of die casting, usually, aluminum substrate and pressure It casts material only to be locked with simple screw, in the case that fitting is not tight, the heat dissipation of LED is bad, and the heat dissipation of die casting material is main It is heat exchange pattern to radiate, heat dissipation capacity is limited, and at this moment the temperature of the LED on aluminum substrate is excessively high, is easy to cause the light of LED light It declines, color shift occurs.

Utility model content

The technical issues of the utility model is solved is to provide a kind of simple in structure, chip on board that can effectively radiate Encapsulating structure.

In order to solve the above technical problems, the utility model provides a kind of chip on board encapsulating structure, including substrate, uniformly set Be placed in several luminescent wafers of the substrate side, be set to the substrate another side radiator base and with the heat dissipation The connected heat-sink unit of device pedestal.

Further, the heat-sink unit includes the multiple copper pipes being connected with the radiator base and multi-layer heat dissipation Piece, the multiple copper pipe are each passed through the multi-layer heat dissipation piece.

Further, it is provided with refrigerant in the copper pipe.

Further, the cooling fin is aluminium radiator fin.

Further, several luminescent wafers are connected by crystal-bonding adhesive with the substrate.

Further, the substrate is copper base.

Further, the radiator base is connected by heat-conducting silicone grease with the substrate.

Further, the distance between each described luminescent wafer is 0.8 to 1.2 millimeter.

Further, the substrate is locked by screw and the radiator base.

The chip on board encapsulating structure of the utility model, the radiator base may be used the good aluminum material of heat conduction or Person's alloy material is made, and the radiator base is used to the heat of the substrate being transferred to by the multiple copper pipe described Multi-layer heat dissipation on piece, and distributed heat by the multiple cooling fin, reach automatic dissipating heat function, reduces to reach The light decay of luminescent wafer prevents color drift phenomenon.

Description of the drawings

Fig. 1 is the schematic diagram of the chip on board encapsulating structure of the utility model；

Fig. 2 is that the chip on board encapsulating structure heat-sink unit of the utility model removes the vertical view of state；

Fig. 3 is that the chip on board encapsulating structure heat-sink unit of the utility model removes the sectional view of state；

In figure label for：Substrate 1, luminescent wafer 2, radiator base 3, heat-sink unit 4, copper pipe 41, cooling fin 42, die bond Glue 5, heat-conducting silicone grease 6.

Specific implementation mode

The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below It crosses the embodiment being described with reference to the drawings to be exemplary, it is intended to for explaining the utility model, and should not be understood as to this practicality Novel limitation.

In the following description, the structure and working method of the utility model in order to clearly demonstrate, will be by all multidirectionals Word is described, but should be by these Word Understandings for convenience of term, and is not construed as word of limitation.

As shown in Figure 1 to Figure 3, the utility model provides a kind of chip on board encapsulating structure, including substrate 1, is uniformly arranged In 1 one side of the substrate several luminescent wafers 2, be set to 1 another side of the substrate radiator base 3 and with it is described dissipate The connected heat-sink unit 4 of hot device pedestal 3；The heat-sink unit 4 include the multiple copper pipes 41 being connected with the radiator base 3 and Multi-layer heat dissipation piece 42, the multiple copper pipe 41 are each passed through the multi-layer heat dissipation piece 42；The substrate 1 is copper base, copper base Hot coefficient difficult to understand is high, and thermal conductivity is good；The good aluminum material of heat conduction or alloy material system may be used in the radiator base 3 At the radiator base 3 is used to the heat of the substrate 1 being transferred to the multi-layer heat dissipation piece by the multiple copper pipe 41 On 42, and heat is distributed by the multiple cooling fin, reach automatic dissipating heat function, to reach reduction luminescent wafer 2 light decay prevents color drift phenomenon.

It is provided with refrigerant in the copper pipe 41.Refrigerant becomes gaseous state by evaporation endothermic, and heat is taken to described dissipate At backing 42, reach automatic dissipating heat function, to reach the light decay for reducing the luminescent wafer 2, prevents color drift phenomenon.

The cooling fin 42 is aluminium radiator fin.The cooling fin 42 uses aluminium flake, the copper pipe 41 to pass through aluminium flake layer by layer, Aluminium flake can quickly be conducted the heat that the copper pipe 41 is brought by way of radiation.

Several luminescent wafers 2 are connected by crystal-bonding adhesive 5 with the substrate 1；The radiator base 3 passes through thermal conductive silicon Fat 6 is connected with the substrate 1, and the substrate 1 is locked by screw and the radiator base 3.Several luminescent wafers 2 are logical Crystal-bonding adhesive 5 is crossed to be fixed on the substrate 1 according to the distance of spacing 1mm；Several luminescent wafers 2 are encapsulated in the substrate 1 After upper, heat-conducting silicone grease 6, i.e. thermal grease are spread in 1 backside of the substrate, is wanted between the substrate 1 and the radiator base 3 Be totally coated with heat-conducting silicone grease, not there is gap, in this way, heat dissipation effect is more preferable, then will the substrate 1 be mounted on the heat dissipation On device pedestal 3, screw is used in combination to lock.

The distance between each described luminescent wafer 2 is 0.8 to 1.2 millimeter, as the preferred embodiment of the utility model, The distance between each described luminescent wafer 2 is 1 millimeter.

The good aluminum material of heat conduction may be used in the chip on board encapsulating structure of the utility model, the radiator base 3 Or alloy material is made, the radiator base 3 is for transmitting the heat of the substrate 1 by the multiple copper pipe 41 Heat is distributed onto the multi-layer heat dissipation piece 42, and by the multiple cooling fin, reaches automatic dissipating heat function, to Reach the light decay for reducing luminescent wafer 2, prevents color drift phenomenon.

The above is only the most preferred embodiment of the utility model, is not made in any form to the utility model Limitation, any technical person familiar with the field, in the case where not departing from technical solutions of the utility model ambit, utilization is above-mentioned The method content of announcement makes many possible changes and modifications to technical solutions of the utility model, belongs to claim protection Range.

Claims

1. a kind of chip on board encapsulating structure, it is characterised in that：Including substrate, it is uniformly arranged on several hairs of the substrate side Light chip, the radiator base for being set to the substrate another side and the heat-sink unit being connected with the radiator base；Institute It includes the multiple copper pipes being connected with the radiator base and multi-layer heat dissipation piece to state heat-sink unit, and the multiple copper pipe is each passed through The multi-layer heat dissipation piece；It is provided with refrigerant in the copper pipe.

2. chip on board encapsulating structure described in claim 1, it is characterised in that：The cooling fin is aluminium radiator fin.

3. chip on board encapsulating structure as described in claim 1, it is characterised in that：Several luminescent wafers pass through crystal-bonding adhesive It is connected with the substrate.

4. chip on board encapsulating structure as described in claim 1, it is characterised in that：The substrate is copper base.

5. chip on board encapsulating structure as described in claim 1, it is characterised in that：The radiator base passes through heat-conducting silicone grease It is connected with the substrate.

6. chip on board encapsulating structure as described in claim 1, it is characterised in that：The distance between each described luminescent wafer It is 0.8 to 1.2 millimeter.

7. chip on board encapsulating structure as described in claim 1, it is characterised in that：The substrate passes through screw and the heat dissipation Device pedestal locks.