CN208570659U - The great power LED illuminator to be conducted heat based on thermoelectric cooling and microchannel - Google Patents
The great power LED illuminator to be conducted heat based on thermoelectric cooling and microchannel Download PDFInfo
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- CN208570659U CN208570659U CN201820419277.1U CN201820419277U CN208570659U CN 208570659 U CN208570659 U CN 208570659U CN 201820419277 U CN201820419277 U CN 201820419277U CN 208570659 U CN208570659 U CN 208570659U
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- thermoelectric
- microchannel
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- heat
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Abstract
The utility model discloses a kind of great power LED illuminator to conduct heat based on thermoelectric cooling and microchannel, including substrate, LED chip, thermoelectric radiating piece and micro-channel heat exchanger, the LED chip are mounted on substrate；The hot end of the substrate is connect with the cold end of the thermoelectric radiating piece, and the hot end of the thermoelectric radiating piece is connect with the cold end of the micro-channel heat exchanger.The beneficial effects of the utility model are: the hot-side temperature of thermoelectric radiating piece can be reduced significantly, so that LED chip directly passes through thermoelectric radiating piece and actively cools down, works well, the working performance, reliability and service life of LED can be improved.
Description
Technical field
The utility model relates to LED technical field of heat dissipation, it is specially a kind of conducted heat based on thermoelectric cooling and microchannel it is big
Power LED illuminator.
Background technique
Currently, LED light heat dissipation aspect in the market mostly uses sheet metal or is generated heat by the substrate export of system into air
It radiates.The main method that the prior art is taken has: the rationally structure of setting cooling fin, increasing heat radiation area；Using actively
Cooling mode, which radiate, is either designed encapsulating structure, carries out while making it have good luminous flux effective
Heat dissipation；It or is using modes such as water cooling, heat pipes.But the heat dissipation effect of this above-mentioned a little method of the prior art is all unobvious,
Radiating efficiency is lower, makes deviateing because of the bad generation emission wavelength that radiates for LED light, reduces luminous flux, or even influence making for LED
With the service life, these consequences restrict LED towards bigger power development.It is above-mentioned for high-powered LED lamp or LED product illuminator
Existing air-cooled or water cooling is usually unable to satisfy cooling requirements.
Utility model content
For deficiency existing for prior art described above, the utility model provides a kind of based on thermoelectric cooling and microchannel
The great power LED illuminator of heat transfer, by combining Thermal Performance of Micro Channels with semiconductor thermoelectric refrigeration technology, by its integration
It is encapsulated in the structure of LED illuminator chip, reaches better active heat removal purpose.
The technical scheme adopted by the utility model to solve the technical problem is as follows: conducted heat based on thermoelectric cooling and microchannel
Great power LED illuminator, including substrate, LED chip, thermoelectric radiating piece and micro-channel heat exchanger, the LED chip are mounted on base
On plate；The hot end of the substrate is connect with the cold end of the thermoelectric radiating piece, the hot end of the thermoelectric radiating piece and described micro- logical
The cold end of road heat exchanger connects.
The export and import of the micro-channel heat exchanger is connect with the inlet and outlet of fluid for radiating heat circulation respectively.
The fluid for radiating heat circulation includes fluid pump and fluid radiator, and the fluid pump and fluid heat exchanger are connected, with
The export and import of the micro-channel heat exchanger connects to form closed fluid for radiating heat circulation.
Working medium in the fluid for radiating heat circulation is nano fluid working medium.
Subtle stream of several channel equivalent diameters at 10~1000 μm is equipped in the flat tube of the micro-channel heat exchanger
Road, and inlet and outlet is set on flat tube.
It is provided with outside the fluid heat exchanger and carries out air-cooled fan.
The upper surface of the substrate is equipped with the groove of reflective cup-shaped, and the LED chip is mounted at the center of the groove,
The upper surface of the silicon substrate is also equipped with the translucent cover of arcuation.
The substrate is aluminum substrate or silicon substrate.
With thermally conductive glue connection between the hot end and the micro-channel heat exchanger of the thermoelectric radiating piece, in order to thermally conductive.
The pin of the LED chip is fixed on the aluminum substrate by scolding tin, the radiating end and thermoelectricity of the LED chip
Interface between cooling fin is fixed by heat-conducting glue.
The hot end of the silicon substrate is connect with several pairs of thermocouple one end using solder reflow process, and the thermocouple is another
It holds and is attached with the cold end of the thermoelectric radiating piece with solder reflow process.
The beneficial effects of the utility model are: the hot-side temperature of thermoelectric radiating piece can be reduced, so that LED chip significantly
Directly actively cooled down by thermoelectric radiating piece, works well, the working performance, reliability and service life of LED can be improved.
Detailed description of the invention
Fig. 1 is 1 structure of embodiment for the great power LED illuminator that the utility model is conducted heat based on thermoelectric cooling and microchannel
Schematic diagram；
Fig. 2 is that the fluid for radiating heat of great power LED illuminator of the utility model based on thermoelectric cooling and microchannel heat transfer follows
The flow chart of ring；
Fig. 3 is the Thermal Performance of Micro Channels for the great power LED illuminator that the utility model is conducted heat based on thermoelectric cooling and microchannel
The structural schematic diagram of device.
Fig. 4 is 2 structure of embodiment for the great power LED illuminator that the utility model is conducted heat based on thermoelectric cooling and microchannel
Schematic diagram；
Fig. 5 is the embodiment 2LED for the great power LED illuminator that the utility model is conducted heat based on thermoelectric cooling and microchannel
Light source partial structure diagram.
Specific embodiment
The utility model is described in detail below in conjunction with the drawings and specific embodiments.It is practical new that attached drawing shows this
The specific structure of the preferred embodiment of type.The wherein design feature of each element, and if there is be described to direction (upper and lower, left and right,
It is with structure shown in FIG. 1 for reference description, but the actual use direction of the utility model is not limited thereto when before and after).
Embodiment 1
Based on the great power LED illuminator that thermoelectric cooling and microchannel are conducted heat, as shown in Figure 1, including silicon substrate 2, LED core
Piece 1, thermoelectric radiating piece 4 and micro-channel heat exchanger 5, the LED chip 1 are mounted on the cold end of silicon substrate 2, form LED light source portion
Point.The hot end of the silicon substrate 2 is connect with the cold end of the thermoelectric radiating piece 4, the hot end of the thermoelectric radiating piece 4 with it is described micro-
The cold end of channel heat exchanger 5 connects.The LED chip 1 is connect with silicon substrate 2 by scolding tin by pin.The wherein silicon substrate
Plate 2 and the thermoelectric radiating piece 4 are integrated encapsulating structure, and 1 release end of heat of LED chip directly connects with the thermoelectric radiating piece 4
Touching, to improve radiating efficiency.The thermoelectric radiating piece 4 is fixedly connected between micro-channel heat exchanger 4 with crystal-bonding adhesive.The thermoelectricity dissipates
Backing 4 is semiconductor chilling plate (thermoelectric module), does not have slide unit, and reliability requirement is high, the field of no refrigerant pollution
It closes.Using the Pelt i er effect of semiconductor material, when the galvanic couple that direct current is connected by two kinds of different semiconductor materials
When, heat can be absorbed respectively at the both ends of galvanic couple and releases heat, and the purpose of refrigeration may be implemented.
The upper surface of the silicon substrate 2 is equipped with the groove of reflective cup-shaped, and the LED chip 1 is mounted in the groove
At the heart, the upper surface of the silicon substrate 2 is also equipped with the translucent cover 9 of arcuation, and phosphor powder layer is equipped in the translucent cover 9, described
Translucent cover 9 seals the groove.The hot end of the silicon substrate 2 is connect with several pairs of 3 one end of thermocouple using solder reflow process,
The cold end of 3 other end of thermocouple and the thermoelectric radiating piece 4 is attached with solder reflow process.
The outlet 50 and import 51 of the micro-channel heat exchanger 5 are connect with the inlet and outlet of fluid for radiating heat circulation respectively.
As shown in Fig. 2, the fluid for radiating heat circulation includes fluid pump 6 and fluid radiator 7, the fluid pump 6 and fluid heat exchanger 7 are gone here and there
Connection connect to form closed fluid for radiating heat circulation with the outlet 50 of the micro-channel heat exchanger 5 and import 51.The fluid for radiating heat
Working medium in circulation is nano fluid working medium.The nano fluid working medium is that the solid particle of 1-100nm and liquid heat exchange are situated between
The suspension that matter is mixed to form has the thermal coefficient and heat convection system bigger than common working medium (such as water and ethylene glycol)
Number, can effectively improve the heat transfer efficiency of micro-channel heat exchanger 5.Nano fluid working medium is by the warm of LED chip 1 and thermoelectric radiating piece 4
Amount exports and then passes through liquid cooling or air-cooled method carries out circulating cooling.The nano fluid working medium is preferably that partial size is 10-
The Cu nanoparticle of 50nm is distributed to the suspension formed in thermally conductive oil-base fluid.
As shown in figure 3, being equipped with tens of channel equivalent diameters in the flat tube of the micro-channel heat exchanger 5 10~1000
μm subtle runner, and on flat tube be arranged import 51 and outlet 50.The micro-channel heat exchanger 5 uses nano fluid working medium
(refrigerant).Preferably, tens of channel equivalent diameters are equipped in the flat tube of the micro-channel heat exchanger 5 at 100~800 μm
Subtle runner, the import 50 and outlet 51 connection be connected by circulation respectively with there is the fluid for radiating heat in working medium circulation channel.It is described
It is provided with outside fluid radiator 7 and air-cooled fan 8 is carried out to the fluid radiator 7.
Nano fluid working medium is by the heat derives of LED and thermoelectric radiating substrate and then passes through liquid cooling or air-cooled method
Carry out circulating cooling compared with prior art, the utility model can reduce the encapsulation heat of LED and thermoelectric radiating piece significantly
Resistance works well so that LED is directly actively cooled down by thermoelectric radiating, the working performance, reliability and use of LED can be improved
Service life.
The packaging thermal resistance of LED and thermoelectric radiating piece can be reduced significantly, so that LED is directly actively dropped by thermoelectric radiating
Temperature works well, and the working performance, reliability and service life of LED can be improved.
The nano fluid working medium is preferably that the Cu nanoparticle that partial size is 10~50nm is distributed to shape in thermally conductive oil-base fluid
At suspension.
Embodiment 2
Based on the great power LED illuminator that thermoelectric cooling and microchannel are conducted heat, as illustrated in figures 4-5, including aluminum substrate 21,
LED chip 2, thermoelectric radiating piece 4 and micro-channel heat exchanger 5.The LED chip 1 is mounted on aluminum substrate 21, forms LED light source
Part.The aluminum substrate 21 is mounted on the cold end of the thermoelectric radiating piece 4, the hot end of the thermoelectric radiating piece 4 and described micro- logical
The cold end of road heat exchanger 5 connects.It is exchanged heat in the micro-channel heat exchanger 5 using nano fluid working medium, nano fluid working medium export
It is radiated after coming by air-cooled or liquid cooling heat radiator.The upper surface of the aluminum substrate 21 is equipped with the translucent cover 9 of arcuation, translucent cover 9
LED chip 1 is encapsulated on the aluminum substrate 21.Phosphor powder layer is equipped in the translucent cover 9.The heat of the aluminum substrate 21
End is connect with several pairs of 3 one end of thermocouple using solder reflow process, 3 other end of thermocouple and the thermoelectric radiating piece 4
Cold end be attached with solder reflow process.
Preferably, between the hot end and the micro-channel heat exchanger 5 of the thermoelectric radiating piece 4 with thermally conductive glue connection, in order to
It is thermally conductive.The pin of the LED chip 1 is fixed on the aluminum substrate 21 by scolding tin 23, the fever end of the LED chip 1 with
Interface between thermoelectric radiating piece 1 is fixed by heat-conducting glue 11.It is set between the aluminum substrate 21 and the LED chip
Insulating layer 22 is set, the pin of the LED chip 1 is fixed by scolding tin 23 and the pad of the aluminum substrate 21.Thermoelectric radiating piece 4 will
Then heat derives are dispersed by heat utilization fluid for radiating heat mechanism derived from micro-channel heat exchanger 1.
Wherein the silicon substrate 21 is integrated encapsulating structure with the thermoelectric radiating piece 1, and 1 release end of heat of LED chip is straight
It connects and is contacted with the thermoelectric radiating piece 4, to improve radiating efficiency.Die bond is used between the thermoelectric radiating piece 4 and micro-channel heat exchanger 5
Glue connection.The aluminum substrate 21, LED chip 2, thermoelectric radiating piece 4 and micro-channel heat exchanger 5 pass through the bolt 24 of bottom plate and two sides
It is fixed as one.
Remaining structure of the present embodiment is same as Example 1.It can be used for the cooling dress of LED the utility model discloses a kind of
It sets, the cooling device includes AL heat-radiating substrate, thermoelectric radiating device, microchannel heat sink.LED light source is mounted on heat dissipation base
Plate forms LED light source part.Substrate 21 is mounted on 4 cold end of thermoelectric radiating device thermoelectric radiating piece；Thermoelectric radiating device thermoelectric radiating piece
4 hot end is connect with microchannel heat sink 5, and nano fluid working medium is used in microchannel heat sink 5, is passed through after working medium export is come
The heat dissipation of air-cooled or liquid cooling heat radiator.The release end of heat of LED chip 1 is directly mounted at thermoelectric radiating device thermoelectric radiating on piece, with heat
Electric radiator thermoelectric radiating piece cold end is closely affixed；Microchannel heat sink then with the close phase in thermoelectric radiating device thermoelectric radiating piece hot end
The interface of patch, thermoelectric radiating device thermoelectric radiating piece connection LED chip and microchannel is fixed with heat-conducting glue, microchannel heat dissipation
Heat utilization fluid radiator derived from device disperses.
As described above, the only preferred embodiment of the utility model, when cannot be limited with this utility model implementation range,
I.e. generally according to simple equivalent changes and modifications made by the utility model claim and novel description, it is new all still to belong to this
In the range of type patent covers.
Claims (10)
1. based on the great power LED illuminator that thermoelectric cooling and microchannel are conducted heat, including substrate, LED chip, thermoelectric radiating piece and
Micro-channel heat exchanger, which is characterized in that the LED chip is mounted on substrate；The hot end of the substrate and the thermoelectric radiating
The cold end of piece connects, and the hot end of the thermoelectric radiating piece is connect with the cold end of the micro-channel heat exchanger.
2. the great power LED illuminator according to claim 1 to be conducted heat based on thermoelectric cooling and microchannel, feature are existed
In the export and import of the micro-channel heat exchanger is connect with the inlet and outlet of fluid for radiating heat circulation respectively.
3. the great power LED illuminator according to claim 2 to be conducted heat based on thermoelectric cooling and microchannel, feature are existed
It include fluid pump and fluid radiator in, fluid for radiating heat circulation, the fluid pump and fluid heat exchanger series connection are and described micro-
The export and import of channel heat exchanger connects to form closed fluid for radiating heat circulation.
4. the great power LED illuminator according to claim 3 to be conducted heat based on thermoelectric cooling and microchannel, feature are existed
In the working medium in the fluid for radiating heat circulation is nano fluid working medium.
5. the great power LED illuminator according to claim 4 to be conducted heat based on thermoelectric cooling and microchannel, feature are existed
In equipped with subtle runner of several channel equivalent diameters at 10~1000 μm in the flat tube of the micro-channel heat exchanger.
6. the great power LED illuminator according to claim 3 to be conducted heat based on thermoelectric cooling and microchannel, feature are existed
In the fluid heat exchanger is provided with outside carries out air-cooled fan.
7. the great power LED illuminator according to claim 1 to be conducted heat based on thermoelectric cooling and microchannel, feature are existed
In the upper surface of the substrate is equipped with the groove of reflective cup-shaped, and the LED chip is mounted at the center of the groove, described
The upper surface of substrate is also equipped with the translucent cover of arcuation.
8. the great power LED illuminator to be conducted heat according to claim 1 or described in 7 based on thermoelectric cooling and microchannel, special
Sign is that the substrate is aluminum substrate or silicon substrate.
9. the great power LED illuminator according to claim 1 to be conducted heat based on thermoelectric cooling and microchannel, feature are existed
In with thermally conductive glue connection between the hot end and the micro-channel heat exchanger of the thermoelectric radiating piece.
10. the great power LED illuminator according to claim 8 to be conducted heat based on thermoelectric cooling and microchannel, feature are existed
In the hot end of the silicon substrate is connect with several pairs of thermocouple one end, the thermocouple other end and the thermoelectric radiating piece
Cold end connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820419277.1U CN208570659U (en) | 2018-03-27 | 2018-03-27 | The great power LED illuminator to be conducted heat based on thermoelectric cooling and microchannel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820419277.1U CN208570659U (en) | 2018-03-27 | 2018-03-27 | The great power LED illuminator to be conducted heat based on thermoelectric cooling and microchannel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208570659U true CN208570659U (en) | 2019-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820419277.1U Expired - Fee Related CN208570659U (en) | 2018-03-27 | 2018-03-27 | The great power LED illuminator to be conducted heat based on thermoelectric cooling and microchannel |
Country Status (1)
| Country | Link |
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| CN (1) | CN208570659U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417703A (en) * | 2018-03-27 | 2018-08-17 | 广东工业大学 | The high-power LED radiating structure to be conducted heat based on thermoelectric cooling and microchannel |
-
2018
- 2018-03-27 CN CN201820419277.1U patent/CN208570659U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417703A (en) * | 2018-03-27 | 2018-08-17 | 广东工业大学 | The high-power LED radiating structure to be conducted heat based on thermoelectric cooling and microchannel |
| WO2019184794A1 (en) * | 2018-03-27 | 2019-10-03 | 广东工业大学 | High-power led heat dissipation structure based on thermoelectric refrigeration and microchannel heat transfer |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 510006 Panyu District, Guangzhou, Guangdong, Panyu District, No. 100, West Ring Road, outside the city. Patentee after: Guangdong University of Technology Address before: 510090 Dongfeng East Road 729, Yuexiu District, Guangzhou City, Guangdong Province Patentee before: Guangdong University of Technology |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190301 Termination date: 20200327 |