CN209801171U

CN209801171U - Aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer

Info

Publication number: CN209801171U
Application number: CN201920402666.8U
Authority: CN
Inventors: 莫松平; 林潇晖; 陈颖; 贾莉斯
Original assignee: Guangdong University of Technology
Current assignee: Guangdong University of Technology
Priority date: 2018-03-27
Filing date: 2019-03-27
Publication date: 2019-12-17
Anticipated expiration: 2029-03-27

Abstract

The utility model discloses an aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer, which comprises an aluminum substrate, an LED chip, thermoelectric radiating fins and a microchannel heat exchanger, wherein the LED chip is attached to the aluminum substrate; the hot end of the aluminum substrate is connected with the cold end of the thermoelectric cooling fin, and the hot end of the thermoelectric cooling fin is connected with the cold end of the micro-channel heat exchanger. The utility model has the advantages that: the heat end temperature of the thermoelectric cooling fin can be obviously reduced, so that the LED chip is directly and actively cooled through the thermoelectric cooling fin, the effect is good, the working performance and the reliability of the LED can be improved, and the service life of the LED can be prolonged.

Description

Aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer

Technical Field

The utility model relates to a LED heat dissipation technical field specifically is an aluminium base high-power LED luminous element based on thermoelectric refrigeration and microchannel heat transfer.

Background

At present, in the aspect of heat dissipation of the LED lamp in the market, a metal sheet or an aluminum substrate of a system is adopted to conduct heat to the air for heat dissipation. The main methods adopted in the prior art are as follows: the structure of the radiating fins is reasonably arranged, so that the radiating area is increased; the heat dissipation is carried out by adopting an active cooling mode or the packaging structure is designed, so that the packaging structure has good luminous flux and can carry out effective heat dissipation; or adopting water cooling, heat pipe and other modes. However, the methods in the prior art have insignificant heat dissipation effects and low heat dissipation efficiency, so that the LED lamp has poor heat dissipation to cause deviation of the light-emitting wavelength, reduce the luminous flux, and even affect the service life of the LED, and these consequences restrict the development of the LED towards higher power. For a high-power LED lamp or an LED product luminous body, the existing air cooling or water cooling cannot meet the heat dissipation requirement generally.

SUMMERY OF THE UTILITY MODEL

To above the not enough of prior art exists, the utility model provides an aluminium base high-power LED luminous element based on thermoelectric refrigeration and microchannel conduct heat, through combining microchannel heat transfer and semiconductor thermoelectric refrigeration technique, encapsulate its integration in the structure of LED luminous element chip, reach better initiative heat dissipation purpose.

The utility model provides a technical scheme that its technical problem adopted is: the aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer comprises an aluminum substrate, an LED chip, thermoelectric radiating fins and a microchannel heat exchanger, wherein the LED chip is attached to the aluminum substrate; the hot end of the aluminum substrate is connected with the cold end of the thermoelectric cooling fin, and the hot end of the thermoelectric cooling fin is connected with the cold end of the micro-channel heat exchanger.

And the outlet and the inlet of the micro-channel heat exchanger are respectively connected with the inlet and the outlet of the fluid heat dissipation circulation.

The fluid heat dissipation circulation comprises a fluid pump and a fluid radiator, wherein the fluid pump and the fluid heat exchanger are connected in series and are connected with an outlet and an inlet of the micro-channel heat exchanger to form closed fluid heat dissipation circulation.

The working medium in the fluid heat dissipation cycle is a nano fluid working medium.

A plurality of fine flow channels with the equivalent diameter of 10-1000 mu m are arranged in the flat tube of the micro-channel heat exchanger, and an inlet and an outlet are arranged on the flat tube.

And a fan for air cooling is arranged outside the fluid heat exchanger.

The hot end of the thermoelectric cooling fin is connected with the micro-channel heat exchanger through heat conducting glue, so that heat conduction is facilitated.

The pins of the LED chip are fixed on the aluminum substrate through soldering tin, and the interface between the heat dissipation end of the LED chip and the thermoelectric heat dissipation sheet is fixed through heat conducting glue.

the hot end of the silicon-aluminum substrate is connected with one ends of a plurality of pairs of thermocouples by using a reflow soldering process, and the other ends of the thermocouples are connected with the cold ends of the thermoelectric cooling fins by using a reflow soldering process.

The utility model has the advantages that: the heat end temperature of the thermoelectric cooling fin can be obviously reduced, so that the LED chip is directly and actively cooled through the thermoelectric cooling fin, the effect is good, the working performance and the reliability of the LED can be improved, and the service life of the LED can be prolonged.

Drawings

FIG. 1 is a schematic structural diagram of an aluminum-based high-power LED illuminant based on thermoelectric refrigeration and microchannel heat transfer according to the present invention;

Fig. 2 is a schematic view of the structure of the LED light source portion of the aluminum-based high-power LED illuminant based on thermoelectric refrigeration and microchannel heat transfer.

FIG. 3 is a flow chart of the fluid heat dissipation cycle of the aluminum-based high-power LED illuminant based on thermoelectric refrigeration and microchannel heat transfer according to the present invention;

Fig. 4 is a schematic structural diagram of the microchannel heat exchanger based on the aluminum-based high-power LED illuminant for thermoelectric refrigeration and microchannel heat transfer.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The drawings show the detailed structure of the preferred embodiment of the invention. The structural features of the elements, if any, are described in terms of directions (up, down, left, right, front and back), which are described with reference to the structure shown in fig. 1, but the practical use direction of the present invention is not limited thereto.

Example 1

An aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer is shown in figures 1 and 2, and an aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer is shown in figures 3-4 and comprises an aluminum substrate 21, an LED chip 2, thermoelectric cooling fins 4 and a microchannel heat exchanger 5. The LED chip 1 is attached to an aluminum substrate 21 to form an LED light source portion. The aluminum substrate 21 is attached to the cold end of the thermoelectric cooling fin 4, and the hot end of the thermoelectric cooling fin 4 is connected with the cold end of the microchannel heat exchanger 5. The microchannel heat exchanger 5 exchanges heat by using a nano fluid working medium, and the nano fluid working medium is led out and then is radiated by an air-cooled or liquid-cooled radiator. An arc-shaped transparent cover 9 is mounted on the upper surface of the aluminum substrate 21, and the LED chip 1 is packaged on the aluminum substrate 21 by the transparent cover 9. A fluorescent powder layer is arranged in the transparent cover 9. The hot end of the aluminum substrate 21 is connected with one ends of the thermocouples 3 by using a reflow soldering process, and the other ends of the thermocouples 3 are connected with the cold ends of the thermoelectric cooling fins 4 by using a reflow soldering process. The thermoelectric cooling fins 4 are semiconductor cooling fins (thermoelectric cooling fins) which have no sliding parts, have high reliability requirements and are free from refrigerant pollution. By using the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigeration can be fulfilled.

The LED chip structure is characterized in that a light-reflecting cup-shaped groove is formed in the upper surface of the silicon-aluminum substrate 2, the LED chip 1 is attached to the center of the groove, an arc-shaped transparent cover 9 is further mounted on the upper surface of the silicon-aluminum substrate 2, a fluorescent powder layer is arranged in the transparent cover 9, and the groove is sealed by the transparent cover 9. The hot end of the silicon-aluminum substrate 2 is connected with one ends of a plurality of pairs of thermocouples 3 by using a reflow soldering process, and the other ends of the thermocouples 3 are connected with the cold ends of the thermoelectric cooling fins 4 by using a reflow soldering process.

Preferably, the hot end of the thermoelectric heat sink 4 is connected with the microchannel heat exchanger 5 by using heat-conducting glue, so as to facilitate heat conduction. The pins of the LED chip 1 are fixed on the aluminum substrate 21 through soldering tin 23, and the interface between the heating end of the LED chip 1 and the thermoelectric heat sink 1 is fixed through heat conducting glue 11. An insulating layer 22 is provided between the aluminum substrate 21 and the LED chip, and the leads of the LED chip 1 are fixed to the pads of the aluminum substrate 21 by solder 23. The thermoelectric heat sink 4 conducts heat out, and the heat conducted out through the microchannel heat exchanger 1 is dissipated by the fluid heat dissipation mechanism.

The silicon-aluminum substrate 21 and the thermoelectric heat sink 1 are of an integrated packaging structure, and the heat release end of the LED chip 1 is directly contacted with the thermoelectric heat sink 4, so that the heat release efficiency is improved. The thermoelectric cooling fins 4 are connected with the micro-channel heat exchanger 5 through crystal fixing glue. The aluminum substrate 21, the LED chip 2, the thermoelectric cooling fin 4 and the micro-channel heat exchanger 5 are fixed into a whole through a bottom plate and bolts 24 on two sides.

The outlet 50 and the inlet 51 of the microchannel heat exchanger 5 are respectively connected with the inlet and the outlet of the fluid heat dissipation circulation. As shown in fig. 3, the fluid heat dissipation cycle includes a fluid pump 6 and a fluid radiator 7, the fluid pump 6 and the fluid heat exchanger 7 are connected in series, and are connected with an outlet 50 and an inlet 51 of the microchannel heat exchanger 5 to form a closed fluid heat dissipation cycle. The working medium in the fluid heat dissipation cycle is a nano fluid working medium. The nano fluid working medium is a suspension formed by mixing 1-100nm solid particles and a liquid heat exchange medium, has a heat conductivity coefficient and a convection heat exchange coefficient higher than those of common working media (such as water and ethylene glycol), and can effectively improve the heat transfer efficiency of the micro-channel heat exchanger 5. After the heat of the LED chip 1 and the thermoelectric heat sink 4 is LED out by the nano fluid working medium, the circulating cooling is carried out by a liquid cooling or air cooling method. The nano fluid working medium is preferably a suspension formed by dispersing Cu nano particles with the particle size of 10-50nm into heat-conducting oil base liquid.

As shown in fig. 4, tens of fine flow channels having an equivalent channel diameter of 10 to 1000 μm are provided in the flat tubes of the microchannel heat exchanger 5, and an inlet 51 and an outlet 50 are provided in the flat tubes. The microchannel heat exchanger 5 adopts a nano fluid working medium (refrigerant). Preferably, dozens of fine flow channels with equivalent diameters of 100-800 μm are arranged in the flat tubes of the microchannel heat exchanger 5, and the inlet 50 and the outlet 51 are respectively connected with a fluid heat dissipation circulation connection with a working medium circulation channel. A fan 8 for cooling the fluid radiator 7 is provided outside the fluid radiator 7.

The utility model discloses a can be used to LED refrigerated device, cooling device include aluminium base board, thermoelectric radiator, microchannel radiator. The LED light source is attached to the heat dissipation aluminum substrate to form an LED light source part. The aluminum substrate 21 is attached to the cold end of the thermoelectric heat sink 4; the hot end of the thermoelectric heat sink 4 of the thermoelectric heat radiator is connected with the microchannel heat radiator 5, and the microchannel heat radiator 5 uses nano fluid working medium, and the working medium is led out and then is radiated by the air cooling or liquid cooling heat radiator. Directly installing the heat release end of the LED chip 1 on a thermoelectric heat sink of a thermoelectric heat sink, and tightly attaching the heat release end of the LED chip to the cold end of the thermoelectric heat sink; the micro-channel radiator is closely attached to the hot end of the thermoelectric radiating fin of the thermoelectric radiator, the interface of the thermoelectric radiating fin of the thermoelectric radiator, which is connected with the LED chip and the micro-channel, is fixed by heat-conducting glue, and the heat LED out by the micro-channel radiator is dissipated by the fluid radiator.

The above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made in the claims and the description of the new invention are also within the scope of the present invention.

Claims

1. The aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer comprises an aluminum substrate, an LED chip, thermoelectric radiating fins and a microchannel heat exchanger, and is characterized in that the LED chip is attached to the aluminum substrate; the hot end of the aluminum substrate is connected with the cold end of the thermoelectric cooling fin, and the hot end of the thermoelectric cooling fin is connected with the cold end of the microchannel heat exchanger; an arc-shaped transparent cover is arranged on the upper surface of the aluminum substrate and encapsulates the LED chip on the aluminum substrate; a fluorescent powder layer is arranged in the transparent cover.

2. The aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer as claimed in claim 1, wherein the outlet and the inlet of the microchannel heat exchanger are respectively connected with the inlet and the outlet of a fluid heat dissipation cycle.

3. The aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer as claimed in claim 2, wherein the fluid heat dissipation cycle comprises a fluid pump and a fluid heat sink, the fluid pump and the fluid heat exchanger are connected in series, and an outlet and an inlet of the microchannel heat exchanger are connected to form a closed fluid heat dissipation cycle.

4. The aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer as claimed in claim 3, wherein the working fluid in the fluid heat dissipation cycle is a nano fluid working fluid.

5. The aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer as claimed in claim 4, wherein a plurality of fine flow channels with equivalent channel diameter of 10-1000 μm are arranged in the flat tube of the microchannel heat exchanger.

6. The aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer as claimed in claim 3, wherein a fan for air cooling is arranged outside the fluid heat exchanger.

7. The aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer as claimed in claim 1, wherein the hot end of the thermoelectric heat sink is connected with the microchannel heat exchanger by heat-conducting glue.

8. The aluminum-based high-power LED luminous body based on thermoelectric refrigeration and microchannel heat transfer as claimed in claim 1, wherein the hot end of the aluminum substrate is connected with one end of a plurality of pairs of thermocouples, and the other end of the thermocouples is connected with the cold end of the thermoelectric heat sink.