TWM616791U - Heat-dissipation module - Google Patents

Abstract

The invention creates a heat dissipation module, which includes a base, at least two heat pipes, and a plurality of heat dissipation units. The at least two heat pipes are provided with a heat absorption end and a heat dissipation end extending outward from the heat absorption end. The heat absorption end is arranged on the base The heat dissipation ends of the at least two heat pipes are located above the base and are arranged in a high and low staggered manner. The plurality of heat dissipation units are coupled to the heat dissipation ends of the heat pipes and are spaced apart from each other. The design can increase the heat dissipation area and avoid the obstruction of the airflow, thereby effectively improving the heat dissipation efficiency.

Description

Cooling module

This creation relates to a heat dissipation module, especially a heat dissipation module that can avoid airflow obstruction and increase the heat dissipation area to effectively improve the heat dissipation efficiency.

Many electronic devices (such as computers) are increasing day by day and their performance is increasing. The electronic components in the electronic devices will generate a high amount of heat, which must be dissipated through a radiator to reduce the temperature in order to maintain working efficiency and reduce the chance of damage to the electronic components. The existing general heat sinks are composed of aluminum extruded heat dissipation fins or buckle stacked heat dissipation fins, but the spacing and height of each heat dissipation fin of these heat sinks are fixed and consistent, so that each The airflow above and below the fins and the spacing will be restricted to be the same and the length of the airflow will be the same, so when the existing radiator is attached to a heat source (such as a central processing unit or a graphics processing chip) to export When the heat energy is dissipated by the upper heat dissipation fins, the air flow on the upper and lower sides of the heat dissipation fins is restricted, and the heat energy taken away is relatively limited, so that it is easy to cause heat accumulation problems. .

With the increase in the wattage and performance of electronic components, it is necessary to increase the heat dissipation area by increasing the number of heat dissipation fins of the existing heat sinks and increasing the heat dissipation fins. However, the only heat sinks that can be placed in the limited space of electronic devices are In the same area, if you need to obtain more heat dissipation area, you must increase the number of heat dissipation fins. For example, although a lot of heat dissipation fins are added to the area of 10 cm x 10 cm, the more fins are adjacent to each other. The distance between the heat sink fins (air flow channel) will be narrower (that is, the distance between two adjacent heat sink fins will be reduced), so that the air flow through the heat sink fins will be subjected to resistance (flow field resistance) ) Is more The amount of air entering the spacing of the heat dissipation fins is also greatly reduced, resulting in poor heat dissipation efficiency. If the heat dissipation fins are increased and elongated, the thickness of each heat dissipation fin is easy to cause deformation or collision damage. If the thickness of each heat dissipation fin is increased, the number of heat dissipation fins will be reduced. , Which in turn leads to the problem of reduced heat dissipation area.

So how can the radiators in a limited space be under the same area? How to use the space above the radiators to increase the heat dissipation area, so the industry thought of stacking two independent radiators directly or overlapping each other in two layers. Ways to combine to get more heat dissipation area, but another problem is extended, because one radiator is directly pressed against another radiator where the heat dissipation fins are arranged, and the radiator stacked on top has considerable Because of the weight, the heat sink fins arranged on the lower heat sink cannot bear the weight of the heat sink stacked on the upper part, which causes deformation (or damage), resulting in poor heat dissipation efficiency. Therefore, the heat dissipating fin structure The strength problem is still unresolved, and it is also one of the problems that the industry still needs to work hard to overcome.

Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the creators of this project and the related manufacturers engaged in this industry urgently want to study and improve.

One purpose of this creation is to provide a heat dissipation module that can increase the heat dissipation area and avoid airflow obstruction to effectively improve the heat dissipation efficiency.

In order to achieve the above-mentioned objective, the present invention provides a heat dissipation module, which includes a base, at least two heat pipes, and a plurality of heat dissipation units. The at least two heat pipes are provided with a heat absorption end and a heat dissipation end extending outward from the heat absorption end. The radiating ends of the at least two heat pipes are located above the pedestal and arranged in a high and low staggered manner. A plurality of radiating units are combined with the radiating end of the heat pipe, and the plurality of radiating units are spaced apart from each other. .

This creation also provides a heat dissipation module, including a base, at least one heat pipe, and at least one heat dissipation unit. The base has a top side and a bottom side. The top side is provided with a plurality of base fins, and the at least one heat pipe A heat-absorbing end and a heat-dissipating end extending outward from the heat-absorbing end are provided. The heat-absorbing end is arranged on the base, and the base and the heat dissipating end located above are arranged high and low, and the heat dissipating unit and the plurality of The base fins have a pitch.

Therefore, through the layered and or staggered spaced design to adjust the high, low, or front and back of the plurality of heat dissipation fins or the placement of the plurality of heat dissipation fins and the plurality of base fins, in addition to increasing the heat dissipation area, it can also avoid airflow. If it is blocked, it can effectively improve the heat dissipation efficiency.

The aforementioned base has a top side and a bottom side. The bottom side of the base has a plurality of grooves. The bottom side of the seat is flush.

An upper side of the heat-absorbing end of the aforementioned at least two heat pipes is in contact with the bottom side of the base, and a lower side of at least one of the heat-absorbing ends of the at least two heat pipes is attached to a heating element.

Each of the foregoing heat dissipation units has a plurality of heat dissipation fins, and an air flow channel is defined between the two heat dissipation fins, and the heat dissipation ends of the at least two heat pipes have the same or different air flow channels on the plurality of heat dissipation fins.

The aforementioned base is a uniform temperature plate, a hot plate, a heat conduction block or a heat sink.

The width of the air flow channel of the plurality of heat dissipation fins on the heat dissipation end of the at least one heat pipe is greater than, equal to or less than the width of the air flow channel of the plurality of heat dissipation fins on the heat dissipation end of the other at least one heat pipe.

The aforementioned heat dissipation module further includes at least one fan, and the fan is selectively arranged on one side of the base or one side or in the middle of the plurality of heat dissipation fins to guide an air flow to the plurality of heat dissipation fins for heat exchange.

The heat dissipating ends of the at least two heat pipes are located above the base and are arranged alternately in front and back.

The aforementioned heat dissipation unit includes a plurality of heat dissipation fins and a two-phase flow heat dissipation structure. One side of the plurality of heat dissipation fins is attached to an upper side of the two-phase flow heat dissipation structure, and the heat dissipation end of the heat pipe is connected to the two-phase flow heat dissipation structure. Knot The lower side of the structure is in contact with or directly communicates with a chamber of the two-phase flow heat dissipation structure. The two-phase flow heat dissipation structure is a uniform temperature plate or a hot plate.

1: Cooling module

11: Pedestal

111: top side

112: bottom side

113: Groove

115: base fin

116: Spacing

12: Heat pipe

121: Endothermic

122: heat sink

14: Cooling unit

141: cooling fins

143: Two-phase flow heat dissipation structure

15: Airflow channel

2: fan

3: heating element

Figure 1 is an exploded three-dimensional schematic diagram of an embodiment of the creation.

Figure 2 is a schematic diagram of a combined cross-section of an embodiment of the creation.

Figure 3A is a schematic diagram of the implementation of the cooling module and fan created.

Figure 3B is a schematic diagram of an implementation state where the air flow from the fan of the creation to the higher and lower layers of the plurality of heat dissipation fins is different.

Figure 4 is a schematic diagram of another implementation of the combined stereo according to an embodiment of the creation.

Figure 5 is a combined three-dimensional schematic diagram of other alternative embodiments of the creation.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.

This creation provides a heat dissipation module. Refer to Figures 1 and 2. The heat dissipation module 1 includes a base 11, at least two heat pipes 12, and a plurality of heat dissipation units 14. The base 11 can be selected as an equalizing plate or a heat sink. Board, a heat-conducting block or a heat sink, the base 11 in this embodiment is selected to be a heat-conducting block made of a metal material (such as copper, aluminum, titanium, stainless steel or alloy), but it is not limited to this. The base 11 has a top side 111, a bottom side 112, and a plurality of grooves 113. The plurality of grooves 113 are concavely formed on the bottom side 112 of the base 11, and the plurality of grooves 113 are used for receiving A heat-absorbing end 121 of the plurality of heat pipes 12 is combined. Each heat pipe 12 is provided with the aforementioned heat-absorbing end 121 and a heat-dissipating end 122 extending outward from the heat-absorbing end 121. The heat-absorbing end 121 is provided at the bottom of the base 11 The side 112 is flush with the bottom side 112 of the base 11, and the shape of each groove 113 is matched with the shape of each heat pipe 12. In a feasible embodiment, it is possible to omit the The groove 113, the heat-absorbing end 121 of the plurality of heat pipes 12 is directly integrated into the base 11, or the heat-absorbing end 121 of the plurality of heat pipes 12 is optionally arranged and attached to the top side 111 or the bottom side 112 of the base 11 To contact.

In another embodiment, the base 11 may have a chamber (such as a uniform temperature plate or a hot plate; not shown) for supplying vapor and liquid phase changes, and the heat absorption end 121 of the plurality of heat pipes 12 is connected to the chamber The connected devices can be connected or disconnected.

The heat dissipating ends 122 of the at least two heat pipes 12 are located above the top side 111 of the base 11 and are arranged in a high and low staggered manner. In this embodiment, the plurality of heat pipes 12 are arranged on opposite sides of the base 11, but it is not limited. Here, in different applications in specific real-time, the number of heat pipes 12 can be more than two heat pipes 12 arranged on the same side of the base 11 (as shown in Figures 3A and 4) or on different sides, and multiple heat pipes The heat dissipating end 122 of 12 is arranged on the top side 111 of the base 11 in a multi-layer manner in a high, low and/or front and back staggered arrangement. And an upper side of the heat-absorbing end 121 of the plurality of heat pipes 12 is contacted and attached to the bottom side 112 of the base 11, and the lower side of the heat-absorbing end 121 of the two heat pipes 12 of the plurality of heat pipes 12 is directly connected to a heating element 3 ( Such as a central processing unit or a graphics processor or a single chip or other electronic components) are placed in contact with each other, and the heat dissipation ends 122 of the plurality of heat pipes 12 are located above the base 11 to form a high and low layer separation arrangement. For the convenience of the description below, the heat dissipation end 122 of the two upper heat pipes 12 in the plurality of heat pipes 12 is referred to as the upper (higher) two heat dissipation ends 122, and the heat dissipation ends 122 of the other two heat pipes 12 located below are referred to as the lower (lower) heat dissipation ends. Lower level) Two heat dissipation terminals 122.

The plurality of heat dissipation units 14 are coupled to the heat dissipation ends 122 of the plurality of heat pipes 12 (such as the upper two heat dissipation ends 122 and the lower two heat dissipation ends 122), and the plurality of heat dissipation units 14 are spaced apart from each other, and each heat dissipation unit 14 includes a plurality of The heat dissipation fins 141 define an air flow channel 15 between the two heat dissipation fins 141. The air flow channel 15 is used to guide an external air flow to take away more heat from the heat dissipation unit 14 for heat exchange. The lower multiple heat dissipation units 14 are separated from the upper heat dissipation unit 14 and the base 11 by a distance 116 respectively. The spacing 116 is used to allow external airflow (such as natural convection or forced convection) to pass through the plurality of heat dissipation fins 141 of the heat dissipation units, so as to avoid obstruction of the airflow and increase the heat exchange efficiency.

The air flow channels 15 of the plurality of heat dissipation fins 141 of the heat dissipation units 14 are the same or different.

In this embodiment, the airflow channel 15 of the heat dissipation unit 14 above the upper heat dissipation end 122 is selected to be different from the airflow channel 15 of the heat dissipation unit 14 above the second heat dissipation end 122 of the lower layer, that is, the plural heat dissipation of the upper heat dissipation unit 14 The width of the airflow channel 15 of the fin 141 is greater than the width of the airflow channel 15 of the plurality of heat dissipation fins 141 of the lower heat dissipation unit 14. In this embodiment, there are more heat dissipation fins in the lower layer, which makes the airflow channels 15 between the lower heat dissipation fins 141 narrower, and the airflow channels 15 between the upper heat dissipation fins 141 are wider to allow airflow. Pass through quickly and increase the flow rate of the air flow. With this design, the flow field of the air flow can be changed to increase or guide the air flow to more smoothly conduct heat exchange to the heat dissipation unit. In addition, whether it is to increase the width of the airflow channel 15 between the cooling fins 141 to increase the flow rate of airflow, or to reduce the width of the airflow channel between the cooling fins 141 in exchange for more cooling fins 141 to increase heat dissipation The area can be beneficial to effectively improve the heat exchange efficiency, and the upper and lower heat dissipation units 14 of this invention can provide multiple design combinations at the same time. Therefore, compared with the conventional heat sink, whether it is the channel between the fins or the number of fins All are fixed and cannot be changed, so the design of this creation provides more flexible fin configuration options.

Therefore, through the creation of the design of the heat dissipation module 1 above the application space to increase the heat dissipation area, the multiple heat dissipation units 14 are used to change the layered interval height (ie, the height difference) on the base 11 to obtain more placement of heat dissipation fins. 141 to increase the heat dissipation area, and by staggering the multiple heat dissipation units 14 with high and low design (such as staggered front and rear or staggered left and right) to prevent airflow from being blocked, so as to effectively increase the flow through the radiating fins 141 and reach Improve the overall heat dissipation performance of the heat dissipation module 1. And the heat dissipation module 1 of this creation can be applied to one In an electronic device (such as a computer, a communication device, or a server; not shown in the figure), the heating element 3 in the electronic device can achieve a better heat dissipation effect in a limited space.

In some other embodiments, the width of the airflow channels 15 of the plurality of heat dissipation fins 141 of the upper (higher layer) heat dissipation unit 14 is less than or equal to the airflow channels of the plurality of heat dissipation fins 141 of the lower (lower layer) heat dissipation unit 14 The width of 15. In still other embodiments, the plurality of heat dissipation units 14 (such as the upper heat dissipation unit 14 and/or the lower heat dissipation unit 14) are integrated at the heat dissipation end 122 (such as the upper heat dissipation end 122 and/or the lower heat dissipation end 122) of the heat pipe 12 The sections can be selected to be arranged in any one of the front section, the middle section and the rear section or any two sections of the heat dissipating end 122 to be arranged in sections. In other embodiments, the bottom side of the plurality of heat dissipation units 14 (such as the upper heat dissipation unit 14 and/or the lower heat dissipation unit 14) is attached to the upper side of a uniform temperature plate (or hot plate), and the heat dissipation end 122 of the heat pipe 12 (Such as the upper heat dissipation end 122 and/or the lower heat dissipation end 122) are connected to the lower side of the uniform temperature plate (or hot plate).

In another alternative embodiment, referring to Figures 3A and 3B, the heat dissipation module 1 further includes at least one fan 2 (such as an axial fan or a centrifugal fan), and the fan 2 is optionally arranged on one side of the base 11 or One side or center of the plurality of radiating fins 141 is used to guide airflow to the plurality of radiating fins 141 for heat exchange to achieve forced heat dissipation. Here, the fan 2 implemented instead is provided on a side of the base 11 On the side, an air outlet of the fan 2 discharges air flow toward the airflow channel 15 of the upper and lower layers (higher and lower layers) of the plurality of heat dissipation fins 141, and flows through the upper layer (higher layer) of the plurality of heat dissipation fins 141. The air flow resistance (flow field resistance) of the lower layer (lower layer) is more than the air flow resistance (flow field resistance) of the plurality of heat dissipation fins 141 in the lower layer (lower layer). But it is not limited to this. In another alternative embodiment, the airflow resistance (or heat dissipation area) flowing through the upper plurality of heat dissipation fins 141 may be modified to be less than the airflow resistance (or heat dissipation area) of the lower plurality of heat dissipation fins 141. Cooling area).

In another alternative embodiment, referring to FIG. 5, the base 11 further includes a plurality of base fins 115, and the plurality of base fins 115 are integrally arranged on the top side 111 of the base 11 to form a heat sink. Here, instead of implementing the heat pipe 12 and the heat dissipating unit 14 as a single heat pipe 12 and a single heat dissipating unit 14, it is explained that the base 11 and the upper The plurality of base fins 115 and the heat dissipation end 122 of the upper heat pipe 12 are arranged at high and low intervals from the upper heat dissipation unit 14, and there is another interval 116 between the heat dissipation unit 14 and the plurality of base fins 115. The heat dissipation unit 14 further includes a two-phase flow heat dissipation structure 143 (such as a uniform temperature plate or a heat plate). One side of the plurality of heat dissipation fins 141 is attached to an upper side of the two-phase flow heat dissipation structure 143. The heat dissipation end 122 of the heat pipe 12 is in contact with the lower side of the two-phase flow heat dissipation structure 143, or directly communicates with the cavity of the two-phase flow heat dissipation structure 143, so through the heat dissipation unit 14 and a plurality of base fins The concept of 115 layered spacing adjusts the heat dissipation area and air flow resistance of the higher and lower layers, thereby effectively increasing the heat dissipation area and avoiding air flow obstruction, thereby effectively improving the heat dissipation efficiency.

1: Cooling module

11: Pedestal

111: top side

116: Spacing

12: Heat pipe

121: Endothermic

122: heat sink

14: Cooling unit

141: cooling fins

15: Airflow channel

Claims (11)

A heat dissipation module includes: a base; at least two heat pipes, provided with a heat absorption end and a heat dissipation end extending outward from the heat absorption end, the heat absorption end is provided on the base, and the heat dissipation end of the at least two heat pipes It is located above the base and is arranged in a high and low staggered manner; and a plurality of heat dissipation units are combined with the heat dissipation ends of the at least two heat pipes, and the plurality of heat dissipation units are spaced apart from each other. According to the heat dissipation module described in claim 1, wherein the base has a top side and a bottom side, the bottom side of the base has a plurality of grooves, and the plurality of grooves can accommodate and combine the at least The heat-absorbing ends of the two heat pipes are made flush with the bottom side of the base. As for the heat dissipation module described in claim 1, wherein an upper side of the heat-absorbing end of the at least two heat pipes is in contact with a bottom side of the base, and at least one of the at least two heat pipes has a lower side of the heat-absorbing end and A heating element is attached to each other. For the heat dissipation module described in item 1 of the scope of patent application, each of the heat dissipation units has a plurality of heat dissipation fins, an air flow channel is defined between the two heat dissipation fins, and the heat dissipation ends of the at least two heat pipes are above the plurality of heat dissipation fins. The airflow channels of the radiating fins are the same or different. For the heat dissipation module described in item 1 of the scope of patent application, the base is a uniform temperature plate, a heat plate, a heat conduction block or a heat sink. The heat dissipation module according to claim 4, wherein the width of the airflow channel of the plurality of heat dissipation fins on the heat dissipation end of the at least one heat pipe is greater than, equal to, or smaller than that of the heat dissipation end of the other at least one heat pipe. The width of the air flow channel of the plurality of heat dissipation fins. For example, the heat dissipation module described in item 4 of the scope of patent application further includes at least one fan. An air flow flows to the plurality of heat dissipation fins for heat exchange. In the heat dissipation module described in item 1 of the scope of patent application, the heat dissipation ends of the at least two heat pipes are located above the base and are arranged alternately in front and back. A heat dissipation module includes: a base having a top side and a bottom side, the top side is provided with a plurality of base fins; and at least one heat pipe is provided with a heat absorption end and a heat absorption end extending outward from the heat absorption end The heat dissipation end, the heat absorption end is arranged on the base, and the base and the heat dissipation end located above are arranged high and low; at least one heat dissipation unit is combined with the heat dissipation end, and the heat dissipation unit and the plurality of bases The seat fins have a pitch. The heat dissipation module according to claim 9, wherein the heat dissipation unit includes a plurality of heat dissipation fins and a two-phase flow heat dissipation structure, and one side of the plurality of heat dissipation fins is opposite to an upper side of the two-phase flow heat dissipation structure When attached, the heat dissipation end of the heat pipe is in contact with the lower side of the two-phase flow heat dissipation structure or directly communicates and connects with a cavity of the two-phase flow heat dissipation structure. For the heat dissipation module described in item 10 of the scope of patent application, the two-phase flow heat dissipation structure is a uniform temperature plate or a hot plate.

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