TWM631672U - Immersion-cooled heat-dissipation substrate with microporous structure - Google Patents

Abstract

An immersion-cooled heat-dissipation substrate with a microporous structure is provided. One surface of the immersion-cooled heat-dissipation substrate has a plurality of micropores configured to facilitate the generation of multiple bubbles. The effective pore diameter of each micropore is of between 5 to 150 microns, and the area covered by the micropores is 3-40% of the area of the surface.

Description

Immersion heat dissipation substrate with microporous structure

The new model relates to a heat-dissipating base material, in particular to an immersed heat-dissipating base material with a microporous structure.

Immersion cooling technology is to directly immerse heating elements (such as servers, disk arrays, etc.) in a non-conductive cooling liquid, so as to take away the heat energy generated by the operation of the heating element through the heat absorption and vaporization of the cooling liquid. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.

In view of this, the creator of this new model has been engaged in the development and design of related products for many years, and feels that the above-mentioned shortcomings can be improved, so he has devoted himself to research and cooperated with the application of academic principles, and finally proposed a reasonable design and effective improvement of the above-mentioned shortcomings of this new model. .

The technical problem to be solved by the present invention is to provide an immersed heat dissipation substrate with a microporous structure in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, the present invention provides an immersed heat dissipation substrate with a microporous structure, one surface of which has a plurality of micropores that are conducive to the generation of air bubbles, and the pore diameter of the plurality of micropores is between 5 and 150 microns. The area of the plurality of micropores covering the surface is 3-40% of the area of the surface.

In a preferred embodiment, the pore size of the plurality of micropores is further defined to be between 10 and 40 microns, and the area of the plurality of micropores covering the surface is further defined to be 20 to 30% of the area of the surface.

In a preferred embodiment, the plurality of micropores are formed on the surface by metal powder sintering.

In a preferred embodiment, the plurality of micropores are formed on the surface by laser ablation.

In a preferred embodiment, the plurality of micropores are formed on the surface by computer numerical control (CNC) processing.

In a preferred embodiment, the plurality of micropores are formed on the surface by punching.

The beneficial effect of the present invention is at least that, the immersion heat dissipation substrate with a microporous structure provided by the present invention can pass through "the surface has a plurality of micropores that are conducive to the generation of air bubbles", "the diameter of the plurality of micropores is between 5~ 150 microns", and the overall technical solution of "the area of the plurality of micropores covering the surface is 3-40% of the area of the surface", which can accelerate the generation of air bubbles and prevent air bubbles from remaining in the micropores, It is beneficial to remove air bubbles and take away heat, thereby improving the heat dissipation capacity of the overall immersion heat dissipation substrate.

For a further understanding of the features and technical contents of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the related embodiments disclosed by the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Please refer to FIG. 1 , which is one of the embodiments of the novel. The novel embodiment provides a submerged heat dissipation substrate with a microporous structure (hereinafter referred to as the submerged heat dissipation substrate SU), which can be used for contacting heating elements.

An example of the submerged heat dissipation substrate SU in this embodiment is an submerged heat dissipation fin of any size, which is immersed in a two-phase cooling liquid. In addition, in order to improve the heat dissipation capability of the immersed heat sink, it is the most effective way to use the micropores 110 on the surface 11 to accelerate the generation and removal of air bubbles. And to carry away heat, too large pores 110 will be detrimental to the formation of air bubbles. Therefore, the maximum pore diameter (or effective diameter) of the micropores 110 needs to be set to at least 5-150 microns. It should be noted that, FIG. 1 shows the micropores 110 in an exaggerated or enlarged manner for better understanding of the present invention.

Referring again to FIG. 2 , FIG. 2 is a scanning electron micrograph of the surface of the immersion heat dissipation substrate according to an embodiment of the present invention. Figure 2 shows that the pore size of the plurality of micropores is between 5 and 10 microns. In addition, the diameter of the plurality of micropores on the surface of the immersion heat dissipation substrate is between 5 and 10 microns as shown in Figure 2, and when the power of the heating element is as high as 200 watts, the measured thermal resistance value (thermal resistance) The value is the ratio of the temperature change of the immersion heat dissipation substrate to the heat energy generated by the heating element) is 0.0603, and when the power of the heating element is as high as 300 watts, the measured thermal resistance value is 0.0510, making the thermal resistance Reduced and heat dissipation capacity increased.

Referring again to FIG. 3 , FIG. 3 is a scanning electron micrograph of the surface of the submerged heat dissipation substrate according to an embodiment of the present invention. Figure 3 shows that the pore size of the plurality of micropores is between 10 and 40 microns. Moreover, the diameter of the plurality of micropores on the surface of the immersion heat dissipation substrate is between 10 and 40 microns as shown in Figure 3, and when the power of the heating element is as high as 200 watts, the measured thermal resistance value is 0.0477, When the power of the heating element is as high as 300 watts, the measured thermal resistance value is 0.0438.

According to the actual test, when the power of the heating element is as high as 200 watts, the measured thermal resistance value is reduced from 0.0603 to 0.4777, and the heat dissipation capacity is improved by 20.9%. When the power of the heating element is as high as 300 watts, the amount of The measured thermal resistance value is reduced from 0.0510 to 0.0438, and there is a 14.1% improvement in heat dissipation capacity. Therefore, when the diameter of the plurality of micro-holes on the surface of the immersion heat dissipation substrate is between 10 and 40 microns, the thermal resistance is greatly reduced and the heat dissipation capability is greatly improved.

Moreover, in order to truly improve the heat dissipation capability of the immersion heat dissipation substrate, in addition to the diameter of the micropores, the coverage area of the micropores must also be matched.

Referring again to FIG. 4 , FIG. 4 is a scanning electron micrograph of the surface of the submerged heat dissipation substrate according to an embodiment of the present invention. Figure 4 shows the area of the surface covered by the plurality of micropores, which is 5% of the surface area.

Referring again to FIG. 5 , FIG. 5 is a scanning electron micrograph of the surface of the submerged heat dissipation substrate according to an embodiment of the present invention. Figure 5 shows the area of the surface covered by the plurality of pores, which is 10% of the surface area.

Referring again to FIG. 6 , FIG. 6 is a scanning electron micrograph of the surface of the submerged heat dissipation substrate according to an embodiment of the present invention. Figure 6 shows the area of the surface covered by the plurality of micropores, which is 20% of the surface area.

Referring again to FIG. 7 , FIG. 7 is a scanning electron micrograph of the surface of the submerged heat dissipation substrate according to an embodiment of the present invention. Figure 7 shows the area of the surface covered by the plurality of pores, which is 27.8% of the surface area.

Therefore, the area of the surface 11 covered by the plurality of micropores 110 of the submerged heat dissipation substrate SU in this embodiment needs to be at least 3-40% of the area of the surface 11, and it can also be said that the plurality of micropores 110 occupy 3-40% of the surface area. %, and when the plurality of micropores 110 occupy 20-30% of the surface area, the heat dissipation capability of the immersion heat dissipation substrate can be more effectively improved.

In addition, the plurality of micropores 110 on the surface 11 of the submerged heat dissipation substrate SU in this embodiment may be formed on the surface 11 of the submerged heat dissipation substrate SU by metal powder sintering. In other embodiments, the plurality of micropores 110 on the surface 11 of the submerged heat dissipation substrate SU may be formed on the surface 11 of the submerged heat dissipation substrate SU by laser ablation. In addition, the plurality of micropores 110 on the surface 11 of the submerged heat dissipation substrate SU may also be formed on the surface 11 of the submerged heat dissipation substrate SU by computer numerical control (CNC) processing or punching.

Based on the above, the immersion heat dissipation substrate with a microporous structure provided by the present invention can pass through "the surface has a plurality of micropores that are conducive to the generation of air bubbles", "the diameter of the plurality of micropores is between 5 and 150 microns". , and the overall technical solution of "the area of the plurality of micropores covering the surface is 3~40% of the area of the surface", which can accelerate the generation of air bubbles and prevent air bubbles from staying in the micropores, which is beneficial to the formation of air bubbles. Remove and take away heat, thereby improving the heat dissipation capacity of the overall immersion heat dissipation substrate.

The contents disclosed above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

SU: Immersion Thermal Substrate 11: Surface 110: Micropore

FIG. 1 is a schematic diagram of a novel immersion heat dissipation substrate.

FIG. 2 is a scanning electron micrograph of the surface of the immersion heat dissipation substrate according to an embodiment of the novel.

FIG. 3 is a scanning electron micrograph of the surface of the immersion heat dissipation substrate according to an embodiment of the novel.

FIG. 4 is a scanning electron micrograph of the surface of the immersion heat dissipation substrate according to an embodiment of the novel.

FIG. 5 is a scanning electron micrograph of the surface of the immersion heat dissipation substrate according to an embodiment of the novel.

FIG. 6 is a scanning electron micrograph of the surface of the immersion heat dissipation substrate according to an embodiment of the novel.

FIG. 7 is a scanning electron micrograph of the surface of the immersion heat dissipation substrate according to an embodiment of the novel.

SU: Immersion Thermal Substrate

11: Surface

110: Micropore

Claims (6)

An immersion heat-dissipating substrate with a microporous structure, one surface of which has a plurality of micropores conducive to the generation of air bubbles, the diameter of the plurality of micropores is between 5 and 150 microns, and the plurality of micropores cover the area of the surface It is 3~40% of the area of the surface. The immersion heat dissipation substrate with a microporous structure according to claim 1, wherein the diameter of the plurality of micropores is further limited to be between 10 and 40 microns, and the area of the plurality of micropores covering the surface is further limited It is limited to 20-30% of the area of the surface. The immersion heat dissipation substrate with a microporous structure according to claim 2, wherein the plurality of micropores are formed on the surface by metal powder sintering. The immersion heat dissipation substrate with a microporous structure according to claim 2, wherein the plurality of micropores are formed on the surface by means of laser ablation. The immersion heat dissipation substrate with a microporous structure according to claim 2, wherein the plurality of micropores are formed on the surface by a computer numerical control (CNC) processing method. The immersion heat dissipation substrate with a microporous structure according to claim 2, wherein the plurality of micropores are formed on the surface by punching.

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