TWI782477B - Insulated metal substrate structure - Google Patents

Abstract

An insulated metal substrate structure includes an electrically-insulating layer, a plurality of metal layers, a plurality of electrically-insulating and thermally-conductive layers, and a heat-dissipation layer. The electrically -insulating and thermally-conductive layers are formed on the heat-dissipation layer. The electrically-insulating layer surrounds the metal layers, so that the metal layers are separated into different regions to form a predetermined circuit pattern, and the electrically-insulating layer is formed with at least one recessed corner for positioning the electrically-insulating and thermally-conductive layer filled between the metal layer and the heat-dissipation layer.

Description

Insulated Metal Substrate Construction

The invention relates to a substrate structure, in particular to an insulating metal substrate structure.

Currently, the existing insulating metal substrate structure uses an etching process to form a predetermined circuit pattern, which makes the process process complicated and the cost increased. In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide an insulating metal substrate structure in view of the deficiencies of the prior art.

In order to solve the above technical problems, the present invention provides an insulated metal substrate structure, including: an electrical insulation layer, a plurality of metal layers, a plurality of electrical insulation and heat conduction layers, and a heat dissipation layer, and a plurality of the electrical insulation and heat conduction layers are formed on the On the heat dissipation layer, the electrical insulating layer surrounds a plurality of the metal layers, so that the plurality of metal layers are separated from different areas to form a predetermined circuit pattern, and the electrical insulating layer forms at least one for positioning and filling the The concave corner structure of the electrical insulation and heat conduction layer between the metal layer and the heat dissipation layer.

In a preferred embodiment, the electrical insulating layer is made of polymer material with high bonding properties.

In a preferred embodiment, the electrical insulation and heat conduction layer is made of polymer material with high bondability, and the electrical insulation heat conduction layer contains ceramic fillers.

In a preferred embodiment, the thickness of the metal layer is configured to be smaller than the thickness of the electrically insulating layer.

In a preferred embodiment, the metal layer is a thick copper block with a thickness ranging from 1 mm to 5 mm.

In a preferred embodiment, the heat dissipation layer is a metal substrate with heat dissipation function.

In a preferred embodiment, the heat dissipation layer is a ceramic substrate with heat dissipation and insulation.

In a preferred embodiment, the bottom of the electrical insulation layer does not contact the heat dissipation layer.

In a preferred embodiment, the bottom of the electrical insulation layer directly contacts the heat dissipation layer.

The beneficial effect of the present invention lies at least in that the insulated metal substrate structure of the present invention can form a predetermined circuit pattern by "the electrical insulating layer surrounds a plurality of the metal layers, so that the plurality of metal layers are separated from different regions, and The electrical insulation layer forms at least one technical solution for positioning the electrical insulation and heat conduction layer filled between the metal layer and the heat dissipation layer, so that multiple metal layers can be quickly replaced by the electrical insulation layer. Separated into different regions to form a predetermined circuit pattern, which reduces the manufacturing process and cost, and can effectively position the electrically insulating and heat-conducting layer filled between the metal layer and the heat dissipation layer.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first" and "second" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

Referring to FIGS. 1 and 2 , the first embodiment of the present invention provides an insulated metal substrate structure. As shown in the figure, the insulated metal substrate structure according to the first embodiment of the present invention basically includes an electrical insulation layer 10 , a plurality of metal layers 20 , a plurality of electrical insulation and heat conduction layers 30 , and a heat dissipation layer 40 .

In this embodiment, the heat dissipation layer 40 can be an aluminum heat sink, or a heat sink with heat dissipation fins, or a metal substrate with heat dissipation, or a heat sink with heat dissipation and insulation. The ceramic substrate, however, is not limited thereto.

In this embodiment, the electrically insulating and heat-conducting layer 30 is formed on the heat-dissipating layer 40. The electrically insulating and heat-conducting layer 30 may be made of a polymer material with high bonding properties, such as epoxy resin, to increase insulation and bonding. sex. Moreover, the electrically insulating and heat-conducting layer 30 may also contain ceramic fillers to improve thermal conductivity.

In this embodiment, the number of metal layers 20 is shown as two, but the number of metal layers 20 is not limited, and may be more than two. Moreover, the electrical insulating layer 10 of the present embodiment surrounds a plurality of metal layers 20, so that the plurality of metal layers 20 are separated into different regions, whereby a predetermined circuit pattern (Pattern) can be quickly formed, and the electrical insulating layer 10 is formed with at least one for positioning The recessed corner structure 101 of the electrical insulation and heat conduction layer 30 filled between the metal layer 20 and the heat dissipation layer 40 can effectively position the electrical insulation heat conduction layer 30 filled between the metal layer 20 and the heat dissipation layer 40 .

In this embodiment, the electrical insulation layer 10 may be made of silicon gel. The electrical insulation layer 10 may be made of resin. The electrical insulation layer 10 is preferably made of high-insulation materials such as high-bondability polymer materials or ceramic materials.

In this embodiment, the metal layer 20 may be a thick copper block with a thickness ranging from 1 mm to 5 mm, so as to further improve heat conduction uniformity and heat transfer efficiency. Moreover, the thickness of the metal layer 20 is different from the thickness of the electrical insulation layer 10, and the thickness of the metal layer 20 is configured to be smaller than the thickness of the electrical insulation layer 10, so that the electrical insulation layer 10 can fill in the electrical insulation and heat conduction layer after surrounding the metal layer 20 30. Moreover, the bottom of the electrical insulation layer 10 in this embodiment may not contact the heat dissipation layer 40 .

Please refer to FIGS. 3 and 4 , the second embodiment of the present invention provides an insulated metal substrate structure. As shown in the figure, the insulated metal substrate structure provided according to the second embodiment of the present invention basically includes an electrical insulation layer 10 , a plurality of metal layers 20 , a plurality of electrical insulation and heat conduction layers 30 , and a heat dissipation layer 40 .

In this embodiment, the number of metal layers 20 is shown as two, but the number of metal layers 20 is not limited, and may be more than two. Moreover, the electrical insulation layer 10 of the present embodiment surrounds a plurality of metal layers 20, so that the plurality of metal layers 20 separate different regions, so that a predetermined circuit pattern can be quickly formed, and the electrical insulation layer 10 is formed with at least one for positioning and filling. The concave corner structure 101 of the electrically insulating and heat conducting layer 30 between the metal layer 20 and the heat dissipation layer 40 can effectively position the electrically insulating and heat conducting layer 30 filled between the metal layer 20 and the heat dissipation layer 40 .

Moreover, the thickness of the metal layer 20 is different from the thickness of the electrical insulation layer 10, and the thickness of the metal layer 20 is configured to be smaller than the thickness of the electrical insulation layer 10, so that the electrical insulation layer 10 can fill in the electrical insulation and heat conduction layer after surrounding the metal layer 20 30. Moreover, the bottom of the electrical insulation layer 10 in this embodiment is in direct contact with the heat dissipation layer 40 . The above describes the differences between this embodiment and other embodiments, and the similarities will not be repeated.

Based on the above, the insulated metal substrate structure provided by the present invention can form a predetermined circuit pattern by "the electrical insulating layer 10 surrounding a plurality of the metal layers 20, so that the plurality of metal layers 20 separate different regions, And the electrical insulation layer 10 forms at least one technical solution for positioning the concave corner structure 101” of the electrical insulation and heat conduction layer 30 filled between the metal layer 20 and the heat dissipation layer 40, so that multiple metal layers It can be quickly divided into different regions by the electrical insulation layer to form a predetermined circuit pattern, which reduces the process flow and cost, and can effectively position the electrical insulation and heat conduction layer filled between the metal layer and the heat dissipation layer.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Electrical insulation layer 101: concave corner structure 20: metal layer 30: Electrical insulation and heat conduction layer 40: heat dissipation layer

FIG. 1 is a schematic top view of a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional structure diagram of line II-II in FIG. 1 .

FIG. 3 is a schematic top view of the second embodiment of the present invention.

FIG. 4 is a schematic cross-sectional structure diagram of line IV-IV in FIG. 3 .

10: Electrical insulation layer 101: concave corner structure 20: metal layer 30: Electrical insulation and heat conduction layer 40: heat dissipation layer

Claims (9)

An insulated metal substrate structure, comprising: an electrical insulation layer, a plurality of metal layers, a plurality of electrical insulation and heat conduction layers, and a heat dissipation layer, a plurality of the electrical insulation and heat conduction layers are formed on the heat dissipation layer, and the electrical insulation layer Surrounding the plurality of metal layers, the plurality of metal layers are separated into different areas to form a predetermined circuit pattern, and the electrical insulation layer is formed with at least one hole for positioning and filling between the metal layer and the heat dissipation layer. The concave corner structure of the electrical insulation and heat conduction layer. The insulated metal substrate structure as claimed in claim 1, wherein the electrical insulation layer is made of high-bonding polymer material. The insulated metal substrate structure according to claim 1, wherein the electrical insulation and heat conduction layer is made of a polymer material with high bondability, and the electrical insulation heat conduction layer contains ceramic fillers. The insulated metal substrate structure of claim 1, wherein the thickness of the metal layer is configured to be less than the thickness of the electrically insulating layer. The insulated metal substrate structure as claimed in claim 4, wherein the metal layer is a thick copper block with a thickness ranging from 1 mm to 5 mm. The insulated metal substrate structure as claimed in claim 1, wherein the heat dissipation layer is a metal substrate with heat dissipation function. The insulated metal substrate structure according to claim 1, wherein the heat dissipation layer is a ceramic substrate with heat dissipation and insulation properties. The insulated metal substrate structure according to claim 1, wherein the bottom of the electrical insulation layer does not contact the heat dissipation layer. The insulated metal substrate structure according to claim 1, wherein the bottom of the electrical insulation layer directly contacts the heat dissipation layer.

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