TWM615543U - Insulated metal substrate structure - Google Patents

Abstract

An insulated metal substrate structure includes an electrically-insulating layer, a plurality of metal layers, a plurality of electrically-insulating and thermally-conductive layers, and a heat-dissipation layer. The electrically -insulating and thermally-conductive layers are formed on the heat-dissipation layer. The electrically-insulating layer surrounds the metal layers, so that the metal layers are separated into different regions to form a predetermined circuit pattern, and the electrically-insulating layer is formed with at least one recessed corner for positioning the electrically-insulating and thermally-conductive layer filled between the metal layer and the heat-dissipation layer.

Description

Insulated metal substrate structure

The present invention relates to a substrate structure, in particular to an insulated metal substrate structure.

At present, the existing insulated metal substrate structure uses an etching process to form a predetermined circuit pattern, which makes the process flow complicated and the cost increases. In view of this, the creator of this new model has been engaged in the development and design of related products for many years, and feels that the above-mentioned shortcomings can be improved. He has made great efforts to research and cooperate with the use of academic principles, and finally proposed a new model with reasonable design and effective improvement of the above-mentioned shortcomings. .

The technical problem to be solved by the present invention is to provide an insulated metal substrate structure in view of the shortcomings of the prior art.

In order to solve the above technical problems, the present invention provides an insulated metal substrate structure, including: an electrical insulation layer, a plurality of metal layers, a plurality of electrical insulation and heat conduction layers, and a heat dissipation layer, a plurality of the electrical insulation and heat conduction layers are formed on the On the heat dissipation layer, the electrically insulating layer surrounds a plurality of the metal layers, so that the plurality of metal layers separate different areas to form a predetermined circuit pattern, and the electrically insulating layer is formed with at least one for positioning and filling the The concave angle structure of the electrically insulating and thermally conductive layer between the metal layer and the heat dissipation layer.

In a preferred embodiment, the electrically insulating layer is made of a polymer material with high bonding properties.

In a preferred embodiment, the electrically insulating and thermally conductive layer is made of a polymer material with high bonding properties, and the electrically insulating and thermally conductive layer contains ceramic fillers.

In a preferred embodiment, the thickness of the metal layer is configured to be smaller than the thickness of the electrically insulating layer.

In a preferred embodiment, the metal layer is a thick copper block with a thickness ranging from 1 mm to 5 mm.

In a preferred embodiment, the heat dissipation layer is a metal substrate with heat dissipation function.

In a preferred embodiment, the heat dissipation layer is a ceramic substrate with heat dissipation and insulation properties.

In a preferred embodiment, the bottom of the electrically insulating layer does not contact the heat dissipation layer.

In a preferred embodiment, the bottom of the electrically insulating layer directly contacts the heat dissipation layer.

The beneficial effect of the present invention is at least that the insulated metal substrate structure of the present invention can form a predetermined circuit pattern by surrounding a plurality of the metal layers with the electrical insulating layer, so that the plurality of metal layers are separated from different regions, and The electrical insulation layer is formed with at least one technical solution for positioning and filling the electrical insulation and heat conduction layer between the metal layer and the heat dissipation layer, so that multiple metal layers can be quickly covered by the electrical insulation layer. Separate into different areas to form a predetermined circuit pattern, reduce the manufacturing process and cost, and can effectively locate the electrically insulating and thermally conductive layer filled between the metal layer and the heat dissipation layer.

In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention. However, the drawings provided are only for reference and explanation, and are not used to limit the present invention.

The following are specific specific examples to illustrate the related implementations disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as “first” and “second” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

Please refer to FIGS. 1 and 2. The first embodiment of the present invention provides an insulated metal substrate structure. As shown in the figure, the insulated metal substrate structure provided by the first embodiment of the present invention basically includes an electrically insulating layer 10, a plurality of metal layers 20, a plurality of electrically insulating and thermally conductive layers 30, and a heat dissipation layer 40.

In this embodiment, the heat dissipation layer 40 may be an aluminum heat sink, or a heat sink with heat dissipation fins, or a metal substrate with heat dissipation function, or a heat sink with heat dissipation function and insulation. The ceramic substrate is not limited to this.

In this embodiment, the electrically insulating and thermally conductive layer 30 is formed on the heat dissipation layer 40, and the electrically insulating and thermally conductive layer 30 may be made of a polymer material with high bonding properties, such as epoxy resin, to increase insulation and bonding. sex. In addition, the electrically insulating and thermally conductive layer 30 may also contain ceramic fillers to improve thermal conductivity.

In this embodiment, the number of metal layers 20 is illustrated as two, but the number of metal layers 20 is not limited, and can also be two or more. In addition, the electrically insulating layer 10 of this embodiment surrounds the plurality of metal layers 20, so that the plurality of metal layers 20 separate different areas, so as to quickly form a predetermined pattern (Pattern), and the electrically insulating layer 10 is formed with at least one for positioning The recessed angle structure 101 of the electrically insulating and thermally conductive layer 30 filled between the metal layer 20 and the heat dissipation layer 40 can effectively locate the electrically insulating and thermally conductive layer 30 between the metal layer 20 and the heat dissipation layer 40.

In this embodiment, the electrically insulating layer 10 may be made of silicone. The electrically insulating layer 10 may be made of resin. Preferably, the electrical insulating layer 10 may be made of a high-bonding polymer material or a ceramic material and other highly insulating materials.

In this embodiment, the metal layer 20 may be a thick copper block with a thickness ranging from 1 mm to 5 mm to further improve the uniformity of heat conduction and heat transfer efficiency. Moreover, the thickness of the metal layer 20 is different from the thickness of the electrically insulating layer 10, and the thickness of the metal layer 20 is configured to be smaller than the thickness of the electrically insulating layer 10, so that the electrically insulating layer 10 can be filled with an electrically insulating and thermally conductive layer after surrounding the metal layer 20 30. In addition, the bottom of the electrically insulating layer 10 of this embodiment may not contact the heat dissipation layer 40.

Please refer to FIGS. 3 and 4, the second embodiment of the present invention provides an insulated metal substrate structure. As shown in the figure, the insulated metal substrate structure provided by the second embodiment of the present invention basically includes an electrically insulating layer 10, a plurality of metal layers 20, a plurality of electrically insulating and thermally conductive layers 30, and a heat dissipation layer 40.

In this embodiment, the number of metal layers 20 is illustrated as two, but the number of metal layers 20 is not limited, and can also be two or more. In addition, the electrically insulating layer 10 of this embodiment surrounds the plurality of metal layers 20, so that the plurality of metal layers 20 separate different areas, so that a predetermined circuit pattern can be quickly formed, and the electrically insulating layer 10 is formed with at least one for positioning and filling The concave angle structure 101 of the electrically insulating and thermally conductive layer 30 between the metal layer 20 and the heat dissipation layer 40 can effectively locate the electrically insulating and thermally conductive layer 30 filled between the metal layer 20 and the heat dissipation layer 40.

Moreover, the thickness of the metal layer 20 is different from the thickness of the electrically insulating layer 10, and the thickness of the metal layer 20 is configured to be smaller than the thickness of the electrically insulating layer 10, so that the electrically insulating layer 10 can be filled with an electrically insulating and thermally conductive layer after surrounding the metal layer 20 30. In addition, the bottom of the electrically insulating layer 10 of this embodiment directly contacts the heat dissipation layer 40. The above is a description of the differences between this embodiment and other embodiments, and the similarities will not be repeated.

In summary, the insulated metal substrate structure provided by the present invention can form a predetermined circuit pattern by surrounding a plurality of the metal layers 20 with the electrical insulating layer 10 so that the plurality of metal layers 20 separate different areas. And the electrically insulating layer 10 is formed with at least one technical solution for positioning the recessed angle structure 101" of the electrically insulating and thermally conductive layer 30 between the metal layer 20 and the heat dissipation layer 40, so that multiple metal layers It can be quickly separated into different areas by the electrical insulation layer to form a predetermined circuit pattern, which reduces the manufacturing process and cost, and can effectively locate the electrical insulation and heat conduction layer filled between the metal layer and the heat dissipation layer.

The content disclosed above is only a preferred and feasible embodiment of the present model, and does not limit the scope of the patent application of the present model. Therefore, all equivalent technical changes made by using the description and schematic content of the present model are included in the application of the present model. Within the scope of the patent.

10: Electrical insulation layer 101: concave angle structure 20: Metal layer 30: Electrically insulating and thermally conductive layer 40: heat dissipation layer

Fig. 1 is a schematic top view of the first embodiment of the new type.

Fig. 2 is a schematic cross-sectional structure diagram taken along the line II-II in Fig. 1.

Fig. 3 is a schematic top view of the second implementation of the new type.

FIG. 4 is a schematic cross-sectional structure diagram taken along the line IV-IV in FIG. 3.

10: Electrical insulation layer

101: concave angle structure

20: Metal layer

30: Electrically insulating and thermally conductive layer

40: heat dissipation layer

Claims (9)

An insulated metal substrate structure, comprising: an electrical insulation layer, a plurality of metal layers, a plurality of electrical insulation and heat conduction layers, and a heat dissipation layer. The plurality of the electrical insulation and heat conduction layers are formed on the heat dissipation layer. Surrounding the plurality of metal layers, separating the plurality of metal layers from different regions to form a predetermined circuit pattern, and the electrically insulating layer is formed with at least one for positioning and filling between the metal layer and the heat dissipation layer The concave angle structure of the electrically insulating and thermally conductive layer. The insulated metal substrate structure according to claim 1, wherein the electrically insulating layer is made of a polymer material with high bonding properties. The insulated metal substrate structure according to claim 1, wherein the electrically insulating and thermally conductive layer is made of a polymer material with high bonding properties, and the electrically insulating and thermally conductive layer contains ceramic filler. The insulated metal substrate structure according to claim 1, wherein the thickness of the metal layer is configured to be smaller than the thickness of the electrically insulating layer. The insulated metal substrate structure according to claim 4, wherein the metal layer is a thick copper block with a thickness ranging from 1 mm to 5 mm. The insulated metal substrate structure according to claim 1, wherein the heat dissipation layer is a metal substrate with a heat dissipation function. The insulated metal substrate structure according to claim 1, wherein the heat dissipation layer is a ceramic substrate with heat dissipation and insulation properties. The insulated metal substrate structure according to claim 1, wherein the bottom of the electrically insulating layer does not contact the heat dissipation layer. The insulated metal substrate structure according to claim 1, wherein the bottom of the electrically insulating layer directly contacts the heat dissipation layer.

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