TWI784746B - Immersion-cooled porous heat-dissipation structure having macroscopic-scale fin structure - Google Patents

Abstract

An immersion-cooled porous heat-dissipation structure having a macroscopic-scale fin structure is provided. The immersion-cooled porous heat-dissipation structure includes a porous heat-dissipation substrate, a macroscopic-scale fin structure, and at least one reinforcement structure. The porous heat-dissipation substrate has a porosity of greater than 8% and has a finned surface and a non-finned surface. The finned surface is connected with the macroscopic-scale fin structure, and the macroscopic-scale fin structure is composed of at least one macroscopic-scale fin. The reinforcement structure protrudes from the finned surface and is integrally connected with the finned surface. The area where the reinforcement structure connected with the finned surface is at least twice as large as the area where the macroscopic-scale fin connected with the finned surface.

Description

Submerged porous cooling structure with giant fin structure

The invention relates to a heat dissipation structure, in particular to a submerged porous heat dissipation structure with a macroscopic fin structure.

The immersion cooling technology is to immerse the heating element (such as server, disk array, etc.) directly in the non-conductive cooling liquid, so as to take away the heat energy generated by the heating element through the heat absorption and vaporization of the cooling liquid. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem to be solved in the industry.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a submerged porous heat dissipation structure with a macroscopic fin structure in view of the deficiencies of the prior art.

2。 The embodiment of the present invention discloses a submerged porous heat dissipation structure with a macroscopic fin structure, which has a porous heat dissipation base, a macroscopic fin structure, and at least one reinforcing structure, and the porosity of the porous heat dissipation base is > 8% and have opposite fin surfaces and non-fin surfaces, the fin surface is connected with the macroscopic fin structure, the macroscopic fin structure is composed of at least one macroscopic fin, and the at least one reinforcing structure protruding from the surface of the fin and integrally connected with the surface of the fin, and the area of the connection between the at least one reinforcing structure and the surface of the fin is divided by the area formed by the at least one macroscopic fin and the surface of the fin connected area

2.

In a preferred embodiment, the macroscopic fin refers to a fin that is at least 100 μm higher than the surface on which the fin grows.

In a preferred embodiment, a heat dissipation structure for strengthening heat dissipation is further formed on the reinforcing structure, and the heat dissipation structure is a structure composed of fins or macroscopic fins.

In a preferred embodiment, a heat dissipation structure for enhancing heat dissipation is further formed on the reinforcement structure, and the heat dissipation structure is a hole structure formed by machining on the reinforcement structure.

In a preferred embodiment, a heat dissipation structure for enhancing heat dissipation is further formed on the reinforcement structure, and the heat dissipation structure is a hole structure formed by chemical etching on the reinforcement structure.

In a preferred embodiment, a heat dissipation structure for enhancing heat dissipation is further formed on the reinforcement structure, and the heat dissipation structure is a sintered structure formed by sintering copper powder on the reinforcement structure.

In a preferred embodiment, a heat dissipation structure for enhancing heat dissipation is further formed on the reinforcement structure, and the heat dissipation structure is a mesh structure formed by attaching a copper mesh on the reinforcement structure.

In a preferred embodiment, the at least one reinforcing structure is a cross-shaped reinforcing structure protruding from the surface of the fin.

2。 The embodiment of the present invention discloses a submerged porous heat dissipation structure with a macroscopic fin structure, which has a porous heat dissipation base, a macroscopic fin structure, and at least one reinforcing structure, and the porosity of the porous heat dissipation base is > 8% and have opposite fin surfaces and non-fin surfaces, the fin surface is connected with the macroscopic fin structure, the macroscopic fin structure is composed of at least one macroscopic fin, and the at least one reinforcing structure protruding from the non-fin surface and integrally connected with the non-fin surface, and the area where the at least one reinforcing structure is connected to the non-fin surface is divided by the at least one macroscopic fin and the The area where the fin face forms a connection

2.

2。 The embodiment of the present invention discloses a submerged porous heat dissipation structure with a macroscopic fin structure, which has a porous heat dissipation base, a macroscopic fin structure, and at least one reinforcing structure, and the porosity of the porous heat dissipation base is > 8% and have opposite fin surfaces and non-fin surfaces, the fin surface is connected with the macroscopic fin structure, the macroscopic fin structure is composed of at least one macroscopic fin, and the at least one reinforcing structure protruding from the surface of the fin and non-integrally connected with the surface of the fin, and the area of the connection between the at least one reinforcing structure and the surface of the fin is divided by the area of the at least one macroscopic fin and the surface of the fin area to form a connection

2.

In a preferred embodiment, the at least one reinforcing structure is a sintered structure formed on the surface of the fin by sintering.

In a preferred embodiment, the at least one reinforcing structure is a welding structure formed on the surface of the fin by welding.

In a preferred embodiment, the at least one reinforcing structure is a deposition structure formed on the surface of the fin by physical or chemical deposition.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

10: Porous heat dissipation substrate

101: fin surface

102: Non-fin surface

20: Macro fin structure

201: Giant Fins

30: Reinforcing structure

30a: straight reinforcement structure

30b: horizontal bar reinforcement structure

40: Heat dissipation structure

Fig. 1 is a schematic side view of the structure of the first embodiment of the present invention.

FIG. 2 is a schematic top view of the structure of the first embodiment of the present invention.

FIG. 3 is a schematic top view of the structure of the second embodiment of the present invention.

Fig. 4 is a schematic side view of the structure of the third embodiment of the present invention.

Fig. 5 is a schematic side view of the fourth embodiment of the present invention.

Fig. 6 is a schematic side view of the structure of the fifth embodiment of the present invention.

Fig. 7 is a schematic top view of the structure of the sixth embodiment of the present invention.

Fig. 8 is a schematic top view of the structure of the seventh embodiment of the present invention.

FIG. 9 is a schematic top view of the structure of the eighth embodiment of the present invention.

Fig. 10 is a schematic side view of the structure of the ninth embodiment of the present invention.

Fig. 11 is a schematic top view of the structure of the ninth embodiment of the present invention.

Fig. 12 is a schematic side view of the structure of the tenth embodiment of the present invention.

Fig. 13 is a schematic side view of the structure of the eleventh embodiment of the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

Please refer to FIGS. 1 and 2, which are the first embodiment of the present invention. The embodiment of the present invention provides a submerged porous heat dissipation structure with a macroscopic fin structure, which can be used to contact heating elements. As shown in Figure 1, the submerged porous heat dissipation structure with macroscopic fin structure provided according to the embodiment of the present invention (hereinafter referred to as the submerged porous heat dissipation structure) has a porous heat dissipation base 10, a macroscopic fin The structure 20 and at least one reinforcing structure 30 .

In this embodiment, the porous heat dissipation substrate 10 can be made of high thermal conductivity materials, such as aluminum, copper or alloys thereof. Further, the porous heat dissipation substrate 10 can be a porous metal heat sink immersed in a two-phase cooling liquid (such as electronic fluorinated liquid) with a porosity greater than 8%, which is used to increase the generation of air bubbles to enhance the effect of immersion heat dissipation .

In this embodiment, the porous heat dissipation substrate 10 has a fin surface 101 and a non-fin surface 102 opposite to each other, and the fin surface 101 is connected with a macroscopic fin structure 20 . Furthermore, the macroscopic fin structure 20 of this embodiment is composed of at least one macroscopic fin 201, and the macroscopic fin 201 refers to a type of fin that is higher than the surface from which the fin grows (ie, the fin surface 101). Out have fins of at least 100 µm. The porous heat dissipation base 10 and the macroscopic fins 201 of this embodiment may be integrally connected by Metal Injection Molding (MIM), or connected by welding. In addition, the macroscopic fins 201 of this embodiment may be but not limited to sheet fins.

)2，藉此使多孔散熱基底10以特定方式進行彎折測試時，在特定壓力下最大變形量可以小於一定值，從而使得浸沒式多孔散熱結構具有一定強度，以強化整體結構。 In this embodiment, the reinforcing structure 30 protrudes from the fin surface 101 and can be integrally connected with the fin surface 101 , that is, integrally formed, so as to have material continuity. In addition, the reinforcement structure 30 of this embodiment may be, but not limited to, a trapezoidal straight structure protruding from the center of the fin surface 101 . And, as shown in Figures 1 and 2, the area where the reinforcing structure 30 forms a connection with the fin surface 101 divided by the area where the macroscopic fin 201 connects to the fin surface 101 must be greater than or equal to (

) 2, so that when the porous heat dissipation substrate 10 is subjected to a bending test in a specific manner, the maximum deformation amount under a specific pressure can be less than a certain value, so that the submerged porous heat dissipation structure has a certain strength to strengthen the overall structure.

[Second embodiment]

Please refer to FIG. 3 , which is the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the macroscopic fin structure 20 is composed of at least one macroscopic fin 201, and the macroscopic fin 201 of this embodiment may be a pin-fin (pin-fin), that is, FIG. 1 The top view of can also be shown in Figure 2. In other embodiments, the macroscopic fin structure 20 may be composed of sheet fins, pin-pillar fins or other similar composite fins.

[Third embodiment]

Please refer to FIG. 4 , which is a third embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, a heat dissipation structure 40 for enhancing heat dissipation is further formed on the reinforcement structure 30 . Further, the heat dissipation structure 40 of this embodiment may be a structure composed of fins or macroscopic fins.

[Fourth Embodiment]

Please refer to FIG. 5 , which is a fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, a heat dissipation structure 40 for enhancing heat dissipation is further formed on the reinforcement structure 30 . Further, the heat dissipation structure 40 of this embodiment may be a secondary processing structure formed by performing secondary processing on the reinforcing structure 30 . More specifically, the heat dissipation structure 40 of this embodiment may be a holed structure formed by machining on the reinforcing structure 30 . In addition, the heat dissipation structure 40 of this embodiment may also be a porous structure formed by chemical etching on the reinforcing structure 30 .

[Fifth Embodiment]

Please refer to FIG. 6 , which is a fifth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, a heat dissipation structure 40 for enhancing heat dissipation is further formed on the reinforcement structure 30 . Further, the heat dissipation structure 40 of this embodiment may be a secondary bonding structure formed by performing secondary processing on the reinforcing structure 30 . More specifically, the heat dissipation structure 40 of this embodiment may be a sintered structure formed by sintering copper powder on the reinforcing structure 30 . In addition, the actual The heat dissipation structure 40 of the embodiment may also be a mesh structure formed by attaching a copper mesh on the reinforcing structure 30 . In other embodiments, the heat dissipation structure 40 may be a welded structure formed by performing metal welding on the reinforcing structure 30 .

[Sixth embodiment]

Please refer to FIG. 7 , which is the sixth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, there are at least two reinforcing structures, one of which may be a straight reinforcing structure 30a protruding from the center of the fin surface 101, and the other reinforcing structure may be protruding from the fin surface 101 and located on a straight line. The horizontal reinforcing structure 30b on either side of the left or right side of the linear reinforcing structure 30a strengthens the overall structure by the straight reinforcing structure 30a and the horizontal reinforcing structure 30b.

[Seventh embodiment]

Please refer to FIG. 8 , which is the seventh embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the reinforcing structure 30 can be a cross-shaped reinforcing structure protruding from the fin surface 101, or it can be said to be a cross-shaped reinforcing structure formed by connecting a straight reinforcing structure and a horizontal reinforcing structure. The overall structure is further strengthened by the cross-shaped reinforcement structure.

[Eighth embodiment]

Please refer to FIG. 9 , which is the eighth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the reinforcing structure 30 may be a reinforcing structure that protrudes from the fin surface 101 and is in a closed and surrounding shape, so that the overall structure is further strengthened by the reinforcing structure in a closed and surrounding shape.

[Ninth Embodiment]

Please refer to Figs. 10 and 11, which are the ninth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

)2。 In this embodiment, the macroscopic fin structure 20 may be composed of a plurality of connected macroscopic fins 201, the reinforcement structure 30 may be a straight reinforcement structure protruding from the center of the fin surface 101, and the reinforcement structure 30 and the fin surface 101 to form a connection area divided by any macroscopic fin 201 and the fin surface 101 to form a connection area greater than or equal to (

)2.

[Tenth Embodiment]

Please refer to FIG. 12 , which is the tenth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

)2。 In this embodiment, the porous heat dissipation base 10 has a fin surface 101 and a non-fin surface 102 facing each other, and the reinforcement structure 30 of this embodiment protrudes from the non-fin surface 102 and can be integrally connected with the non-fin surface 102 , that is integrally formed, and the area of the reinforcing structure 30 connected to the non-fin surface 101 divided by the area of the connection formed between the macroscopic fin 201 and the fin surface 101 is greater than or equal to (

)2.

[Eleventh embodiment]

Please refer to FIG. 13 , which is an eleventh embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the reinforcing structure 30 protrudes from the fin surface 101 and may be non-integrally connected with the fin surface 101 , that is, not integrally formed. More specifically, the reinforcement structure 30 of this embodiment may be a sintered structure formed on the fin surface 101 by sintering. In addition, the reinforcement structure 30 of this embodiment may be a deposition structure formed on the fin surface 101 by physical or chemical deposition. In other embodiments, the reinforcement structure 30 may be a welding structure formed on the fin surface 101 by welding.

2」的技術方案，使得多孔散熱基底以特定方式進行彎折測試時，在特定壓力下最大變形量可以小於一定值，從而使得具巨觀鰭片結構之浸沒式多孔散熱結構具有一定強度，以強化整體結構。 Based on the above, the submerged porous heat dissipation structure with a macroscopic fin structure provided by the present invention can at least pass through "a porous heat dissipation base, a macroscopic fin structure, and at least one reinforcing structure", "the The porous heat dissipation base has a porosity>8% and has opposite fin surfaces and non-fin surfaces", "the fin surface is connected to the macroscopic fin structure, and the macroscopic fin structure is composed of at least one macroscopic fin constituted", "the at least one reinforcing structure protrudes from the fin surface and is integrally connected with the fin surface, and the area where the at least one reinforcing structure is connected to the fin surface is divided by the at least The area where a macroscopic fin forms a connection with the fin face

2” technical solution, when the porous heat dissipation substrate is subjected to a bending test in a specific way, the maximum deformation under a specific pressure can be less than a certain value, so that the submerged porous heat dissipation structure with a giant fin structure has a certain strength. Strengthen the overall structure.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Porous heat dissipation substrate

101: fin surface

102: Non-fin surface

20: Macro fin structure

201: Giant Fins

30: Reinforcing structure

Claims (9)

A submerged porous heat dissipation structure with a macroscopic fin structure, which has a porous heat dissipation base, a macroscopic fin structure, and at least one reinforcement structure, the porous heat dissipation base is a cooling liquid for immersion A porous metal heat sink with a porosity greater than 8%, and has opposite fin surfaces and non-fin surfaces, the fin surface is connected with the macroscopic fin structure, and the macroscopic fin structure is composed of at least one macroscopic fin structure The at least one reinforcing structure protrudes from the fin surface and is integrally connected with the fin surface, and the area of the at least one reinforcing structure connected to the fin surface is divided by the at least one The area where the macro fin forms a connection with the fin face

2. The submerged porous heat dissipation structure with a macroscopic fin structure according to claim 1, wherein the macroscopic fin refers to a fin that is at least 100 μm higher than the surface on which the fin grows. The submerged porous heat dissipation structure with a macroscopic fin structure as described in claim 1, wherein a heat dissipation structure for enhancing heat dissipation is further formed on the reinforcing structure, and the heat dissipation structure is formed of fins or macroscopic fins The structure of the film. The submerged porous heat dissipation structure with a macroscopic fin structure as described in claim 1, wherein a heat dissipation structure for strengthening heat dissipation is further formed on the reinforcement structure, and the heat dissipation structure is passed on the reinforcement structure A porous structure formed by machining. The submerged porous heat dissipation structure with a macroscopic fin structure as described in claim 1, wherein a heat dissipation structure for strengthening heat dissipation is further formed on the reinforcement structure, and the heat dissipation structure is passed on the reinforcement structure formed by chemical corrosion The porous structure. The submerged porous heat dissipation structure with a macroscopic fin structure as described in claim 1, wherein a heat dissipation structure for strengthening heat dissipation is further formed on the reinforcement structure, and the heat dissipation structure is passed on the reinforcement structure A sintered structure formed by sintering copper powder. The submerged porous heat dissipation structure with a macroscopic fin structure as described in claim 1, wherein a heat dissipation structure for strengthening heat dissipation is further formed on the reinforcement structure, and the heat dissipation structure is passed on the reinforcement structure The mesh structure formed by attaching the copper mesh. The submerged porous heat dissipation structure with a macroscopic fin structure according to claim 1, wherein the at least one reinforcing structure is a cross-shaped reinforcing structure protruding from the surface of the fin. A submerged porous heat dissipation structure with a macroscopic fin structure, which has a porous heat dissipation base, a macroscopic fin structure, and at least one reinforcement structure, the porosity of the porous heat dissipation base is >8% and has a relative The fin surface and the non-fin surface, the fin surface is connected with the macroscopic fin structure, the macroscopic fin structure is composed of at least one macroscopic fin, and the at least one reinforcing structure protrudes from the non-finned surface. The fin surface is integrally connected with the non-fin surface, and the area of the at least one reinforcing structure connected to the non-fin surface is divided by the area of the at least one macroscopic fin connected to the fin surface

2.

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