TWI792524B - Liquid-cooled heat-dissipation substrate structure with partial reinforcement structure - Google Patents

Abstract

A liquid-cooled heat-dissipation substrate structure with a partial reinforcement structure includes a heat-dissipation substrate which is integrally formed with a main structure and a reinforcement structure. The main structure and the reinforcement structure are formed by different processes. The metallographic structure of the main structure is different from the metallographic structure of the reinforcement structure. The crystal grains of the metallographic structure of the main structure are arranged in all directions, and the crystal grains of the metallographic structure of the reinforcement structure are arranged in stacks perpendicular to the direction of the pressure applied to the heat-dissipation substrate.

Description

A liquid-cooled and heat-dissipating substrate structure with partial pressure reinforcement

The invention relates to a heat dissipation base material structure, in particular to a liquid-cooled heat dissipation base material structure reinforced by partial pressure application.

Based on the heat dissipation requirements of high-power heating elements, the heat sink body of existing high-power heating elements mostly uses copper metal, but whether it is formed by metal diffusion bonding or metal sintering, the reduction of material strength is inevitable, which leads to the service life of the product significantly reduce.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a liquid-cooled and heat-dissipating base material structure with local pressure and reinforcement for the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, the present invention provides a liquid-cooled and heat-dissipating substrate structure with partial pressure reinforcement, including: a heat dissipation base, which is integrally formed with a heat dissipation main structure and a pressure reinforcement structure, and the heat dissipation main structure Formed in a different process from the pressure reinforcing structure, and the metallographic structure of the heat dissipation main structure is different from the metallographic structure of the pressure reinforcing structure; wherein, the grains of the metallographic structure of the heat dissipation main structure There is no arrangement direction, but the grains of the metallographic structure of the pressure reinforcing structure have a lamination arrangement direction perpendicular to the direction of pressure.

In a preferred embodiment, the heat dissipation base is firstly formed into an integrated structure through a metal diffusion bonding process, and then pressure is applied to a local area of the heat dissipation base through a process of applying pressure to form the pressure reinforcement structure .

In a preferred embodiment, the pressure reinforcing structure is a structure formed on the heat dissipation base by at least one of stamping, forging and forging processes.

In a preferred embodiment, the heat dissipation base is firstly formed into an integrated structure through a metal powder sintering process, and then pressure is applied to a local area of the heat dissipation base through a process of applying pressure to form the pressure reinforcement structure .

In a preferred embodiment, the heat dissipation base is formed of one of copper and copper alloy.

In a preferred embodiment, a fin structure is further integrally formed on the surface of the heat dissipation base, and the multiple reinforcing parts of the pressure reinforcing structure and the multiple fins of the fin structure are staggered and parallel. arrangement.

In a preferred embodiment, a fin structure is integrally formed on the surface of the heat dissipating base, and a plurality of reinforcing parts of the pressure reinforcing structure are arranged parallel to and interlaced with the fin structure to form multiple rows pin post fins.

In a preferred embodiment, a fin structure is further integrally formed on the surface of the heat dissipation base, and a plurality of reinforcing parts of the pressure reinforcing structure are arranged vertically and parallelly on the fin structure in a staggered manner. Between multiple pin post fins.

In a preferred embodiment, the pressure reinforcing structure is at least one of indentations, indentations, patterned indentations and indentations.

The beneficial effect of the present invention lies at least in that the liquid-cooled and heat-dissipating substrate structure provided by the present invention can be integrally formed with a heat-dissipating base structure and a pressure-applying reinforcing structure through "the heat-dissipating base", "the main heat-dissipating structure The metallographic structure of the heat dissipation structure is different from that of the pressure reinforcement structure”, “the metallographic structure of the heat dissipation main structure is different from the metallographic structure of the pressure application reinforcement structure”, “the metallographic structure of the heat dissipation main structure is The crystal grains have no arrangement direction, and the grains of the metallographic structure of the pressure-applied reinforcement structure have a stacking arrangement direction perpendicular to the pressure-applied direction", so that the structural strength of the heat dissipation substrate can be effectively improved to strengthen the overall structure.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

Please refer to Figs. 1 and 2, which are one of the embodiments of the present invention. The embodiment of the present invention provides a liquid-cooled and heat-dissipating substrate structure with partial pressure reinforcement, which can be used to contact heating elements. As shown in Figures 1 and 2, the liquid-cooled and heat-dissipating substrate structure provided according to the embodiment of the present invention may include a heat-dissipating base 10 which is integrally formed with a main heat-dissipating structure 11 and a pressure-applying reinforcement structure12.

Furthermore, the heat dissipation base 10 of this embodiment can be formed into an integrated structure through a metal diffusion bonding (Diffusion Bonding) process, and then through a process of applying pressure (such as stamping, forging or forging process) on the heat dissipation base The local area of 10 is reinforced by pressure to form the pressure reinforcement structure 12 , so that the heat dissipation main structure 11 and the pressure reinforcement structure 12 of the heat dissipation base 10 are formed by different processes.

In addition, the metallographic structure of the heat dissipation main structure 11 is different from the metallographic structure of the pressure reinforcing structure 12 . As shown in FIG. 2 , the grains 110 of the metallographic structure of the heat dissipation main structure 11 have no specific arrangement direction, and can also be said to be arranged randomly or randomly, while the pressure reinforcing structure 12 The grains 120 of the metallographic structure have a stacked arrangement direction perpendicular to the direction F of the pressure, that is, the grains 120 of the metallographic structure of the pressure reinforcing structure 12 have a stacked arrangement perpendicular to the direction F of the pressure, In this way, the structural strength of the heat dissipation base material can be effectively improved to strengthen the overall structure.

In addition, the heat dissipation base 10 of this embodiment may be a one-piece structure firstly formed by a metal powder sintering process, and may be a porous copper heat dissipation base formed by heating and sintering copper or copper alloy powder, and then by applying The process of pressure applies pressure to a specific local area of the heat dissipation substrate 10 to form the pressure reinforcement structure 12, so that the heat dissipation main structure 11 and the pressure reinforcement structure 12 of the heat dissipation substrate 10 are formed by different processes. Moreover, the heat dissipation base 10 may be a porous liquid-cooled heat sink submerged in a two-phase cooling liquid with a porosity greater than 5%, so as to enhance the overall heat dissipation effect. Moreover, the pressure reinforcing structure 12 may be indentation, indentation, or patterned indentation or indentation.

[Second embodiment]

Please refer to FIG. 3 , which is one of the embodiments of the present invention. As shown in the top view of FIG. 3 , the liquid-cooled and heat-dissipating substrate structure provided according to the embodiment of the present invention may include a heat-dissipating base 10 which is integrally formed with a heat-dissipating main structure 11 and a pressure-applying reinforcement. Structure 12a.

Furthermore, in this embodiment, a fin structure 13a is integrally formed on the surface of the heat dissipation base 10 , and the plurality of reinforcing portions 121a of the pressure reinforcing structure 12a and the plurality of plates of the fin structure 13a The fins 131a are arranged in a staggered manner, thereby effectively enhancing the heat dissipation effect and structural strength of the heat dissipation substrate.

[Third embodiment]

Please refer to FIG. 4 , which is one embodiment of the present invention. As shown in the top view of FIG. 4 , the liquid-cooled and heat-dissipating substrate structure provided according to the embodiment of the present invention may include a heat-dissipating base 10 which is integrally formed with a heat-dissipating main structure 11 and a pressure-applying reinforcement. Structure 12b.

Furthermore, in this embodiment, a fin structure 13b is integrally formed on the surface of the heat dissipation base 10, and the plurality of reinforcing parts 121b of the pressure reinforcing structure 12b are parallel to and interlaced with the plurality of fin structures 13b. The pin-fins 131b are arranged in multiple rows, thereby effectively enhancing the heat dissipation effect and the structural strength of the heat dissipation base material at the same time.

[Fourth embodiment]

Please refer to FIG. 5 , which is one of the embodiments of the present invention. As shown in the top view of FIG. 5 , the liquid-cooled and heat-dissipating substrate structure provided according to the embodiment of the present invention may include a heat-dissipating base 10 which is integrally formed with a heat-dissipating main structure 11 and a pressure-applying and reinforcing structure. Structure 12c.

Furthermore, in this embodiment, a fin structure 13c is integrally formed on the surface of the heat dissipation base 10, and the reinforcing parts 121c of the pressure reinforcing structure 12c are arranged vertically and parallelly on the surface of the reinforcing structure 12c. Between the plurality of pin post fins 131c of the fin structure 13c, the heat dissipation effect and the structural strength of the heat dissipation substrate can be effectively enhanced at the same time.

Based on the above, the liquid-cooled and heat-dissipating substrate structure provided by the embodiment of the present invention can be formed through "the heat-dissipating base integrally forms a heat-dissipating main structure and a pressure-applying and reinforcing structure", "the main heat-dissipating structure Formed in a different process from the pressure reinforcing structure", "the metallographic structure of the main heat dissipation structure is different from the metallographic structure of the pressure reinforcing structure", "the crystallographic structure of the metallographic structure of the main heat dissipation structure The grains have no arrangement direction, and the grains of the metallographic structure of the pressure reinforcement structure have a stacking arrangement direction perpendicular to the direction of pressure", so that the structural strength of the heat dissipation substrate can be effectively improved to strengthen the overall structure.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: heat dissipation base 11: Main heat dissipation structure 110: grain 12: Pressure reinforcement structure 120: grain 12a: Pressure reinforcement structure 121a: Reinforcement department 13a: Fin structure 131a: Slab fins 12b: Pressure reinforcement structure 121b: Reinforcing Department 13b: Fin structure 131b: pin column fins 12c: Pressure reinforcement structure 121c: Reinforcing Department 13c: Fin structure 131c: pin column fins F: Direction of pressure

FIG. 1 is a schematic top view of the structure of a liquid-cooled and heat-dissipating base material reinforced by partial pressure in accordance with the first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of line II-II in FIG. 1 .

FIG. 3 is a top view schematic diagram of a liquid-cooled and heat-dissipating substrate structure reinforced by partial pressure in accordance with a second embodiment of the present invention.

FIG. 4 is a top view schematic diagram of a liquid-cooled and heat-dissipating substrate structure reinforced by partial pressure in accordance with a third embodiment of the present invention.

FIG. 5 is a schematic top view of a liquid-cooled and heat-dissipating substrate structure reinforced by partial pressure in accordance with a fourth embodiment of the present invention.

10: heat dissipation base

11: Main heat dissipation structure

12: Pressure reinforcement structure

Claims (7)

A liquid-cooled and heat-dissipating substrate structure with partial pressure reinforcement, comprising: a heat dissipation base, which is integrally formed with a heat dissipation main structure and a pressure reinforcement structure, and the heat dissipation main structure and the pressure reinforcement structure are made of different processes formed, and the metallographic structure of the heat dissipation main structure is different from the metallographic structure of the pressure reinforcing structure; wherein, the grains of the metallographic structure of the heat dissipation main structure have no arrangement direction, and the pressure reinforcing structure The crystal grains of the metallographic structure of the structure have a stacking direction perpendicular to the direction of pressure; wherein, a fin structure is integrally formed on the surface of the heat dissipation base, and the multiple reinforcing parts of the pressure reinforcement structure are connected to the A plurality of fins in the above fin structure are arranged in parallel in a staggered manner. The liquid-cooled and heat-dissipating substrate structure reinforced by local pressure application as described in Claim 1, wherein the heat-dissipating substrate is firstly formed into an integrated structure through a metal diffusion bonding process, and then bonded to the heat-dissipating substrate through a process of applying pressure The local area is reinforced with pressure to form the pressure-reinforced structure. The liquid-cooled and heat-dissipating substrate structure with partial pressure reinforcement according to Claim 2, wherein the pressure-reinforcing structure is formed on the heat dissipation substrate by at least one of stamping, forging, and forging processes. The liquid-cooled and heat-dissipating substrate structure reinforced by local pressure application as described in claim 1, wherein the heat-dissipating substrate is firstly formed into an integrated structure through a metal powder sintering process, and then applied pressure on the heat-dissipating substrate The local area is reinforced with pressure to form the pressure-reinforced structure. The liquid-cooled and heat-dissipating substrate structure for local pressure reinforcement according to claim 4, wherein the pressure reinforcement structure is at least one of stamping, forging, and forging processes And the structure formed on the heat dissipation base. The liquid-cooled and heat-dissipating substrate structure reinforced by partial pressure as claimed in claim 1, wherein the heat-dissipating substrate is formed of one of copper and copper alloy. The liquid-cooled and heat-dissipating substrate structure for partial pressure reinforcement according to Claim 1, wherein the pressure reinforcement structure is at least one of indentations, indentations, patterned indentations, and indentations.

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