TWI774542B - Liquid-cooled heat-dissipation substrate with partial reinforcement structure - Google Patents

Abstract

A liquid-cooled heat-dissipation substrate with a partial reinforcement structure includes a heat-dissipation substrate having opposite top and bottom surfaces, and a reinforcement structure partially formed on at least one of the top and bottom surfaces. The total projected area of the reinforcement structure onto the top and bottom surfaces is 10-60% of the total area of the top and bottom surfaces.

Description

A liquid-cooled heat-dissipating substrate for local pressure reinforcement

The invention relates to a heat dissipation base material, in particular to a liquid-cooled heat dissipation base material for local pressure reinforcement.

Based on the heat dissipation requirements of high-power heating elements, the radiator body of the existing high-power heating elements mostly uses copper metal, but whether it is formed by metal diffusion bonding or metal sintering, the material strength is inevitably reduced, which leads to product service life. significantly reduce.

In view of this, the inventor of the present invention has been engaged in the development and design of related products for many years, and feels that the above deficiencies can be improved, so he has devoted himself to research and application of theories, and finally proposes a reasonable design and effectively improves the above deficiencies. The present invention.

The technical problem to be solved by the present invention is to provide a liquid-cooled heat-dissipating substrate with partial pressure reinforcement in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, the present invention provides a liquid-cooled heat dissipation base material with partial pressure reinforcement, including: a heat dissipation base having opposite upper and lower surfaces, and a pressure reinforcement structure formed locally on the heat dissipation base. At least one of the upper surface and the lower surface; wherein, the projected area of the pressure-reinforcing structure on the upper surface and the sum of the projected area on the lower surface, and the area of the upper surface and The ratio of the total area of the lower surface is 10% or more and 60% or less.

In a preferred embodiment, the heat dissipation base is first formed into an integrated structure through a metal diffusion bonding process, and then pressure reinforcement is performed on a local area of the heat dissipation base through a pressure application process to form the pressure reinforcement structure. .

In a preferred embodiment, the heat dissipation base is first formed into an integrated structure through a metal powder sintering process, and then pressure reinforcement is performed on a local area of the heat dissipation base through a pressure application process to form the pressure reinforcement structure. .

In a preferred embodiment, the heat dissipation base is formed of one of copper and copper alloys.

In a preferred embodiment, a fin structure is further integrally formed on the upper surface of the heat dissipation base, and a plurality of reinforcing parts of the pressure-reinforcing structure and a plurality of fins of the fin structure are formed in a shape. Staggered parallel arrangement.

In a preferred embodiment, a fin structure is further integrally formed on the upper surface of the heat dissipation base, and a plurality of reinforcing portions of the pressure-applying reinforcing structure are arranged in parallel and staggered to the plurality of fin structures. Pin-post fins in multiple rows.

In a preferred embodiment, a fin structure is further integrally formed on the upper surface of the heat dissipation base, and a plurality of reinforcement parts of the pressure reinforcement structure are staggered in the vertical and parallel manners. between a plurality of pin-post fins of the fin structure.

In a preferred embodiment, the pressure reinforcement structure is at least one of indentation, indentation, patterned indentation and indentation.

In a preferred embodiment, the depth of the indentation of the pressure-reinforcing structure does not exceed 10% of the thickness of the heat dissipation substrate.

The beneficial effect of the present invention is at least in that the liquid-cooled heat dissipation base material provided by the present invention can be partially pressurized and reinforced by "the heat dissipation base has opposite upper and lower surfaces, and a pressure-reinforcing structure is formed locally at the place. At least one of the upper surface and the lower surface", "the projected area of the pressure-reinforcing structure on the upper surface, and the sum of the projected area on the lower surface, and the area of the upper surface and The ratio of the total area of the lower surface is more than 10% and less than 60%", so that the heat dissipation effect can be taken into account and the structural strength can be strengthened.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the embodiments disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Please refer to FIGS. 1 and 2 , which are one of the embodiments of the present invention. The embodiment of the present invention provides a liquid-cooled heat dissipation substrate with partial pressure reinforcement, which can be used to contact heating elements. As shown in FIGS. 1 and 2 , the liquid-cooled heat-dissipating substrate reinforced by partial pressure application according to an embodiment of the present invention may include a heat-dissipating substrate 10 having opposite upper surfaces 11 and lower surfaces 12 , and a heat-dissipating substrate 10 . The pressure reinforcement structure 13 is locally formed on at least one of the upper surface 11 and the lower surface 12 .

Further, the heat dissipation substrate 10 of the present embodiment may be formed into a one-piece structure through a metal diffusion bonding process, and the heat dissipation substrate 10 may be immersed in a two-phase cooling liquid with a porosity greater than 5%. Liquid cooling fins to enhance the overall cooling effect. In addition, since the heat dissipation substrate 10 is first formed through a metal diffusion bonding process, the structural strength is inevitably reduced. Therefore, in order to take into account the heat dissipation effect and strengthen the structural strength, the projected area of the pressure-reinforcing structure 13 in this embodiment on the upper surface 11 , and the sum of the projected area on the lower surface 12, and the ratio of the sum of the area of the upper surface 11 and the area of the lower surface 12 is 10% or more and 60% or less, according to which the heat dissipation effect can be taken into account and the structural strength can be strengthened.

Specifically, the pressure-reinforcing structure 13 of this embodiment is a reinforcement structure formed by applying pressure to a local area of the heat dissipation substrate 10 by applying pressure (eg, stamping, forging or forging). In addition, the pressure reinforcement structure 13 may be an indentation, an indentation, or a patterned indentation or indentation, and the depth of the indentation does not exceed 15% of the thickness of the heat dissipation substrate 10 .

In addition, the heat dissipation substrate 10 of this embodiment can also be formed into an integrated structure through a metal powder sintering process, and can be a liquid-cooled heat sink formed by sintering copper and copper alloy powders, and then the process of applying pressure is applied to the heat sink. A partial area of the heat dissipation base 10 is reinforced by pressure to form the pressure reinforced structure 13 .

In addition, the ratio of the total projected area of the pressure reinforcement structure 13 on the upper surface 11 and the projected area on the lower surface 12 of the present embodiment to the sum of the area of the upper surface 11 and the area of the lower surface 12 is about 27%.

[Second Embodiment]

Please refer to FIGS. 3 and 4 , which are the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

Specifically, as shown in the top view of FIG. 3 , a fin structure 14 a is further integrally formed on the upper surface 11 of the heat dissipation substrate 10 of this embodiment, and a plurality of reinforcing parts of the pressure-reinforcing structure 13 a are formed. The fins 131a and the plurality of plate-shaped fins 141a of the fin structure 14a are arranged in a staggered and parallel manner, thereby enhancing the heat dissipation effect and the structural strength more effectively.

In addition, the ratio of the total projected area of the pressure-reinforcing structure 13a on the upper surface 11 and the projected area on the lower surface 12 of the present embodiment to the sum of the area of the upper surface 11 and the area of the lower surface 12 is about 25%.

[Third Embodiment]

Please refer to FIGS. 5 and 6 , which are the third embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

Specifically, as shown in the top view of FIG. 5 , a fin structure 14b is further integrally formed on the surface of the heat dissipation base 10 in this embodiment, and the plurality of reinforcement portions 131b of the pressure-reinforcing structure 13b in this embodiment are parallel and staggered The plurality of pin-fins 141b arranged in multiple rows on the fin structure 14b can more effectively enhance the heat dissipation effect and the structural strength at the same time.

In addition, the ratio of the total projected area of the pressure-reinforcing structure 13b on the upper surface 11 and the projected area on the lower surface 12 of the present embodiment to the sum of the area of the upper surface 11 and the area of the lower surface 12 is about 20%.

[Fourth Embodiment]

Please refer to FIGS. 7 and 8 , which are the fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

Specifically, as shown in the top view of FIG. 7 , a fin structure 14c is further integrally formed on the surface of the heat dissipation base 10 of this embodiment, and the plurality of reinforcement portions 131c of the pressure-reinforcing structure 13c in this embodiment are vertical The fins 141c of the fin structure 14c are alternately arranged between the plurality of pin-post fins 141c in two ways, so that the heat dissipation effect and the structural strength can be more effectively enhanced at the same time.

In addition, the ratio of the total projected area of the pressure-reinforcing structure 13c on the upper surface 11 and the projected area on the lower surface 12 of the present embodiment to the sum of the area of the upper surface 11 and the area of the lower surface 12 is about 45%.

Based on the above, the liquid-cooled heat dissipation substrate provided by the embodiment of the present invention can be partially pressurized and reinforced. At least one of the upper surface and the lower surface”, “the sum of the projected area of the pressure-reinforcing structure on the upper surface, and the projected area on the lower surface, and the area of the upper surface and the sum of the projected area on the lower surface. The ratio of the total area of the lower surface is more than 10% and less than 60%", so that the heat dissipation effect can be taken into account and the structural strength can be strengthened.

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Thermal base 11: Upper surface 12: Lower surface 13: Pressure Reinforcement Structure 13a: Compression reinforcement structure 131a: Reinforcement 14a: Fin structure 141a: Plate fins 13b: Compression reinforcement structure 131b: Reinforcing Department 14b: Fin structure 141b: Pin Post Fins 13c: Compression reinforcement structure 131c: Reinforcing Department 14c: Fin structure 141c: Pin Post Fins

FIG. 1 is a schematic top view of a liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to a first embodiment of the present invention.

FIG. 2 is a schematic side view of a liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to the first embodiment of the present invention.

FIG. 3 is a schematic top view of a liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to a second embodiment of the present invention.

FIG. 4 is a schematic side view of a liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to a second embodiment of the present invention.

FIG. 5 is a schematic top view of a liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to a third embodiment of the present invention.

FIG. 6 is a schematic side view of a liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to a third embodiment of the present invention.

FIG. 7 is a schematic top view of a liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to a fourth embodiment of the present invention.

FIG. 8 is a schematic side view of a liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to a fourth embodiment of the present invention.

10: Thermal base

11: Upper surface

13: Pressure Reinforcement Structure

Claims (6)

A liquid-cooled heat-dissipating base material with partial pressure reinforcement, comprising: a heat-dissipation base having opposite upper and lower surfaces, and a pressure-reinforcing structure partially formed on at least one of the upper surface and the lower surface. One; wherein, the ratio of the projected area of the pressure-reinforcing structure on the upper surface and the sum of the projected area on the lower surface to the sum of the area of the upper surface and the area of the lower surface is more than 10% and less than 60%; wherein, a fin structure is more integrally formed on the upper surface of the heat dissipation base, and a plurality of reinforcing parts of the pressure-reinforcing structure and a plurality of the fin structures are formed. The fins are staggered and arranged in parallel. The liquid-cooled heat-dissipating substrate reinforced by partial pressure application according to claim 1, wherein the heat-dissipating substrate is firstly formed into an integrated structure through a metal diffusion bonding process, and then a part of the heat-dissipating substrate is formed in a part of the heat-dissipating substrate through a process of applying pressure. The area is reinforced by pressure to form the pressure reinforced structure. The liquid-cooled heat-dissipating base material reinforced by partial pressure application according to claim 1, wherein the heat-dissipating base is first formed into an integrated structure through a metal powder sintering process, and then the heat-dissipating base is formed in a part of the heat-dissipating base through a process of applying pressure. The area is reinforced by pressure to form the pressure reinforced structure. The liquid-cooled heat-dissipating substrate for local pressure reinforcement according to claim 1, wherein the heat-dissipating substrate is formed of one of copper and copper alloys. The liquid-cooled heat-dissipating substrate for local pressure reinforcement according to claim 1, wherein the pressure reinforcement structure is at least one of indentation, indentation, patterned indentation, and indentation. The liquid-cooled heat-dissipating substrate for partial pressure reinforcement according to claim 5, wherein the indentation depth of the pressure-reinforcing structure does not exceed 15% of the thickness of the heat dissipation substrate.

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