TWI696416B - Immersion cooling apparatus - Google Patents
Immersion cooling apparatus Download PDFInfo
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- TWI696416B TWI696416B TW108132894A TW108132894A TWI696416B TW I696416 B TWI696416 B TW I696416B TW 108132894 A TW108132894 A TW 108132894A TW 108132894 A TW108132894 A TW 108132894A TW I696416 B TWI696416 B TW I696416B
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Abstract
Description
本發明關於一種浸入式冷卻設備,尤指一種具有自冷卻液槽之上排氣口往上延伸形成之多數個金屬管的浸入式冷卻設備。The invention relates to an immersion cooling equipment, in particular to an immersion cooling equipment having a plurality of metal pipes extending upward from the exhaust port above the cooling liquid tank.
一般而言,浸入式冷卻設備係利用將發熱元件(如伺服器、磁碟陣列等)浸沒在冷卻液槽所儲存的冷卻液中,透過冷卻液吸熱後所產生之蒸氣帶走發熱元件運作時之熱能,再使用風扇裝置將蒸氣冷卻回液體並經由泵浦裝置送回的液氣兩相轉換過程來產生散熱功效。在實際應用中,由於使用環境(如車用散熱)的限制,因此需要採用無風扇之熱虹吸冷卻設計,簡言之,其係透過散熱管將兩相浸沒式冷卻系統之熱蒸氣冷卻為液體後,再將液體引流回冷卻液槽中。然而,在上述設計中,由於散熱管中並未配置有主動回液之結構設計,導致管內流阻較大,因此會大大地降低浸入式冷卻設備之散熱效果以及液體回流效率。Generally speaking, immersion cooling equipment utilizes the heating elements (such as servers, disk arrays, etc.) to be immersed in the cooling liquid stored in the cooling liquid tank, and the steam generated after absorbing heat through the cooling liquid takes away the heating elements. For the heat energy, the fan device is used to cool the vapor back to the liquid and the liquid-gas two-phase conversion process returned by the pump device is used to generate heat. In practical applications, due to the limitations of the use environment (such as car heat dissipation), a fanless thermosiphon cooling design is required. In short, it uses the heat pipe to cool the hot vapor of the two-phase immersion cooling system into a liquid After that, the liquid is drained back into the cooling liquid tank. However, in the above design, since the heat pipe is not configured with active liquid return structure, resulting in a large flow resistance in the pipe, it will greatly reduce the heat dissipation effect and liquid return efficiency of the immersion cooling equipment.
本發明之目的在於提供一種具有自冷卻液槽之上排氣口往上延伸之多數個金屬管的浸入式冷卻設備,以解決上述之問題。An object of the present invention is to provide an immersion cooling device having a plurality of metal tubes extending upward from an exhaust port above a cooling liquid tank to solve the above-mentioned problems.
根據一實施例,本發明之浸入式冷卻設備包含一發熱元件、一冷卻液槽以及多數個金屬管。該冷卻液槽具有多數個上排氣口且用來儲存一冷卻液以及容置該發熱元件以使該發熱元件浸入該冷卻液中。該些金屬管分別連通於該些上排氣口,每一金屬管自該上排氣口往上延伸形成,以使該冷卻液於吸收該發熱元件之熱能時所產生之蒸氣經由該些上排氣口離開該冷卻液槽而進入該些金屬管中。當該些金屬管將流入之蒸氣冷卻回液體時,冷卻後之液體沿著每一金屬管通過相對應之該上排氣口向下流回該冷卻液中。According to an embodiment, the immersion cooling device of the present invention includes a heating element, a cooling liquid tank, and a plurality of metal tubes. The cooling liquid tank has a plurality of upper exhaust ports for storing a cooling liquid and accommodating the heating element so that the heating element is immersed in the cooling liquid. The metal tubes are respectively connected to the upper exhaust ports, and each metal tube extends upward from the upper exhaust port, so that the steam generated when the cooling liquid absorbs the heat energy of the heating element passes through the upper ports The exhaust port leaves the coolant tank and enters the metal tubes. When the metal tubes cool the inflowing vapor back to the liquid, the cooled liquid flows down through the corresponding upper exhaust port back to the cooling liquid along each metal tube.
綜上所述,透過金屬管自冷卻液槽之上排氣口往上延伸形成的散熱管路設計,經過金屬管冷卻後之液體就會受到重力的影響而克服管內流阻,從而快速地沿著金屬管向下回流至冷卻液槽的冷卻液中,藉此,本發明係可大大地提升浸入式冷卻設備的散熱效果以及液體回流效率。In summary, the design of the heat dissipation pipeline that extends upward from the exhaust port above the coolant tank through the metal tube, the liquid after the metal tube is cooled will be affected by gravity and overcome the flow resistance in the tube, thereby quickly Returning down the metal pipe to the cooling liquid in the cooling liquid tank, the invention can greatly improve the heat dissipation effect and liquid return efficiency of the immersion cooling equipment.
關於本發明之優點與精神可以藉由以下的實施方式及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention can be further understood through the following embodiments and the accompanying drawings.
請參閱第1圖,其為根據本發明之一實施例所提出之一浸入式冷卻設備10之剖面簡示圖,浸入式冷卻設備10係用來對一發熱元件11(如刀鋒型伺服器、磁碟陣列等)進行散熱,如第1圖所示,浸入式冷卻設備10包含發熱元件11、一冷卻液槽12以及多數個金屬管14。冷卻液槽12係可為一般常見應用在浸入式冷卻設備中之冷卻液儲存槽室(其相關槽室設計係常見於先前技術中,故於此不再贅述)且具有多數個上排氣口16,冷卻液槽12係可用來儲存一冷卻液18以及容置發熱元件11,以使發熱元件11可浸入冷卻液18中,其中冷卻液18係可為常見用來進行浸入式冷卻的惰性介電液(如礦物油、聚矽氧油等)。Please refer to FIG. 1, which is a schematic cross-sectional view of an
由第1圖可知,多數個金屬管14係可分別連通於多數個上排氣口16,每一金屬管14係可自相對應之上排氣口16往上延伸形成,以使冷卻液18於吸收發熱元件11之熱能時所產生之蒸氣能夠經由多數個上排氣口16離開冷卻液槽12而進入多數個金屬管14中,在此實施例中,每一金屬管14係可較佳地自上排氣口16垂直往上延伸(但不以此為限,在另一實施例中,本發明亦可採用傾斜向上延伸之金屬管設計,其相關描述係可參照第1圖類推,於此不再贅述)。It can be seen from FIG. 1 that a plurality of
更進一步地,浸入式冷卻設備10係可採用將散熱裝置配置在金屬管上之散熱設計,舉例來說,由第1圖可知,浸入式冷卻設備10可另包含一散熱裝置20,在此實施例中,散熱裝置20係可較佳地為散熱鰭片結構(但不以此為限),且多數個金屬管14係穿設於散熱鰭片結構中以增加散熱面積,藉此,散熱鰭片結構係可吸收流入金屬管14內之蒸氣的熱能以將蒸氣加速冷卻回液體。需注意的是,透過金屬管14自冷卻液槽12向上延伸的散熱管路設計,浸入式冷卻設備10係可更進一步地將裝設有散熱裝置20的金屬管14延伸配置到溫度較低(如室外)或氣流速度較快(例如在車用散熱的應用情境下,金屬管14可延伸出車體之外以透過車輛移動時產生的空氣流動加強散熱效率)的位置,進而大幅地提升浸入式冷卻設備10的散熱效能。Furthermore, the
透過上述設計,當發熱元件11運作而產生熱能時,冷卻液18吸收熱能後所產生的蒸氣就會經由多數個上排氣口16離開冷卻液槽12且流入多數個金屬管14中,在此過程中,從上排氣口16流入金屬管14中之蒸氣即可經由金屬管14本身的高導熱特性以及散熱裝置20與外界的接觸散熱而快速地冷卻回液體,於此同時,由第1圖可知,由於金屬管14之導流方向係與重力方向平行且一致,因此,冷卻後之液體就會受到重力的影響而快速地沿著金屬管14向下回流至冷卻液18中而繼續對發熱元件11進行散熱,藉此,本發明係可大大地提升浸入式冷卻設備10的散熱效果以及液體回流效率。Through the above design, when the
值得一提的是,本發明係可採用毛細結構引流設計,舉例來說,請參閱第2圖,其為第1圖之金屬管14連通於冷卻液槽12之上排氣口16之部分放大剖面簡示圖,由第2圖可知,在此實施例中,浸入式冷卻設備10可另包含一毛細結構22,毛細結構22係可設置於金屬管14內(其針對毛細結構設計與毛細作用原理的相關描述係常見於先前技術中,於此不再贅述),如此一來,在金屬管14透過本身的高導熱特性以及散熱裝置20與外界的接觸散熱而將從上排氣口16流入金屬管14中之蒸氣快速地冷卻回液體後,冷卻後之液體就會在毛細結構22所提供之毛細作用的引導下更加快速地沿著金屬管14向下回流至冷卻液槽12的冷卻液18中,從而有效地降低管內流阻並且更進一步地提升金屬管14的液體回流效率以及浸入式冷卻設備10的解熱能力。
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。
It is worth mentioning that the present invention can adopt a capillary structure drainage design. For example, please refer to FIG. 2, which is an enlargement of the portion of the
10:浸入式冷卻設備 11:發熱元件 12:冷卻液槽 14:金屬管 16:上排氣口 18:冷卻液 20:散熱裝置 22:毛細結構10: Immersion cooling equipment 11: heating element 12: Coolant tank 14: Metal tube 16: Upper exhaust 18: Coolant 20: Heat sink 22: Capillary structure
第1圖為根據本發明之一實施例所提出之浸入式冷卻設備之剖面簡示圖。 第2圖為第1圖之金屬管連通於冷卻液槽之上排氣口之部分放大剖面簡示圖。 FIG. 1 is a schematic cross-sectional view of an immersion cooling device according to an embodiment of the present invention. FIG. 2 is an enlarged schematic cross-sectional view of a portion of the metal pipe of FIG. 1 communicating with the exhaust port above the coolant tank.
10:浸入式冷卻設備 10: Immersion cooling equipment
11:發熱元件 11: heating element
12:冷卻液槽 12: Coolant tank
14:金屬管 14: Metal tube
16:上排氣口 16: Upper exhaust
18:冷卻液 18: Coolant
20:散熱裝置 20: Heat sink
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TWI797871B (en) * | 2021-12-06 | 2023-04-01 | 艾姆勒科技股份有限公司 | Two-phase immersion-type heat-dissipation substrate structure |
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CN115568172A (en) * | 2022-09-23 | 2023-01-03 | 东莞立讯技术有限公司 | Immersed cabinet and heat dissipation system thereof |
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US8619425B2 (en) * | 2011-10-26 | 2013-12-31 | International Business Machines Corporation | Multi-fluid, two-phase immersion-cooling of electronic component(s) |
US8739406B2 (en) * | 2012-09-13 | 2014-06-03 | International Business Machines Corporation | Vapor condenser with three-dimensional folded structure |
TWM514714U (en) * | 2015-10-12 | 2015-12-21 | Cooler Master Co Ltd | Heat-dissipating system |
TW201821938A (en) * | 2016-12-01 | 2018-06-16 | 英業達股份有限公司 | Radiator and server module |
TW201905160A (en) * | 2017-06-07 | 2019-02-01 | 美商3M新設資產公司 | Fluid for immersion cooling |
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Patent Citations (5)
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US8619425B2 (en) * | 2011-10-26 | 2013-12-31 | International Business Machines Corporation | Multi-fluid, two-phase immersion-cooling of electronic component(s) |
US8739406B2 (en) * | 2012-09-13 | 2014-06-03 | International Business Machines Corporation | Vapor condenser with three-dimensional folded structure |
TWM514714U (en) * | 2015-10-12 | 2015-12-21 | Cooler Master Co Ltd | Heat-dissipating system |
TW201821938A (en) * | 2016-12-01 | 2018-06-16 | 英業達股份有限公司 | Radiator and server module |
TW201905160A (en) * | 2017-06-07 | 2019-02-01 | 美商3M新設資產公司 | Fluid for immersion cooling |
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TWI797871B (en) * | 2021-12-06 | 2023-04-01 | 艾姆勒科技股份有限公司 | Two-phase immersion-type heat-dissipation substrate structure |
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