TWI696416B - Immersion cooling apparatus - Google Patents

Immersion cooling apparatus Download PDF

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TWI696416B
TWI696416B TW108132894A TW108132894A TWI696416B TW I696416 B TWI696416 B TW I696416B TW 108132894 A TW108132894 A TW 108132894A TW 108132894 A TW108132894 A TW 108132894A TW I696416 B TWI696416 B TW I696416B
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liquid
metal tubes
upper exhaust
heat dissipation
cooling
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TW108132894A
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TW202112214A (en
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童凱煬
陳虹汝
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英業達股份有限公司
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Abstract

An immersion cooling apparatus includes a heat-generating member, a chamber and a plurality of metal tubes. The chamber has a plurality of upper steam-discharging outlets. The chamber stores a cooling solution and contains the heat-generating member to make the heat-generating member immersed in the cooling solution. The plurality of metal tubes is communicated with the plurality of the upper steam-discharging outlets respectively. Each metal tube extends upward from the upper steam-discharging outlet to guide steam generated by the cooling solution when the cooling solution absorbs heat of the heat generating member to leave the chamber through the upper steam-discharging outlets and then enter the metal tubes. When the metal tubes cool the steam into liquid, the liquid flows to the cooling solution downward along each metal tube through the upper steam-discharging outlets.

Description

浸入式冷卻設備Immersion cooling equipment

本發明關於一種浸入式冷卻設備,尤指一種具有自冷卻液槽之上排氣口往上延伸形成之多數個金屬管的浸入式冷卻設備。The invention relates to an immersion cooling equipment, in particular to an immersion cooling equipment having a plurality of metal pipes extending upward from the exhaust port above the cooling liquid tank.

一般而言,浸入式冷卻設備係利用將發熱元件(如伺服器、磁碟陣列等)浸沒在冷卻液槽所儲存的冷卻液中,透過冷卻液吸熱後所產生之蒸氣帶走發熱元件運作時之熱能,再使用風扇裝置將蒸氣冷卻回液體並經由泵浦裝置送回的液氣兩相轉換過程來產生散熱功效。在實際應用中,由於使用環境(如車用散熱)的限制,因此需要採用無風扇之熱虹吸冷卻設計,簡言之,其係透過散熱管將兩相浸沒式冷卻系統之熱蒸氣冷卻為液體後,再將液體引流回冷卻液槽中。然而,在上述設計中,由於散熱管中並未配置有主動回液之結構設計,導致管內流阻較大,因此會大大地降低浸入式冷卻設備之散熱效果以及液體回流效率。Generally speaking, immersion cooling equipment utilizes the heating elements (such as servers, disk arrays, etc.) to be immersed in the cooling liquid stored in the cooling liquid tank, and the steam generated after absorbing heat through the cooling liquid takes away the heating elements. For the heat energy, the fan device is used to cool the vapor back to the liquid and the liquid-gas two-phase conversion process returned by the pump device is used to generate heat. In practical applications, due to the limitations of the use environment (such as car heat dissipation), a fanless thermosiphon cooling design is required. In short, it uses the heat pipe to cool the hot vapor of the two-phase immersion cooling system into a liquid After that, the liquid is drained back into the cooling liquid tank. However, in the above design, since the heat pipe is not configured with active liquid return structure, resulting in a large flow resistance in the pipe, it will greatly reduce the heat dissipation effect and liquid return efficiency of the immersion cooling equipment.

本發明之目的在於提供一種具有自冷卻液槽之上排氣口往上延伸之多數個金屬管的浸入式冷卻設備,以解決上述之問題。An object of the present invention is to provide an immersion cooling device having a plurality of metal tubes extending upward from an exhaust port above a cooling liquid tank to solve the above-mentioned problems.

根據一實施例,本發明之浸入式冷卻設備包含一發熱元件、一冷卻液槽以及多數個金屬管。該冷卻液槽具有多數個上排氣口且用來儲存一冷卻液以及容置該發熱元件以使該發熱元件浸入該冷卻液中。該些金屬管分別連通於該些上排氣口,每一金屬管自該上排氣口往上延伸形成,以使該冷卻液於吸收該發熱元件之熱能時所產生之蒸氣經由該些上排氣口離開該冷卻液槽而進入該些金屬管中。當該些金屬管將流入之蒸氣冷卻回液體時,冷卻後之液體沿著每一金屬管通過相對應之該上排氣口向下流回該冷卻液中。According to an embodiment, the immersion cooling device of the present invention includes a heating element, a cooling liquid tank, and a plurality of metal tubes. The cooling liquid tank has a plurality of upper exhaust ports for storing a cooling liquid and accommodating the heating element so that the heating element is immersed in the cooling liquid. The metal tubes are respectively connected to the upper exhaust ports, and each metal tube extends upward from the upper exhaust port, so that the steam generated when the cooling liquid absorbs the heat energy of the heating element passes through the upper ports The exhaust port leaves the coolant tank and enters the metal tubes. When the metal tubes cool the inflowing vapor back to the liquid, the cooled liquid flows down through the corresponding upper exhaust port back to the cooling liquid along each metal tube.

綜上所述,透過金屬管自冷卻液槽之上排氣口往上延伸形成的散熱管路設計,經過金屬管冷卻後之液體就會受到重力的影響而克服管內流阻,從而快速地沿著金屬管向下回流至冷卻液槽的冷卻液中,藉此,本發明係可大大地提升浸入式冷卻設備的散熱效果以及液體回流效率。In summary, the design of the heat dissipation pipeline that extends upward from the exhaust port above the coolant tank through the metal tube, the liquid after the metal tube is cooled will be affected by gravity and overcome the flow resistance in the tube, thereby quickly Returning down the metal pipe to the cooling liquid in the cooling liquid tank, the invention can greatly improve the heat dissipation effect and liquid return efficiency of the immersion cooling equipment.

關於本發明之優點與精神可以藉由以下的實施方式及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention can be further understood through the following embodiments and the accompanying drawings.

請參閱第1圖,其為根據本發明之一實施例所提出之一浸入式冷卻設備10之剖面簡示圖,浸入式冷卻設備10係用來對一發熱元件11(如刀鋒型伺服器、磁碟陣列等)進行散熱,如第1圖所示,浸入式冷卻設備10包含發熱元件11、一冷卻液槽12以及多數個金屬管14。冷卻液槽12係可為一般常見應用在浸入式冷卻設備中之冷卻液儲存槽室(其相關槽室設計係常見於先前技術中,故於此不再贅述)且具有多數個上排氣口16,冷卻液槽12係可用來儲存一冷卻液18以及容置發熱元件11,以使發熱元件11可浸入冷卻液18中,其中冷卻液18係可為常見用來進行浸入式冷卻的惰性介電液(如礦物油、聚矽氧油等)。Please refer to FIG. 1, which is a schematic cross-sectional view of an immersion cooling device 10 according to an embodiment of the present invention. The immersion cooling device 10 is used for a heating element 11 (such as a blade server, Disk array, etc.) for heat dissipation. As shown in FIG. 1, the immersion cooling device 10 includes a heating element 11, a cooling liquid tank 12, and a plurality of metal tubes 14. The coolant tank 12 can be a coolant storage tank commonly used in immersion cooling equipment (the related tank design is common in the prior art, so it will not be repeated here) and has many upper exhaust ports 16. The cooling liquid tank 12 can be used for storing a cooling liquid 18 and accommodating the heating element 11 so that the heating element 11 can be immersed in the cooling liquid 18, wherein the cooling liquid 18 can be an inert medium commonly used for immersion cooling Electro-hydraulic (such as mineral oil, silicone oil, etc.).

由第1圖可知,多數個金屬管14係可分別連通於多數個上排氣口16,每一金屬管14係可自相對應之上排氣口16往上延伸形成,以使冷卻液18於吸收發熱元件11之熱能時所產生之蒸氣能夠經由多數個上排氣口16離開冷卻液槽12而進入多數個金屬管14中,在此實施例中,每一金屬管14係可較佳地自上排氣口16垂直往上延伸(但不以此為限,在另一實施例中,本發明亦可採用傾斜向上延伸之金屬管設計,其相關描述係可參照第1圖類推,於此不再贅述)。It can be seen from FIG. 1 that a plurality of metal tubes 14 can be respectively connected to a plurality of upper exhaust ports 16, and each metal tube 14 can be formed to extend upward from the corresponding upper exhaust port 16, so that the coolant 18 The steam generated when absorbing the heat energy of the heating element 11 can leave the cooling liquid tank 12 through the plurality of upper exhaust ports 16 and enter the plurality of metal tubes 14. In this embodiment, each metal tube 14 may be better The ground extends vertically upwards from the upper exhaust port 16 (but not limited to this, in another embodiment, the present invention can also use a metal tube design that extends obliquely upward, and the related description can be referred to the first figure, and so on, (I will not repeat them here).

更進一步地,浸入式冷卻設備10係可採用將散熱裝置配置在金屬管上之散熱設計,舉例來說,由第1圖可知,浸入式冷卻設備10可另包含一散熱裝置20,在此實施例中,散熱裝置20係可較佳地為散熱鰭片結構(但不以此為限),且多數個金屬管14係穿設於散熱鰭片結構中以增加散熱面積,藉此,散熱鰭片結構係可吸收流入金屬管14內之蒸氣的熱能以將蒸氣加速冷卻回液體。需注意的是,透過金屬管14自冷卻液槽12向上延伸的散熱管路設計,浸入式冷卻設備10係可更進一步地將裝設有散熱裝置20的金屬管14延伸配置到溫度較低(如室外)或氣流速度較快(例如在車用散熱的應用情境下,金屬管14可延伸出車體之外以透過車輛移動時產生的空氣流動加強散熱效率)的位置,進而大幅地提升浸入式冷卻設備10的散熱效能。Furthermore, the immersion cooling device 10 may adopt a heat dissipation design in which a heat dissipation device is disposed on a metal tube. For example, as can be seen from FIG. 1, the immersion cooling device 10 may further include a heat dissipation device 20, which is implemented here For example, the heat dissipation device 20 may be preferably a heat dissipation fin structure (but not limited to this), and a plurality of metal tubes 14 are penetrated in the heat dissipation fin structure to increase the heat dissipation area, thereby, the heat dissipation fin The sheet structure can absorb the heat energy of the vapor flowing into the metal tube 14 to accelerate the cooling of the vapor back to the liquid. It should be noted that through the design of the heat pipe extending upward from the coolant tank 12 through the metal pipe 14, the immersion cooling device 10 can further extend the metal pipe 14 equipped with the heat sink 20 to a lower temperature ( Such as outdoor) or the airflow speed is fast (for example, in the case of vehicle heat dissipation, the metal tube 14 can be extended outside the car body to enhance the heat dissipation efficiency through the air flow generated when the vehicle moves), thereby greatly improving the immersion Heat dissipation efficiency of the cooling device 10.

透過上述設計,當發熱元件11運作而產生熱能時,冷卻液18吸收熱能後所產生的蒸氣就會經由多數個上排氣口16離開冷卻液槽12且流入多數個金屬管14中,在此過程中,從上排氣口16流入金屬管14中之蒸氣即可經由金屬管14本身的高導熱特性以及散熱裝置20與外界的接觸散熱而快速地冷卻回液體,於此同時,由第1圖可知,由於金屬管14之導流方向係與重力方向平行且一致,因此,冷卻後之液體就會受到重力的影響而快速地沿著金屬管14向下回流至冷卻液18中而繼續對發熱元件11進行散熱,藉此,本發明係可大大地提升浸入式冷卻設備10的散熱效果以及液體回流效率。Through the above design, when the heating element 11 operates to generate heat energy, the vapor generated by the cooling liquid 18 after absorbing the heat energy leaves the cooling liquid tank 12 through the plurality of upper exhaust ports 16 and flows into the plurality of metal tubes 14, where During the process, the vapor flowing into the metal tube 14 from the upper exhaust port 16 can be quickly cooled back to the liquid through the high thermal conductivity of the metal tube 14 and the heat dissipation of the heat sink 20 and the outside world. At the same time, the first As can be seen from the figure, since the flow direction of the metal tube 14 is parallel and consistent with the direction of gravity, the cooled liquid will quickly return to the cooling liquid 18 along the metal tube 14 under the influence of gravity and continue to The heat-generating element 11 dissipates heat, whereby the present invention can greatly improve the heat dissipation effect and liquid return efficiency of the immersion cooling device 10.

值得一提的是,本發明係可採用毛細結構引流設計,舉例來說,請參閱第2圖,其為第1圖之金屬管14連通於冷卻液槽12之上排氣口16之部分放大剖面簡示圖,由第2圖可知,在此實施例中,浸入式冷卻設備10可另包含一毛細結構22,毛細結構22係可設置於金屬管14內(其針對毛細結構設計與毛細作用原理的相關描述係常見於先前技術中,於此不再贅述),如此一來,在金屬管14透過本身的高導熱特性以及散熱裝置20與外界的接觸散熱而將從上排氣口16流入金屬管14中之蒸氣快速地冷卻回液體後,冷卻後之液體就會在毛細結構22所提供之毛細作用的引導下更加快速地沿著金屬管14向下回流至冷卻液槽12的冷卻液18中,從而有效地降低管內流阻並且更進一步地提升金屬管14的液體回流效率以及浸入式冷卻設備10的解熱能力。 以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 It is worth mentioning that the present invention can adopt a capillary structure drainage design. For example, please refer to FIG. 2, which is an enlargement of the portion of the metal pipe 14 of FIG. 1 communicating with the exhaust port 16 above the cooling liquid tank 12 A schematic cross-sectional view, as can be seen from FIG. 2, in this embodiment, the immersion cooling device 10 may further include a capillary structure 22, which can be disposed in the metal tube 14 (which is designed for capillary structure and capillary action The relevant description of the principle is common in the prior art, and will not be repeated here.) In this way, the metal tube 14 will radiate from the upper exhaust port 16 through its own high thermal conductivity and heat dissipation of the heat sink 20 and the outside world. After the vapor in the metal tube 14 is quickly cooled back to the liquid, the cooled liquid will be more quickly returned to the cooling liquid of the cooling liquid tank 12 along the metal tube 14 under the guidance of the capillary action provided by the capillary structure 22 18 to effectively reduce the flow resistance in the tube and further improve the liquid return efficiency of the metal tube 14 and the heat removal capacity of the immersion cooling device 10. The above are only the preferred embodiments of the present invention, and all changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.

10:浸入式冷卻設備 11:發熱元件 12:冷卻液槽 14:金屬管 16:上排氣口 18:冷卻液 20:散熱裝置 22:毛細結構10: Immersion cooling equipment 11: heating element 12: Coolant tank 14: Metal tube 16: Upper exhaust 18: Coolant 20: Heat sink 22: Capillary structure

第1圖為根據本發明之一實施例所提出之浸入式冷卻設備之剖面簡示圖。 第2圖為第1圖之金屬管連通於冷卻液槽之上排氣口之部分放大剖面簡示圖。 FIG. 1 is a schematic cross-sectional view of an immersion cooling device according to an embodiment of the present invention. FIG. 2 is an enlarged schematic cross-sectional view of a portion of the metal pipe of FIG. 1 communicating with the exhaust port above the coolant tank.

10:浸入式冷卻設備 10: Immersion cooling equipment

11:發熱元件 11: heating element

12:冷卻液槽 12: Coolant tank

14:金屬管 14: Metal tube

16:上排氣口 16: Upper exhaust

18:冷卻液 18: Coolant

20:散熱裝置 20: Heat sink

Claims (5)

一浸入式冷卻設備,其包含: 一發熱元件; 一冷卻液槽,其具有多數個上排氣口,用來儲存一冷卻液以及容置該發熱元件,以使該發熱元件浸入該冷卻液中;以及 多數個金屬管,其分別連通於該些上排氣口,每一金屬管自該上排氣口往上延伸形成,以使該冷卻液於吸收該發熱元件之熱能時所產生之蒸氣經由該些上排氣口離開該冷卻液槽而進入該些金屬管中; 其中當該些金屬管將流入之蒸氣冷卻回液體時,冷卻後之液體沿著每一金屬管通過相對應之該上排氣口向下流回該冷卻液中。 An immersion cooling equipment, which contains: A heating element; A cooling liquid tank having a plurality of upper exhaust ports for storing a cooling liquid and accommodating the heating element so that the heating element is immersed in the cooling liquid; and A plurality of metal tubes are respectively connected to the upper exhaust ports, and each metal tube extends upward from the upper exhaust port, so that the vapor generated by the cooling liquid when absorbing the heat energy of the heating element passes through the The upper exhaust ports leave the coolant tank and enter the metal tubes; When the metal tubes cool the inflowing vapor back to the liquid, the cooled liquid flows down through the corresponding upper exhaust port back to the cooling liquid along each metal tube. 如請求項1所述之浸入式冷卻設備,其中每一該些金屬管自該上排氣口垂直往上延伸形成。The immersion cooling device according to claim 1, wherein each of the metal tubes extends vertically upward from the upper exhaust port. 如請求項1所述之浸入式冷卻設備,其另包含: 一散熱裝置,其設置於該些金屬管上,用來吸收流入該些金屬管內之蒸氣的熱能以將蒸氣冷卻回液體。 The immersion cooling equipment as described in claim 1, which additionally includes: A heat dissipation device is disposed on the metal tubes and used to absorb the heat energy of the vapor flowing into the metal tubes to cool the vapor back to the liquid. 如請求項3所述之浸入式冷卻設備,其中該散熱裝置為一散熱鰭片結構,該些金屬管穿設於該散熱鰭片結構中,使得該散熱鰭片結構吸收流入該些金屬管內之蒸氣的熱能以將蒸氣冷卻回液體。The immersion cooling device according to claim 3, wherein the heat dissipation device is a heat dissipation fin structure, and the metal tubes are penetrated in the heat dissipation fin structure, so that the heat dissipation fin structure absorbs and flows into the metal tubes The thermal energy of the vapor is used to cool the vapor back to the liquid. 如請求項1所述之浸入式冷卻設備,其另包含: 一毛細結構,其設置於該些金屬管內,用來引導冷卻後之液體沿著每一金屬管通過相對應之該上排氣口向下流回該冷卻液中。 The immersion cooling equipment as described in claim 1, which additionally includes: A capillary structure is disposed in the metal tubes and is used to guide the cooled liquid to flow down the cooling liquid through the corresponding upper exhaust port along each metal tube.
TW108132894A 2019-09-12 2019-09-12 Immersion cooling apparatus TWI696416B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797871B (en) * 2021-12-06 2023-04-01 艾姆勒科技股份有限公司 Two-phase immersion-type heat-dissipation substrate structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115568172A (en) * 2022-09-23 2023-01-03 东莞立讯技术有限公司 Immersed cabinet and heat dissipation system thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8619425B2 (en) * 2011-10-26 2013-12-31 International Business Machines Corporation Multi-fluid, two-phase immersion-cooling of electronic component(s)
US8739406B2 (en) * 2012-09-13 2014-06-03 International Business Machines Corporation Vapor condenser with three-dimensional folded structure
TWM514714U (en) * 2015-10-12 2015-12-21 Cooler Master Co Ltd Heat-dissipating system
TW201821938A (en) * 2016-12-01 2018-06-16 英業達股份有限公司 Radiator and server module
TW201905160A (en) * 2017-06-07 2019-02-01 美商3M新設資產公司 Fluid for immersion cooling

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8619425B2 (en) * 2011-10-26 2013-12-31 International Business Machines Corporation Multi-fluid, two-phase immersion-cooling of electronic component(s)
US8739406B2 (en) * 2012-09-13 2014-06-03 International Business Machines Corporation Vapor condenser with three-dimensional folded structure
TWM514714U (en) * 2015-10-12 2015-12-21 Cooler Master Co Ltd Heat-dissipating system
TW201821938A (en) * 2016-12-01 2018-06-16 英業達股份有限公司 Radiator and server module
TW201905160A (en) * 2017-06-07 2019-02-01 美商3M新設資產公司 Fluid for immersion cooling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797871B (en) * 2021-12-06 2023-04-01 艾姆勒科技股份有限公司 Two-phase immersion-type heat-dissipation substrate structure

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