CN110360860B - Method for processing brazing type soaking plate - Google Patents
Method for processing brazing type soaking plate Download PDFInfo
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- CN110360860B CN110360860B CN201910656707.0A CN201910656707A CN110360860B CN 110360860 B CN110360860 B CN 110360860B CN 201910656707 A CN201910656707 A CN 201910656707A CN 110360860 B CN110360860 B CN 110360860B
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- 238000005219 brazing Methods 0.000 title claims abstract description 34
- 238000002791 soaking Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 32
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 76
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000002131 composite material Substances 0.000 claims abstract description 52
- 239000011247 coating layer Substances 0.000 claims abstract description 30
- 239000000945 filler Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000003672 processing method Methods 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 57
- 238000002844 melting Methods 0.000 claims description 35
- 230000008018 melting Effects 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000004088 foaming agent Substances 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 5
- 229910000676 Si alloy Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000013618 particulate matter Substances 0.000 description 11
- 239000004411 aluminium Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000005253 cladding Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
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- 238000000576 coating method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000004140 cleaning Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/04—Arrangements for sealing elements into header boxes or end plates
- F28F9/16—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
- F28F9/18—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
Abstract
The invention relates to the technical field of vapor chamber manufacturing, and particularly discloses a processing method of a brazing type vapor chamber, which comprises the following steps: step S1: preparing materials, namely preparing two plate bodies and a filler, wherein at least one of the two plate bodies is an aluminum-based composite plate; step S2: attaching, namely attaching the two plate bodies; step S3: brazing; step S4: according to the processing method, at least one of the two prepared plate bodies is the aluminum-based composite plate, the aluminum-based composite plate comprises the base body and the coating layer, at least one of the two plate bodies is provided with the groove, and the soaking plate is formed by sealing after the two plate bodies are attached, brazed and filled with the working medium, so that the processing mode is more convenient and efficient, the material and processing cost is reduced, and meanwhile, the weight of the soaking plate is reduced.
Description
Technical Field
The invention relates to the technical field of vapor chamber manufacturing, in particular to a method for processing a brazing type vapor chamber.
Background
The soaking plate is a plate structure formed by compounding two metal substrates, and a hollow closed cavity is arranged between the two metal substrates. The closed cavity is in a negative pressure state, the phase change working medium is filled in the cavity, and a part of the cavity is also reserved. When the heat-dissipating device works, the heat source transfers heat to the soaking plate, the liquid working medium in the closed cavity is heated in a negative-pressure environment and then quickly evaporated into steam and quickly diffused to the whole closed cavity, the steam is condensed after being dissipated by the surface of the soaking plate or the heat-dissipating fins connected with the soaking plate, and the condensed liquid flows back to the bottom for circulation so as to achieve the uniform-temperature heat-dissipating effect.
The existing vapor chamber is generally formed by stamping and welding two copper substrates, the welding process is carried out along the joint of the two copper substrates, the processing is troublesome, the process is complex, and the defects of high material and processing cost and heavy weight of the manufactured vapor chamber exist.
Disclosure of Invention
The invention aims to solve the defects of troublesome processing, complex process, high material and processing cost and heavy weight of a copper soaking plate in the prior art, and provides a processing method of a brazing type soaking plate.
In order to achieve the purpose, the invention adopts the following technical scheme:
a processing method of a brazing type soaking plate comprises the following steps:
step S1: preparing materials, namely preparing two plate bodies, wherein one plate body is an aluminum plate, the other plate body is an aluminum-based composite plate, or the two plate bodies are both aluminum-based composite plates, each aluminum-based composite plate comprises a base body and a coating layer arranged on the surface of the base body, the melting point of the coating layer is lower than the melting points of the base body and the aluminum plate, and at least one of the two plate bodies is provided with a groove;
step S2: attaching, namely attaching the two plate bodies, wherein after the two plate bodies are attached, the coating layer of at least one aluminum-based composite plate is positioned on the attaching surface;
step S3: brazing, namely brazing the whole structure of the two laminated plate bodies after the aluminum-based composite plate with the groove is arranged below the other plate body, wherein the brazing temperature is higher than the melting point of the coating layer and lower than the melting point of the base body, so that the coating layer is melted, and the two plate bodies are fixed after the coating layer is cooled to form a plate-type structure with a closed cavity;
step S4: and filling working medium.
Preferably, in step S2, a filler is put into the groove so that the filler is interposed between the two plate bodies after the two plate bodies are bonded to each other.
Preferably, the filler comprises particles, a binder and/or a foaming agent, the particles having a melting point higher than the brazing temperature.
Preferably, the filler comprises first particles and second particles, the melting point of the first particles is higher than the brazing temperature, and the melting point of the second particles is lower than the brazing temperature.
Preferably, the particle size of the first particles is 25-100 meshes, and the particle size of the second particles is 100-200 meshes.
Preferably, the filler is particulate matter, and the melting point of the particulate matter is higher than the brazing temperature.
Preferably, in step S2, a metal mesh is first laid in the groove, and then the filler is disposed on the metal mesh, wherein the mesh aperture of the metal mesh is smaller than the particle size of the filler.
Preferably, a micro groove is disposed between the two plate bodies in step S1.
Preferably, the ratio of the thickness of the clad layer to the total thickness of the aluminum-based composite plate is 5-20%.
Preferably, one side of at least one of the two plate bodies, which is far away from the joint position, is provided with a heat conduction layer, and the heat conduction coefficient of the heat conduction layer is greater than that of the two plate bodies.
The invention has the beneficial effects that:
according to the processing method adopted by the invention, at least one of the two prepared plate bodies is the aluminum-based composite plate, the aluminum-based composite plate comprises the base body and the coating layer, at least one of the two plate bodies is provided with the groove, and the soaking plate is formed by sealing after the bonding, the brazing and the filling of the working medium, so that the processing mode is more convenient and efficient, the material and processing cost is reduced, and the weight of the soaking plate is reduced.
Drawings
FIG. 1 is a flow chart of a method for processing a brazed soaking plate according to the invention;
FIG. 2 is a schematic structural diagram of a vapor chamber produced by the method for processing a brazed vapor chamber according to the present invention;
fig. 3 is a schematic structural diagram of two plate bodies in the method provided in the first embodiment;
fig. 4 is a schematic structural diagram of two plate bodies in the method provided in the fourth embodiment;
fig. 5 is a schematic structural diagram of two plate bodies in the method provided in the fifth embodiment;
fig. 6 is a schematic structural diagram of two plate bodies in the method provided in the sixth embodiment;
fig. 7 is a schematic structural diagram of two plate bodies in the method provided in the seventh embodiment;
fig. 8 is a schematic structural diagram of two plate bodies in the method according to the eighth embodiment;
fig. 9 is a schematic structural diagram of two plate bodies in the method provided in the ninth embodiment.
In the figure: the heat-conducting plate comprises a plate body 1, an aluminum plate 11, an aluminum-based composite plate 12, a filler 2, a base body 3, a coating layer 4, grooves 5, a closed cavity 6, a capillary structure 7, a heat-conducting layer 8, microgrooves 9, a first groove 91, a second groove 92 and a metal mesh 10.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-9, a method for processing a brazed soaking plate includes the following steps:
referring to fig. 1-2, step S1: preparing materials, preparing two plate bodies 1, wherein one plate body 1 is an aluminum plate 11, and the other plate body 1 is an aluminum-based composite plate 12, or the two plate bodies 1 are the aluminum-based composite plate 12, the aluminum-based composite plate 12 comprises a base body 3 and a coating layer 4 arranged on the surface of the base body 3, wherein the melting point of the coating layer 4 is lower than the base body 3 and the melting point of the aluminum plate 11, and at least one of the two plate bodies 1 is provided with a groove 5.
It will be appreciated that the recess 5 may be formed by stamping.
In the aluminum-based composite plate 12, the ratio of the thickness of the clad layer 4 to the total thickness of the aluminum-based composite plate 12 (i.e., the cladding rate of the aluminum-based composite plate) is 5 to 20%. The substrate 3 is aluminum or aluminum alloy, wherein the aluminum alloy includes but is not limited to one or more of 3 series aluminum alloy, 6 series aluminum alloy and 7 series aluminum alloy, preferably 3003, 3A11, 6061, 6951 and 7072. The material of the coating layer 4 is aluminum-silicon alloy, preferably 4004, 4045, 4047 and 4343 in 4-series aluminum-silicon alloy.
Step S2: and (3) attaching, namely attaching the two plate bodies 1, and after the two plate bodies 1 are attached, positioning the coating layer of at least one aluminum-based composite plate 12 on the attaching surface.
Specifically, before the two plate bodies 1 are attached to each other, a filler 2 may be put into the groove 5, the melting point of the filler 2 is higher than that of the coating layer 4, and after the two plate bodies 1 are attached to each other, the filler 2 is located between the two plate bodies 1.
The filler 2 may be particles having a melting point higher than the brazing temperature. Alternatively, the filler 2 comprises particles having a melting point higher than the brazing temperature and a binder and/or a foaming agent. Alternatively, the filler 2 comprises first particles having a melting point higher than the brazing temperature and second particles having a melting point lower than the brazing temperature.
It will be appreciated that the two panels 1 are subjected to a cleaning process prior to the fitting of the two panels 1.
Step S3: brazing, after arranging the aluminum-based composite board with the groove 5 in the lower part of another board body, it is right the overall structure after two board bodies 1 are attached is brazed, the brazing temperature is higher than the melting point of the coating layer 4 is lower than the melting point of the base body 3, so that the coating layer 4 is melted, and after the coating layer 4 is cooled, the two board bodies 1 are fixed to form a plate type structure with a closed cavity 6.
Step S4: filling a working medium, welding a process connecting pipe with the plate-type structure, communicating the process connecting pipe with the closed cavity 6, vacuumizing the closed cavity 6 through the process connecting pipe, filling a phase-change working medium, and then sealing the process connecting pipe, wherein the sealing mode comprises but is not limited to extrusion sealing and welding sealing.
The soaking plate manufactured by the method can connect the heating source with one side of the plate body 1 with the groove 5 in the soaking plate. When the heat-dissipating device works, the heat source transfers heat to the soaking plate, the liquid working medium in the closed cavity 6 is heated in a negative-pressure environment and then quickly evaporated into steam and quickly diffused to the whole closed cavity 6, the steam is condensed after being dissipated by the surface of the other side of the soaking plate or the heat-dissipating fins connected with the soaking plate, and the condensed liquid flows back to the bottom for circulation so as to achieve the effect of uniform-temperature heat dissipation.
The first embodiment is as follows:
referring to fig. 3, in the embodiment, the two plate bodies 1 are an aluminum plate 11 and an aluminum-based composite plate 12, respectively, and the cladding layer 4 on the aluminum-based composite plate 12 is located on a side close to the aluminum plate 11. The filler 2 is a particulate matter, specifically copper powder and/or ceramic powder particles and/or hydrated aluminosilicate, the particle size of the particulate matter is 25-100 meshes, the melting point of the substrate 3 in the aluminum-based composite plate 12 is 630-660 ℃, the melting point of the coating layer 4 is 580-610 ℃, the melting point of the filler 2 in the embodiment is higher than 800 ℃, and the melting point of the coating layer 4 is about 50 ℃ lower than that of the substrate 3. After the aluminum-based composite board 12 is punched and the groove 5 is formed, the aluminum board 11 is placed above the aluminum-based composite board 12, the particles are put into the groove 5, and the aluminum board 11 and the aluminum-based composite board 12 are attached and assembled and then are sent into a furnace with the temperature of about 600 ℃ for heat preservation. The aluminium plate 11, the matrix 3 and the particles on the aluminium-based composite plate 12 do not melt at this temperature, whereas the clad layer 4 on the aluminium-based composite plate 12 does. On the one hand, under the capillary action, be located on aluminium base composite panel 12 with the coating 4 of the aluminium plate 11 laminating department inhale with be full of between the base member 3 on aluminium plate 11 and the aluminium base composite panel 12, form liquid form after coating 4 melts, can with after the 4 condensation of liquid coating aluminum plate 11 is fixed with aluminium base composite panel 12 to make between aluminium plate 11 and the aluminium base composite panel 12 correspond the position formation of recess 5 closed cavity 6. On the other hand, the coating layer 4 fixes the particles on the groove wall of the groove 5, the particles form a capillary structure 7, and the soaking plate is finally obtained.
Example two:
the present embodiment is different from the first embodiment in that the filler 2 further comprises a binder and/or a foaming agent, and the melting point of the particles is higher than the brazing temperature. Wherein the volume ratio of the adhesive and/or the foaming agent to the entire filler 2 is 5 to 20%. After brazing, the particles are matched with a binder and/or a foaming agent to form sintered particles attached to the inner surface of the closed cavity 6 more easily, and then the capillary structure 7 is formed.
Example three:
the present embodiment differs from the first embodiment in that the filler 2 comprises first particles having a melting point higher than the brazing temperature and second particles having a melting point lower than the brazing temperature. Specifically, the first particulate matter is copper powder, alumina, silica or a mixture thereof, the particle size of the first particulate matter is 25-100 meshes, and the melting point of the first particulate matter is higher than 800 ℃. The second particles are aluminum-silicon alloy particles, wherein the silicon content is 3-10%, the particle size of the second particles is 100-: 1-10: 1. in this embodiment, the second particulate matter with a small melting point is mixed with the first particulate matter with a large melting point, and after brazing, the second particulate matter is connected between the first particulate matter and the inner wall of the closed cavity to form a capillary structure. In particular, the capillary structure 7 formed in this embodiment has a larger surface porosity at the inner wall far from the sealed cavity 6, and a smaller bottom porosity at the inner wall near the sealed cavity 6, so that it has a better capillary liquid absorption capacity.
The existing copper soaking plate adopts a copper powder sintering process, and the porosity of a sintering layer is 30-50%; in the sintered layer in the embodiment, the porosity of the bottom layer is 20-40%, and the porosity of the surface layer is 30-70%, so that the capillary structure is more beneficial to the backflow of condensate.
Example four:
referring to fig. 4, the difference between the first embodiment and the second embodiment is that in step S2, a metal mesh 10 is first laid in the grooves 5, and then the particles are disposed on the metal mesh 10, wherein the mesh opening of the metal mesh 10 is smaller than the particle size of the particles. Specifically, the mesh aperture of the metal net 10 is 100-200 meshes, and the particle size of the filler 2 is 50-100 meshes. Since the mesh aperture of the metal mesh 10 is smaller than the particle size of the particles, the particles cover the upper and periphery of the metal mesh 10. The metal net 10 cannot be completely and tightly attached to the bottom of the groove 5, a certain gap is formed, particles above the metal net 10 form a capillary structure after sintering, and meanwhile, the particles fix the metal net 10 and the bottom of the groove 5 in the sintering process. Therefore, in this embodiment, the pores formed among the sintered particles, the meshes of the metal mesh 10, and the gaps between the metal mesh 10 and the bottom of the groove 5 together form the capillary structure 7, which is different from the existing sintered capillary structure layer, and the capillary structure has both the sintered layer and the gap layer, thereby being more beneficial to the backflow of the condensate.
Example five:
referring to fig. 5, the present embodiment is different from the first embodiment in that the step of putting the filler 2 into the groove 5 in step S3 is omitted, the micro groove 9 is disposed between the two plate bodies 1 in step S1, and the capillary structure 7 is formed after the two plate bodies 1 are attached to each other by the micro groove 9. Specifically, the micro-groove 9 is disposed on one side of the two plate bodies 1, which is capable of being attached to the other plate body 1. The micro-groove 9 comprises a first groove 91 provided on one of the plate bodies and/or a second groove 92 provided on the other plate body. The depth of the micro-groove 9 is 0.2-2.0 mm, and the width is 0.2-2.0 mm. The length direction of the first groove 91 and the length direction of the second groove 92 form an included angle, and the included angle ranges from 30 degrees to 90 degrees. The first grooves 91 and the second grooves 92 can form a net structure together, so that the first grooves 91 and the second grooves 92 can generate capillary action when the soaking plate works.
Example six:
referring to fig. 6, the difference between the first embodiment and the second embodiment is that in the present embodiment, both the two plate bodies 1 are aluminum-based composite plates 12, and at this time, the cladding layers 4 on the two aluminum-based composite plates 12 are disposed oppositely. When the aluminum base composite board is sent into the heating furnace, the two coating layers are attached and cooled after being heated, and the base plates 3 on the two aluminum base composite boards 12 are fixed together under the combined action of the coating layers 4 on the two sides.
It is understood that the outward arrangement of the cladding layer in the present embodiment is also applicable
The second embodiment to the fifth embodiment are not described in detail herein.
Example seven:
referring to fig. 7, the difference between the present embodiment and the first embodiment is that in the present embodiment, the aluminum plate 11 and the aluminum-based composite plate 12 are both provided with the grooves 5. After the aluminum plate 11 and the aluminum-based composite plate 12 are fixed under the action of the coating layer 4, the two grooves 5 jointly form a closed cavity 6
It can be understood that the manner in which the cladding layer is disposed outward in this embodiment is also applicable to the second embodiment to the sixth embodiment, and details are not described here.
Example eight:
referring to fig. 8, the difference between the third embodiment and the second embodiment is that in the present embodiment, the clad layer 4 of the aluminum-based composite plate 12 provided with the groove 5 is disposed opposite to the substrate 3 of another aluminum-based composite plate 12, so that the clad layer 4 on the aluminum-based composite plate 12 not provided with the groove 5 is disposed outward, and the clad layer 4 disposed outward is used for connecting with other heat dissipation components (e.g., fins). Specifically, in the process of cooling after heating, the heat dissipation part can be fixed on the substrate 3 by the coating layer 4 arranged outwards, and the operation is simple and convenient.
It can be understood that the manner in which the cladding layer is disposed outward in this embodiment is also applicable to the second to seventh embodiments, and details are not repeated here.
Example nine:
referring to fig. 9, the difference between the first embodiment and the second embodiment is that a heat conduction layer 8 is disposed on one side of at least one of the two plate bodies 1 away from the joint, that is, the heat conduction layer 8 is disposed on one side of the aluminum plate 11 and/or the aluminum-based composite plate 12 away from the joint. Specifically, the side of the aluminum-based composite plate 12 away from the aluminum plate 11 in the present embodiment is provided with the heat conduction layer 8. It can be understood that the thickness of the aluminum plate 11 or the aluminum-based composite plate 12 is only 0.5-2 mm, and the length of the plane of the aluminum plate 11 or the aluminum-based composite plate 12 usually reaches tens to hundreds of mm, so the thermal resistance of the aluminum plate 11 or the aluminum-based composite plate 12 in the height direction is much smaller than that in the plane direction. The heat conduction layer 8 is pasted with the heating source or the heat dissipation source, so that the heat conduction layer 8 is adopted in the plane direction between the manufactured soaking plate and the heating source or the heat dissipation source, the heat conduction coefficient is higher, the thickness of the manufactured soaking plate is very small, the influence on the heat transfer efficiency and the heat dissipation performance can be ignored, and the heat transfer efficiency and the heat dissipation performance of the soaking plate are further improved.
It should be noted that the heat conducting layer in this embodiment may be replaced by one or more materials with a higher thermal conductivity than that of the plate body 1, such as copper, silver, and graphene.
It is understood that this embodiment is also applicable to the second embodiment to the eighth embodiment, and the description thereof is omitted here.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The processing method of the brazing type soaking plate is characterized by comprising the following steps of:
step S1: preparing materials, namely preparing two plate bodies, wherein one plate body is an aluminum plate, the other plate body is an aluminum-based composite plate, or the two plate bodies are both aluminum-based composite plates, each aluminum-based composite plate comprises a base body and a coating layer arranged on the surface of the base body, the melting point of the coating layer is lower than the melting points of the base body and the aluminum plate, and at least one of the two plate bodies is provided with a groove;
step S2: attaching, namely putting a filler into the groove, attaching the two plate bodies, wherein after the two plate bodies are attached, the coating layer of at least one aluminum-based composite plate is positioned on the attaching surface, and the filler is positioned between the two plate bodies; wherein the filler comprises first particles and second particles, the first particles are copper powder, alumina, silicon dioxide or a mixture thereof, the second particles are aluminum-silicon alloy particles, and the volume ratio of the first particles to the second particles is 3: 1-10: 1, the melting point of the first particles is higher than the brazing temperature, the melting point of the second particles is lower than the brazing temperature, and the particle size of the second particles is smaller than that of the first particles;
step S3: brazing, namely brazing the whole structure of the two laminated plate bodies after the aluminum-based composite plate with the groove is arranged below the other plate body, wherein the brazing temperature is higher than the melting point of the coating layer and lower than the melting point of the base body, so that the coating layer is melted, and the two plate bodies are fixed after the coating layer is cooled to form a plate-type structure with a closed cavity;
step S4: and filling working medium.
2. The method of processing a brazed heat spreader plate of claim 1, wherein the filler further comprises particles, a binder and/or a foaming agent, the particles having a melting point higher than the brazing temperature.
3. The method for processing a brazed soaking plate as claimed in claim 1, wherein the grain size of the first particles is 25-100 meshes, and the grain size of the second particles is 100-200 meshes.
4. The method of claim 1 wherein the filler is particulate and the melting point of the particulate is higher than the brazing temperature.
5. The method for processing a brazed soaking plate according to claim 4, wherein in step S2, a metal mesh is laid in the grooves, and then the filler is arranged on the metal mesh, wherein the mesh aperture of the metal mesh is smaller than the grain size of the filler.
6. The method for processing a brazed soaking plate according to claim 1, wherein micro grooves are formed between the two plate bodies in the step S1.
7. The method of claim 1, wherein the ratio of the thickness of the clad layer to the total thickness of the aluminum-based composite plate is 5-20%.
8. The method of claim 1, wherein a heat conducting layer is disposed on at least one of the two plates away from the joint, and the heat conducting layer has a thermal conductivity greater than that of the two plates.
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