CN208570582U - A kind of metal material radiator - Google Patents
A kind of metal material radiator Download PDFInfo
- Publication number
- CN208570582U CN208570582U CN201820691126.1U CN201820691126U CN208570582U CN 208570582 U CN208570582 U CN 208570582U CN 201820691126 U CN201820691126 U CN 201820691126U CN 208570582 U CN208570582 U CN 208570582U
- Authority
- CN
- China
- Prior art keywords
- metal material
- heat dissipation
- spine
- dissipation channel
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007769 metal material Substances 0.000 title claims abstract description 74
- 230000017525 heat dissipation Effects 0.000 claims abstract description 62
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 239000003507 refrigerant Substances 0.000 claims abstract description 13
- 230000001788 irregular Effects 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 210000000988 bone and bone Anatomy 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 235000013399 edible fruits Nutrition 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Abstract
Description
Claims (7)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820691126.1U CN208570582U (en) | 2018-05-10 | 2018-05-10 | A kind of metal material radiator |
JP2018002386U JP3217881U (en) | 2018-05-10 | 2018-06-25 | Metal heat dissipation device |
DE202018103701.3U DE202018103701U1 (en) | 2018-05-10 | 2018-06-28 | Metallic cooling device |
TW107209468U TWM569079U (en) | 2018-05-10 | 2018-07-13 | Heat dissipation device made of metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820691126.1U CN208570582U (en) | 2018-05-10 | 2018-05-10 | A kind of metal material radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208570582U true CN208570582U (en) | 2019-03-01 |
Family
ID=63444137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820691126.1U Active CN208570582U (en) | 2018-05-10 | 2018-05-10 | A kind of metal material radiator |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3217881U (en) |
CN (1) | CN208570582U (en) |
DE (1) | DE202018103701U1 (en) |
TW (1) | TWM569079U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113494863A (en) * | 2020-04-03 | 2021-10-12 | 得意精密电子(苏州)有限公司 | Temperature-equalizing plate and manufacturing method thereof |
-
2018
- 2018-05-10 CN CN201820691126.1U patent/CN208570582U/en active Active
- 2018-06-25 JP JP2018002386U patent/JP3217881U/en active Active
- 2018-06-28 DE DE202018103701.3U patent/DE202018103701U1/en active Active
- 2018-07-13 TW TW107209468U patent/TWM569079U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113494863A (en) * | 2020-04-03 | 2021-10-12 | 得意精密电子(苏州)有限公司 | Temperature-equalizing plate and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWM569079U (en) | 2018-10-21 |
DE202018103701U1 (en) | 2018-11-16 |
JP3217881U (en) | 2018-09-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210726 Address after: 523170 Room 302, No. 3, Qixiang, nanzha Wenming Road, Humen Town, Dongguan City, Guangdong Province Patentee after: DONGGUAN TONGXUN METAL SCIENCE & TECHNOLOGY Co.,Ltd. Address before: Chinese Taiwan New Taipei City Patentee before: Lin Jindong Patentee before: Yang Aolong Patentee before: Chang Hong |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231028 Address after: Room 301, No. 3, Qixiang, Nanzha Wenming Road, Humen Town, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan Baili Electronic Technology Co.,Ltd. Address before: 523170 Room 302, No. 3, Qixiang, nanzha Wenming Road, Humen Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN TONGXUN METAL SCIENCE & TECHNOLOGY Co.,Ltd. |