CN110854089A

CN110854089A - Radiating tube with core for mobile phone chip

Info

Publication number: CN110854089A
Application number: CN201911144379.2A
Authority: CN
Inventors: 张俊霞; 王泽华
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-11-20
Filing date: 2019-11-20
Publication date: 2020-02-28

Abstract

The invention discloses a radiating tube with a core for a mobile phone chip, belonging to the technical field of heat exchange enhancement in the energy and power engineering discipline. The device has the advantages of small volume, low cost, energy conservation, environmental protection, simple structure and good heat dissipation effect.

Description

Radiating tube with core for mobile phone chip

Technical Field

The invention belongs to the technical field of heat exchange enhancement in the discipline of energy and power engineering, and relates to a radiating tube with a core for a mobile phone chip.

Background

Currently, mobile communication devices, such as mobile phones, have become one of the necessary living goods, and along with the popularization of smart phones, the mobile communication devices have the advantages of high transmission rate, multiple smart device connections, improved network connection, prolonged service life of mobile phone batteries, and the like. The existing mobile phone mainly comprises a CPU processor, a memory, input and output equipment and the like, wherein the heat dissipation of a chip is completed by sticking a copper plate on the back of the CPU processor chip, and along with the improvement of the performance of the mobile phone, the heat dissipation capacity is increased, and the simple copper plate sticking can not meet the heat dissipation requirement of the CPU processor chip. Therefore, it is necessary to provide a scheme capable of effectively improving the heat dissipation of the mobile phone chip.

Disclosure of Invention

In order to overcome the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a heat dissipating tube with a core for a mobile phone chip, so as to solve the problem of overheating of the mobile phone chip caused by the inability of the conventional heat dissipating device for a mobile phone to transfer a large amount of heat released by the chip.

In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:

the invention discloses a radiating pipe with a core for a mobile phone chip, which comprises a gasification condensing part and a reflux part, wherein the gasification condensing part is arranged on the gasification condensing part;

the gasification condensation part comprises a heat absorption pipe, a condensate header and a gas header connected with the heat absorption pipe, the bottom of the condensate header is connected with a heat release pipe, the gas header is connected with the condensate header by a transmission pipe, the heat absorption pipe is in mutual contact with the mobile phone chip, and the inside of the heat absorption pipe is filled with a refrigeration working medium;

the backflow part comprises capillary bridges arranged in the gas header and the condensate header and capillary cores arranged in the heat absorption pipe, the heat release pipe and the transmission pipe, the capillary bridges in the gas header connect the capillary cores in the heat absorption pipe and the transmission pipe together, and the capillary bridges in the condensate header connect the capillary cores in the transmission pipe and the heat release pipe together.

Preferably, the filling rate of the refrigerant in the heat absorption pipe is 3/4, and the refrigerant is R22 refrigerant with 5-6 atmospheric pressures.

Preferably, the number of the capillary cores and the number of the capillary bridges are equal and a plurality of capillary cores and capillary bridges are arranged.

Preferably, the pipe diameters of the heat absorbing pipes and the heat releasing pipes are 5-6mm, a plurality of heat releasing pipes are arranged, and the number of the heat releasing pipes is larger than that of the heat absorbing pipes.

Preferably, a plurality of heat dissipation pipelines are arranged in the gas header and the condensate header, and the diameters of the pipelines are 6-8 mm.

Preferably, the capillary core is prepared by any one of double-layer copper, aluminum and magnesium alloy wire screens, the mesh light transmission size is 0.14mm multiplied by 0.14mm, the wire screen diameter is 0.06mm, the wire screen thickness is 0.12mm, and the capillary core porosity is 0.7.

Preferably, the heat absorption pipe, the gas header, the transmission pipe and the condensate header are all formed by etching and laser welding any one of copper, aluminum alloy and magnesium alloy.

Preferably, the pipe diameter of the transfer pipe is 20 mm.

Compared with the prior art, the invention has the following beneficial effects:

the invention relates to a radiating tube with a core for a mobile phone chip, which comprises a circulating loop consisting of a heat absorbing tube, a gas header, a transmission tube, a liquid header, a heat releasing tube, a capillary core and a capillary bridge inside the heat absorbing tube, wherein a refrigerating working medium is filled in the loop, the heat absorbing tube is in mutual contact with the mobile phone chip, the refrigerating working medium is converted into steam after the heat absorbing tube absorbs heat, the steam enters the heat releasing tube along the gas header, the transmission tube and the liquid header, the steam returns to the heat absorbing tube along a liquid absorbing core and a liquid absorbing bridge inside the tube after being condensed into liquid in the heat releasing tube, and then the heat releasing process is completed in a circulating reciprocating manner, so that the transmission and the. The plurality of capillary cores and the capillary bridges are arranged in the device, so that the gasification and condensation of the refrigeration working medium can be accelerated, the heat dissipation rate of the mobile phone chip can be improved, and the problem that the mobile phone chip releases a large amount of heat to cause overheating of the mobile phone is avoided. The device has the advantages of small volume, low cost, energy conservation, environmental protection, simple structure and good heat dissipation effect.

Furthermore, the device is made of etched copper, aluminum, magnesium alloy and other metals with good heat dissipation performance, so that the refrigeration working medium can be fully contacted with the metal wall surface with fast heat dissipation to be quickly condensed, and the heat dissipation rate is improved.

Furthermore, by arranging a plurality of heat dissipation loops, the transmission rate of the refrigeration working medium in the pipeline can be effectively increased, and the heat dissipation efficiency of the mobile phone chip can be further improved.

Furthermore, the capillary core is prepared by using the double-layer wire mesh with good heat dissipation performance, the porosity is high, the reflux rate of the refrigeration working medium can be increased, and the circulation rate of the heat dissipation process is accelerated.

Drawings

FIG. 1 is a schematic structural view of the present invention;

wherein: 1, a heat absorption tube; 2, a gas header; 3, conveying the pipe; 4, a condensate header; 5, heat releasing the tube; 6 capillary bridge.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The invention is described in further detail below with reference to the accompanying drawings:

the radiating tube with the core for the mobile phone chip is shown in figure 1, 4 heat absorbing tubes 1 are jointly installed on a gas header 2, the gas header 2 and a condensate header 4 are connected with each other through a

transmission tube

3, 6 heat releasing tubes 5 are installed below the condensate header 4, capillary bridges 6 are arranged in the gas header 2 and the condensate header 4, capillary cores are arranged inside the heat absorbing tubes 1, the heat releasing tubes 5 and the transmission tube 3, the capillary cores in the heat absorbing tubes 1 and the transmission tube 3 are connected with each other through the capillary bridges 6 in the gas header 2, the capillary cores in the transmission tubes 1 and the transmission tube 3 are connected with each other through the capillary bridges 6 in the condensate header 4, the transmission tube 3 and the capillary cores in the heat releasing tubes 5 are connected with each other, and the capillary cores and the capillary bridges 6 in the device form a loop which flows back to the heating tube 1 from the heat releasing tubes 5.

The invention relates to a heat pipe with a core for radiating a mobile phone chip, which is used before the use: the heat absorption tube 1 is placed on a mobile phone chip, and the refrigerant working medium filled with R22 is converted into refrigerant steam after absorbing heat and is gathered in the gas header 2. As a result of the continuous generation of refrigerant vapor in the heat absorption tubes 1, this vapor flows along the transfer tube 3 from the gas header 2 into the condensate header 4 and into the 6 heat release tubes 5. The R22 refrigerant working medium loses heat in the heat release pipe 5 and then turns into condensed liquid, the condensed liquid enters the capillary core in the heat release pipe 5, is sucked into the condensate header 4, is sent into the capillary core of the transmission pipe 3 by the capillary bridge 6 therein, is further sent into the gas header 2, is sent into the capillary core in the heat absorption pipe 1 by the capillary bridge 6 therein, and is absorbed by the capillary core.

The pipe diameters of the heat absorption pipe 1 and the heat release pipe 5 are 5-6 mm.

The whole device can be completed by etching and laser welding materials such as copper, aluminum alloy, magnesium alloy and the like.

The absorbent capillary wick in the absorber tubing 1, the emitter tubing 5, the transfer tubing 3, and the capillary bridges 6 in the gas header 2 and the condensate header 4 can be etched.

The capillary wick can adopt a double-layer copper, aluminum and magnesium alloy wire mesh, the light transmission size of the mesh is 0.14mm multiplied by 0.14mm, the diameter of the wire mesh is 0.06mm, the thickness of the wire mesh is 0.12mm, and the porosity of the wick is 0.7.

The liquid filling rate in the heat absorption pipe 1 is 3/4, and the working medium is R22 refrigerant working medium with 5-6 atmospheric pressures.

The diameter of the conveying pipe is about 20 mm.

Capillary bridges 6 in the gas header 2 interconnect the capillary wicks in the absorber tubing 1 and the transfer tubing 3.

Capillary bridges 6 in the condensate header 4 interconnect the capillary wicks in the transfer tube 3 and the discharge tube 5.

The pipe diameters in the gas header 2 and the condensate header 4 are 6-8 mm.

The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.

Claims

1. The utility model provides a take core cooling tube for cell-phone chip which characterized in that: comprises a gasification condensing part and a reflux part;

the gasification condensation part comprises a heat absorption pipe (1), a condensate header (4) and a gas header (2) connected with the heat absorption pipe (1), the bottom of the condensate header (4) is connected with a heat release pipe (5), the gas header (2) is connected with the condensate header (4) through a transmission pipe (3), the heat absorption pipe (1) is in contact with a mobile phone chip, and a refrigeration working medium is filled in the heat absorption pipe (1);

the backflow part comprises capillary bridges (6) arranged inside the gas header (2) and the condensate header (4) and capillary cores arranged inside the heat absorption pipe (1), the heat release pipe (5) and the transmission pipe (3), the capillary bridges (6) in the gas header (2) connect the capillary cores in the heat absorption pipe (1) and the transmission pipe (3) together, and the capillary bridges (6) in the condensate header (4) connect the capillary cores in the transmission pipe (3) and the heat release pipe (5) together.

2. The tube of claim 1, wherein the tube comprises: the filling rate of the refrigeration working medium in the heat absorption pipe (1) is 3/4, and the refrigeration working medium is R22 refrigeration working medium with 5-6 atmospheric pressures.

3. The tube of claim 1, wherein the tube comprises: the number of the capillary cores and the number of the capillary bridges (6) are equal and a plurality of capillary cores and capillary bridges are arranged.

4. The tube of claim 1, wherein the tube comprises: the pipe diameters of the heat absorption pipes (1) and the heat release pipes (5) are 5-6mm, a plurality of heat release pipes are arranged, and the number of the heat release pipes (5) is larger than that of the heat absorption pipes.

5. The tube of claim 1, wherein the tube comprises: a plurality of heat dissipation pipelines are arranged in the gas header (2) and the condensate header (4), and the diameters of the pipelines are 6-8 mm.

6. The tube of claim 1, wherein the tube comprises: the capillary core is prepared from any one of double-layer copper, aluminum and magnesium alloy wire nets, the light transmission size of meshes is 0.14mm multiplied by 0.14mm, the diameter of the wire net is 0.06mm, the thickness of the wire net is 0.12mm, and the porosity of the capillary core is 0.7.

7. The tube of claim 1, wherein the tube comprises: the heat absorption pipe (1), the gas header (2), the transmission pipe (3) and the condensate header (4) are all formed by etching and laser welding any one of copper, aluminum alloy and magnesium alloy.

8. The tube of claim 1, wherein the tube comprises: the pipe diameter of the conveying pipe (3) is 20 mm.