CN104329848B - Semiconductor freezer - Google Patents
Semiconductor freezer Download PDFInfo
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- CN104329848B CN104329848B CN201410123662.8A CN201410123662A CN104329848B CN 104329848 B CN104329848 B CN 104329848B CN 201410123662 A CN201410123662 A CN 201410123662A CN 104329848 B CN104329848 B CN 104329848B
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- recess
- air
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 94
- 238000001816 cooling Methods 0.000 claims abstract description 45
- 238000010276 construction Methods 0.000 claims abstract description 21
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 62
- 230000008030 elimination Effects 0.000 claims description 10
- 238000003379 elimination reaction Methods 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 claims 1
- 230000004087 circulation Effects 0.000 abstract description 4
- 241000521257 Hydrops Species 0.000 description 17
- 206010030113 Oedema Diseases 0.000 description 17
- 230000005494 condensation Effects 0.000 description 11
- 238000009833 condensation Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000005057 refrigeration Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010016807 Fluid retention Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/003—General constructional features for cooling refrigerating machinery
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a kind of semiconductor freezer.The semiconductor freezer includes：Inner bag, defines storing compartment, is provided with construction opening in the middle part of the rear wall of inner bag in which；Air duct cover board, is arranged on the inside of the rear wall of inner bag, and air channel is formed with and the rear wall of inner bag between, and air duct cover board offers return air inlet with the correspondence position of construction opening, and the upper and lower of air duct cover board is respectively arranged with air outlet；Semiconductor cooling device, one part pass through construction opening, are inserted in air channel, and the cold scattering blower fan that semiconductor cooling device is carried is arranged at the rear of return air inlet, by the air-flow suction air channel in storing compartment.The semiconductor freezer of the present invention arranges air duct cover board and forms air channel with inner container of icebox rear wall, and using cold scattering blower fan, upper and lower two air circulations of interior formation between storing make storing compartment internal temperature balanced, and heat exchange efficiency is high.
Description
Technical field
The present invention relates to refrigeration plant, more particularly to a kind of semiconductor freezer.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.Which utilizes semiconductor chilling plate by the double-deck heat of highly effective ring
Pipe radiates and conduction technique and automatic pressure-transforming Variable flow control technology realization refrigeration, without the need for refrigeration working medium and mechanical moving element, solution
Determine the application problem of the traditional mechanical refrigerator such as medium pollution and mechanical vibration.
However, semiconductor freezer is needed effectively by the temperature conduction of semiconductor chilling plate cold end between refrigerator storing
Interior, prior art typically using fin as low-temperature receiver, fin by with semiconductor chilling plate cold end directly contact, and with
Storing compartment carries out heat exchange, and the heat conduction heat exchange efficiency of this refrigeration structure is low, is unfavorable for the performance of quasiconductor optimum performance, and
And radiating fin volume is larger, the temperature distributing disproportionation for taking chamber interior between refrigerator space, and storing is even, near fin
Temperature is low, apart from fin, position temperature is high farther out, affects the normal use of semiconductor freezer.
The content of the invention
It is an object of the present invention to providing, a kind of heat exchange efficiency is high, freeze uniform semiconductor freezer.
The present invention one further objective is that semiconductor freezer to be caused take up room it is little, production and assembly technology
Simply.
The present invention another further objective is that the problem of condensation on the inwall solved by semiconductor freezer inner bag.
Especially, the invention provides a kind of semiconductor freezer.The semiconductor freezer includes：Inner bag, in which
Storing compartment is defined, in the middle part of the rear wall of inner bag, construction opening is provided with；Air duct cover board, is arranged on the inside of the rear wall of inner bag, and
Air channel is formed with and the rear wall of inner bag between, air duct cover board offers return air inlet, air duct cover board with the correspondence position of construction opening
Upper and lower be respectively arranged with air outlet；Semiconductor cooling device, one part pass through construction opening, are inserted into air channel
In, the cold scattering blower fan that semiconductor cooling device is carried is arranged at the rear of return air inlet, by the air-flow suction wind in storing compartment
Road.
Alternatively, the rear wall of inner bag includes：Recess, is arranged at rear wall central authorities；Water guide structure part, is adjacent to recessed
Beneath portions；Periphery, is looped around recess and water guide structure portion and in same perpendicular；Recess
Split-phase is recessed backward for the perpendicular residing for periphery, and construction opening is arranged at the middle part of recess；Air channel
Cover plate is covered on recess and water guide structure part, to form air channel with recess.
Alternatively, the width and length of recess is respectively greater than water guide structure part, and recess is horizontal at which
The side surface that both sides are connected with periphery is inclined turning sphering joint face；Water guide structure part includes：Dash boss, it is adjacent
The recessed surfaces outwardly convex that is connected to below recess, relative to recess but still in vertically flat residing for periphery
Face rear；At least one vertical guiding gutter, it is top surface from dash boss, backward recessed relative to the protrusion surface of dash boss
Extend straight down；V-type water leg below guiding gutter and the outlet at V-type water leg minimum point, V-type catchment
Groove is arranged to for the water from V-type water leg and/or guiding gutter to be guided to outlet, to be discharged to outside inner bag.
Alternatively, the upper top surface that recess is connected with periphery is the scalariform face with knuckle, and scalariform face includes：It is parallel
Face, parallel surface are connected with periphery, and parallel surface is parallel with the recessed surfaces of recess and the surface of peripherally located part
And recessed surfaces between；And inclined plane, inclined plane and recessed surfaces are inclined and are connected；And knuckle, knuckle is inwardly projecting and is more than 90
Degree.
Alternatively, the upper fixing hole for installing air duct cover board is provided with parallel surface；Installation air channel is provided with dash boss
The lower fixed hole of cover plate, lower fixed hole are located at the lower section of the dash boss between two guiding gutters, and the vertical of lower fixed hole is put down
Face is located between dash surface and the bottom land plane of guiding gutter；It is longitudinally spaced on side surface to be provided with for engaging quasiconductor system
The draw-in groove of the air duct cover board of cold refrigerator.
Alternatively, the corresponding position of the opening of air duct cover board and rear wall be provided with it is being adapted with cold scattering blower fan shape,
And towards the projection of chamber interior between storing, to form the space for accommodating cold scattering blower fan；Return air inlet is multiple, is distributed in the table of projection
Face.
Alternatively, along raised center radial distribution, wherein each return air inlet is huge circle to return air inlet, its prolongation
Line forms concentric circular of the multi-turn with raised center as the center of circle.
Alternatively, semiconductor cooling device includes：Semiconductor chilling plate, is arranged at the outside of the rear wall of inner bag, its cold end
As the low-temperature receiver of semiconductor freezer；Cold scattering fin assembly, which includes：Conduction cooling plate, is arranged at opposite in the one of air duct cover board
Side, the cold end thermally coupled with semiconductor chilling plate；Many cold scattering heat pipes, every cold scattering heat pipe it is hot linked with conduction cooling plate from which
First section forward fold extends to the second relative section parallel with conduction cooling plate；Cold scattering fin, is arranged at many cold scattering heat pipes
The second section on, and its opposite to each other in the side of air duct cover board in conduction cooling plate contact；Cold scattering fin is installed to be through installation to be opened
Mouth is stretched in air channel.
Alternatively, cold scattering fin is provided with the draw-in groove with hook formation relative to the side of air duct cover board；Cold scattering blower fan
Both sides are provided with anchorage bar, and anchorage bar is installed in draw-in groove, and cold scattering blower fan is fixed on cold scattering fin, will be between storing
The air-flow sucked in room, after blowing to cold scattering fin, is discharged through cold scattering fin and along air channel by air outlet.
Alternatively, semiconductor freezer also includes：Heat insulation layer, is arranged between conduction cooling plate and semiconductor chilling plate；Pass
Cold piece, it is embedded in inside heat insulation layer；Conduction cooling plate is opposite to each other in the side of air duct cover board by cold transfer block and the cold end of semiconductor chilling plate
Thermally coupled.
Alternatively, semiconductor freezer also includes：Also include：Heat elimination assembly, is connected with the hot junction heat of semiconductor chilling plate
Connect, for hot-side heat dissipation, heat elimination assembly includes：Heat-conducting plate, itself and hot junction thermally coupled；Many radiating heat pipes, radiate heat per root
The bottom of pipe and heat-conducting plate contact heat-exchanging；Radiating fin, is arranged at many radiating heat pipe tops；And cooling fan, by fastening
Mechanism is fixed on radiating fin opposite to each other in the side of air duct cover board, for producing radiating airflow.
The present invention semiconductor freezer taken into full account semiconductor cooling device refrigerating capacity and refrigerating efficiency and
The profile feature of semiconductor cooling device, forms air channel with inner container of icebox rear wall by arranging air duct cover board, using cold scattering blower fan
Produce in air channel from storing compartment enter, carry out, after heat exchange, storage being returned respectively from upper and lower through after refrigerating plant
Thing compartment, upper and lower two air circulations of interior formation between storing make storing compartment internal temperature balanced, and heat exchange efficiency is high.
Further, the rear wall of inner container of icebox has recess, as the space for forming air channel, takes storing compartment empty
Between it is little.
Further, it is of the invention by corresponding air duct cover board fixed structure is arranged on rear wall, by installing air channel
Cover plate is covering refrigerating plant and the water guide structure part of condensation, it is to avoid itself and refrigerator inside directly contact, it is therefore prevented that in refrigerator
The debris adhesion in portion, it is ensured that drainage effect.
According to the detailed description below in conjunction with accompanying drawing to the specific embodiment of the invention, those skilled in the art will be brighter
The above-mentioned and other purposes of the present invention, advantages and features.
Description of the drawings
Describe some specific embodiments of the present invention hereinafter with reference to the accompanying drawings by way of example, and not by way of limitation in detail.
In accompanying drawing, identical reference denotes same or similar part or part.It should be appreciated by those skilled in the art that these
What accompanying drawing was not necessarily drawn to scale.In accompanying drawing：
Fig. 1 is the front schematic view of semiconductor freezer according to an embodiment of the invention；
Fig. 2 is the schematic cross sectional views that the cutting line E-E in Fig. 1 is intercepted；
Fig. 3 is the rear wall perspective schematic view according to the inner bag of semiconductor freezer in one embodiment of the invention；
Fig. 4 is the schematic cross sectional views that the cutting line A-A in Fig. 3 is intercepted；
Fig. 5 is the schematic cross sectional views that the cutting line B-B in Fig. 3 is intercepted；
Fig. 6 is the scalariform face section view partial enlarged drawing of recess and periphery junction in Fig. 4；
Fig. 7 is the section view enlarged diagram of water guide structure part in Fig. 4；
Fig. 8 is the exploded perspective view of semiconductor freezer according to an embodiment of the invention；
Fig. 9 is the cold scattering fin assembly exploded perspective view of semiconductor freezer according to an embodiment of the invention；With
And
Figure 10 is the heat elimination assembly exploded perspective view of semiconductor freezer according to an embodiment of the invention.
Specific embodiment
Fig. 1 is the front schematic view of semiconductor freezer according to an embodiment of the invention, and Fig. 2 is along Fig. 1
The schematic cross sectional views that cutting line E-E is intercepted, as illustrated, the semiconductor freezer may include in general manner：Inner bag 100,
Air duct cover board 300, semiconductor cooling device 400, cold scattering blower fan 410, wherein, inner bag 100 defines storing compartment, inner bag in which
Construction opening is provided with the middle part of 100 rear wall；Air duct cover board 300 is arranged on the inside of the rear wall of inner bag 100, and with inner bag 100
Air channel 500 is formed between rear wall, air duct cover board 300 offers return air inlet 310, air duct cover board with the correspondence position of construction opening
300 upper and lower is respectively arranged with air outlet 320；A part for semiconductor cooling device 400 passes through construction opening, stretches into
In air channel 500, the cold scattering blower fan 410 that semiconductor cooling device 400 is carried is arranged at the rear of return air inlet 420, by storing
Air-flow suction air channel 500 in compartment.Wherein, forward and backward, the upper and lower position relation in the present embodiment can be relative to refrigerator
Normal condition for, wherein before be direction near refrigerator open, after be near the direction of refrigerator back.
Semiconductor cooling device 400 is using semiconductor chilling plate as low-temperature receiver, and semiconductor chilling plate cold junction temperature is transmitted
To in storing compartment, forced convertion is carried out due to taking cold scattering blower fan 410, effectively increase heat exchange efficiency, while cold scattering wind
The air-flow that machine 410 is produced is guided by air channel 500, is internally formed multiple circulations in storing compartment, can effectively balanced storage
Between thing, the temperature of indoor each position, improves the refrigeration of refrigerator.
In order that air channel 500 is not take up the space of storing compartment, the semiconductor freezer of the present embodiment employs uniqueness
Inner-tube structure, both saved space, and solved the problems, such as that condensed water was gathered.
Fig. 3 is the rear wall perspective schematic view according to the inner bag of semiconductor freezer in one embodiment of the invention.Its
In, it is in the central recess 200 of rear wall, the water guide structure being adjacent to below recess by 100 points of the rear wall of inner bag
Part 240 and it is looped around around recess 200 and water guide structure part 240 and the outer part in same perpendicular
Divide 250.Wherein recess 200 is recessed backward relative to the perpendicular residing for periphery 250, has in recess 200
Have for installing the construction opening 202 of semiconductor cooling device.The refrigerating plant of semiconductor freezer is arranged on recess
At 200 construction opening 202, it is therefore desirable to which recess 200 has corresponding installing space.As condensation occurs from refrigeration
Around device, lower section is eventually flowed to, so water guide structure part 240 is arranged on the lower section of construction opening 202, in order to hydrops
Convergence and water conservancy diversion.Water guide structure part 240 includes：The dash boss 241 being adjacent to below recess, as shown in Fig. 2 gear
Water boss 241 relative to recess 200 recessed surfaces outwardly convex but still in the perpendicular residing for periphery 250
Rear.I.e. dash boss 241 needs the hydrops flowed down to recess 200 to have barrier effect, therefore its relative recess 200
It is outwardly, but the height for protruding is no more than the vertical plane of periphery 250.For the ease of dredging at dash boss 241
Hydrops, the guiding gutter 210 of at least one vertical arrangement is set on dash boss 241, guiding gutter 210 is from dash boss 241
Top surface, relative to dash boss 241 protrusion surface it is backward recessed extend straight down.Guiding gutter 210 is vertical to be passed through
Dash boss 241, in order to guiding the hydrops of recess 200 and passing through dash boss 241.Guiding gutter 210 is convex in dash
As long as the position on platform 241 suitably guides the position of hydrops all may be used.Inner bag is discharged for convenience of hydrops, is set below guiding gutter 210
V-type water leg 230 and the outlet 220 at 230 minimum point of V-type water leg are put, V-type water leg 230 is arranged to from V
The hydrops of type water leg itself and/or guiding gutter are guided to outlet 220, so as to be discharged to outside inner bag.
The semiconductor cooling device 400 of the semiconductor freezer that the application is related to is arranged on the rear wall appearance of inner bag 100
On face, a part for semiconductor cooling device 400 is extend in air channel 500 through the construction opening 202 on recess 200,
It is during semiconductor freezer normal work, that semiconductor cooling device 400 stretches into air channel 500 partly because temperature is less than surrounding ring
Border can produce condensation, and condensation is eventually along the stream of recess 200 to water guide structure part 240, the gear of water guide structure part 240
Water boss 241 stops to water, makes guiding gutter 210 water conservancy diversion of the aquiform stool at by dash boss to the outlet 220 of lower section,
And the water that water guide structure part 240 is flowed down by V-type water leg 230 is all pooled at outlet 220, and pass through outlet 220
Discharge inner bag.
The width and length of recess 200 can be all higher than water guide structure part 240.Such structure is both beneficial to recessed
Associated refrigeration device is installed in part 200, converges hydrops beneficial to water guide structure part 240 again.
Fig. 4 is the schematic cross sectional views that the cutting line A-A in Fig. 3 is intercepted；Fig. 5 is that the cutting line B-B in Fig. 3 is intercepted
Schematic cross sectional views.It can be seen that the bottom surface 201 that recess 200 is connected with water guide structure part 240 is inclination in figure
The inclined plane of connection.Bottom surface 201 is specifically connected to the back edge of the top surface of dash boss 241, and such ground structure can not
Affect the dash effect of dash boss top surface.
Its upper end open of guiding gutter 210 and bottom surface in one embodiment of the application, on dash boss 241
201 bottom connection, and the bottom of the bottom land plane of guiding gutter 210 and bottom surface 201 is on same perpendicular.
I.e. dash boss 241 is vertically divided into left and right two parts by guiding gutter 210, so that the hydrops that recess 200 is flowed down are under process
Converge behind bottom surface 201 and be directed in the guiding gutter 210 of water guide structure part 240.And the bottom land plane of guiding gutter 210 with go to the bottom
The bottom in face 201 is located at the flowing that same perpendicular is then conducive to hydrops.
In a further embodiment of the application, guiding gutter 210 is provided with two, and two guiding gutters 210 with regard to
The center upright axis of symmetry of dash boss 241 is symmetrical arranged.The more convenient water conservancy diversion hydrops of such structure
Further, as the impact dirty to condensation or condensation of the left and right sides surface of recess 200 is little, therefore
The left and right side surface 203 of recess 200 is turning sphering joint face, and which is by the less mode in angle of inclination and periphery
250 incline connection.Inclination angle of its angle of inclination of vertical plane of 203 relative recess 200 of side surface less than bottom incline
Degree,.Further, since V-type water leg 230 has been able to block hydrops, therefore water guide structure part 240 and periphery 250
Connection be to be directly connected to according to the structure of V-type water leg outer side edges.
Fig. 6 is the scalariform face section view partial enlarged drawing of recess and periphery junction in Fig. 4, and Fig. 7 is led in Fig. 4
The section view enlarged diagram of water-bound part, shows in figure：The upper topside 260 of recess 200 is adopted with periphery 250
Ladder-shaper structure connects, and ladder-shaper structure includes the folding of parallel surface 261, inclined plane 262 and connection parallel surface 261 and inclined plane 262
Angle 263, three form a scalariform face, and knuckle 263 is towards inside inner bag and is more than 90 degree.That is the upper top of recess 200
While 260 with periphery 250 by with knuckle 263 while be connected, therebetween formation stairstepping it is excessive.Top surface is gone up wherein
The 260 folding faces being connected with periphery 250 are parallel surface 261, and parallel surface 261 is parallel with the recessed surfaces of recess 260
And peripherally located part 250 surface and recessed surfaces between.Inclined plane 262 is inclined with recessed surfaces and is connected.Upper top surface is adopted
Ladder-shaper structure can both facilitate the condensation at the top of inner bag to flow into recess 200 along periphery 250, can also make parallel surface
261 used as the mount point for supporting air duct cover board 300.And two that scalariform face 260 is connected with periphery 250 and recess 200
Side is respectively adopted with interior radian（Its radian direction is in opposite direction with knuckle）Arc-shaped side connection, to ensure that condensation can
Recess 200 is flowed into smoothly, it is to avoid hydrops are dripped.
In one embodiment of the application, the upper fixing hole 243 of fixed air duct cover board 300 is provided with rear wall 100
With lower fixed hole 242, wherein upper fixing hole 243 is arranged on the parallel surface 261 of top surface 260, and lower fixed hole 242 is arranged on
The lower section of dash boss 241 between two guiding gutters 210.The position of lower fixed hole 242 is arranged on below dash boss 241,
Hydrops of the performance of 241 dash of dash boss to prevent top can be utilized to enter lower fixed hole 242.Therefore, lower fixed hole 242
Perpendicular is located between the perpendicular and the bottom land plane of guiding gutter of dash boss 241.It is i.e. parallel to the ground with inwall 100
Mode observe, the set location of lower fixed hole 242 height to be less than the height and the bottom land higher than guiding gutter of dash boss 241
Level.After air duct cover board 300 is fixed, recess 200, semiconductor cooling device 400 can be stretched in air channel 500
Partly, cold scattering blower fan 410, and water guide structure part 240 close, by refrigerating part and condensation part and storing compartment every
Open, it is to avoid condensation part adheres to debris.
The position of cold scattering blower fan 410 is corresponding with the position of return air inlet 310 on air duct cover board 300.In a kind of preferred embodiment
Under, air duct cover board 300 and the corresponding position of the opening of rear wall are provided be adapted with 410 shape of cold scattering blower fan, and direction
The projection of chamber interior between storing, to form the space for accommodating cold scattering blower fan 410；Return air inlet 310 is multiple, is distributed in the table of projection
Face.For example, in the case where the profile of cold scattering blower fan 410 is for circle, air duct cover board 300 is formed with towards circle indoor between storing
Shape is raised, and the thickness of raised height and cold scattering blower fan 410 is to adaptation.
To ensure that cold scattering blower fan 410 effectively can suck air from storing compartment, return air inlet 310 be set to it is multiple,
Under a kind of embodiment, along raised center radial distribution, wherein each return air inlet 310 is hard iron to multiple return air inlets 310
Circle, its extended line form concentric circular of the multi-turn with raised center as the center of circle.
Accordingly, multiple air outlets 320 that the upper and lower of air duct cover board 300 is respectively provided with, or hard iron is circular,
Arranged parallel to each other.
In one embodiment of the application, it is the fixed effect for further improving air duct cover board 300, in recess
On 200 side surface 203, horizontal interval is provided with for engaging the draw-in groove 204 of air duct cover board 300.Draw-in groove 204 is used for correspondence
The fixture block of 300 liang of sides of engaging air duct cover board, when mounted, first by the fixture block of air duct cover board both sides and the card of guide face both sides
Groove 204 engages, and air duct cover board 300 is fixed on 200 He of recess by upper fixing hole 243 and lower fixed hole 242 again then
On water guide structure part 240.
Outlet 220 is entered for convenience of hydrops, with outlet 220 as convergent point around outlet 220 in the present embodiment
Indent arc hole 244 is set.V-type water leg 230 as arc hole 244 bottom and incline to outlet 220, which is inclined
Angle with the vertical line of water guide structure part 240 to outlet 220 as reference, V-type water leg outer side edges to water outlet with hang down
The angle of straight line is more than 10 degree and is less than 40 degree.I.e. V-type water leg 230 is opening up and higher than outlet 220 as one
The hydrops that water guide structure part flows down are blocked by dykes and dams so as to flowed in outlet 220.V-type water leg 230 is overall to outlet
220 incline, while dash effect is played, the also effect with water-retention.Vertical with ground with water guide structure part 240
When line is observed for standard, V-type water leg 230 is inclined to vertical line, while bottom of the V-type water leg 230 as arc hole 244
Side and by arc hole 244 be constrained to centered on outlet 220 half arcs hole.Now, the base of outlet 220 and V-type
Water leg 230 is contacted or is overlapped, to ensure the smooth inflow of hydrops.
The body structure of refrigerator typically yet includes：Shell, chamber door and heat insulation layer.Outcase of refrigerator generally there are two kinds of knots
Structure, it is a kind of be pin-connected panel, a complete casing is assembled into by top cover, left side plate, postnotum, lower shoe etc..It is another kind of
Monoblock type, will top cover and left side plate on request rolling into an inverted " u " font, referred to as U shells are postnotum, lower shoe
Point is welded into casing.The semiconductor freezer of the embodiment of the present invention preferably use monoblock type shell, i.e. shell include U shells and after
The back of the body, wherein U shells are arranged at side wall and the outside of roof of inner bag 100, and it is empty that the back of shell defines installation with the rear wall of inner bag
Between.
Fig. 8 is the exploded perspective view of semiconductor freezer according to an embodiment of the invention, semiconductor cooling device
400 are arranged on the outside of the rear wall of inner bag 100 in the installing space limited with shell back 620.
Semiconductor cooling device 400 includes：Semiconductor chilling plate 430, cold scattering fin assembly 420, heat elimination assembly 430, its
Middle semiconductor chilling plate 430, is arranged at the outside of the rear wall of inner bag 100, low-temperature receiver of its cold end as semiconductor freezer.Dissipate
A part for cold fin assembly 420 is stretched in air channel by construction opening, to conduct cold junction temperature to storing compartment.
Fig. 9 is 420 exploded perspective view of cold scattering fin assembly of semiconductor freezer according to an embodiment of the invention,
Cold scattering fin assembly 420 includes：Conduction cooling plate 421, wherein many cold scattering heat pipes 422, cold scattering fins 423, conduction cooling plate 421, are arranged
In opposite to each other in the side of air duct cover board 300, the cold end thermally coupled with semiconductor chilling plate 430；Every cold scattering heat pipe 422 from its with
421 hot linked first section forward fold of conduction cooling plate extends to the second relative section parallel with conduction cooling plate 421；Cold scattering fin
423 are arranged on the second section of many cold scattering heat pipes 422, and which is connect in conduction cooling plate 421 in the side of air duct cover board 300 opposite to each other
Touch；Cold scattering fin 423 is installed to be through construction opening and stretches in air channel.
First section of every cold scattering heat pipe 422 is directly welded in side of the conduction cooling plate 421 relative to cold scattering fin 423,
Or first section be directly embedded into inside conduction cooling plate 421.Every cold scattering heat pipe 422 forms similar " U " type, its first section and the
Two sections have bending section to connect.
When the semiconductor freezer of the present embodiment works, cold scattering blower fan 410 produce in air channel 500 enter from return air inlet 310,
Gap through cold scattering fin 423 enters the air-flow of the storing compartment by air outlet 320 after fully exchanging heat.
Cold scattering blower fan 410 can be fixedly installed on the inner bag of refrigerator, it is also possible to be fixed on cold scattering fin 423, one
Plant in alternative embodiment, cold scattering fin 423 is provided with the draw-in groove with hook formation relative to the side of air duct cover board 300；Cold scattering
The both sides of blower fan 410 are provided with anchorage bar, and anchorage bar is installed in draw-in groove, and cold scattering blower fan 410 is fixed on cold scattering fin 423
On, the air-flow that will be sucked from storing compartment, after blowing to cold scattering fin 423, the gap through cold scattering fin 423 is changed
Heat, and discharged by air outlet 320 along air channel 500.
A certain distance can be preferably provided between the rear wall of semiconductor chilling plate 430 and inner bag 100, to ensure having a power failure
Or the heat in hot junction will not be conducted to inner bag 100 during operation troubles, in this case, semiconductor freezer also includes：It is adiabatic
Layer 610 and cold transfer block（Cannot illustrate inside heat insulation layer）, wherein, heat insulation layer 610 is arranged at conduction cooling plate 421 and quasiconductor system
Between cold 430；Inside the embedded heat insulation layer 610 of cold transfer block；Conduction cooling plate 421 is opposite cold by passing in the side of air duct cover board 300
The cold end thermally coupled of block and semiconductor chilling plate 430.
To solve the heat dissipation problem in semiconductor chilling plate hot junction, the semiconductor freezer of the present embodiment can also be arranged
Have：The hot junction thermally coupled of heat elimination assembly and semiconductor chilling plate 430, the heat for hot junction is produced are distributed to surrounding.
Figure 10 is the heat elimination assembly exploded perspective view of semiconductor freezer according to an embodiment of the invention, the radiating
Assembly 440 includes：Heat-conducting plate 441, many radiating heat pipes 442, radiating fin 443, cooling fans 444, wherein heat-conducting plate 441 with
Hot junction thermally coupled；The bottom of radiating heat pipe 442 and 441 contact heat-exchanging of heat-conducting plate, radiating fin 443 per root, are arranged at many and dissipate
The top of heat pipe 442；Cooling fan 444 is fixed on radiating fin opposite to each other in the side of air duct cover board by retention mechanism, with
Heat to radiating fin 443 is reached from radiating heat pipe 442 carries out forced convertion radiating.To ensure each connection member of heat transfer efficiency
Between adopt heat-conducting silicone grease（Graphite or other media）Contact.This heat elimination assembly is conducted heat by heat pipe fin structure, is passed through
Fan carries out forced convertion, and radiating effect is fast, simple structure, easy to maintenance, concise production process.
Heat elimination assembly is also an option that other structures in addition, for example, fitted and outcase of refrigerator using refrigerant line, by
Outcase of refrigerator natural heat dissipation etc..
The air channel structure of the embodiment of the present invention can effectively upper and lower two air circulations of indoor formation between storing, make storage
Thing compartment internal temperature is balanced, and heat exchange efficiency is high, it is little to take up room.
So far, although those skilled in the art will appreciate that detailed herein illustrate and describe multiple showing for the present invention
Example property embodiment, but, without departing from the spirit and scope of the present invention, still can be direct according to present disclosure
It is determined that or deriving many other variations or modifications for meeting the principle of the invention.Therefore, the scope of the present invention is understood that and recognizes
It is set to and covers all these other variations or modifications.
Claims (11)
1. a kind of semiconductor freezer, including：
Inner bag, defines storing compartment, is provided with construction opening in the middle part of the rear wall of the inner bag in which；
Air duct cover board, is arranged on the inside of the rear wall of inner bag, and air channel is formed with and the rear wall of the inner bag between, the air channel lid
Plate offers return air inlet with the correspondence position of the construction opening, and the upper and lower of the air duct cover board is respectively arranged with air-out
Mouthful；
Semiconductor cooling device, one part pass through the construction opening, are inserted in the air channel, the semiconductor refrigerating dress
The cold scattering blower fan for carrying is put, the rear of the return air inlet is arranged at, the air-flow in the storing compartment is sucked into the air channel,
Wherein
The rear wall of the inner bag includes：Recess, is arranged at the rear wall central authorities；Water guide structure part, is adjacent to described recessed
Enter beneath portions；Periphery, is looped around the recess and the water guide structure portion and in same vertically flat
In face；And
The recess is recessed backward relative to the perpendicular residing for the periphery, and the construction opening is arranged
In the middle part of the recess.
2. semiconductor freezer according to claim 1, wherein
The air duct cover board is covered on the recess and the water guide structure part, to be formed with the recess
The air channel.
3. semiconductor freezer according to claim 2, wherein
The width and length of the recess is respectively greater than the water guide structure part, and the recess is horizontal at which
The side surface that both sides are connected with the periphery is inclined turning sphering joint face；
The water guide structure part includes：
Dash boss, be adjacent to below the recess, relative to the recess recessed surfaces outwardly convex but still
In the perpendicular rear residing for the periphery；
At least one vertical guiding gutter, top surface from the dash boss, relative to the dash boss protrusion surface backward
Extend straight down recessedly；
V-type water leg below the guiding gutter and the outlet at the V-type water leg minimum point, the V-type
Water leg is arranged to for the water from the V-type water leg and/or the guiding gutter to be guided to the outlet, to be discharged to
State outside inner bag.
4. semiconductor freezer according to claim 3, wherein
The upper top surface that the recess is connected with the periphery is the scalariform face with knuckle, and the scalariform face includes：
Parallel surface, the parallel surface are connected with the periphery, and the recessed surfaces of the parallel surface and the recess
It is parallel and between the surface of the periphery and the recessed surfaces；With
Inclined plane, the inclined plane are inclined with the recessed surfaces and are connected；With
Knuckle, the knuckle is inwardly projecting and is more than 90 degree.
5. semiconductor freezer according to claim 4, wherein
The upper fixing hole for installing the air duct cover board is provided with the parallel surface；
It is provided with the lower fixed hole for installing the air duct cover board on the dash boss, the lower fixed hole is positioned at leading described in two
The lower section of the dash boss between chute, and the perpendicular of lower fixed hole is located at the dash surface and the guiding gutter
Bottom land plane between；
It is longitudinally spaced on the side surface to be provided with for engaging the card of the air duct cover board of the semiconductor freezer
Groove.
6. semiconductor freezer according to claim 1, wherein
The air duct cover board and the corresponding position of the opening of the rear wall be provided with it is being adapted with the cold scattering blower fan shape,
And towards the projection of chamber interior between the storing, to form the space for accommodating the cold scattering blower fan；
The return air inlet is multiple, is distributed in the surface of the projection.
7. semiconductor freezer according to claim 6, wherein
The return air inlet is huge circle along the raised center radial distribution, wherein each described return air inlet, and which prolongs
Long line forms concentric circular of the multi-turn with the raised center as the center of circle.
8. semiconductor freezer according to claim 1, the semiconductor cooling device include：
Semiconductor chilling plate, is arranged at the outside of the rear wall of the inner bag, and its cold end is cold as the semiconductor freezer
Source；
Cold scattering fin assembly, which includes：
Conduction cooling plate, is arranged at opposite in the side of the air duct cover board, the cold end thermally coupled with the semiconductor chilling plate；
Many cold scattering heat pipes, are prolonged with the hot linked first section forward fold of the conduction cooling plate from which per cold scattering heat pipe described in root
Extend the second relative section parallel with the conduction cooling plate；
Cold scattering fin, is arranged on the second section of many cold scattering heat pipes, and which is opposite to each other in the side of the air duct cover board
Contact in the conduction cooling plate；
The cold scattering fin is installed to be through the construction opening and stretches in the air channel.
9. semiconductor freezer according to claim 8, wherein
The cold scattering fin is provided with the draw-in groove with hook formation relative to the side of the air duct cover board；
The both sides of the cold scattering blower fan are provided with anchorage bar, and the anchorage bar is installed in the draw-in groove, by the cold scattering wind
Machine is fixed on the cold scattering fin, the air-flow that will be sucked from the storing compartment, after blowing to the cold scattering fin, is passed through
The cold scattering fin is simultaneously discharged by the air outlet along the air channel.
10. semiconductor freezer according to claim 8, also includes：
Heat insulation layer, is arranged between the conduction cooling plate and the semiconductor chilling plate；
Cold transfer block, is embedded in inside the heat insulation layer；
Conduction cooling plate cold end opposite to each other in the side of the air duct cover board by the cold transfer block and the semiconductor chilling plate
Thermally coupled.
11. semiconductor freezers according to claim 1, also include：
Heat elimination assembly, the hot junction thermally coupled with the semiconductor chilling plate, for the hot-side heat dissipation, the heat elimination assembly bag
Include：
Heat-conducting plate, itself and the hot junction thermally coupled；
Many radiating heat pipes, bottom and the heat-conducting plate contact heat-exchanging per the heat pipe that radiates described in root；
Radiating fin, is arranged at many radiating heat pipes top；With
Cooling fan, is fixed on the radiating fin opposite to each other in the side of the air duct cover board by retention mechanism, for producing
Radiating airflow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410123662.8A CN104329848B (en) | 2014-03-28 | 2014-03-28 | Semiconductor freezer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410123662.8A CN104329848B (en) | 2014-03-28 | 2014-03-28 | Semiconductor freezer |
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| Publication Number | Publication Date |
|---|---|
| CN104329848A CN104329848A (en) | 2015-02-04 |
| CN104329848B true CN104329848B (en) | 2017-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410123662.8A Active CN104329848B (en) | 2014-03-28 | 2014-03-28 | Semiconductor freezer |
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| CN (1) | CN104329848B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
| CN105466100B (en) * | 2015-12-24 | 2018-10-12 | 青岛海尔电冰箱有限公司 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
| KR102309117B1 (en) * | 2017-03-21 | 2021-10-06 | 엘지전자 주식회사 | Refrigerator |
| CN107393150A (en) * | 2017-08-10 | 2017-11-24 | 湖南金码智能设备制造有限公司 | A kind of energy-saving tray of automatic vending machine |
| CN113028631A (en) * | 2019-12-24 | 2021-06-25 | 宁波奥克斯电气股份有限公司 | Condensate water drainage device and air conditioner |
| CN111829253A (en) * | 2020-07-01 | 2020-10-27 | 海信容声(广东)冰箱有限公司 | Refrigerator with a door |
| CN113970229B (en) * | 2020-07-24 | 2023-10-10 | 青岛海尔特种电冰柜有限公司 | Refrigeration assembly and wine cabinet |
| CN113970210B (en) * | 2020-07-24 | 2023-09-29 | 青岛海尔特种电冰柜有限公司 | Refrigeration assembly and wine cabinet |
| CN115507582A (en) * | 2021-06-07 | 2022-12-23 | 青岛海尔电冰箱有限公司 | Ripening device for refrigerator, control method of ripening device and refrigerator |
| CN113865189A (en) * | 2021-10-13 | 2021-12-31 | 长虹美菱股份有限公司 | Refrigerating device of beauty box |
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| JP2004340404A (en) * | 2003-05-13 | 2004-12-02 | Matsushita Electric Ind Co Ltd | Heat radiator for electronic refrigerator |
| CN201497248U (en) * | 2009-08-12 | 2010-06-02 | 广东德豪润达电气股份有限公司 | Refrigeration device and electronic wine cabinet |
| CN201909500U (en) * | 2010-12-14 | 2011-07-27 | 河北鸿久人生电子科技有限公司 | Air duct type semiconductor freezer |
| CN203810823U (en) * | 2014-03-28 | 2014-09-03 | 海尔集团公司 | Semiconductor refrigerating refrigerator |
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| JP2004340404A (en) * | 2003-05-13 | 2004-12-02 | Matsushita Electric Ind Co Ltd | Heat radiator for electronic refrigerator |
| CN201497248U (en) * | 2009-08-12 | 2010-06-02 | 广东德豪润达电气股份有限公司 | Refrigeration device and electronic wine cabinet |
| CN201909500U (en) * | 2010-12-14 | 2011-07-27 | 河北鸿久人生电子科技有限公司 | Air duct type semiconductor freezer |
| CN203810823U (en) * | 2014-03-28 | 2014-09-03 | 海尔集团公司 | Semiconductor refrigerating refrigerator |
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| CN104329848A (en) | 2015-02-04 |
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