CN203810823U - Semiconductor refrigerating refrigerator - Google Patents

Abstract

The utility model provides a semiconductor refrigerating refrigerator. The semiconductor refrigerating refrigerator comprises a liner, an air duct cover plate and a semiconductor refrigerating device; a storage chamber is defined in the liner; a mounting opening is formed in the middle of the rear wall of the liner; the air duct cover plate is arranged at the inside of the rear wall of the liner; an air duct is formed between the air duct cover plate and the rear wall of the liner; air returning ports are formed in the positions, corresponding to the mounting opening, of the air duct cover plate; air outlets are formed in each of the upper part and the lower part of the air duct cover plate; one part of the semiconductor refrigerating device penetrates through the mounting opening to extend into the air duct; a cooling fan arranged on the semiconductor refrigerating device is arranged behind the air returning port, so air flows in the storage chamber is sucked into the air duct. According to the semiconductor refrigerating refrigerator, the air duct is formed by the air duct cover plate and the rear wall of the liner of the refrigerator, two air circulation processes are formed in the storage chamber by using the cooling fan, so the temperature in the storage chamber is balanced and the heat exchange efficiency is high.

Description

Semiconductor freezer

Technical field

The utility model relates to refrigeration plant, particularly relates to a kind of semiconductor freezer.

Background technology

Semiconductor freezer, is also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to pass through the double-deck heat pipe heat radiation of highly effective ring and conduction technique and automatic pressure-transforming Variable flow control technology and realizes refrigeration, without refrigeration working medium and mechanical moving element, solved the application problem of traditional mechanical refrigeration refrigerators such as medium pollution and mechanical oscillation.

Yet, semiconductor freezer need to be effectively by the temperature conduction of semiconductor chilling plate cold junction to indoor between refrigerator storing, prior art generally adopts fin as low-temperature receiver, fin is by directly contacting with semiconductor chilling plate cold junction, and and storing between chamber carry out heat exchange, the heat conduction heat exchange efficiency of this refrigeration structure is low, be unfavorable for the performance of semiconductor optimum performance, and radiating fin volume is larger, take refrigerator space, and between storing, the temperature distributing disproportionation of chamber interior is even, temperature near fin is low, high compared with distant positions temperature apart from fin, affect the normal use of semiconductor freezer.

Utility model content

An object of the present utility model is to provide that a kind of heat exchange efficiency is high, uniform semiconductor freezer freezes.

Further object of the utility model be to make semiconductor freezer take up room little, production and assembly technology simple.

Another further object of the utility model is the problem that will solve condensation on the inwall of semiconductor freezer inner bag.

Especially, the utility model provides a kind of semiconductor freezer.This semiconductor freezer comprises: inner bag, in it, be limited with chamber between storing, and the rear wall middle part of inner bag is provided with construction opening; Air duct cover board, is arranged on the rear wall inner side of inner bag, and and the rear wall of inner bag between be formed with air channel, the correspondence position of air duct cover board and construction opening offers return air inlet, the upper and lower of air duct cover board is respectively arranged with air outlet; Semiconductor cooling device, its part through construction opening, is inserted in air channel, semiconductor cooling device with cold scattering blower fan, be arranged at the rear of return air inlet, so that the air-flow in chamber between storing is sucked to air channel.

Alternatively, the rear wall of inner bag comprises: recess, is arranged at rear wall central authorities; Water guide structure part, is adjacent to recess below; Periphery, is looped around around recess and water guide structure part and in same perpendicular; Recess is recessed backward with respect to the residing perpendicular of periphery, and construction opening is arranged at the middle part of recess; Air duct cover board is covered in recess and water guide structure part, to form air channel with recess.

Alternatively, the width of recess and length are greater than respectively water guide structure part, and the side surface that recess is connected with periphery in its both lateral sides is the turning sphering joint face of inclination; Water guide structure partly comprises: dash boss, is adjacent to recess below, with respect to the recessed surfaces outwardly convex of recess but still in the residing perpendicular of periphery rear; At least one vertical guiding gutter, from the end face of dash boss, with respect to the protrusion surface of dash boss backward recessed extend straight down; In V-type water leg and the delivery port in V-type water leg minimum point place of guiding gutter below, V-type water leg is arranged to the water from V-type water leg and/or guiding gutter to be guided to delivery port, to be discharged to outside inner bag.

Alternatively, the upper end face that recess is connected with periphery is the scalariform face with knuckle, scalariform face comprises: parallel surface, and parallel surface is connected with periphery, and the recessed surfaces of parallel surface and recess is parallel and between the surface and recessed surfaces of periphery; And inclined plane, inclined plane tilts to be connected with recessed surfaces; And knuckle, knuckle is to projecting inward and be greater than 90 degree.

Alternatively, on parallel surface, be provided with the upper fixing hole that air duct cover board is installed; On dash boss, be provided with the lower fixed hole that air duct cover board is installed, lower fixed hole is below the dash boss between two guiding gutters, and the perpendicular of lower fixed hole is between the bottom land plane of dash surface and guiding gutter; On side surface, longitudinal separation is provided with for engaging the draw-in groove of the air duct cover board of semiconductor freezer.

Alternatively, the corresponding position of the opening of air duct cover board and rear wall is provided with and cold scattering blower fan shape adapts and towards between storing the projection of chamber interior, to form the space that holds cold scattering blower fan; Return air inlet is a plurality of, is distributed in protruding surface.

Alternatively, return air inlet distributes along protruding center radial, and to be wherein hard iron circular for each return air inlet, and its extended line forms multi-turn and take the concentric circles that protruding center is the center of circle.

Alternatively, semiconductor cooling device comprises: semiconductor chilling plate, be arranged at the outside of the rear wall of inner bag, and its cold junction is as the low-temperature receiver of semiconductor freezer; Cold scattering fin assembly, it comprises: conduction cooling plate, be arranged at opposing in a side of air duct cover board, thermally coupled with the cold junction of semiconductor chilling plate; Many cold scattering heat pipes, the bending forward and extend to relative second section parallel with conduction cooling plate from hot linked the first section of itself and conduction cooling plate of every cold scattering heat pipe; Cold scattering fin, is arranged on the second section of many cold scattering heat pipes, and its opposing side in air duct cover board contacts in conduction cooling plate; Cold scattering fin is installed to be through construction opening and stretches in air channel.

Alternatively, cold scattering fin has the draw-in groove with hook formation with respect to a side of air duct cover board; The both sides of cold scattering blower fan are provided with anchorage bar, and anchorage bar is installed in draw-in groove, so that cold scattering blower fan is fixed on cold scattering fin, with by the air-flow sucking chamber between storing, blow to after cold scattering fin, pass cold scattering fin and discharge by air outlet along air channel.

Alternatively, semiconductor freezer also comprises: heat insulation layer, is arranged between conduction cooling plate and semiconductor chilling plate; Cold transfer block, embeds heat insulation layer inner; The opposing side in air duct cover board of conduction cooling plate is thermally coupled by the cold junction of cold transfer block and semiconductor chilling plate.

Alternatively, semiconductor freezer also comprises: also comprise: heat elimination assembly, and thermally coupled with the hot junction of semiconductor chilling plate, for to hot-side heat dissipation, heat elimination assembly comprises: heat-conducting plate, itself and hot junction are thermally coupled; Many heat radiation heat pipes, bottom and the heat-conducting plate contact heat-exchanging of every heat radiation heat pipe; Radiating fin, is arranged at many heat radiation heat pipe tops; And cooling fan, by retention mechanism, be fixed on radiating fin opposing in a side of air duct cover board, for generation of radiating airflow.

Semiconductor freezer of the present utility model has taken into full account the refrigerating capacity of semiconductor cooling device and the profile feature of refrigerating efficiency and semiconductor cooling device, by being set, air duct cover board and inner container of icebox rear wall form air channel, utilizing cold scattering blower fan in air channel, to produce chamber between storing enters, through refrigerating plant, carries out after heat exchange, from upper and lower, return to respectively chamber between storing, upper and lower two air circulation of indoor formation between storing, make chamber interior temperature equalization between storing, heat exchange efficiency is high.

Further, the rear wall of inner container of icebox has recess, as the space that forms air channel, takies between storing space, chamber little.

Again further, the utility model, by corresponding air duct cover board fixed structure is set on rear wall, covers refrigerating plant and the water guide structure part of condensation by air duct cover board is installed, avoid it directly to contact with refrigerator inside, the foreign material that prevented refrigerator inside adhere to, and have guaranteed drainage effect.

According to the detailed description to the utility model specific embodiment by reference to the accompanying drawings below, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present utility model more.

Accompanying drawing explanation

Hereinafter in exemplary and nonrestrictive mode, describe specific embodiments more of the present utility model in detail with reference to the accompanying drawings.In accompanying drawing, identical Reference numeral has indicated same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not draw in proportion.In accompanying drawing:

Fig. 1 is according to the front schematic view of the semiconductor freezer of an embodiment of the utility model;

Fig. 2 is the schematic cross sectional views along the cutting line E-E intercepting in Fig. 1;

Fig. 3 is according to the rear wall perspective schematic view of the inner bag of semiconductor freezer in embodiment of the utility model;

Fig. 4 is the schematic cross sectional views along the cutting line A-A intercepting in Fig. 3;

Fig. 5 is the schematic cross sectional views along the cutting line B-B intercepting in Fig. 3;

Fig. 6 is that in Fig. 4, the scalariform face of recess and periphery junction is analysed and observe partial enlarged drawing;

Fig. 7 be in Fig. 4 water guide structure part analyse and observe enlarged diagram;

Fig. 8 is according to the exploded perspective view of the semiconductor freezer of an embodiment of the utility model;

Fig. 9 is the cold scattering fin assembly exploded perspective view according to the semiconductor freezer of an embodiment of the utility model; And

Figure 10 is according to the heat elimination assembly exploded perspective view of the semiconductor freezer of an embodiment of the utility model.

The specific embodiment

Fig. 1 is according to the front schematic view of the semiconductor freezer of an embodiment of the utility model, Fig. 2 is the schematic cross sectional views along the cutting line E-E intercepting in Fig. 1, as shown in the figure, this semiconductor freezer can comprise in general manner: inner bag 100, air duct cover board 300, semiconductor cooling device 400, cold scattering blower fan 410, wherein, inner bag 100 is limited with chamber between storing in it, and the rear wall middle part of inner bag 100 is provided with construction opening; Air duct cover board 300 is arranged on the rear wall inner side of inner bag 100, and and between the rear wall of inner bag 100, be formed with air channel 500, air duct cover board 300 offers return air inlet 310 with the correspondence position of construction opening, and the upper and lower of air duct cover board 300 is respectively arranged with air outlet 320; A part for semiconductor cooling device 400 through construction opening, is inserted in air channel 500, semiconductor cooling device 400 with cold scattering blower fan 410, be arranged at the rear of return air inlet 420, so that the air-flow in chamber between storing is sucked to air channel 500.Wherein, forward and backward, upper and lower position relation in the present embodiment can be for the normal condition of refrigerator, and wherein front is the direction of close refrigerator open, is the direction near refrigerator back afterwards.

Semiconductor cooling device 400 is usingd semiconductor chilling plate as low-temperature receiver, and semiconductor chilling plate cold junction temperature is delivered between storing in chamber, owing to having taked cold scattering blower fan 410 to carry out forced convertion, effectively improved heat exchange efficiency, the air-flow that the blower fan of cold scattering simultaneously 410 produces is guided by air channel 500, between storing, chamber interior forms a plurality of circulations, and the temperature of indoor each position between balanced storing has effectively improved the refrigeration of refrigerator.

In order to make air channel 500 not take the space of chamber between storing, the semiconductor freezer of the present embodiment has adopted unique inner-tube structure, has both saved space, and has solved the problem that condensed water gathers.

Fig. 3 is according to the rear wall perspective schematic view of the inner bag of semiconductor freezer in embodiment of the utility model.Wherein, the rear wall of inner bag 100 is divided into recess 200 in rear wall central authorities, is adjacent to the water guide structure part 240 of recess below and is looped around recess 200 and water guide structure part 240 around and the periphery 250 in same perpendicular.Wherein recess 200 is recessed backward with respect to the residing perpendicular of periphery 250, has for the construction opening 202 of semiconductor cooling device is installed in recess 200.The refrigerating plant of semiconductor freezer is arranged on construction opening 202 places of recess 200, therefore needs recess 200 to have corresponding installing space.Because condensation is to appear at around refrigerating plant, finally flow to below, thus water guide structure part 240 is arranged on to the below of construction opening 202, so that the converging and water conservancy diversion of ponding.Water guide structure part 240 comprises: be adjacent to the dash boss 241 of recess below, as shown in Figure 2, dash boss 241 is with respect to the recessed surfaces outwardly convex of recess 200 but still in the residing perpendicular of periphery 250 rear.Be that the ponding that dash boss 241 need to flow down recess 200 has barrier effect, so its relative recess 200 is outwardly, but the height protruding can not surpass the vertical plane of periphery 250.For the ease of dredging the ponding at dash boss 241 places, at least one guiding gutter 210 of vertically arranging is set on dash boss 241, guiding gutter 210 from the end face of dash boss 241, with respect to the protrusion surface of dash boss 241 backward recessed extend straight down.Guiding gutter 210 vertical through dash boss 241, so that the ponding of recess 200 is guided and pass dash boss 241.All can in the position that the position of guiding gutter 210 on dash boss 241 needs only suitable guiding ponding.For convenience of ponding, discharge inner bag, V-type water leg 230 and the delivery port 220 in V-type water leg 230 minimum point places are set below guiding gutter 210, V-type water leg 230 is arranged to the ponding from V-type water leg self and/or guiding gutter to be guided to delivery port 220, thereby is discharged to outside inner bag.

The semiconductor cooling device 400 of the semiconductor freezer that the application relates to is arranged on the rear wall outer surface of inner bag 100, a part for semiconductor cooling device 400 extend in air channel 500 through the construction opening 202 on recess 200, when semiconductor freezer is normally worked, semiconductor cooling device 400 stretches into the part in air channel 500 because temperature can produce condensation lower than surrounding environment, condensation finally can flow to water guide structure part 240 along recess 200, 241 pairs of water of dash boss of water guide structure part 240 stop, make water be convenient to guiding gutter 210 water conservancy diversion by dash boss place to the delivery port 220 of below, and the water that V-type water leg 230 flows down water guide structure part 240 is all pooled to delivery port 220 places, and discharge inner bag by delivery port 220.

The width of recess 200 and length can all be greater than water guide structure part 240.Such structure had both been beneficial to recess 200 relevant refrigerating plant had been installed, and was beneficial to again water guide structure part 240 and converged ponding.

Fig. 4 is the schematic cross sectional views along the cutting line A-A intercepting in Fig. 3; Fig. 5 is the schematic cross sectional views along the cutting line B-B intercepting in Fig. 3.In figure, can find out that the bottom surface 201 that recess 200 is connected with water guide structure part 240 is the inclined plane that tilts to connect.Bottom surface 201 is specifically connected to the back edge of the end face of dash boss 241, and structure can not affect the dash effect of dash boss end face in this wise.

In the application's a embodiment, guiding gutter 210 its upper end open that are positioned on dash boss 241 are connected with the bottom of bottom surface 201, and the bottom land plane of guiding gutter 210 and the bottom of bottom surface 201 are positioned on same perpendicular.Be that guiding gutter 210 is vertically divided into left and right two parts by dash boss 241, so that the ponding that recess 200 flows down in converging and be directed to the guiding gutter 210 of water guide structure part 240 after bottom surface 201.The bottom land plane of guiding gutter 210 and the bottom of bottom surface 201 are positioned at same perpendicular and are conducive to flowing of ponding.

In the application's a further embodiment, guiding gutter 210 is provided with two, and two guiding gutters 210 are symmetrical arranged about the vertical axis of symmetry of central authorities of dash boss 241.The more convenient water conservancy diversion ponding of such structure

Further, because the surface, the left and right sides of recess 200 is little on condensation or the dirty impact of condensation, so the left and right sides of recess 200 surface 203 be turning sphering joint face, and it is connected with periphery 250 inclinations by the less mode in angle of inclination.Its angle of inclination of vertical plane of side surface 203 relative recesses 200 is less than the angle of inclination of bottom incline.In addition, because V-type water leg 230 can block ponding, so water guide structure part 240 is directly to connect according to the structure of V-type water leg outer side edges with being connected of periphery 250.

Fig. 6 is that in Fig. 4, the scalariform face of recess and periphery junction is analysed and observe partial enlarged drawing, Fig. 7 be in Fig. 4 water guide structure part analyse and observe enlarged diagram, there is shown: the upper topside 260 of recess 200 adopts ladder-shaper structure to be connected with periphery 250, ladder-shaper structure comprises parallel surface 261, inclined plane 262 and the knuckle 263 that connects parallel surface 261 and inclined plane 262, three forms a scalariform face, and knuckle 263 is inner and be greater than 90 degree towards inner bag.The upper topside 260 that is recess 200 is connected by the limit with knuckle 263 with periphery 250, and it is excessive that between forms stairstepping.Wherein going up the folding face that end face 260 is connected with periphery 250 is parallel surface 261, and the recessed surfaces of parallel surface 261 and recess 260 is parallel and between the surface and recessed surfaces of periphery 250.Inclined plane 262 tilts to be connected with recessed surfaces.Upper end face adopts ladder-shaper structure both can facilitate the condensation at inner bag top to flow into recess 200 along periphery 250, can also make parallel surface 261 as the mounting points that supports air duct cover board 300.And the dual-side that scalariform face 260 is connected with recess 200 with periphery 250 adopts respectively the arc-shaped side with the interior radian opposite direction of knuckle (its radian direction with) to be connected, to guarantee that condensation can flow into recess 200 smoothly, avoid ponding drippage.

In the application's a embodiment, on rear wall 100, be provided with fixedly upper fixing hole 243 and the lower fixed hole 242 of air duct cover board 300, wherein go up on the parallel surface 261 that fixing hole 243 is arranged on end face 260, and lower fixed hole 242 is arranged on the below of dash boss 241 between two guiding gutters 210.The position of lower fixed hole 242 is arranged on to dash boss 241 belows, can utilizes the performance of dash boss 241 dash to prevent that the ponding on top from entering lower fixed hole 242.Therefore, the perpendicular of lower fixed hole 242 is between the perpendicular of dash boss 241 and the bottom land plane of guiding gutter.In inwall 100 mode parallel to the ground, observe, the setting position height of lower fixed hole 242 will be lower than the height of dash boss 241 and higher than the bottom land level of guiding gutter.After air duct cover board 300 is fixing, recess 200, semiconductor cooling device 400 can be stretched into part, cold scattering blower fan 410 and 240 sealings of water guide structure part in air channel 500, so that chamber between refrigerating part and condensation part and storing is separated, avoid condensation partly to adhere to foreign material.

The position of cold scattering blower fan 410 is corresponding with the position of return air inlet 310 on air duct cover board 300.Under a kind of preferred embodiment, the corresponding position of the opening of air duct cover board 300 and rear wall is provided with and cold scattering blower fan 410 shapes adapt and towards between storing the projection of chamber interior, to form the space that holds cold scattering blower fan 410; Return air inlet 310 is a plurality of, is distributed in protruding surface.For example, in the situation that the profile of cold scattering blower fan 410 is circular, air duct cover board 300 is formed with circular protrusion indoor towards between storing, and the height of projection and the thickness of cold scattering blower fan 410 are to adaptation.

For guaranteeing that cold scattering blower fan 410 can be effectively from indoor air amount between storing, return air inlet 310 is set to a plurality of, under a kind of embodiment, a plurality of return air inlets 310 distribute along protruding center radial, it is circular that wherein each return air inlet 310 is hard iron, and its extended line forms multi-turn and take the concentric circles that protruding center is the center of circle.

Accordingly, a plurality of air outlets 320 that the upper and lower of air duct cover board 300 arranges respectively, also can be circular for hard iron, arranges parallel to each other.

In the application's a embodiment, for further improving the fixed effect of air duct cover board 300, on the side surface 203 of recess 200, horizontal interval is provided with for engaging the draw-in groove 204 of air duct cover board 300.Draw-in groove 204 is for the fixture block of correspondence engaging air duct cover board 300 dual-sides, when mounted, first the fixture block of air duct cover board both sides is engaged with the draw-in groove 204 of guide face both sides, and then by upper fixing hole 243 and lower fixed hole 242, air duct cover board 300 is fixed in recess 200 and water guide structure part 240.

For convenience of ponding, enter delivery port 220, the delivery port 220 of take around delivery port 220 in the present embodiment cheats 244 as convergent point arranges indent arc.V-type water leg 230 is as the bottom in arc hole 244 and to delivery port 220 inclinations, it is reference that the angle of its inclination be take water guide structure part 240 to the vertical line of delivery port 220, and V-type water leg outer side edges to the angle of water outlet and vertical line is greater than 10 degree and is less than 40 degree.Be that V-type water leg 230 is opening up and block higher than the ponding that the dykes and dams of delivery port 220 partly flow down water guide structure as one, it is flowed in delivery port 220.V-type water leg 230 integral body tilt to delivery port 220, when playing dash effect, also have the effect of retaining.Take the vertical line on water guide structure part 240 and ground when standard is observed, V-type water leg 230 tilts to vertical line, and V-type water leg 230 is cheated 244 bottom side and arc hole 244 is constrained to half arcs hole centered by delivery port 220 as arc simultaneously.Now, the base of delivery port 220 contacts or overlaps with V-type water leg 230, to guarantee the smooth inflow of ponding.

The body structure of refrigerator generally yet comprises: shell, chamber door and heat insulation layer.Outcase of refrigerator is general there are two kinds of structures, a kind of be pin-connected panel, by top cover, left side plate, postnotum, lower shoe etc., be assembled into a complete casing.Another kind is monoblock type, be about to top cover and left side plate on request rolling become " U " font, be called U shell, be that postnotum, lower shoe point are welded into casing.The semiconductor freezer of the utility model embodiment is preferably used monoblock type shell, and shell includes U shell and back, and wherein U shell is arranged at the outside of sidewall and the roof of inner bag 100, and the back of shell and the rear wall of inner bag are limited with installing space.

Fig. 8 is according to the exploded perspective view of the semiconductor freezer of an embodiment of the utility model, and semiconductor cooling device 400 is arranged in the rear wall outside of inner bag 100 and the installing space of shell back 620 restrictions.

Semiconductor cooling device 400 comprises: semiconductor chilling plate 430, cold scattering fin assembly 420, heat elimination assembly 430, and wherein semiconductor chilling plate 430, are arranged at the outside of the rear wall of inner bag 100, and its cold junction is as the low-temperature receiver of semiconductor freezer.A part for cold scattering fin assembly 420 stretches in air channel by construction opening, to conduct cold junction temperature to chamber between storing.

Fig. 9 is cold scattering fin assembly 420 exploded perspective views according to the semiconductor freezer of an embodiment of the utility model, cold scattering fin assembly 420 comprises: conduction cooling plate 421, many cold scattering heat pipes 422, cold scattering fin 423, wherein conduction cooling plate 421, be arranged at opposing in a side of air duct cover board 300, thermally coupled with the cold junction of semiconductor chilling plate 430; Every cold scattering heat pipe 422 bends forward and extends to relative second section parallel with conduction cooling plate 421 from hot linked the first section of itself and conduction cooling plate 421; Cold scattering fin 423 is arranged on the second section of many cold scattering heat pipes 422, and its opposing side in air duct cover board 300 is in 421 contacts of conduction cooling plate; Cold scattering fin 423 is installed to be through construction opening and stretches in air channel.

The first section of every cold scattering heat pipe 422 is directly welded in conduction cooling plate 421 with respect to a side of cold scattering fin 423, or the first section directly embeds conduction cooling plate 421 inside.Every cold scattering heat pipe 422 forms similar " U " type, and its first section has bend to be connected with the second section.

Semiconductor freezer when work of the present embodiment, cold scattering blower fan 410 the interior generation in air channel 500 from return air inlet 310 enter, through the gap of cold scattering fin 423 after abundant heat exchange, by air outlet 320, enter the air-flow of chamber between described storing.

Cold scattering blower fan 410 can be fixedly installed on the inner bag of refrigerator, also can be fixed on cold scattering fin 423, and in a kind of optional embodiment, cold scattering fin 423 has the draw-in groove with hook formation with respect to a side of air duct cover board 300; The both sides of cold scattering blower fan 410 are provided with anchorage bar, anchorage bar is installed in draw-in groove, so that cold scattering blower fan 410 is fixed on cold scattering fin 423, with by the air-flow sucking chamber between storing, blow to after cold scattering fin 423, through the gap of cold scattering fin 423 carrying out heat exchange, and 500 by air outlet 320, discharge along air channel.

Between the rear wall of semiconductor chilling plate 430 and inner bag 100, certain distance can be preferably set, with guarantee have a power failure or during operation troubles the heat in hot junction can not conduct to inner bag 100, in this case, semiconductor freezer also comprises: heat insulation layer 610 and cold transfer block (being positioned at heat insulation layer inside cannot illustrate), wherein, heat insulation layer 610 is arranged between conduction cooling plate 421 and semiconductor chilling plate 430; Cold transfer block embeds heat insulation layer 610 inside; The opposing side in air duct cover board 300 of conduction cooling plate 421 is thermally coupled by the cold junction of cold transfer block and semiconductor chilling plate 430.

For solving the heat dissipation problem in semiconductor chilling plate hot junction, the semiconductor freezer of the present embodiment can also be provided with: the hot junction of heat elimination assembly and semiconductor chilling plate 430 is thermally coupled, for by the dissipation of heat of hot junction generation to surrounding environment.

Figure 10 is according to the heat elimination assembly exploded perspective view of the semiconductor freezer of an embodiment of the utility model, this heat elimination assembly 440 comprises: heat-conducting plate 441, many dispel the heat heat pipe 442, radiating fin 443, cooling fans 444, and wherein heat-conducting plate 441 is thermally coupled with hot junction; Bottom and heat-conducting plate 441 contact heat-exchangings, the radiating fin 443 of every heat radiation heat pipe 442, be arranged at the top of the many heat pipes 442 that dispel the heat; It is opposing in a side of air duct cover board that cooling fan 444 is fixed on radiating fin by retention mechanism, to carry out forced convertion heat radiation to reach the heat of radiating fin 443 from heat radiation heat pipe 442.For guaranteeing to adopt heat-conducting silicone grease (graphite or other media) to contact between each attaching parts of heat transfer efficiency.This heat elimination assembly conducts heat by heat pipe fin structure, by fan, carries out forced convertion, and radiating effect is fast, simple in structure, easy to maintenance, concise production process.

Heat elimination assembly can also be selected other structures in addition, for example, use refrigerant line laminating and outcase of refrigerator, by outcase of refrigerator natural heat dissipation etc.

The air channel structure of the utility model embodiment is upper and lower two air circulation of indoor formation between storing effectively, make chamber interior temperature equalization between storing, and heat exchange efficiency is high, it is little to take up room.

So far, those skilled in the art will recognize that, although detailed, illustrate and described a plurality of exemplary embodiment of the present utility model herein, but, in the situation that not departing from the utility model spirit and scope, still can directly determine or derive many other modification or the modification that meets the utility model principle according to the disclosed content of the utility model.Therefore, scope of the present utility model should be understood and regard as and cover all these other modification or modifications.

Claims (11)

1. a semiconductor freezer, is characterized in that comprising:

Inner bag, is limited with chamber between storing in it, the rear wall middle part of described inner bag is provided with construction opening;

Air duct cover board, is arranged on the rear wall inner side of inner bag, and and the rear wall of described inner bag between be formed with air channel, the correspondence position of described air duct cover board and described construction opening offers return air inlet, the upper and lower of described air duct cover board is respectively arranged with air outlet;

Semiconductor cooling device, its part through described construction opening, is inserted in described air channel, described semiconductor cooling device with cold scattering blower fan, be arranged at the rear of described return air inlet, so that the air-flow in chamber between described storing is sucked to described air channel.

2. semiconductor freezer according to claim 1, is characterized in that

The rear wall of described inner bag comprises:

Recess, is arranged at described rear wall central;

Water guide structure part, is adjacent to described recess below;

Periphery, is looped around around described recess and described water guide structure part and in same perpendicular;

Described recess is recessed backward with respect to the residing perpendicular of described periphery, and described construction opening is arranged at the middle part of described recess;

Described air duct cover board is covered in described recess and described water guide structure part, to form described air channel with described recess.

3. semiconductor freezer according to claim 2, is characterized in that

The width of described recess and length are greater than respectively described water guide structure part, and the side surface that described recess is connected with described periphery in its both lateral sides is the turning sphering joint face of inclination;

Described water guide structure partly comprises:

Dash boss, is adjacent to described recess below, with respect to the recessed surfaces outwardly convex of described recess but still in the residing perpendicular of described periphery rear;

At least one vertical guiding gutter, from the end face of described dash boss, with respect to the protrusion surface of described dash boss backward recessed extend straight down;

In V-type water leg and the delivery port in described V-type water leg minimum point place of described guiding gutter below, described V-type water leg is arranged to the water from described V-type water leg and/or described guiding gutter to be guided to described delivery port, to be discharged to outside described inner bag.

4. semiconductor freezer according to claim 3, is characterized in that

The upper end face that described recess is connected with described periphery is the scalariform face with knuckle, and described scalariform face comprises:

Parallel surface, described parallel surface is connected with described periphery, and the recessed surfaces of described parallel surface and described recess is parallel and between the surface and described recessed surfaces of described periphery; With

Inclined plane, described inclined plane tilts to be connected with described recessed surfaces; With

Knuckle, described knuckle is to projecting inward and be greater than 90 degree.

5. semiconductor freezer according to claim 4, is characterized in that

On described parallel surface, be provided with the upper fixing hole that described air duct cover board is installed;

On described dash boss, be provided with the lower fixed hole that described air duct cover board is installed, described lower fixed hole is below the described dash boss between two described guiding gutters, and the perpendicular of lower fixed hole is between described dash surface and the bottom land plane of described guiding gutter;

On described side surface, longitudinal separation is provided with for engaging the draw-in groove of the described air duct cover board of described semiconductor freezer.

6. semiconductor freezer according to claim 1, is characterized in that

Projection that the corresponding position of the opening of described air duct cover board and described rear wall is provided with and described cold scattering blower fan shape adapts and chamber interior towards between described storing, to form the space that holds described cold scattering blower fan;

Described return air inlet is a plurality of, is distributed in the surface of described projection.

7. semiconductor freezer according to claim 6, is characterized in that

Described return air inlet distributes along the center radial of described projection, wherein described in each return air inlet to be hard iron circular, its extended line forms multi-turn and take the concentric circles that the center of described projection is the center of circle.

8. semiconductor freezer according to claim 1, is characterized in that described semiconductor cooling device comprises:

Semiconductor chilling plate, is arranged at the outside of the rear wall of described inner bag, and its cold junction is as the low-temperature receiver of described semiconductor freezer;

Cold scattering fin assembly, it comprises:

Conduction cooling plate, be arranged at opposing in a side of described air duct cover board, thermally coupled with the cold junction of described semiconductor chilling plate;

Many cold scattering heat pipes, the bending forward and extend to relative second section parallel with described conduction cooling plate from itself and hot linked the first section of described conduction cooling plate of every described cold scattering heat pipe;

Cold scattering fin, is arranged on the second section of described many cold scattering heat pipes, and its opposing side in described air duct cover board contacts in described conduction cooling plate;

Described cold scattering fin is installed to be through described construction opening and stretches in described air channel.

9. semiconductor freezer according to claim 8, is characterized in that

Described cold scattering fin has the draw-in groove with hook formation with respect to a side of described air duct cover board;

The both sides of described cold scattering blower fan are provided with anchorage bar, described anchorage bar is installed in described draw-in groove, so that described cold scattering blower fan is fixed on described cold scattering fin, with by the air-flow sucking chamber between described storing, blow to after described cold scattering fin, pass described cold scattering fin and discharge by described air outlet along described air channel.

10. semiconductor freezer according to claim 8, characterized by further comprising:

Heat insulation layer, is arranged between described conduction cooling plate and described semiconductor chilling plate;

Cold transfer block, embeds described heat insulation layer inner;

The opposing side in described air duct cover board of described conduction cooling plate is thermally coupled by the cold junction of described cold transfer block and described semiconductor chilling plate.

11. semiconductor freezers according to claim 1, characterized by further comprising:

Heat elimination assembly, thermally coupled with the hot junction of described semiconductor chilling plate, for to described hot-side heat dissipation, described heat elimination assembly comprises:

Heat-conducting plate, itself and described hot junction are thermally coupled;

Many heat radiation heat pipes, the bottom of every described heat radiation heat pipe and described heat-conducting plate contact heat-exchanging;

Radiating fin, is arranged at described many heat radiation heat pipe tops; With

Cooling fan, is fixed on described radiating fin by retention mechanism opposing in a side of described air duct cover board, for generation of radiating airflow.