CN104329853B - Semiconductor refrigeration refrigerator and manufacturing method thereof - Google Patents
Semiconductor refrigeration refrigerator and manufacturing method thereof Download PDFInfo
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- CN104329853B CN104329853B CN201410437802.9A CN201410437802A CN104329853B CN 104329853 B CN104329853 B CN 104329853B CN 201410437802 A CN201410437802 A CN 201410437802A CN 104329853 B CN104329853 B CN 104329853B
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- side heat
- inner bag
- heat pipes
- semiconductor
- cool side
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 152
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000005057 refrigeration Methods 0.000 title abstract description 14
- 239000000758 substrate Substances 0.000 claims description 51
- 238000012546 transfer Methods 0.000 claims description 49
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 44
- 229910002804 graphite Inorganic materials 0.000 claims description 44
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- 238000009833 condensation Methods 0.000 claims description 35
- 230000005494 condensation Effects 0.000 claims description 35
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 238000010025 steaming Methods 0.000 claims description 3
- 239000005439 thermosphere Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 12
- 238000001704 evaporation Methods 0.000 abstract description 4
- 230000008020 evaporation Effects 0.000 abstract description 4
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Abstract
The invention relates to a semiconductor refrigeration refrigerator and a manufacturing method thereof. The invention provides a semiconductor refrigeration refrigerator which comprises an inner container, a semiconductor module and at least one cold end heat pipe for transferring cold energy of the semiconductor module to the inner container, wherein at least part of an evaporation section of each cold end heat pipe is welded on the outer surface of the inner container. In addition, the invention also provides a manufacturing method of the semiconductor refrigeration refrigerator. In the semiconductor refrigeration refrigerator and the manufacturing method thereof, at least part of the evaporation section of each cold end heat pipe is welded on the outer surface of the inner container, so that the surface of the inner container can be fully utilized as a cooling surface, and natural convection cooling is performed inside the inner container, so that the semiconductor refrigeration refrigerator is energy-saving, environment-friendly, high in reliability, simple in structure, convenient to install and high in adaptability.
Description
Technical field
The present invention relates to refrigerator, particularly relate to a kind of semiconductor freezer and manufacture method thereof.
Background technology
Conventional refrigerator use freon as cold-producing medium, and dynamic using compressor as refrigerator inside working medium circulation
Power, also exists pollution problems such as depletions of the ozone layer, does not meets the environmental requirement of country.Semiconductor refrigerating,
It is also called freezing by thermoelectric action, thermoelectric cooling.Compared with traditional steam compression type refrigeration mode, quasiconductor system
Cold without compressor, cold-producing medium, the advantages such as cooling activation is rapid, simple in construction, noiselessness, therefore recognized
For being a kind of environmental-protection refrigeration mode contributing to solving ozone layer destroying problem.Meanwhile, semiconductor refrigerating also has
The advantages such as refrigerator volume is little, mobile, easy for installation, its refrigerating capacity can become between milliwatt level to multikilowatt
Changing, the refrigeration temperature difference can adjust in the range of 20～150 DEG C, therefore cools down at electronic devices and components, and small-sized refrigerating sets
Standby, military, armarium, there is a lot of application in the field such as scientific research, and what is more important semiconductor refrigerating is opened
Ward off a Ge Xin branch of Refrigeration Technique, solve a refrigeration difficult problem for many occasions.Particularly recently as
Our people's growth in the living standard, semiconductor refrigerating is at domestic necks such as small refrigerator, water dispenser, dehumidifiers
The application in territory is promoted rapidly.
At present, on market, most of semiconductor freezers use radiation aluminium groove or heat pipe set fin as heat radiation mould
Block, and under aerofoil fan effect, carry out forced convertion heat radiation (cold scattering), this cold hot-side heat dissipation (cold scattering)
Mode, although ensure that temperature and the requirement of cold preservation indoor air temperature in semiconductor cooling hot junction, but also
There are some problems, need to consume extra electric energy as realized the aerofoil fan of forced convertion, simultaneously along with axle
The time that flow fan runs increases, and its noise produced and fault rate are the most increasing, affect the comfortable of indoor
Property, additionally, refrigerator is indoor according to forced convertion cold scattering, also need aluminum liner is slotted, easily cause cold
Leakage.
Summary of the invention
One purpose of first aspect present invention is intended to overcome at least one defect of refrigerator of the prior art,
Thering is provided a kind of semiconductor freezer, cool side heat pipes can be fixed on inner bag to make full use of by effectively
Inner bag surface is as cold scattering face, and extra electric energy, noise be low and failure rate is low without consuming.
One of first aspect present invention further objective is that the homogeneous temperature distribution on inner bag surface to be made.
Another of first aspect present invention further objective is that and to improve semiconductor freezer as far as possible
Efficiency.
One purpose of second aspect present invention is to provide for a kind of for any of the above-described kind of semiconductor refrigerating ice
The manufacture method of case.
According to the first aspect of the invention, the invention provides a kind of semiconductor freezer, including inner bag and
Semiconductor module and the cold of described semiconductor module is reached at least cool side heat pipes of described inner bag,
Especially, at least part of evaporator section of every described cool side heat pipes is welded in the outer surface of described inner bag.
Alternatively, at least part of evaporator section by every described cool side heat pipes is welded in the outer surface of described inner bag
Carried out by soldering.
Alternatively, the removing of the gallbladder wall described inner bag being welded with at least part of evaporator section of described cool side heat pipes is used
Arrange on remaining outer surface after the outer surface of at least part of evaporator section of every described cool side heat pipes of welding
There is graphite film.
Alternatively, the evaporator section of every described cool side heat pipes includes being positioned at the condensation segment both sides of this cool side heat pipes
First evaporator section and the second evaporator section.
Alternatively, the first evaporator section of every described cool side heat pipes and at least part of pipeline section of the second evaporator section divide
The outer surface of two opposing sidewalls of described inner bag it is not welded in along horizontal longitudinal direction.
Alternatively, the quantity of described at least cool side heat pipes is at least two, a part of described cool side heat pipes
In the first evaporator section of every cool side heat pipes and at least part of pipeline section of the second evaporator section indulge along level respectively
The outer surface of two opposing sidewalls of described inner bag it is welded in, in cool side heat pipes described in remainder to direction
First evaporator section of every cool side heat pipes and at least part of pipeline section of the second evaporator section are all along horizontal longitudinal direction
It is welded in the outer surface of the roof of described inner bag.
Alternatively, described semiconductor module includes: semiconductor chilling plate；With cold end heat transfer substrate, its
It is installed into the cold end thermally coupled making its rear surface with described semiconductor chilling plate, on described cold end heat transfer substrate
Being formed with at least one holding tank, each described holding tank is configured to accommodate a corresponding described cool side heat pipes
At least partly condensation segment.
Alternatively, the outer surface of the rear wall of described inner bag is provided with graphite film, described cold end heat transfer substrate
Front surface contacts against with the graphite film on the outer surface of the rear wall of described inner bag.
Alternatively, described semiconductor module farther includes: cool guiding block, its rear surface and described quasiconductor system
The cold end in contact of cold against, its front surface contacts against with the rear surface of described cold end heat transfer substrate；And tool
Having the cold and hot end thermal insulation layer of central opening, described semiconductor chilling plate and described cool guiding block are arranged on described central authorities
In opening, the hot junction of described semiconductor chilling plate protrudes from or flushes in the rear side of described cold and hot end thermal insulation layer
Face, the front surface of described cool guiding block protrudes from or flushes in the leading flank of described cold and hot end thermal insulation layer；And heat
End heat transfer substrate, its front surface contacts against with the hot junction of described semiconductor chilling plate.
Alternatively, the opening of each described holding tank is towards described cool guiding block, so that every described cool side heat pipes
The outer wall of at least part of condensation segment contact against with described cool guiding block.
Alternatively, at least part of evaporator section of every described cool side heat pipes is flat tube.
According to the second aspect of the invention, the invention provides any of the above-described kind of semiconductor refrigerating ice of a kind of manufacture
The manufacture method of case, including:
Card dress step: use fixture by least part of steaming of every cool side heat pipes of described semiconductor freezer
Send out the pre-position of outer surface that section is resisted against the inner bag of described semiconductor freezer；
Welding step: at least part of evaporator section of every cool side heat pipes of described semiconductor freezer is welded
Outer surface in the inner bag of described semiconductor freezer.
Alternatively, described welding step also includes: at least part of evaporator section of cool side heat pipes every described with
Gap between the outer surface of described inner bag fills low temperature tin cream, and sends in reflow soldering, with in described backflow
At least part of evaporator section of every cool side heat pipes of described semiconductor freezer is welded in by brazier described
The outer surface of the inner bag of semiconductor freezer.
Alternatively, before described card dress step, also there is graphite film and apply step, comprising: in described
The removing of the gallbladder wall being welded with at least part of evaporator section of described cool side heat pipes on gallbladder is described cold for welding every
Graphite spraying coating or stickup on remaining outer surface after the outer surface of at least part of evaporator section of end heat pipe
Graphite film；And/or, graphite spraying coating or stickup graphite film on the outer surface of the rear wall of described inner bag.
Alternatively, also included before described card dress step: by pressure-riveting process by every described cool side heat pipes
At least part of condensation segment embed the cold end heat transfer substrate of semiconductor module of described semiconductor freezer
In corresponding holding tank.
Alternatively, also there is after described welding step semiconductor module fixing step, comprising:
Formed after the semiconductor chilling plate of described semiconductor module, cool guiding block are installed on cold and hot end thermal insulation layer
The front surface of the first pre-arrangement is resisted against the rear surface of described cold end heat transfer substrate；
The front surface of the hot junction heat transfer substrate of described semiconductor module is resisted against described semiconductor chilling plate
Hot junction；
Multiple screws are sequentially passed through respectively the respective through hole on the heat transfer substrate of described hot junction, described cold and hot end every
Screw on described inner bag rear wall after respective through hole on thermosphere and the respective through hole on described cold end heat transfer substrate
Screw hole in, described semiconductor module to be fixed on the rear wall of described inner bag.
Because by least portion of every cool side heat pipes in the semiconductor freezer of the present invention and manufacture method thereof
Evaporator section is divided to be welded in the outer surface of inner bag, therefore, it is possible to securely cool side heat pipes is fixed on inner bag, with
Make full use of inner bag surface as cold scattering face, and inner bag internal free convection refrigeration, so that this quasiconductor system
Cold refrigerator noise is low, energy-conserving and environment-protective, reliability are high, and simple in construction, easy for installation, strong adaptability.
Further, due to the part gallbladder wall of inner bag in the semiconductor freezer of the present invention and manufacture method thereof
On be provided with graphite film, to utilize the horizontal high thermal conductivity of graphite film, cold cool side heat pipes spread out of is uniform
Be dissipated into inner bag surface.
Further, due to cool side heat pipes special in the semiconductor freezer of the present invention and manufacture method thereof
Structure, substantially increase biography cold efficiency and the efficiency of refrigerator.
Further, due in the semiconductor freezer of the present invention and manufacture method thereof cold end heat transfer substrate with
Inner bag contacts against, and significantly increases cooling area.
Further, owing to the semiconductor freezer and preparation method thereof of the present invention not having water conservancy diversion in inner bag
Fan, can avoid the probability that moving component breaks down because of situations such as abrasion, collisions, improve and partly lead
System cold refrigerator reliability of operation and life-span.Between storing, chamber interior is in addition to core semiconductor cooling piece, nothing
The auxiliary equipment being required to be any power consumption provides driving force, reduces the power consumption of whole system.
According to below in conjunction with the accompanying drawing detailed description to the specific embodiment of the invention, those skilled in the art will
More understand the above-mentioned of the present invention and other purposes, advantage and feature.
Accompanying drawing explanation
Some describing the present invention the most by way of example, and not by way of limitation in detail are concrete
Embodiment.Reference identical in accompanying drawing denotes same or similar parts or part.Art technology
Personnel are it should be understood that what these accompanying drawings were not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention；
Fig. 2 is the schematic local structural graph of semiconductor freezer according to an embodiment of the invention；
Fig. 3 is the schematic cross sectional views of semiconductor freezer according to an embodiment of the invention；
Fig. 4 is the schematic partial enlarged view in Fig. 3 at A；
Fig. 5 is the schematic local structural graph of semiconductor freezer according to an embodiment of the invention；
Fig. 6 is the schematic local structural graph of semiconductor freezer according to an embodiment of the invention；
Fig. 7 is the schematic partial structurtes of the shell of the semiconductor freezer with one embodiment of the invention
Figure；
Fig. 8 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention；
Fig. 9 is the schematic flow of the manufacture method of semiconductor freezer according to an embodiment of the invention
Figure.
Detailed description of the invention
Fig. 1 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention.Such as Fig. 1
Shown in, and with reference to Fig. 2, embodiments providing a kind of semiconductor freezer, it includes inner bag 10
Cold with semiconductor module 20 and by semiconductor module 20 reaches an at least cold end heat of inner bag 10
Pipe 30.Especially, at least part of evaporator section of every cool side heat pipes 30 is welded in the outer surface of inner bag 10.
Can cool side heat pipes 30 be fixed on inner bag 10 securely by welding, every cool side heat pipes 30 is extremely
Small part evaporator section and inner bag 10 are directly against leaning on, and thermal contact resistance is little, to make full use of inner bag surface as dissipating
Huyashi-chuuka (cold chinese-style noodles), and inner bag internal free convection refrigeration, it is not necessary to fan inside water conservancy diversion, so that this semiconductor refrigerating
Refrigerator energy-saving environmental protection, reliability height, and simple in construction, easy for installation, strong adaptability, it is possible to realize partly leading
System cold refrigerator " zero noise ".
In order to improve heat exchange efficiency further, at least part of evaporator section of every cool side heat pipes 30 is flat tube,
The cross section i.e. abutting in the part cool side heat pipes pipeline section on inner bag 10 is squarish or square circle.Every
At least part of evaporator section of cool side heat pipes 30 can be by soldering in the outer surface of inner bag 10.
Fig. 3 is the schematic cross sectional views of semiconductor freezer according to an embodiment of the invention.Such as Fig. 3
Shown in, and with reference to Fig. 4, inner bag 10 is welded with the gallbladder wall of at least part of evaporator section of cool side heat pipes 30
Remove remaining outer surface after the outer surface of at least part of evaporator section welding every cool side heat pipes 30
It is provided with graphite film, say, that on it, be welded with at least part of evaporation of one or more cool side heat pipes 30
It is provided with graphite film 12, cool side heat pipes 30 to be spread out of at least part of outer surface of the gallbladder wall of the inner bag of section
Cold be uniformly dissipated into the outer surface of the gallbladder wall being welded with cool side heat pipes.In one concrete enforcement of the present invention
In example, the outer surface of two opposing sidewalls of inner bag 10 welds cool side heat pipes 30, then the two of inner bag 10
It is provided with graphite film on the outer surface of individual relative gallbladder wall.The semiconductor freezer of the embodiment of the present invention is abundant
Utilizing the horizontal high thermal conductivity (alternatively referred to as uniform temperature) of graphite film 12, cool side heat pipes 30 spread out of is cold
Amount is uniformly dissipated into the outer surface of the gallbladder wall being welded with cool side heat pipes, so that the gallbladder wall being welded with cool side heat pipes is equal
Distribute cold to room between the storing in inner bag 10 evenly.In the other embodiment of the present invention, inner bag
Graphite film 12 can be provided with on the outer surface of all gallbladder walls of 10.
Those skilled in the art is generally, it is considered that metal inner tube just has thermal conduction characteristic, it is possible to transmitted by cold
To inner bag storing between indoor, and need not samming, but it was found by the inventors of the present invention that directly by every
When the cold of the evaporator section of cool side heat pipes reaches outer surface of liner, the evaporator section of the close cool side heat pipes on inner bag
The temperature in region to make room between the storing in inner bag well below the region of the evaporator section away from cool side heat pipes
The cold that interior various piece absorbs is inconsistent, reduces the biography cold efficiency of semiconductor freezer.At inner bag
At least partly on outer surface, graphite spraying coating or stickup graphite film can make each place indoor between storing
Ratio of catching a cold is more uniform.
In view of the particularity of the structure of inner container of icebox, every cool side heat pipes is designed as by the embodiment of the present invention
The structure of " similar U-shaped ".Specifically, the evaporator section of every cool side heat pipes 30 includes being positioned at this cold end heat
First evaporator section of the condensation segment both sides of pipe 30 and the second evaporator section, the first evaporation of every cool side heat pipes 30
At least part of pipeline section of section and the second evaporator section is respectively perpendicular at least part of condensation of corresponding cool side heat pipes 30
Section.In embodiments of the present invention, the condensation segment of every cool side heat pipes 30 is the intervalve of corresponding cool side heat pipes
Section part, is mainly used in absorbing the cold that semiconductor module 20 produces, such as, every cool side heat pipes 30
Condensation segment can at least include the cold end heat transfer substrate 22 being embedded in semiconductor module 20 of corresponding cool side heat pipes
In portions.As it is shown in figure 5, the first evaporator section of every cool side heat pipes 30 and the second evaporator section
At least part of pipeline section is welded in the outer surface of two opposing sidewalls of inner bag respectively along horizontal longitudinal direction.Such as figure
Shown in 6, the quantity of at least cool side heat pipes 30 is at least two, and every in a part of cool side heat pipes cold
First evaporator section of end heat pipe 30 and at least part of pipeline section of the second evaporator section weld along horizontal longitudinal direction respectively
It is connected to the outer surface of two opposing sidewalls of inner bag 10, every cool side heat pipes in remainder cool side heat pipes
First evaporator section of 30 and at least part of pipeline section of the second evaporator section are all welded in inner bag along horizontal longitudinal direction
The outer surface of the roof of 10.Cool side heat pipes 30 is to arrange, between storing along inner bag 10 two sides and upper surface
The air of indoor top absorbs cold, and temperature reduces, and density increases, and precipitates downwards, thus accelerates between storing
Circulating of room air.
The quantity of at least cool side heat pipes 30 of the present invention can (refrigerating capacity etc.) be closed according to the actual needs
Reason design, the first evaporator section of every cool side heat pipes 30 and the position of the second evaporator section need also dependent on reality
Reset.Such as when refrigerating capacity is within 40W, will be partly by two " U-shaped like " heat pipes
The cold of conductor module conducts the two sides to inner bag 10.When refrigerating capacity is 40～100W, by four
The cold of semiconductor module is conducted the two sides to inner bag 10 by " U-shaped like " heat pipe, it is possible to by three
The cold of semiconductor module is conducted to the two sides of inner bag 10 with by one by root " U-shaped like " heat pipe
The cold of semiconductor module is conducted the upper surface to inner bag 10 by " U-shaped like " heat pipe.In general,
Cold end cold often increases 25W, then need to increase a cool side heat pipes 30.
In some alternate embodiment of the present invention, the first evaporator section of every cool side heat pipes 30 and second
At least part of pipeline section of evaporator section is welded in outside a respective side walls of inner bag along horizontal longitudinal direction respectively
Surface and the outer surface of roof.Such as, the quantity of at least cool side heat pipes 30 can be 2, and one cold
At least part of pipeline section of the first evaporator section of end heat pipe 30 is welded in of inner bag 10 along horizontal longitudinal direction
The outer surface of respective side walls, at least part of pipeline section of the second evaporator section is welded in inner bag 10 along horizontal longitudinal direction
The outer surface of roof；At least part of pipeline section of the first evaporator section of an other cool side heat pipes 30 is along level
Longitudinal direction is welded in the outer surface of a respective side walls of inner bag 10, at least part of pipe of the second evaporator section
Section is welded in the outer surface of the roof of inner bag 10 along horizontal longitudinal direction.
In a preferred embodiment of the invention, semiconductor module 20 can include semiconductor chilling plate 21,
Cold end heat transfer substrate 22, hot junction heat transfer substrate 25 and cool guiding block 23 and have the cold and hot end of central opening every
Thermosphere 24.The quantity of semiconductor chilling plate 21 can be one or more.In embodiments of the present invention, partly lead
The quantity of body cooling piece 21 is one piece.Cold end heat transfer substrate 22 is installed into makes its rear surface and quasiconductor system
The cold end thermally coupled of cold 21, cold end heat transfer substrate 22 is formed at least one holding tank, each receiving
Groove is configured to accommodate at least part of condensation segment of a corresponding cool side heat pipes 30.The rear surface of cool guiding block 23 with
The cold end in contact of semiconductor chilling plate 21 is against, the front surface of cool guiding block 23 and cold end heat transfer substrate 22
Rear surface contacts against, and reaches cold end heat transfer substrate 22 with the cold by semiconductor chilling plate 21.Quasiconductor
Cooling piece 21 and cool guiding block 23 are arranged in the central opening of cold and hot end thermal insulation layer 24, semiconductor chilling plate
The hot junction of 21 protrudes from or flushes in the trailing flank of cold and hot end thermal insulation layer 24, and the front surface of cool guiding block 23 protrudes
In or flush in the leading flank of cold and hot end thermal insulation layer 24, to prevent cold end heat transfer substrate 22 and hot junction from conducting heat base
Cold and hot exchange is carried out between plate 25.The front surface of hot junction heat transfer substrate 25 and the heat of semiconductor chilling plate 21
End in contact against, be transferred in air with the heat by semiconductor chilling plate 21, dispel the heat.Quasiconductor
Cooling piece 21, cold end heat transfer substrate 22, hot junction heat transfer substrate 25 and cool guiding block 23 contact each other
Face heat-conducting silicone grease to be smeared, to reduce contact surface thermal resistance.
In a preferred embodiment of the invention, the outer surface of the rear wall of inner bag 10 is provided with graphite
Film 12, the front surface of cold end heat transfer substrate 22 connects with the graphite film 12 on the outer surface of the rear wall of inner bag 10
Touch against so that cold end heat transfer substrate 22 contacts with graphite film 12, significantly increase cooling area.At this
In some other the embodiment of invention, the opening of each holding tank of cold end heat transfer substrate 22 is in cold end
The rear surface of heat transfer substrate 22 so that the outer wall of at least part of condensation segment of every cool side heat pipes 30 with
Cool guiding block 23 contacts against, so that the condensation segment of every cool side heat pipes 30 and the outer surface of inner bag 10 rear wall
Between there is certain spacing, can prevent the condensation segment of every cool side heat pipes 30 from absorbing on inner bag 10 outer surface
Cold, reduce refrigeration.
Fig. 7 is the schematic partial structurtes of the shell of the semiconductor freezer with one embodiment of the invention
Figure.The semiconductor freezer of the embodiment of the present invention may also include and the heat of semiconductor module 20 reaches half
At least hot side heat 60 of the shell 50 of conductor refrigerator.Every hot side heat 60 at least part of
Condensation segment is welded in the inner surface of shell 50, and is carried out by soldering.I.e. hot side heat 60 can be with warp
The shell 50 crossing plating nickel on surface process carries out soldering connection, to reduce thermal contact resistance.In the present invention one
In alternative embodiment, semiconductor freezer may also include at least one hot junction fixation clip.Each heat
At least part of condensation segment of every hot side heat 60 is fixed on the inner surface of shell 50 by end fixation clip, with
At least part of condensation segment making every hot side heat 60 is posted by the inner surface of shell 50.Semiconductor refrigerating ice
Case using inner surface of outer cover as radiating surface, simplified processing process, cost-effective.
First condensation segment of every hot side heat 60 and at least part of pipeline section of the second condensation segment are respectively along level
Longitudinal direction is fixed on the inner surface of two opposing sidewalls of shell 50.Or, at least hot side heat 60
Quantity be at least three, so that two parts or three parts can be divided into.When being separated into two parts, one
First condensation segment of the every hot side heat 60 in part hot side heat and at least part of pipe of the second condensation segment
Section is fixed on the inner surface of two opposing sidewalls of shell 50, remainder heat respectively along horizontal longitudinal direction
First condensation segment of the every hot side heat 60 in end heat pipe and the equal edge of at least part of pipeline section of the second condensation segment
Horizontal longitudinal direction is fixed on the inner surface of the roof of shell 50.When being separated into three parts, a part
First condensation segment of the every hot side heat 60 in hot side heat and at least part of pipeline section of the second condensation segment divide
The inner surface of two opposing sidewalls of shell 50, another part hot junction heat it is not fixed on along horizontal longitudinal direction
First condensation segment of the every hot side heat 60 in pipe and at least part of pipeline section of the second condensation segment are all along level
Longitudinal direction is fixed on the inner surface of the roof of shell 50, every hot junction heat in remainder hot side heat
Outside first condensation segment of pipe 60 and at least part of pipeline section of the second condensation segment are all fixed on along horizontal longitudinal direction
The inner surface of the diapire of shell 50.
Being also formed with at least one holding tank on hot junction heat transfer substrate 25, each holding tank is configured to accommodate one
At least part of evaporator section of the corresponding hot side heat of root 60.The opening of each holding tank is in hot junction heat transfer substrate
The front surface of 25, so that the outer wall of at least part of evaporator section of every hot side heat 60 and quasiconductor system
The hot junction of cold contacts against.The rear surface of hot junction heat transfer substrate 25 connects with the inner surface of the rear wall of shell 50
Touch against.It is also equipped with graphite film 51, to improve radiating efficiency at least part of inner surface of shell 50.
At least part of condensation segment of every hot side heat 60 is flat tube.
Fig. 8 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention.At this
In bright embodiment, the radiating mode of semiconductor freezer may be used without hot side fin chunk 70 and dispels the heat.
Hot side fin chunk 70 includes similar U-shaped heat radiation heat pipe and the multiple of the condensation segment being sleeved on heat radiation heat pipe dissipate
Hot fin, it utilizes surrounding air in the effect of density contrast, makes air vent from semiconductor freezer rear wall
Entering radiating area, flow through cooling fin surfaces, then from rear wall, vent flows out and takes away radiating fin
Heat.
In one embodiment of the invention, inner bag 10, cold end heat transfer substrate 22 and hot junction heat transfer substrate 25
And shell 50 all uses aluminium alloy 6061 and utilizes aluminium section bar cold extruding formation process one-body molded and right
It carries out plating nickel on surface process, and its gap is carried out argon arc welding, utilizes drilling machine to hole in relevant position.Additionally,
Shell 50 outer surface can cover ABS hard material.The material of cool guiding block 23 can use heat transfer efficiency higher
Copper product.Inner bag 10, cold end heat transfer substrate 22, cool guiding block 23 and hot junction heat transfer substrate 25 and outer
Shell 50 may be used without other metal material.
Cool side heat pipes 30 and hot side heat 60 mainly use copper product, the working medium in cool side heat pipes 30
Can be ethanol or methanol, the working medium in hot side heat 60 can be deionized water.In order to ensure semiconductor refrigerating
The temperature of the cold and hot end of sheet 21 and the temperature difference, single cool side heat pipes 30 and hot side heat 60 are at the power of 25W
Under test condition, its temperature difference is necessarily less than 5 DEG C.Cool side heat pipes 30 and hot side heat 60 through oversintering, fluid injection,
It is initially formed round directly-heated pipe after evacuation, degasification and sealing after technique, then utilizes punch press and pressing mold by circle directly-heated
Pipe strikes out required form, such as flat tube shape, also needs its surface is carried out finish turning processing after flattening, to ensure
Flatness.Using ambient humidity relatively big, also needing cool side heat pipes 30 and hot side heat 60 surface
Learn nickel plating, and carry out Salt frog test, to avoid cool side heat pipes to be corroded.
The cold and hot end thermal insulation layer 24 of semiconductor module 20 uses polyurethane foam material, is sent out by mould one
Soak type, is then holed in its relevant position, and by semiconductor chilling plate 21 and cool guiding block 23 interference fit
Be positioned in central opening.
Fig. 9 is the schematic flow of the manufacture method of semiconductor freezer according to an embodiment of the invention
Figure.The embodiment of the present invention additionally provides a kind of manufacture method manufacturing any of the above-described kind of semiconductor freezer,
Comprising:
Card dress step: use fixture by least part of evaporator section of every cool side heat pipes of semiconductor freezer
It is resisted against the pre-position of the outer surface of the inner bag of semiconductor freezer.With
Welding step: at least part of evaporator section of every cool side heat pipes of semiconductor freezer is welded in half
The outer surface of the inner bag of conductor refrigerator.
Specifically, welding step also includes: outside at least part of evaporator section of every cool side heat pipes with inner bag
Gap between surface fills low temperature tin cream, and sends in reflow soldering, with in reflow soldering by quasiconductor system
At least part of evaporator section of every cool side heat pipes of cold refrigerator is welded in outside the inner bag of semiconductor freezer
Surface.
In some embodiments of the invention, before card dress step, also there is graphite film and apply step, its bag
Include: on inner bag, be welded with the removing of gallbladder wall of at least part of evaporator section of cool side heat pipes for welding every cold end
Graphite spraying coating or stickup stone on remaining outer surface after the outer surface of at least part of evaporator section of heat pipe
Ink film；And/or on the outer surface of the rear wall of inner bag graphite spraying coating or paste graphite film.Additionally, also
Can on the outer surface of other gallbladder wall of inner bag graphite spraying coating or paste graphite film, say, that stone
Ink film applies step and also is understood as: the removing at the predetermined gallbladder wall of inner bag is used for welding every cold end
Graphite spraying coating or stickup stone on remaining outer surface after the outer surface of at least part of evaporator section of heat pipe
Ink film, to form graphite film layer, the predetermined gallbladder wall of inner bag at least include rear wall and/or its on be welded with
The gallbladder wall of at least part of evaporator section of one or more cool side heat pipes.
Such as, in one specific embodiment of the present invention, on the outer surface of two opposing sidewalls of inner bag
It is welded with at least part of evaporator section of cool side heat pipes.It will be appreciated by persons skilled in the art that can only including
Graphite spraying coating or stickup graphite film on the outer surface of two opposing sidewalls of gallbladder, with by semiconductor module
Uniformly distributed two opposing sidewalls to inner bag of cold so that catching a cold uniformly inside inner bag；Also can be only
Graphite spraying coating or paste graphite film on the outer surface of the rear wall of inner bag, cold with by semiconductor module
Cold on end heat transfer substrate is transferred directly to inner bag rear wall；Also can be at the two of inner bag opposing sidewalls and rear wall
Outer surface on graphite spraying coating or paste graphite film；Also stone can be sprayed on whole outer surfaces of inner bag
Ink coating or stickup graphite film.Above-mentioned four kinds of situations, can enter according to the work requirements of semiconductor freezer
Row selects.
In the other embodiment of the present invention, may also include that before card dress step will by pressure-riveting process
At least part of condensation segment of every cool side heat pipes embeds the cold end of the semiconductor module of semiconductor freezer and passes
In the corresponding holding tank of hot substrate.
May also include semiconductor module fixing step after the welding step.Specifically, semiconductor module is fixed
Step is: formed after the semiconductor chilling plate of semiconductor module, cool guiding block are installed on cold and hot end thermal insulation layer
The front surface of the first pre-arrangement is resisted against the rear surface of cold end heat transfer substrate.The hot junction of semiconductor module is passed
The front surface of hot substrate is resisted against the hot junction of semiconductor chilling plate.Multiple screws sequentially pass through hot junction respectively pass
Leading to accordingly on the respective through hole on hot substrate, the respective through hole on cold and hot end thermal insulation layer and cold end heat transfer substrate
Screw in behind hole in the screw hole on inner bag rear wall, semiconductor module to be fixed on the rear wall of inner bag.
Semiconductor module fixing step also includes: by pressure-riveting process by least portion of every hot side heat
In dividing the corresponding holding tank of hot junction heat transfer substrate of the semiconductor module of evaporator section embedding semiconductor freezer.
At least part of condensation segment of every hot side heat of semiconductor freezer is fixed on semiconductor freezer
Shell remove rear wall inner surface after remaining inner surface on, to form the second pre-arrangement.To partly lead
The front surface of the hot junction heat transfer substrate of module is resisted against the hot junction of semiconductor chilling plate, namely pre-by second
Arrangement is arranged on inner bag.
Foaming step is also included: by the rear wall of the shell of semiconductor freezer after semiconductor module fixing step
Together with being fixed by screws in the remainder of shell, filled polyurethane foaming between shell and inner bag
Layer, to completely cut off cold leakage indoor between storing.
The most also include door body installation steps: at the Qianmen of semiconductor freezer and shell
Magnetic sealing strip is installed in contact position, Qianmen is passed through hinge together with housing hinge.
It should be noted that above-mentioned steps has been able to make semiconductor freezer be operated, but in order to attractive in appearance
Or other requirement, in addition it is also necessary to install the parts etc. of some ornamental member, protectiveness.
So far, although those skilled in the art will appreciate that and the most detailed illustrate and describing the present invention's
Multiple exemplary embodiments, but, without departing from the spirit and scope of the present invention, still can be according to this
Disclosure of invention directly determines or derives other variations or modifications of many meeting the principle of the invention.Cause
This, the scope of the present invention is it is understood that and regard as covering other variations or modifications all these.
Claims (15)
1. a semiconductor freezer, including inner bag and semiconductor module and by described semiconductor module
Cold reaches at least cool side heat pipes of described inner bag, it is characterised in that
At least part of evaporator section of every described cool side heat pipes is welded in the outer surface of described inner bag；And
Described semiconductor module includes:
Semiconductor chilling plate；With
Cold end heat transfer substrate, it is installed into makes its rear surface connect with the cold end heat of described semiconductor chilling plate
Connecing, described cold end heat transfer substrate is formed at least one holding tank, each described holding tank is configured to accommodate
At least part of condensation segment of a piece corresponding described cool side heat pipes.
Semiconductor freezer the most according to claim 1, it is characterised in that
It is to pass through by the outer surface that at least part of evaporator section of every described cool side heat pipes is welded in described inner bag
Soldering is carried out.
Semiconductor freezer the most according to claim 1, it is characterised in that
The removing of gallbladder wall of at least part of evaporator section of described cool side heat pipes it is welded with for welding on described inner bag
It is provided with graphite on remaining outer surface after the outer surface of at least part of evaporator section of every described cool side heat pipes
Film.
Semiconductor freezer the most according to claim 1, it is characterised in that
The evaporator section of every described cool side heat pipes includes the first steaming being positioned at the condensation segment both sides of this cool side heat pipes
Send out section and the second evaporator section.
Semiconductor freezer the most according to claim 4, it is characterised in that
First evaporator section of every described cool side heat pipes and at least part of pipeline section of the second evaporator section are respectively along water
Flat longitudinal direction is welded in the outer surface of two opposing sidewalls of described inner bag.
Semiconductor freezer the most according to claim 4, it is characterised in that
The quantity of described at least cool side heat pipes is at least two, every in a part of described cool side heat pipes
First evaporator section of cool side heat pipes and at least part of pipeline section of the second evaporator section weld along horizontal longitudinal direction respectively
It is connected to the outer surface of two opposing sidewalls of described inner bag, every cold end in cool side heat pipes described in remainder
First evaporator section of heat pipe and at least part of pipeline section of the second evaporator section are all welded in institute along horizontal longitudinal direction
State the outer surface of the roof of inner bag.
Semiconductor freezer the most according to claim 1, it is characterised in that
Be provided with graphite film on the outer surface of the rear wall of described inner bag, the front surface of described cold end heat transfer substrate with
Graphite film on the outer surface of the rear wall of described inner bag contacts against.
Semiconductor freezer the most according to claim 1, it is characterised in that described semiconductor module
Farther include:
Cool guiding block, the cold end in contact of its rear surface and described semiconductor chilling plate against, its front surface is with described
The rear surface of cold end heat transfer substrate contacts against；With
Having the cold and hot end thermal insulation layer of central opening, described semiconductor chilling plate and described cool guiding block are arranged on institute
Stating in central opening, the hot junction of described semiconductor chilling plate protrudes from or flushes in described cold and hot end thermal insulation layer
Trailing flank, the front surface of described cool guiding block protrudes from or flushes in the leading flank of described cold and hot end thermal insulation layer；With
And
Hot junction heat transfer substrate, its front surface contacts against with the hot junction of described semiconductor chilling plate.
Semiconductor freezer the most according to claim 8, it is characterised in that
The opening of each described holding tank is towards described cool guiding block, so that at least portion of every described cool side heat pipes
The outer wall dividing condensation segment contacts against with described cool guiding block.
Semiconductor freezer the most according to claim 1, it is characterised in that
At least part of evaporator section of every described cool side heat pipes is flat tube.
The manufacture method of semiconductor freezer according to any one of 11. 1 kinds of claim 1 to 10, it is special
Levy and be, including:
Card dress step: use fixture by least part of steaming of every cool side heat pipes of described semiconductor freezer
Send out the pre-position of outer surface that section is resisted against the inner bag of described semiconductor freezer；
Welding step: at least part of evaporator section of every cool side heat pipes of described semiconductor freezer is welded
Outer surface in the inner bag of described semiconductor freezer.
12. manufacture methods according to claim 11, it is characterised in that described welding step also includes:
Fill to gap between at least part of evaporator section of cool side heat pipes and the outer surface of described inner bag every described
Note low temperature tin cream, and sends in reflow soldering, with in described reflow soldering by described semiconductor freezer
At least part of evaporator section of every cool side heat pipes be welded in the appearance of inner bag of described semiconductor freezer
Face.
13. manufacture methods according to claim 11, it is characterised in that before described card dress step
Also there is graphite film and apply step, comprising:
Described inner bag is welded with the removing of gallbladder wall of at least part of evaporator section of described cool side heat pipes for welding
Graphite spraying on remaining outer surface after the outer surface of at least part of evaporator section connecing every described cool side heat pipes
Coating or stickup graphite film；And/or
Graphite spraying coating or stickup graphite film on the outer surface of the rear wall of described inner bag.
14. manufacture methods according to claim 11, it is characterised in that before described card dress step
Also include: by pressure-riveting process, at least part of condensation segment of every described cool side heat pipes is embedded described quasiconductor
In the corresponding holding tank of the cold end heat transfer substrate of the semiconductor module of refrigerator.
15. manufacture methods according to claim 14, it is characterised in that after described welding step
Also there is semiconductor module fixing step, comprising:
Formed after the semiconductor chilling plate of described semiconductor module, cool guiding block are installed on cold and hot end thermal insulation layer
The front surface of the first pre-arrangement is resisted against the rear surface of described cold end heat transfer substrate；
The front surface of the hot junction heat transfer substrate of described semiconductor module is resisted against described semiconductor chilling plate
Hot junction；
Multiple screws are sequentially passed through respectively the respective through hole on the heat transfer substrate of described hot junction, described cold and hot end every
Screw on described inner bag rear wall after respective through hole on thermosphere and the respective through hole on described cold end heat transfer substrate
Screw hole in, described semiconductor module to be fixed on the rear wall of described inner bag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410437802.9A CN104329853B (en) | 2014-08-29 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410437802.9A CN104329853B (en) | 2014-08-29 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104329853A CN104329853A (en) | 2015-02-04 |
| CN104329853B true CN104329853B (en) | 2017-01-04 |
Family
ID=
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| CN103193222A (en) * | 2007-05-17 | 2013-07-10 | 株式会社钟化 | Graphite film and graphite composite film |
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| US5239839A (en) * | 1991-06-17 | 1993-08-31 | James Timothy W | Thermal energy storage apparatus enabling use of aqueous or corrosive thermal storage media |
| CN2201630Y (en) * | 1994-06-24 | 1995-06-21 | 瞿德来 | Semiconductor refrigerating and heating device |
| JP2006010120A (en) * | 2004-06-23 | 2006-01-12 | Hitachi Home & Life Solutions Inc | Refrigerator and manufacturing method thereof |
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