JPS5318388A - Air cooled heat sink for flat package type semiconductor device - Google Patents

Air cooled heat sink for flat package type semiconductor device

Info

Publication number
JPS5318388A
JPS5318388A JP9302676A JP9302676A JPS5318388A JP S5318388 A JPS5318388 A JP S5318388A JP 9302676 A JP9302676 A JP 9302676A JP 9302676 A JP9302676 A JP 9302676A JP S5318388 A JPS5318388 A JP S5318388A
Authority
JP
Japan
Prior art keywords
semiconductor device
heat sink
type semiconductor
air cooled
cooled heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9302676A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9302676A priority Critical patent/JPS5318388A/en
Publication of JPS5318388A publication Critical patent/JPS5318388A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Details Of Measuring And Other Instruments (AREA)

Abstract

PURPOSE: To reduce the difference in thermal capacity between fins and a circular cylinder, facilitate brazing operation and reduce weight by hollowing the adiabatic end side of the circular cylinder and providing through-holes perpendicular to its axis in an air cooled heat sink used by contacting the end face of the circular cylinder having a plurality of metal plate fins on its circumference to the flat surface of a flat package type semiconductor device.
COPYRIGHT: (C)1978,JPO&Japio
JP9302676A 1976-08-03 1976-08-03 Air cooled heat sink for flat package type semiconductor device Pending JPS5318388A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9302676A JPS5318388A (en) 1976-08-03 1976-08-03 Air cooled heat sink for flat package type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9302676A JPS5318388A (en) 1976-08-03 1976-08-03 Air cooled heat sink for flat package type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5318388A true JPS5318388A (en) 1978-02-20

Family

ID=14070968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9302676A Pending JPS5318388A (en) 1976-08-03 1976-08-03 Air cooled heat sink for flat package type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5318388A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019159959A1 (en) * 2018-02-19 2019-08-22 株式会社フジキン Piezoelectric element-driven valve and flow volume control device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019159959A1 (en) * 2018-02-19 2019-08-22 株式会社フジキン Piezoelectric element-driven valve and flow volume control device
JPWO2019159959A1 (en) * 2018-02-19 2021-02-04 株式会社フジキン Piezoelectric drive valve and flow control device

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