JPS5318388A - Air cooled heat sink for flat package type semiconductor device - Google Patents
Air cooled heat sink for flat package type semiconductor deviceInfo
- Publication number
- JPS5318388A JPS5318388A JP9302676A JP9302676A JPS5318388A JP S5318388 A JPS5318388 A JP S5318388A JP 9302676 A JP9302676 A JP 9302676A JP 9302676 A JP9302676 A JP 9302676A JP S5318388 A JPS5318388 A JP S5318388A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat sink
- type semiconductor
- air cooled
- cooled heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Details Of Measuring And Other Instruments (AREA)
Abstract
PURPOSE: To reduce the difference in thermal capacity between fins and a circular cylinder, facilitate brazing operation and reduce weight by hollowing the adiabatic end side of the circular cylinder and providing through-holes perpendicular to its axis in an air cooled heat sink used by contacting the end face of the circular cylinder having a plurality of metal plate fins on its circumference to the flat surface of a flat package type semiconductor device.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9302676A JPS5318388A (en) | 1976-08-03 | 1976-08-03 | Air cooled heat sink for flat package type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9302676A JPS5318388A (en) | 1976-08-03 | 1976-08-03 | Air cooled heat sink for flat package type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5318388A true JPS5318388A (en) | 1978-02-20 |
Family
ID=14070968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9302676A Pending JPS5318388A (en) | 1976-08-03 | 1976-08-03 | Air cooled heat sink for flat package type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5318388A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019159959A1 (en) * | 2018-02-19 | 2019-08-22 | 株式会社フジキン | Piezoelectric element-driven valve and flow volume control device |
-
1976
- 1976-08-03 JP JP9302676A patent/JPS5318388A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019159959A1 (en) * | 2018-02-19 | 2019-08-22 | 株式会社フジキン | Piezoelectric element-driven valve and flow volume control device |
JPWO2019159959A1 (en) * | 2018-02-19 | 2021-02-04 | 株式会社フジキン | Piezoelectric drive valve and flow control device |
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