JPS5344189A - Semiconductor laser device - Google Patents

Semiconductor laser device

Info

Publication number
JPS5344189A
JPS5344189A JP11883376A JP11883376A JPS5344189A JP S5344189 A JPS5344189 A JP S5344189A JP 11883376 A JP11883376 A JP 11883376A JP 11883376 A JP11883376 A JP 11883376A JP S5344189 A JPS5344189 A JP S5344189A
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser device
laser element
damaging
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11883376A
Other languages
Japanese (ja)
Other versions
JPS5940318B2 (en
Inventor
Kouji Shinohara
Yoshinori Tsujino
Shoji Doi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JAPAN ELECTRONIC IND DEV ASSOC<JEIDA>
NIPPON DENSHI KOGYO SHINKO
Fujitsu Ltd
Original Assignee
JAPAN ELECTRONIC IND DEV ASSOC<JEIDA>
NIPPON DENSHI KOGYO SHINKO
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JAPAN ELECTRONIC IND DEV ASSOC<JEIDA>, NIPPON DENSHI KOGYO SHINKO, Fujitsu Ltd filed Critical JAPAN ELECTRONIC IND DEV ASSOC<JEIDA>
Priority to JP51118833A priority Critical patent/JPS5940318B2/en
Publication of JPS5344189A publication Critical patent/JPS5344189A/en
Publication of JPS5940318B2 publication Critical patent/JPS5940318B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Semiconductor Lasers (AREA)

Abstract

PURPOSE: Damaging of an element occuring in the difference in the coefficient of thermal expansion between heat sinks and a laser element by radiating heat efficiently from both main surfaces of the laser element.
COPYRIGHT: (C)1978,JPO&Japio
JP51118833A 1976-10-01 1976-10-01 semiconductor laser equipment Expired JPS5940318B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51118833A JPS5940318B2 (en) 1976-10-01 1976-10-01 semiconductor laser equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51118833A JPS5940318B2 (en) 1976-10-01 1976-10-01 semiconductor laser equipment

Publications (2)

Publication Number Publication Date
JPS5344189A true JPS5344189A (en) 1978-04-20
JPS5940318B2 JPS5940318B2 (en) 1984-09-29

Family

ID=14746273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51118833A Expired JPS5940318B2 (en) 1976-10-01 1976-10-01 semiconductor laser equipment

Country Status (1)

Country Link
JP (1) JPS5940318B2 (en)

Also Published As

Publication number Publication date
JPS5940318B2 (en) 1984-09-29

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