JPS5267978A - Boiling-cooling type semiconductor unit - Google Patents
Boiling-cooling type semiconductor unitInfo
- Publication number
- JPS5267978A JPS5267978A JP14417075A JP14417075A JPS5267978A JP S5267978 A JPS5267978 A JP S5267978A JP 14417075 A JP14417075 A JP 14417075A JP 14417075 A JP14417075 A JP 14417075A JP S5267978 A JPS5267978 A JP S5267978A
- Authority
- JP
- Japan
- Prior art keywords
- type semiconductor
- boiling
- semiconductor unit
- cooling type
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain boiling-cooling type semiconductor unit featuring thermal and mechanical high dependability by increasing contact area with cooling agent by making flat the contact surface between element and heat radiator and by providing grooves at the area other than the flat surface.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14417075A JPS5267978A (en) | 1975-12-03 | 1975-12-03 | Boiling-cooling type semiconductor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14417075A JPS5267978A (en) | 1975-12-03 | 1975-12-03 | Boiling-cooling type semiconductor unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5267978A true JPS5267978A (en) | 1977-06-06 |
Family
ID=15355819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14417075A Pending JPS5267978A (en) | 1975-12-03 | 1975-12-03 | Boiling-cooling type semiconductor unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5267978A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
US4694323A (en) * | 1985-04-10 | 1987-09-15 | Hitachi, Ltd. | Apparatus for vapor-cooling a semiconductor |
WO2015010039A1 (en) * | 2013-07-19 | 2015-01-22 | General Electric Company | Method and system for an immersion boiling heat sink |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS502868A (en) * | 1973-05-09 | 1975-01-13 | ||
JPS5018457U (en) * | 1973-06-20 | 1975-02-28 |
-
1975
- 1975-12-03 JP JP14417075A patent/JPS5267978A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS502868A (en) * | 1973-05-09 | 1975-01-13 | ||
JPS5018457U (en) * | 1973-06-20 | 1975-02-28 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
US4694323A (en) * | 1985-04-10 | 1987-09-15 | Hitachi, Ltd. | Apparatus for vapor-cooling a semiconductor |
WO2015010039A1 (en) * | 2013-07-19 | 2015-01-22 | General Electric Company | Method and system for an immersion boiling heat sink |
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