JPS54571A - Semiconductor device and steam used for the same - Google Patents
Semiconductor device and steam used for the sameInfo
- Publication number
- JPS54571A JPS54571A JP6483877A JP6483877A JPS54571A JP S54571 A JPS54571 A JP S54571A JP 6483877 A JP6483877 A JP 6483877A JP 6483877 A JP6483877 A JP 6483877A JP S54571 A JPS54571 A JP S54571A
- Authority
- JP
- Japan
- Prior art keywords
- same
- semiconductor device
- steam used
- pellet
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To reduce position deviation defects of pellets and number of steps by providing grooves for brazing material leading-in and pellet locating on the pellet mounting face of a heat sink.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6483877A JPS54571A (en) | 1977-06-03 | 1977-06-03 | Semiconductor device and steam used for the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6483877A JPS54571A (en) | 1977-06-03 | 1977-06-03 | Semiconductor device and steam used for the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54571A true JPS54571A (en) | 1979-01-05 |
Family
ID=13269768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6483877A Pending JPS54571A (en) | 1977-06-03 | 1977-06-03 | Semiconductor device and steam used for the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54571A (en) |
-
1977
- 1977-06-03 JP JP6483877A patent/JPS54571A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS54571A (en) | Semiconductor device and steam used for the same | |
JPS5314561A (en) | Packaging device of semiconductor device | |
JPS5230167A (en) | Method for production of semiconductor device | |
JPS5339067A (en) | Production of semiconductor device | |
JPS5441665A (en) | Manufacture for semiconductor device | |
JPS5218173A (en) | Soldering method of semiconductor element | |
JPS5236980A (en) | Heat sink for semiconductor devices | |
JPS51140252A (en) | Regenerator | |
JPS52138873A (en) | Automatic positioning method of semiconductor pellets | |
JPS52147065A (en) | Semiconductor device | |
JPS5211769A (en) | Method of adhering semiconductor proper and semiconductor holder | |
JPS5359366A (en) | Semiconductor unit | |
JPS535574A (en) | Manufacture of semiconductor device | |
JPS53126275A (en) | Semiconductor device | |
JPS528787A (en) | Semiconductor device process | |
JPS5267574A (en) | Manufacture for semiconductor device | |
JPS5362473A (en) | Production of semiconductor device | |
JPS53108281A (en) | Manufacture of semiconductor device | |
JPS5419364A (en) | Semiconductor device | |
JPS51132969A (en) | Semiconductor device | |
JPS51114739A (en) | Heating table | |
JPS5374360A (en) | Heat treatment method for compound semiconductor | |
JPS52135667A (en) | Dicing method of semiconductor wafer | |
JPS5383579A (en) | Manufacture of semiconductor device | |
JPS5286064A (en) | Semiconductor device |