JPS553654A - Cooling highly densified circuitry - Google Patents
Cooling highly densified circuitryInfo
- Publication number
- JPS553654A JPS553654A JP7571278A JP7571278A JPS553654A JP S553654 A JPS553654 A JP S553654A JP 7571278 A JP7571278 A JP 7571278A JP 7571278 A JP7571278 A JP 7571278A JP S553654 A JPS553654 A JP S553654A
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- highly densified
- insulating substrate
- circuitry
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To provide highly densified semiconductor element mounting on a circuit substrate, hollow cylinder is covered on its outer surface with an insulating substrate, and on which semiconductor elements are mounted, then cold water is passed inside the cylinder to achieve highly efficient cooling.
CONSTITUTION: A hollow cylinder base 1 is covered on its surface, partially or entirely, with an insulating substrate 5. The surface of the insulating substrate 5 is fixed with a connector 8 in the cylinder axial direction and formed in a circuit substrate by mounting semiconductor elements such as LSI. The cylinder 1 has an inlet 2 at the bottom and an outlet 4 at the top, through which water is passed to cool highly densified circuit composition. Thus, an effective cooling means is provided to high-density circuitry, enabling to extend its application range widely.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7571278A JPS553654A (en) | 1978-06-22 | 1978-06-22 | Cooling highly densified circuitry |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7571278A JPS553654A (en) | 1978-06-22 | 1978-06-22 | Cooling highly densified circuitry |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS553654A true JPS553654A (en) | 1980-01-11 |
Family
ID=13584119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7571278A Pending JPS553654A (en) | 1978-06-22 | 1978-06-22 | Cooling highly densified circuitry |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS553654A (en) |
-
1978
- 1978-06-22 JP JP7571278A patent/JPS553654A/en active Pending
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