JPS553654A - Cooling highly densified circuitry - Google Patents

Cooling highly densified circuitry

Info

Publication number
JPS553654A
JPS553654A JP7571278A JP7571278A JPS553654A JP S553654 A JPS553654 A JP S553654A JP 7571278 A JP7571278 A JP 7571278A JP 7571278 A JP7571278 A JP 7571278A JP S553654 A JPS553654 A JP S553654A
Authority
JP
Japan
Prior art keywords
cylinder
highly densified
insulating substrate
circuitry
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7571278A
Other languages
Japanese (ja)
Inventor
Hideji Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7571278A priority Critical patent/JPS553654A/en
Publication of JPS553654A publication Critical patent/JPS553654A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide highly densified semiconductor element mounting on a circuit substrate, hollow cylinder is covered on its outer surface with an insulating substrate, and on which semiconductor elements are mounted, then cold water is passed inside the cylinder to achieve highly efficient cooling.
CONSTITUTION: A hollow cylinder base 1 is covered on its surface, partially or entirely, with an insulating substrate 5. The surface of the insulating substrate 5 is fixed with a connector 8 in the cylinder axial direction and formed in a circuit substrate by mounting semiconductor elements such as LSI. The cylinder 1 has an inlet 2 at the bottom and an outlet 4 at the top, through which water is passed to cool highly densified circuit composition. Thus, an effective cooling means is provided to high-density circuitry, enabling to extend its application range widely.
COPYRIGHT: (C)1980,JPO&Japio
JP7571278A 1978-06-22 1978-06-22 Cooling highly densified circuitry Pending JPS553654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7571278A JPS553654A (en) 1978-06-22 1978-06-22 Cooling highly densified circuitry

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7571278A JPS553654A (en) 1978-06-22 1978-06-22 Cooling highly densified circuitry

Publications (1)

Publication Number Publication Date
JPS553654A true JPS553654A (en) 1980-01-11

Family

ID=13584119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7571278A Pending JPS553654A (en) 1978-06-22 1978-06-22 Cooling highly densified circuitry

Country Status (1)

Country Link
JP (1) JPS553654A (en)

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