JPS5478670A - High-density packing integrated circuit substrate device - Google Patents

High-density packing integrated circuit substrate device

Info

Publication number
JPS5478670A
JPS5478670A JP14585877A JP14585877A JPS5478670A JP S5478670 A JPS5478670 A JP S5478670A JP 14585877 A JP14585877 A JP 14585877A JP 14585877 A JP14585877 A JP 14585877A JP S5478670 A JPS5478670 A JP S5478670A
Authority
JP
Japan
Prior art keywords
substrate
chip
mounting region
wiring
chip mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14585877A
Other languages
Japanese (ja)
Other versions
JPS5625785B2 (en
Inventor
Etsuro Sasaki
Ken Ogiso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP14585877A priority Critical patent/JPS5478670A/en
Publication of JPS5478670A publication Critical patent/JPS5478670A/en
Publication of JPS5625785B2 publication Critical patent/JPS5625785B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE: To realize a high-density packing as well as the uniformity of the heat resistance of the chip on the substrate by separating the chip mounting region from the heat radiation component mounting region via the ceramic substrate of the heat pipe structure.
CONSTITUTION: Substrate 9 is held by through-hole 16 doubling support 15 with cavity 9-1 provided, and capillary structure (wick W1, W2) 10 is formed. Then the water or the like is put in with a proper amount, and deairing is given until the fixed vapor pressure suited to the conditions is obtained to carry out sealing 11. Then chip mounting land 12 and wiring 13 are provided on the surface of substrate 9 for the IC mounting and wiring use, and through-hole 16 is provided when necessary to inner layer wiring 14 as wall as within support 15 of the substrate. The substrate is divided into two parts: the IC chip is mounted to part 17; and radiation fin is mounted to part 18 respectively. In this constitution, the supply of no cooling air is required to the chip mounting region, so connector 8 can be led out from the four sides of the substrate. Thus, a miniature device along with a high speed can be realized. Furthermore, the noise margin is decreased, ensuring a low power consumption.
COPYRIGHT: (C)1979,JPO&Japio
JP14585877A 1977-12-05 1977-12-05 High-density packing integrated circuit substrate device Granted JPS5478670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14585877A JPS5478670A (en) 1977-12-05 1977-12-05 High-density packing integrated circuit substrate device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14585877A JPS5478670A (en) 1977-12-05 1977-12-05 High-density packing integrated circuit substrate device

Publications (2)

Publication Number Publication Date
JPS5478670A true JPS5478670A (en) 1979-06-22
JPS5625785B2 JPS5625785B2 (en) 1981-06-15

Family

ID=15394697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14585877A Granted JPS5478670A (en) 1977-12-05 1977-12-05 High-density packing integrated circuit substrate device

Country Status (1)

Country Link
JP (1) JPS5478670A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
JP5717922B1 (en) * 2013-12-26 2015-05-13 三菱電機株式会社 Power converter

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050411A (en) * 1973-09-05 1975-05-06
JPS50139969A (en) * 1974-04-30 1975-11-10
JPS523361U (en) * 1975-06-24 1977-01-11

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523361B2 (en) * 1972-03-14 1977-01-27

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050411A (en) * 1973-09-05 1975-05-06
JPS50139969A (en) * 1974-04-30 1975-11-10
JPS523361U (en) * 1975-06-24 1977-01-11

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
JP5717922B1 (en) * 2013-12-26 2015-05-13 三菱電機株式会社 Power converter
WO2015097833A1 (en) * 2013-12-26 2015-07-02 三菱電機株式会社 Power conversion device

Also Published As

Publication number Publication date
JPS5625785B2 (en) 1981-06-15

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