JPS5478670A - High-density packing integrated circuit substrate device - Google Patents
High-density packing integrated circuit substrate deviceInfo
- Publication number
- JPS5478670A JPS5478670A JP14585877A JP14585877A JPS5478670A JP S5478670 A JPS5478670 A JP S5478670A JP 14585877 A JP14585877 A JP 14585877A JP 14585877 A JP14585877 A JP 14585877A JP S5478670 A JPS5478670 A JP S5478670A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chip
- mounting region
- wiring
- chip mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE: To realize a high-density packing as well as the uniformity of the heat resistance of the chip on the substrate by separating the chip mounting region from the heat radiation component mounting region via the ceramic substrate of the heat pipe structure.
CONSTITUTION: Substrate 9 is held by through-hole 16 doubling support 15 with cavity 9-1 provided, and capillary structure (wick W1, W2) 10 is formed. Then the water or the like is put in with a proper amount, and deairing is given until the fixed vapor pressure suited to the conditions is obtained to carry out sealing 11. Then chip mounting land 12 and wiring 13 are provided on the surface of substrate 9 for the IC mounting and wiring use, and through-hole 16 is provided when necessary to inner layer wiring 14 as wall as within support 15 of the substrate. The substrate is divided into two parts: the IC chip is mounted to part 17; and radiation fin is mounted to part 18 respectively. In this constitution, the supply of no cooling air is required to the chip mounting region, so connector 8 can be led out from the four sides of the substrate. Thus, a miniature device along with a high speed can be realized. Furthermore, the noise margin is decreased, ensuring a low power consumption.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14585877A JPS5478670A (en) | 1977-12-05 | 1977-12-05 | High-density packing integrated circuit substrate device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14585877A JPS5478670A (en) | 1977-12-05 | 1977-12-05 | High-density packing integrated circuit substrate device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5478670A true JPS5478670A (en) | 1979-06-22 |
JPS5625785B2 JPS5625785B2 (en) | 1981-06-15 |
Family
ID=15394697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14585877A Granted JPS5478670A (en) | 1977-12-05 | 1977-12-05 | High-density packing integrated circuit substrate device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5478670A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
JP5717922B1 (en) * | 2013-12-26 | 2015-05-13 | 三菱電機株式会社 | Power converter |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5050411A (en) * | 1973-09-05 | 1975-05-06 | ||
JPS50139969A (en) * | 1974-04-30 | 1975-11-10 | ||
JPS523361U (en) * | 1975-06-24 | 1977-01-11 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS523361B2 (en) * | 1972-03-14 | 1977-01-27 |
-
1977
- 1977-12-05 JP JP14585877A patent/JPS5478670A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5050411A (en) * | 1973-09-05 | 1975-05-06 | ||
JPS50139969A (en) * | 1974-04-30 | 1975-11-10 | ||
JPS523361U (en) * | 1975-06-24 | 1977-01-11 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
JP5717922B1 (en) * | 2013-12-26 | 2015-05-13 | 三菱電機株式会社 | Power converter |
WO2015097833A1 (en) * | 2013-12-26 | 2015-07-02 | 三菱電機株式会社 | Power conversion device |
Also Published As
Publication number | Publication date |
---|---|
JPS5625785B2 (en) | 1981-06-15 |
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