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WO2015097833A1 - Power conversion device - Google Patents

Power conversion device

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Publication number
WO2015097833A1
WO2015097833A1 PCT/JP2013/085001 JP2013085001W WO2015097833A1 WO 2015097833 A1 WO2015097833 A1 WO 2015097833A1 JP 2013085001 W JP2013085001 W JP 2013085001W WO 2015097833 A1 WO2015097833 A1 WO 2015097833A1
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WO
Grant status
Application
Patent type
Prior art keywords
heat
power
plate
conversion
portion
Prior art date
Application number
PCT/JP2013/085001
Other languages
French (fr)
Japanese (ja)
Inventor
彰 畑井
加藤 昌則
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring, busbar connections
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A power conversion device comprises a plurality of power conversion modules each having a circuit board portion and a heat dissipating portion and a chassis for housing the power conversion modules, wherein: the circuit board portion includes an insulating substrate mounted in one end-side region of a heat conducting plate and mounted with a power conversion circuit having a semiconductor switching element, said heat conducting plate having a thermal conductivity higher than that of the insulating substrate; and the heat dissipating portion lies in the other end-side region of the heat conducting plate, adjacent to the one end-side region, has a plurality of first air gaps penetrating the heat conducting plate in a thickness direction or a surface direction thereof, and releases the heat conducted from the insulating substrate to the heat conducting plate to cool the insulating substrate. The circuit board portions of the power conversion modules are housed in the chassis while the heat dissipating portions thereof are exposed to the outside.

Description

Power converter

The present invention relates to a power converter.

A power module is a component of the power conversion device may be in a form heating value are mounted on the heat sink larger it is common. That is, the power module is large amount of heat generated during operation. Therefore, power module, it is necessary to provide a cooling structure such as an external cooling fins and cooling fans of the power module to the heat dissipating and cooling the heat. Such cooling structure, in order to inhibit the size and cost of the power converter, a technique to reduce the size of the cooling structure has been studied.

For example, Patent Document 1, can implement the various components, the heat radiating portion of the larger area than the substrate is pulled out the inner conductor layer to the outside is shown a printed wiring board provided. The heat sink is shown to be further mounted as the heat dissipating member on a printed wiring board.

JP 2006-93370 JP

However, for example, when configuring the power conversion device of large capacity by the prior art, such as a plurality of inverter circuits is required, the area of ​​the printed wiring board becomes large. As a result, the power conversion device is increased in size.

Also, for example, to the power module of each inverter circuit, it is necessary to each of the plurality of power modules having a plurality of semiconductor elements. If require multiple power modules, since each of the plurality of power modules is likely to heating, it is desirable to cool each of the plurality of power modules. At this time, the plurality of power modules are cooled by the heat sink, the heat sink size is particularly required volume, also miniaturization and cost reduction because it costs is desired.

The present invention was made in view of the above, downsizing and cost reduction achievable power converter, and obtaining a power conversion module that can realize the power conversion device of interest.

To solve the above problems and achieve the object, a power converting apparatus according to the present invention, insulating substrate power conversion circuit are mounted with a semiconductor element switching element is higher thermal conductivity than said insulating substrate a circuit board unit mounted on one end region of the heat conductive plate, a second end region adjacent to the one end region in the heat conductive plate, a plurality of penetrating the heat-conducting plate in the thickness direction or plane direction the first has a void portion, the insulating substrate and the heat radiating portion for cooling the insulating substrate by radiating the heat conducted to the heat conduction plate, and a plurality of power conversion modules with the plurality of power conversion modules and a housing for accommodating the power conversion module, wherein said circuit board portion in a state in which the heat radiating portion exposed to the outside is accommodated in the housing, characterized by.

According to the present invention, a power conversion apparatus downsizing and cost reduction has been achieved to obtain an effect that.

Figure 1 is a perspective view of the power conversion module according to the first embodiment of the present invention. Figure 2 is a cross-sectional view of the power conversion module according to the first embodiment of the present invention, an A-A sectional view in FIG. Figure 3 is a bottom view of the power conversion module according to the first embodiment of the present invention. Figure 4 is a sectional view showing another example of the power conversion module according to the first embodiment of the present invention. Figure 5 is a perspective view showing a housing for a power converter according to a first embodiment of the present invention. Figure 6 is a sectional view showing a state in which the housing has two power conversion modules are housed. Figure 7 is a sectional view showing a state in which the housing 3 of the power conversion module is accommodated. Figure 8 is a perspective view of the power conversion module according to a second embodiment of the present invention. Figure 9 is a sectional view showing a power conversion module according to Embodiment 2 of the three implementation before bonding. Figure 10 is a sectional view showing a power conversion module according to the three embodiments 2 after joining. Figure 11 is a sectional view showing a state in which the power conversion module according to Embodiment 2 of the two embodiments the housing is accommodated. Figure 12 is a sectional view showing a state in which the power conversion module according to Embodiment 2 of the three embodiments the housing is accommodated. Figure 13 is a diagram illustrating a power conversion module according to a third embodiment of the present invention. Figure 14 is an exploded view of the power conversion module according to a third embodiment of the present invention. Figure 15 is a diagram illustrating a power conversion module according to a fourth embodiment of the present invention. Figure 16 is an exploded view of the power conversion module according to a fourth embodiment of the present invention. Figure 17 is a diagram illustrating a power conversion module according to a fifth embodiment of the present invention. Figure 18 is an exploded view of the power conversion module according to a fifth embodiment of the present invention. Figure 19 is a sectional view showing a power conversion module according to a sixth embodiment of the present invention. Figure 20 is a bottom view showing the power conversion module according to a sixth embodiment of the present invention. Figure 21 is a sectional view showing another power conversion module according to a sixth embodiment of the present invention. Figure 22 is a sectional view showing a power conversion module according to a seventh embodiment of the present invention.

It will be described below in detail with reference to the embodiment of the power converter and the power converter module according to the present invention with reference to the accompanying drawings. The present invention is not limited to the following description, it can be appropriately changed without departing from the scope of the present invention. In the drawings below, for easy understanding, the scale of each member may differ from the actual. The same applies to between the drawings. Further, even in a plan view, it may be hatched for easy understanding.

The first embodiment.
1 to 3 are views illustrating a power conversion module 1 according to a first embodiment of the present invention. Figure 1 is a perspective view of the power conversion module 1. Figure 2 is a cross-sectional view of the power conversion module 1, an A-A sectional view in FIG. Figure 3 is a bottom view of the power conversion module 1. 4 is a sectional view showing another example of the power conversion module 1 according to a first embodiment of the present invention.

Power conversion module 1 according to the first embodiment is a substantially flat, having a circuit board portion 10 and the heat radiating portion 20. The circuit board unit 10 is provided in a region of the one end side in a plane direction of the power conversion module 1 (the X direction in FIGS. 1 to 3 on the right). The circuit board unit 10, the power conversion function is performed. In the circuit board unit 10, the power conversion circuit board 50 on one surface of the heat conductive plate 30 (upper surface) it is disposed. Power conversion circuit board 50, semiconductor switching elements (semiconductor device) power conversion circuit that is configured with 51, are mounted for example on an insulating substrate (printed circuit board) 55, such as a glass epoxy substrate. The power conversion circuit, for example, either or both of the inverter circuit and the converter circuit are mounted. Power conversion circuit board 50 is fixed to the upper surface of the heat conductive plate 30 of the circuit board portion 10 by screws for example.

The power conversion circuit board 50, the wiring 53 provided on the inner layer of the power conversion circuit board 50, the semiconductor switching element 51 provided on an upper layer of the power conversion circuit board 50 are electrically connected. Semiconductor switching element 51, the electrode (junction) 51a of the semiconductor switching elements provided on one surface thereof (lower surface), the wiring 53 via a solder joint 52 is electrically and physically connected. In the semiconductor switching element 51, the electrode of the semiconductor switching element (joint) 51a is provided only on the lower surface (surface facing the insulating substrate 55). The semiconductor switching element 51, for example, silicon: a semiconductor element such as an IGBT or FET using (silicon Si) based semiconductor is used. The portion to which one end portion of the wire 53 protrudes from one end of the power conversion circuit board 50 in the planar direction of the power conversion circuit board 50 (the X direction in FIGS. 1 to 3 on the right), an external circuit power conversion circuit It is input and output terminals 54 for connection.

Heat conducting plate 30, the thermal conductivity than the insulating substrate 55 is high, that is composed of a material having a lower thermal resistance than the insulating substrate 55. Such heat conductive plate 30, for example (low thermal resistance) high aluminum or thermal conductivity such as copper metal plate is used. Further, instead of the metal plate, a high thermal conductivity than the insulating substrate 55, i.e., may be used a substrate having heat resistance and the like lower resin material than that of the insulating substrate 55.

Heat radiating portion 20, in the heat conductive plate 30, the other end side in the planar direction of the power conversion module 1 in the region of the (X-direction on the left side in FIGS. 1 to 3), is provided adjacent to the circuit board portion 10 a cooling structure. Heat radiating portion 20, the area adjacent to the circuit board portion 10 in the heat conductive plate 30 itself, that is, the other end of the area itself of the heat conduction plate 30. Heat radiating portion 20 functions as a heat sink for cooling the power conversion circuit board 50.

The heat radiating portion 20, a plurality of first air gap 31 which penetrates the heat conduction plate 30 in the thickness direction are provided in any pattern. This first gap portion 31, the direction opposite to the first air gap 31 (e.g., a direction perpendicular to the surface direction of the heat conducting plate 30) from is blown cooling air natural cooling or forced air cooling. Cooling air 60, for example as shown in FIG. 2, it is blown to a direction perpendicular the air passage direction in the plane direction of the heat conducting plate 30. When performing forced air cooling, the direction opposite to the first air gap 31 (e.g., a direction perpendicular to the plane direction of the heat conducting plate 30) fan for blowing cooling air from is provided.

In the vicinity of the boundary between the circuit board unit 10 and the heat radiating portion 20, the waterproof and dustproof member 40 is attached to cover the front and back surfaces and side surfaces of the heat conductive plate 30. In FIGS. 1 to 3, a waterproof and dustproof member 40 shows a case provided in the heat radiating portion 20 side from the boundary between the circuit board unit 10 and the heat radiating portion 20. Incidentally, it is not provided by the use condition of the power conversion module 1.

Such power conversion module 1 according to the first embodiment, one in a housing 210 shown in FIG. 5, or a plurality may be implemented constituting the power conversion device 200. Figure 5 is a perspective view showing a housing 210 of the power conversion apparatus according to a first embodiment of the present invention.

Housing 210 is a box-shaped having a substantially rectangular parallelepiped shape. Housing 210 includes an opening 211 for receiving the power conversion module 1 on one side. For example, in FIG. 5, four openings 211 are arranged in parallel in the vertical direction on one side surface of the housing 210. Further, on the upper surface of the housing 210, controls the semiconductor switching element 51 from the outside and connected via the input-output terminals 54 to the power supply line 212, and the input-output terminal 54 for connecting the power conversion circuit to an external power source control terminal 213 for is located.

Figure 6 is a sectional view showing the two states which the power conversion module 1 is housed in the housing 210, corresponding to section B-B in FIG. Figure 7 is a sectional view showing the three states which the power conversion module 1 is housed in the housing 210, corresponding to section B-B in FIG. In FIG. 6, it shows two power conversion module 1 can store a housing 210. Further, FIG. 7 shows a housing 210 capable of housing three power conversion module 1. The number of power housing 210 is capable of accommodating conversion module 1 is not limited, it may be set as appropriate depending on the application.

The housing 210, as shown in FIGS. 6 and 7, the power conversion module 1 is accommodated in the planar direction in the plane in the same direction as the direction of the upper surface of the housing 210 (parallel). Power wiring 212 in the housing 210, is connected to the input and output terminals 54 of each power conversion module 1 accommodated in the housing 210.

When the power conversion module 1 is received in the housing 210, for example, waterproof and dustproof member 40 serves as a stopper, only the circuit board unit 10 in the electric power conversion module 1 is housed in a housing 210. Also, waterproof and dustproof member 40 is sealed to isolate the interior of the housing 210 to seal the gap between the opening 211 and the power conversion module 1 from the outside environment of the housing 210 (water, dust). Thus, the influence of the external environment of the atmosphere, such as for housing 210 is accommodated in the circuit board unit 10 (the power conversion circuit board 50) is cut off, the protection circuit board unit 10 (the power conversion circuit board 50) from the external environment It is. Waterproof and dustproof member 40, if sealing the interior of the opening 211 and the housing 210 to securely seal a gap between the power conversion module 1, the material and shape are not particularly limited.

Heat radiating portion 20 is in a state of being exposed from the housing 210. That is, the heat radiating portion 20 is exposed so as to protrude from the opening 211 to the outside in the plane direction of the upper surface of the housing 210. A plurality of power conversion module 1 accommodated in the housing 210, the first air gap 31 of each of the heat radiating portion 20 exposed from the housing 210 is the same position in the planar direction of the heat conducting plate 30. Further, in the power conversion module 1 adjacent housed in a housing 210, a heat conductive plate 30 of the circuit board portion 10 of the power conversion module 1 on the upper side, the circuit board of the power conversion module 1 located on the lower side the distance between the semiconductor switching element 51 of the 10 is the distance that the insulating distance is secured.

In the power conversion apparatus 200 according to the first embodiment constructed as described above, by driving the power conversion circuit in the circuit board portion 10 which is housed inside the housing 210, specifically the plurality of semiconductor switching elements 51 by the switching operation, the semiconductor switching element 51 generates heat. Heat generated by the semiconductor switching element 51, the electrode (joint) 51a of the semiconductor switching element, the solder joint 52, the wiring 53, via an insulating substrate (printed circuit board) 55, the lower portion of the part of the semiconductor switching element 51 It is conducted to the heat conduction plate 30 in the region. The heat conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51, along the direction indicated by the arrow H in FIG. 2, is conducted to the heat conductive plate 30 of the heat radiating portion 20.

Here, the heat radiating portion 20 are exposed to the outside of the housing 210, heat is radiated from the heat conducting plate 30 exposed to the outside. The heat radiating portion 20, the direction opposite to the first air gap 31 (e.g., in a direction perpendicular plane direction of the heat conducting plate 30) the cooling air 60 is blown from the first air gap 31. Cooling air 60, for example as shown in FIGS. 6 and 7 is blown from the direction perpendicular to the surface direction of the heat conducting plate 30. Thus, the heat radiation is promoted by heat taken away from the heat radiating portion 20 forcibly thermally conductive plate 30 in. Further, a plurality of power conversion module 1 accommodated in the housing 210, the first air gap 31 of the heat radiating portion 20 exposed from the housing 210 is the same position in the plane direction of the substrate 30. Thereby, the cooling wind 60, the first air gap 31 of all of the power conversion module 1 accommodated in the housing 210 can pass through.

Accordingly, all of the power conversion module 1 accommodated in the housing 210, heat conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51 is efficiently radiated in the heat conductive plate 30 of the heat radiating portion 20 that. Thus, in all of the power conversion module 1 accommodated in the housing 210, the electrode (junction) of the semiconductor switching element 51 51a and solder temperature of joint 52 can more efficiently reduce further semiconductor switching element 51 itself It can be reduced in temperature more efficiently, adverse effect on the solder joints 52 by heat (melting), and can further suppress the adverse effect on the semiconductor switching element 51.

By heat of the heat conducting plate 30 of the heat radiating portion 20 as described above is radiated, it arises temperature gradient between the heat conduction plate 30 of the heat conduction plate 30 and the circuit board portion 10 of the heat radiating portion 20. Therefore, heat conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51 is easily conducted to the heat conductive plate 30 of the heat radiating portion 20. Thus, more heat out of the heat is conducted to the heat conductive plate 30 of the heat radiation member 20 will be radiated by the radiation portion 20.

Here, the semiconductor switching element 51, close to the heat radiating portion 20 in the plane direction of the insulating substrate 55 are mounted to the heat radiating portion 20 of the outer edge region. Therefore, heat conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51 is conducted more to the heat conduction plate 30 of the heat radiating portion 20 easily, the heat of more heat out of the heat is the heat radiation portion 20 is radiated is conducted to the conductive plate 30. Moreover, since much heat is conducted to the heat conductive plate 30 of the heat radiating portion 20 from among the heat conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51, the heat conductive plate 30 of the circuit board portion 10 heat is reduced is radiated into the housing 210, the temperature rise in the casing 210 is inhibited. Thus, the semiconductor electrodes (joint) of the switching element 51 can be reduced 51a and solder temperature of joint 52 more efficiently, can more efficiently reduce the power conversion circuit board 50 including a semiconductor switching element 51, due to heat adverse effect on the solder joints 52 (melt) and can further suppress the adverse effect on the semiconductor switching element 51.

Further, in FIGS. 1 to 3, the semiconductor switching element 51 is provided via the non-mounting region 11 on the circuit board unit 10 side from the boundary between the circuit board portion 10 in the surface direction of the substrate 30 and the heat radiating portion 20 , away from the boundary between the circuit board unit 10 and the heat radiating portion 20. Here, the semiconductor switching element 51 is preferably implemented closer to possible heat radiating portion 20 side. Then, the semiconductor switching element 51, as shown in FIG. 4, the end portion of the heat radiating portion 20 of the semiconductor switching element 51 is implemented in accordance with the position of the boundary between the circuit board unit 10 and the heat radiating portion 20 but most preferred. That is, the semiconductor switching element 51 is preferably arranged at the end of the heat radiating portion 20 side of the circuit board unit 10.

Thus, heat conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51 is easily conducted to the heat conductive plate 30 of the heat radiation portion 20, more heat out of the heat of the heat radiating portion 20 is radiated is conducted to the heat conductive plate 30. Moreover, since much heat is conducted to the heat conductive plate 30 of the heat radiating portion 20 from among the heat conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51, the heat conductive plate 30 of the circuit board portion 10 heat is reduced is radiated into the housing 210, the temperature rise in the casing 210 is inhibited. Therefore, the electrode (junction) of the semiconductor switching element 51 the temperature of the 51a and the solder joint 52 can more efficiently reduce, can be further more effectively reduce the temperature of the power conversion circuit board 50 including a semiconductor switching element 51, adverse effect on the adverse effects (melt) and the semiconductor switching element 51 to the solder joints 52 due to heat can be more suppressed.

The first air gap 31 is preferably provided only spaced some distance from the boundary between the circuit board unit 10 and the heat radiating portion 20 in the planar direction of the heat radiating portion 20 (heat conductive plate 30). That is, as shown in FIGS. 2 and 3, the heat radiating portion 20, it is preferable that the outer edge region 21 of the circuit board unit 10 side in the surface direction of the heat radiating portion 20 is not provided with the first air gap 31. That is, the first air gap 31 is preferably provided at a position separated from the circuit board unit 10. Thus, since the heat conducted from the heat conduction plate 30 in the lower region to the heat transfer plate 30 of the heat radiation portion 20 of the semiconductor switching element 51 is dispersed in the surface direction in the heat transfer plate 30 of the heat radiating portion 20, the heat radiation It is efficiently radiated in the section 20.

The heat conductive plate 30, the thermal conductivity than the insulating substrate 55 is high, that is composed of a material having a lower thermal resistance than the insulating substrate 55. Therefore, the electrode (junction) of the semiconductor switching element from the semiconductor switching element 51 51a, solder joint 52, heat conducted to the insulating substrate 55 in the lower region of the semiconductor switching element 51 via the wiring 53, the insulating substrate easily conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51 than the surface direction of 55.

Thus, more heat among the heat conducted to the insulating substrate 55 in the lower region of the semiconductor switching element 51 from the semiconductor switching element 51 is conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51, further radiator It is conducted to the heat conduction plate 30 parts 20. The heat conductive plate 30 to be conducted heat is radiated to the housing 210 of the circuit board portion 10 from the insulating substrate 55 is reduced, the temperature rise in the casing 210 is inhibited. Therefore, the electrode (junction) of the semiconductor switching element 51 the temperature of the 51a and the solder joint 52 can more efficiently reduce, can be further more effectively reduce the temperature of the power conversion circuit board 50 including a semiconductor switching element 51, adverse effect on the adverse effects (melt) and the semiconductor switching element 51 to the solder joints 52 due to heat can be more suppressed.

Further, in order to more heat of the heat conducted to the heat conductive plate 30 of the circuit board portion 10 is conducted to the heat conductive plate 30 of the heat radiating portion 20, from the lower region of the semiconductor switching element 51 the length of the wire 53 to the output terminal 54 as much as possible it is preferable to shorten. By shortening the length of the wire 53, it is prevented that heat conducted to the wiring 53 from the semiconductor switching element 51 is conducted to output terminal 54 side in the wiring 53. Thus, more heat is conducted to the heat conduction plate 30 in the lower region of the semiconductor switching element 51 from the wiring 53 through the insulating substrate 55, it is further conducted to the heat conductive plate 30 of the heat radiating portion 20. Also, the amount of heat is radiated to the housing 210 through the insulating substrate 55 and the heat conduction plate 30 was conducted to the input-output terminal 54 side in the wire 53 is reduced, the temperature rise in the casing 210 is inhibited. Therefore, the electrode (junction) of the semiconductor switching element 51 the temperature of the 51a and the solder joint 52 can more efficiently reduce, can be further more effectively reduce the temperature of the power conversion circuit board 50 including a semiconductor switching element 51, adverse effect on the adverse effects (melt) and the semiconductor switching element 51 to the solder joints 52 due to heat can be more suppressed.

Further, by shortening the length of the wire 53, the power conversion circuit, the noise and the vibration of the unintentional high frequency is generated is suppressed.

In the power conversion module 1 according to the first embodiment configured as described above, the power conversion circuit board 50 in the region of one end side of the heat conduction plate 30 is mounted (the circuit board unit 10), the power conversion circuit the other end of the region where the substrate 50 is not mounted (radiating portion 20) is used as a heat sink (heat radiating plate). Thus, the circuit board unit 10 which functions as a power conversion circuit, to be formed along the surface direction of the heat radiating portion 20 are thermally conductive plate 30 for cooling the circuit board unit 10, a thin power conversion module 1 can be realized.

Further, in the power conversion module 1, a simple structure of only the first air gap 31 a plurality of the single heat conducting plate 30 is provided, the heat radiating portion 20 is configured. Therefore, the heat radiating portion 20 can be formed using only the cut-out and drilling of the heat conducting plate 30, to simplify the manufacturing process of the heat sink (heat radiating plate), it is possible to reduce the manufacturing cost.

The power conversion device 200 according to the first embodiment, since the housing 210 power conversion module 1 of the thin are configured housed, the power conversion device 200 of the thin are feasible.

Further, in the power conversion apparatus 200 according to the first embodiment, by a plurality of power conversion module 1 of the thin are configured housed in parallel in the housing 210, it can be configured a power conversion device of a large capacity it is. In this case, the heat radiating portion 20 in a plurality of power conversion modules 1 are arranged in a state of overlapping in the same region in the planar direction of the power conversion module 1. Therefore, even when the power conversion apparatus 200 using a plurality of power conversion module 1 is configured, the area required as a heat sink (heat radiating plate) is only the area of ​​one of the heat radiating portion 20. This allows a heat sink and miniaturization of the power inverter 200. Therefore, in the power conversion apparatus 200 according to the first embodiment, by arranging superimposed multiple power conversion module 1 on one area of ​​the power conversion device 200, it is possible to realize a large capacity and small-sized power converter .

Further, in the power conversion apparatus 200 according to the first embodiment, it is possible to increase the output capacity by storing stacked a plurality of power conversion module 1 having the same structure in the housing 210. Therefore, even when configuring the power conversion device of large capacity, without increasing the area of ​​the power converter can reduce the amount of conductors used for wiring. Therefore, in the power conversion apparatus 200 according to the first embodiment, it is possible to realize a power converter of large capacity and low cost.

In the first embodiment described above, it may be configured to place the power conversion circuit board 50 on the front and back surfaces of the heat conductive plate of the circuit board unit 10. Accordingly, the heat generated by the semiconductor switching element 51 mounted on the power conversion circuit board 50 on the front and back surfaces of the heat conducting plate to efficiently heat radiating portion 20 can be thermally conductive, as in the first embodiment described above effect can be obtained.

Therefore, according to the first embodiment, a small power converter can be obtained at low cost, an effect that.

The second embodiment.
Figure 8 is a perspective view of the power conversion module 70 according to a second embodiment of the present invention. The power conversion module 70, except that a heat transfer plate 71 larger than the thickness of the heat conducting plate 30 circuit board unit 10 the thickness of the heat radiation member 20 in place of the heat conducting plate 30, according to the first embodiment It has the same configuration and effect as the power conversion module 1. That is, the circuit board unit 10 is provided on one end side of the area in the plane direction of the heat conducting plate 71. Further, the heat radiating unit 20, the heat conductive plate 71, the other end of the area in the plane direction, is provided adjacent to the circuit board unit 10. The first air gap 31 is likewise through the heat conduction plate 71 in the thickness direction and the power conversion module 1. In FIG. 8 shows focused on heat conduction plate 71, are omitted other than among thermal conductive plate 71 of the components of the power conversion module 70.

As shown in FIGS. 8 and 9, the heat radiation portion 20 of the other end of the heat conductive plate 71 at least one of the top end region and a lower surface end region (FIG. 8 and the X-direction on the left side in FIG. 9) the locking portion 72 for laminating fixing the heat radiating portion 20 between the power conversion module 70 superimposed vertically stacked without a gap is provided. Figure 9 is a sectional view showing a power conversion module 70 according to Embodiment 2 of the three implementation before bonding. In FIG. 8, although the locking portion 72 is provided across the entire width of the top surface edge area of ​​the heat radiating portion 20 side of the heat conduction plate 71, the arrangement position of the engaging portion 72 is not limited thereto. The locking portion 72, for example, it is sufficient provided partly in one or more places in the width direction of the upper surface end region and a lower surface end region of the heat radiating portion 20 side of the heat conduction plate 71 may be provided intermittently .

As shown in FIG. 10, locking when the power conversion module 70 are joined by overlapping the provided at an end portion of the heat radiating portion 20 of the power conversion module 70 on the upper side in the power conversion module 70 adjacent and parts 72, are locked engagement portion 72 Togakakari provided at an end portion of the heat radiating portion 20 of the power conversion module 70 located on the lower side. Then, a heat radiating portion 20 of the power conversion module 70 on the upper side in the power conversion module 70 adjacent the heat radiating portion 20 of the power conversion module 70 located on the lower side is no gap junction, fixed in laminated state that. A plurality of power conversion modules 70 joined, the position of the first air gap 31 of the heat radiating portion 20 is the same position in the planar direction of the heat conducting plate 71. Thus, into the gap between the heat radiating portion 20 of the power conversion module 70 is located in the heat radiating portion 20 and the lower side of the power conversion module 70 positioned on the upper side, the leakage of cooling air 60 from the first air gap 31 eliminated, the cooling effect of the heat radiating portion 20 by the cooling air 60 is increased. Figure 10 is a sectional view showing a power conversion module 70 according to Embodiment 2 of the three implementation after bonding.

This effect, as shown in FIGS. 11 and 12, a plurality of power conversion module 70 to the housing 210 is accommodated power converter obtained without change even in a state of being configured. Figure 11 is a sectional view showing a state in which the power conversion module 70 according to Embodiment 2 of the two embodiments the housing 210 is accommodated. Figure 12 is a sectional view showing a state in which the power conversion module 70 according to Embodiment 2 of the three embodiments the housing 210 is accommodated.

Further, in the power conversion module 70 adjacent housed in a housing 210, a heat conductive plate 30 of the circuit board portion 10 of the power conversion module 70 on the upper side, the circuit board of the power conversion module 70 positioned on the lower side insulating distance between the semiconductor switching element 51 of 10 the thickness of the heat conductive plate 30 of the heat radiating portion 20 is ensured is set.

Further, in the power conversion module 70 according to the second embodiment, due to the provision of a locking portion 72 on the end portion of the heat conductive plate 71, alignment and fixation between the heat conduction plate 71 can be easily, the effect that is obtained .

As described above fixed, in the power conversion apparatus according to the second embodiment, the heat radiating portion 20 of the power conversion module 70 is located in the heat radiating portion 20 and the lower side of the power conversion module 70 located on the upper side by the locking portion 72 It is. This eliminates the leakage of cooling air 60 from the first air gap 31 into the gap between the heat radiating portion 20 of the power conversion module 70 is located in the heat radiating portion 20 and the lower side of the power conversion module 70 positioned on the upper side , the cooling effect of the heat radiating portion 20 by the cooling air 60 is increased, the effect is obtained that.

Further, in the power conversion apparatus according to the second embodiment, due to the provision of a locking portion 72 on the end portion of the heat conductive plate 71 of the power conversion module 70, alignment and fixation between the heat conduction plate 71 can be easily referred to effect can be obtained.

Embodiment 3.
Figure 13 is a diagram illustrating a power conversion module 80 according to a third embodiment of the present invention. Power conversion module 80 according to the third embodiment has the same external shape as the power conversion module 70 according to the second embodiment. Therefore, the power conversion module 80 according to the third embodiment, and a power conversion device in which a plurality of power conversion module 80 to the housing 210 is accommodated, the same as in the case of essentially Embodiment 1 and Embodiment 2 It has an effect.

Figure 14 is an exploded view of the power conversion module 80 according to a third embodiment of the present invention. Power conversion module 80 according to the third embodiment, in place of the heat conduction plate 71, the first heat conducting plate 81 and the second heat conducting plate 85 to a second point that heat conducting plate is formed is carried out It differs from such power conversion module 70. A first heat conducting plate 81 and the second heat conducting plate 85 may be made of the same material, or may be composed of different materials.

The first region 82 corresponding to the circuit board portion 10 in the first heat conducting plate 81 is, for example, the same size as the corresponding parts on the circuit board portion 10 of the heat conductive plate 71 according to the second embodiment. Note that in FIG. 13 and 14, the first heat conducting plate 81 is shown focused on the second heat conducting plate 85, the first heat conducting plate 81 among the constituent members of the power conversion module 80 and the second It is omitted other than the heat conductive plate 85.

In the first heat conducting plate 81, second region 83 is a protrusion that is accommodated in the second heat conducting plate 85 is thinner thickness than the first region 82 and protrudes from one side in the surface direction of the first region 82 It is provided with. Note that the second region 83 may be the same thickness as the first region 82.

In the second region 83, a second gap portion 84 is provided at a position corresponding to the position of the first cavity portion 31 provided on the second heat conducting plate 85 when housed in the second heat conducting plate 85 there. That is, the second gap portion 84, when the second region 83 is housed in the second heat conducting plate 85, a first air gap 31 and the second gap portion 84 in the surface direction of the second heat conducting plate 85 are formed so as to mutually the same position. Second gap section 84 through the second region 83 in the thickness direction, are provided in the same pattern as the first air gap 31. Although shows a configuration having a second region 83 of the one in Figure 14, may be configured with two or more second region 83 which is divided.

The second heat conducting plate 85 is, for example, the same size as the portion corresponding to the heat radiating portion 20 of the heat conductive plate 71 according to the second embodiment. The second heat conducting plate 85, to accommodate the second region 83 of the first heat conducting plate 81, provided over the interior from one side to correspond to the shape of the second region 83 of the first heat conducting plate 81 It has an opening 86. The second heat conducting plate 85, except that it has an opening 86, has the same configuration as the portion corresponding to the heat radiating portion 20 of the heat conductive plate 71 according to the second embodiment.

The second region 83 of the first heat conducting plate 81 by being inserted into the opening 86 of the second heat conducting plate 85, and the power conversion module 80 according to the third embodiment. Here, since the second region 83 in the first heat conducting plate 81 is provided with a thin thickness than the first region 82, the side surface of the second region 83 side in the first region 82 serves as a stopper, is aligned It becomes easier. A first heat conducting plate 81 and the second heat conducting plate 85 is fixed by fixing members such as screws, not shown.

In thus constructed power conversion module 80, a second heat conductive plates 85 need relatively thick thickness, and a first heat conducting plate 81 relatively thick thickness is not required can be manufactured separately. That is, the second heat conducting plate 85 may be produced by a method such as cut out from a thick thermally conductive plate. On the other hand, the first heat conducting plate 81 may be produced by a method such as cut out of a thin heat conductive plate and the like. Thus, as compared with the case where cut out from a thick single heat conducting plate according to the thickness of the second thermal conductive plate 85, can reduce the amount of metal, it is possible to reduce the cost.

As described above, in the third embodiment, relatively thick thickness and the second heat conducting plate 85 required, relatively thick thickness and a first heat conducting plate 81 need not be made separately power conversion to produce a module 80. This can reduce the amount of metal, it is possible to reduce the cost of the power conversion module and the power converter.

Embodiment 4.
Figure 15 is a diagram illustrating a power conversion module 90 according to the fourth embodiment of the present invention. Power conversion module 90 according to the fourth embodiment has the same external shape as the power conversion module 80 according to the power conversion module 70 and Embodiment 3 according to the second embodiment. Therefore, the power conversion module 90 according to the fourth embodiment, and a power conversion device in which a plurality of power conversion module 90 to the housing 210 is accommodated, the same as in the case of essentially Embodiment 1 and Embodiment 2 It has an effect.

Figure 16 is an exploded view of the power conversion module 90 according to the fourth embodiment of the present invention. Power conversion module 90 according to the fourth embodiment, a third heat conduction plate 91 having a plurality of line-shaped cut portion instead of the second gap section 84 (slit) 94 is provided in the second region 93, the second that heat conducting plate is composed of the heat conduction plate 85 is different from the power conversion module 80 according to the third embodiment. Therefore, the power conversion module 90 according to the fourth embodiment, and a power conversion device in which a plurality of power conversion module 90 to the housing 210 is accommodated has the same effects as the embodiment 3 basically performed. Note that in FIG. 15 and FIG. 16, a third heat conductive plate 91 is shown focused on the second heat conducting plate 85, and the third heat conduction plate 91 among the constituent members of the power conversion module 90 second It is omitted other than the heat conductive plate 85.

The first region 92 corresponding to the circuit board portion 10 in the third heat conduction plate 91 is the same size as the first region 82 corresponding to the circuit board portion 10 of the first heat conducting plate 81 according for example to the third embodiment that. Further, in the third heat conductive plate 91, second region 93 is a protrusion that is accommodated in the second heat conducting plate 85 is, than the first region 92 and protrudes from one side in the surface direction of the first region 92 It is provided with a thin thickness. Note that the second region 93 may be the same thickness as the first region 82.

The second region 93 extends along the storing direction of the second heat conducting plate 85 of the second region 93, that is, the direction from the first region 92 toward the second region 93 (X direction in FIG. 16) a plurality of line-shaped cut portion 94 is provided. Therefore, in the second region 93, the metal portion is provided in a comb teeth shape. The width of the cut portion 94 (Y direction in FIG. 16) is narrower than the width of the first gap portion 31 of the second heat conducting plate 85 (Y direction in FIG. 16), a plurality within the width of the first air gap 31 provided to include the notch portion 94.

The second region 93 of the third heat conduction plate 91 by being inserted into the opening 86 of the second heat conducting plate 85, and the power conversion module 90 according to the fourth embodiment. A third heat conduction plate 91 and the second heat conducting plate 85 is fixed by fixing members such as screws, not shown.

Then, in the power conversion module 90, a first air gap 31 in the direction (e.g., a direction perpendicular to the plane direction of the second heat conducting plate 85) the second heat conduction plate 85 is blown from the opposite to the first air gap 31 cooling air to flow, the third heat conductive plate 91 by passing through the cut portion 94 of the second region 93 of the second heat conducting plate 85 is cooled.

In thus constructed power conversion module 90, the gap portion provided in the second region 93 of the third heat conduction plate 91 is a line-shaped cut portion 94. Therefore, when assembling the second heat conducting plate 85 by inserting the second region 93 of the third heat conduction plate 91, the gap portion of the second heat conducting plate 85 (the first air gap 31) third heat conduction gap portion of the second region 93 of the plate 91 there is no need to align the (cut section 94), the production of the second heat conducting plate 85 and the third heat conduction plate 91 is facilitated, reducing the processing cost it can.

As described above, in the fourth embodiment, the gap portion provided in the second region 93 of the third heat conduction plate 91 is a line-shaped cut portion 94. Thus, the production of the second heat conducting plate 85 and the third heat conduction plate 91 is facilitated, can be reduced machining cost, it is possible to reduce the cost of the power conversion module and the power converter.

Embodiment 5.
Figure 17 is a diagram illustrating a power conversion module 100 according to a fifth embodiment of the present invention. Figure 18 is an exploded view of the power conversion module 100 according to a fifth embodiment of the present invention. Power conversion module 100 according to the fifth embodiment, in place of the second heat conducting plate 85 and a fourth heat conductive plate 101, third heat conduction shown in the fourth heat conductive plate 101 in the fourth embodiment plate 91 is different from the power conversion module 90 according to a fourth heat conductive plates fourth points embodiment having inclined with inserted appearance shape 101. Therefore, the power conversion module 100 according to the fifth embodiment, and a power conversion device in which a plurality of power conversion module 100 to the housing 210 is accommodated, the same as in the case of essentially Embodiment 1 and Embodiment 2 It has an effect.

As shown in FIGS. 17 and 18, at least one of the fourth top end region of the side where the third heat conduction plate 91 in the heat-conductive plate 101 is inserted opposite a is the other end side and a lower surface end region the is provided likewise the locking portion 103 and the power conversion module 70 according to the second embodiment.

The fourth heat conductive plate 101, as a void portion for passing the cooling air 105, a third gap 104 in place of the first air gap 31. The third air gap portion 104, the side surface of the fourth heat conductive plate 101, are provided by dividing through the pair of side surfaces perpendicular to the side surface of the third heat conduction plate 91 are inserted for example into three layers.

The fourth heat conductive plate 101 has an opening 102 provided over the interior from one side to correspond to the shape of the second region 93 of the third heat conduction plate 91. Opening 102, on the side opposite to the side surface of the side where the locking portion 103 is provided, is provided obliquely with respect to the surface direction of the fourth heat conductive plate 101. Opening 102 is provided so as to extend diagonally example of the side surface.

The second region 93 of the third heat conduction plate 91 by being inserted into the opening 102 of the fourth heat conductive plate 101, the power conversion module 100 according to the fifth embodiment is configured. A third heat conduction plate 91 and the fourth heat conductive plate 101 is fixed by fixing members such as screws, not shown.

Then, in the power conversion module 100, a direction opposite to the third cavity portion 104 (e.g., a direction perpendicular to the surface direction of the sides third gap part 104 is provided) of the fourth heat conductive plate 101 is blown from the 3 cooling air 105 flowing through the gap portion 104, the third heat conductive plate 91 by passing through the cut portion 94 of the second region 93 of the third heat conduction plate 91 are cooled. Then, since the second region 93 of the third heat conduction plate 91 is inserted inclined with respect to the plane direction of the fourth heat conductive plate 101, the cooling air 105 to pass through all of the cut portion 94, the third heat conduction plate 91 is reliably cooled.

In thus constructed power conversion module 100, in a case where the direction of introduction of the cooling air, such as for low profile power converter and the side surface direction of the fourth heat conductive plate 101, the cooling air 105 Third can hit the notch portion 94 of the second region 93 of the heat conduction plate 91, it can be cooled third heat conduction plate 91.

As described above, in the fifth embodiment, the third gap part 104 that penetrates the inter-side surface of the fourth heat conductive plate 101 is provided, the direction of introduction of the cooling air 105 is a surface direction of the fourth heat conductive plate 101 . The second region 93 of the third heat conduction plate 91 is inserted inclined with respect to the plane direction of the fourth heat conductive plate 101. Thus, according to the fifth embodiment, the low height of the power conversion device can be realized.

Embodiment 6.
Figure 19 is a sectional view showing a power conversion module 110 according to the sixth embodiment of the present invention. Figure 20 is a bottom view showing the power conversion module 110 according to the sixth embodiment of the present invention. Power conversion module 110 according to the sixth embodiment in that the heat conductive plate 30 of the circuit board portion 10 and the fourth air gap portion 111 is provided is different from the power conversion module 1 according to the first embodiment. Therefore, the power conversion module 90 according to the sixth embodiment, and a power conversion device in which a plurality of power conversion module 90 to the housing 210 is accommodated has the same effects as the embodiment 1 basically performed.

The fourth air gap portion 111, opposite to the radiating portion 20 than the mounting region of the semiconductor switching element 51 in the planar direction of the heat conductive plate 30, namely the thermal conduction plate 30 in the region of the input-output terminal 54 side, the circuit board unit 10 It provided to extend in the direction along the boundary between the heat radiating portion 20 (Y direction in FIG. 20). In FIG. 19, there is shown a single thin line-shaped fourth gap part 111, not the shape and quantity of the fourth air gap portion 111 is not limited to this. For example, the fourth gap part 111 is divided partially plurality may be provided.

The fourth air gap portion 111, from the side lower end position of the input and output terminals 54 of the semiconductor switching element 51, an angle of 45 degrees to the output terminal 54 side with respect to the normal to the heat conduction plate 30 in the side surface lower end position it is preferably provided on the outer side (input-output terminal 54 side) than the eggplant virtual line. The semiconductor switching device 51 is mainly the easy heat is conducted to the inner (heat radiating portion 20 side) than the virtual line. Thus, by providing the fourth gap part 111 to the position in the heat conductive plate 30, heat conducted from the semiconductor switching element 51 is easily conducted by thermal conduction plate 30 in the lower region of the semiconductor switching element 51, the heat dissipation easily conducted to the heat conduction plate 30 parts 20 side.

Thus, more heat out of the heat conducted from the semiconductor switching element 51, is conducted to the heat conductive plate 30 of the heat radiation member 20, it is radiated. The outer than the imaginary line of the circuit board portion 10 from the insulating substrate 55 is conducted to the heat conduction plate 30 (output terminal 54 side) heat is radiated to the housing 210 is reduced, the housing 210 temperature rise of is suppressed. Therefore, the electrode (junction) of the semiconductor switching element 51 the temperature of the 51a and the solder joint 52 can more efficiently reduce, can be further more effectively reduce the temperature of the power conversion circuit board 50 including a semiconductor switching element 51, adverse effect on the adverse effects (melt) and the semiconductor switching element 51 to the solder joints 52 due to heat can be more suppressed.

Further, as shown in FIG. 21, it may be configured than the imaginary line in the circuit board unit 10 eliminating the heat conductive plate 30 of the outer (input-output terminal 54 side). In this case also obtained the same effect as described above, is conducted to the heat conduction plate 30 and heat is radiated to the housing 210 is reduced, the temperature rise in the casing 210 is inhibited. Figure 21 is a sectional view showing another power conversion module according to a sixth embodiment of the present invention.

As described above, in the sixth embodiment, the fourth gap part 111 is provided in the region of the input-output terminal 54 side of the heat conductive plate 30 of the circuit board unit 10. Thus, since the heat conducted from the semiconductor switching element 51 is easily conducted by thermal conduction plate 30 in the lower region of the semiconductor switching element 51, it tends to heat conduction to the heat conduction plate 30 of the heat radiating portion 20, the heat radiating portion 20 heat dissipation in is promoted.

Embodiment 7.
Figure 22 is a sectional view showing a power conversion module 120 according to a seventh embodiment of the present invention. Power conversion module 120 according to the seventh embodiment, between the power conversion circuit board 50 and the heat conductive plate 30, is that it includes a thermal diffusion sheet 121 has high thermal conductivity than air, according to the first embodiment different from the power conversion module 1. Therefore, the power conversion module 90 according to the seventh embodiment, and a power conversion device in which a plurality of power conversion module 90 to the housing 210 is accommodated has the same effects as the embodiment 1 basically performed.

The mounting surface opposite to the surface of the semiconductor switching element 51 (the back surface) of the power conversion circuit board 50, there is a case where the conductive pattern or the like is formed. In this case, by a conductor pattern or the like, irregularities may occur on the back side of the power conversion circuit board 50. Therefore, in the portion where the conductive pattern or the like on the back surface is provided in the power conversion circuit board 50, the shape of such conductive pattern on the surface of the heat conductive plate 30 that faces the power conversion circuit board 50 so as not to crush a conductor pattern or the like and It is disposed with a recess corresponding to the thickness. As a result, the air layer is formed between the back surface and the heat conductive plate 30 of the power conversion circuit board 50. When such an air layer is present, thermal conductivity between the power conversion circuit board 50 and the heat conductive plate 30 is lowered.

Therefore, in the power conversion module 120 according to the seventh embodiment, to place the heat diffusion sheet 121 between the power conversion circuit board 50 and the heat conductive plate 30, a power conversion circuit board 50 through the heat diffusion sheet 121 adhering the thermally conductive plate 30. Thus, eliminating the air layer, a good heat conduction path of heat conduction is formed between the power conversion circuit board 50 and the heat conductive plate 30 through the thermal diffusion sheet 121, the thermal conductivity and the power conversion circuit board 50 it is possible to improve the thermal conductivity between the plates 30. Further, since the thermal diffusion in the lateral direction of the heat (the surface direction of the heat conducting plate 30) further proceeds by thermal diffusion sheet 121, the heat conductive plate 30 extending in the transverse direction becomes easier to heat conduction, the heat radiation portion 20 side of the heat It becomes easier to heat conduction to the conductive plate 30.

As described above, in the seventh embodiment, between the power conversion circuit board 50 and the heat conductive plate 30 includes a thermal diffusion sheet 121 has high thermal conductivity than air. This eliminates the air layer between the power conversion circuit board 50 and the heat conductive plate 30, improves the thermal conductivity between the power conversion circuit board 50 and the heat conductive plate 30. Further, the heat conductive plate 30 extending in the transverse direction becomes easier to heat conduction, it tends to heat conduction to the heat conductive plate 30 of the heat radiating portion 20 side.

As the semiconductor switching elements 51 to be applied to the power conversion device described in the above embodiment, silicon: Compared with (silicon Si) based semiconductor, the wide band gap (WBG) semiconductor having a large energy band width semiconductor elements formed can be used. As the WBG semiconductor, for example, silicon carbide (SiC) or gallium nitride (GaN) based material or diamond like, is.

Semiconductor element formed by such a WBG semiconductors, voltage resistance is high, since high allowable current density, it is possible to reduce the size of the semiconductor device, by using these miniaturized semiconductor devices, these miniaturization of the power conversion device incorporating a semiconductor device becomes possible.

Further, since WBG semiconductor power loss is low, it is capable of high efficiency of the semiconductor element, and by extension, allowing higher efficiency of the power converter.

Furthermore, WBG semiconductor heat resistance is high, there is an advantage that it is possible to achieve a heat sink and the chassis miniaturization of, on the one hand, the temperature of the semiconductor device becomes higher than the conventional, housing interior and electric components associated with it it is necessary to take into account the temperature rise of. In the power conversion apparatus described in the embodiment described above, it is possible to suppress heat radiation to the housing interior of the heat the semiconductor element is emitted, it becomes easy to apply the semiconductor device formed by the WBG semiconductor.

The configuration shown in the above embodiment, an example of the configuration of the present invention, can be combined with other known techniques. Further, the technique shown in the above embodiment, combined without departing from the scope of the present invention, or the like will be partially omitted, it is needless to say that can be configured to change.

As described above, the power conversion device according to the present invention are useful in downsizing and cost reduction of the power converter.

1 power conversion module, 10 circuit board unit, 11 unmounted area, 20 radiating portion, 21 the outer edge region, 30 heat conductive plate, 31 a first gap portion 40 waterproof and dustproof member, 50 power conversion circuit board, 51 semiconductor switching element, 52 a solder joint, 53 wiring, 54 input and output terminals, 55 the insulating substrate, 60 cooling air, 70,80,90,100,110,120 power conversion module, 71 heat conducting plate, 72 engagement portion, 81 second 1 heat conductive plate, 82 first region, 83 second region, 84 second gap portion, 85 second heat conductive plates, 86 opening, 91 third heat conduction plate, 92 first region, 93 second region, 94 incisions, 101 fourth heat conductive plate, 102 opening, 103 engagement portion, 104 the third cavity portion, 105 cooling air, 111 fourth gap part, 121 thermal diffusion sheet, 200 power converter, 210 a housing, 2 11 opening, 212 power line, 213 control terminal.

Claims (13)

  1. Insulating substrate power conversion circuit are mounted with a semiconductor element switching element, and a circuit board portion mounted on one end region of the high thermal conductivity plate thermal conductivity than said insulating substrate,
    A second end region adjacent to the one end region in the heat conductive plate having a first cavity portion a plurality of penetrating the thermal conductive plate in the thickness direction or plane direction, the heat conduction from the insulating substrate a radiator unit for cooling the insulating substrate by radiating the heat conducted to the plate,
    A plurality of power conversion modules with,
    A housing for housing the plurality of power conversion modules,
    Equipped with a,
    The power conversion module, that the circuit board portion being exposed to the heat radiating portion to the outside is accommodated in the housing,
    Power converter according to claim.
  2. The cooling air is blown from a direction facing the first gap portion,
    Power converter according to claim 1, wherein the.
  3. The semiconductor device switching element, being disposed in the outer edge area of ​​the heat radiating portion in the circuit board portion,
    Power converter according to claim 1 or 2, characterized in.
  4. The semiconductor device switching element, that is disposed at the end portion of the heat radiating portion in the circuit board portion,
    Power converter according to claim 1, any one of 3, wherein the.
  5. It said first gap section, be provided at a position separated from the circuit board portion,
    Power converter according to claim 1, any one of 4, wherein.
  6. The power converter module,
    The thickness of the heat-conducting plate in the heat radiating portion is larger than the thickness of the thermal conductive plate of the circuit board portion,
    In the end region opposite to the circuit board portion in the thermal conductive plate of the heat radiating portion, a locking portion for fixing the two said power conversion modules are stacked in a state of being joined by overlapping the radiator portions be provided with,
    Power converter according to claim 1, any one of 5, wherein the.
  7. A first region constituting the heat-conducting plate in the circuit board portion,
    A second region projecting from the side surface of the first region in the planar direction of the first region,
    A first heat conductive plate having,
    The thicker thickness than the first heat conduction plate has a first gap portion, the said heat radiating portion of the first opening has a side surface of the second region of the first heat conduction plate is inserted a second heat conducting plate constituting,
    Equipped with a,
    Wherein the heat-conductive plate is inserted is formed the second region of the first thermal conductive plate to the first opening of the second heat conducting plate,
    The second region may comprise a second cavity portion at a position corresponding to the first gap portion in a state of being inserted into the second heat conducting plate,
    Power converter according to claim 6, wherein.
  8. A third region constituting the heat-conducting plate in the circuit board portion,
    And a fourth region which projects from the side surface of the third region in the planar direction of the third region,
    A third heat conductive plate having,
    The thicker thickness than the third heat conductive plate having the first gap portion, the said heat radiating portion and the second opening has a side surface of the fourth region of the third heat conduction plate is inserted a fourth heat conductive plate forming,
    Equipped with a,
    Said third heat conduction plate the thermally conductive plate and the fourth region is inserted into the second opening of the fourth heat conduction plate is configured,
    The fourth region is at a position corresponding to the first gap portion in a state of being inserted into the fourth heat conductive plate, extending along the direction of insertion into the fourth heat conductive plate of the fourth region They comprise a plurality of first slits,
    Power converter according to claim 6, wherein.
  9. A fifth region which constitutes the thermal conductive plate of the circuit board unit,
    A sixth region projecting from the side surface of the fifth region in the planar direction of the fifth region,
    A fifth heat conductive plate having,
    The fifth heat conduction thicker thickness than plate has a third gap portion which penetrates between the opposing sides, the plane of the upper surface of the fourth opening the sixth region of the fifth heat conductive plate is inserted a sixth heat conductive plate constituting the heat radiating portion has a side surface inclined relative to the direction,
    Equipped with a,
    The fifth heat conducting plate the heat-conductive plate is inserted the sixth region to the fourth opening of the sixth heat conductive plate of the construction,
    The sixth region, it comprises a plurality of second slits extending along the direction of insertion into the sixth heat conductive plate of the sixth region,
    Power converter according to claim 6, wherein.
  10. The thermal conductive plate of the circuit board unit, a position opposite to the heat radiating portion than the mounting position of the semiconductor element switching elements in the plane direction of the thermal conductive plate, having a third gap portion penetrating in the thickness direction about,
    Power converter according to any one of claims 1 to 9, characterized in.
  11. Wherein between the insulating substrate and the heat conduction plate, that comprises a heat diffusion sheet having high thermal conductivity than air in the circuit board portion,
    Power converter according to claim 1, any one of 10, wherein.
  12. The semiconductor device switching elements, it is a wide band-gap semiconductor element,
    Power converter according to any one of claims 1 to 11, characterized in.
  13. Wherein the insulating substrate is placed on the front and back surfaces of the heat conductive plate in the circuit board portion,
    Power converter according to claim 1, any one of 12, wherein the.
PCT/JP2013/085001 2013-12-26 2013-12-26 Power conversion device WO2015097833A1 (en)

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PCT/JP2013/085001 WO2015097833A1 (en) 2013-12-26 2013-12-26 Power conversion device
JP2014528759A JP5717922B1 (en) 2013-12-26 2013-12-26 Power converter

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CN105379097A (en) 2016-03-02 application
CN105379097B (en) 2017-07-18 grant

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