JPS57152152A - Cooler - Google Patents

Cooler

Info

Publication number
JPS57152152A
JPS57152152A JP3631881A JP3631881A JPS57152152A JP S57152152 A JPS57152152 A JP S57152152A JP 3631881 A JP3631881 A JP 3631881A JP 3631881 A JP3631881 A JP 3631881A JP S57152152 A JPS57152152 A JP S57152152A
Authority
JP
Japan
Prior art keywords
parts
heat
high density
evaporator
heat pipes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3631881A
Other languages
Japanese (ja)
Inventor
Kozo Katayama
Osamu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIHON YUNIBATSUKU KK
NIPPON UNIVAC KK
Mitsubishi Electric Corp
Original Assignee
NIHON YUNIBATSUKU KK
NIPPON UNIVAC KK
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIHON YUNIBATSUKU KK, NIPPON UNIVAC KK, Mitsubishi Electric Corp filed Critical NIHON YUNIBATSUKU KK
Priority to JP3631881A priority Critical patent/JPS57152152A/en
Publication of JPS57152152A publication Critical patent/JPS57152152A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To perform cooling of a high density heat generating parts safely and effectively by a method wherein a refrigerator having an evaporator as a constituent, the high density heat generating parts, and heat pipes interposed between them of which the condensing parts at one ends of the heat pipes are put in the evaporator, and the evaporating parts at the other ends are made to come in contact with the parts, are arranged. CONSTITUTION:The high density part generating parts 7 consisting of gathered plural large capacity integrated circuit element, for example, are combined in a sandwich type, and the evaporating parts 8b of heat pipes, plates 9 of Al, copper, etc., and fibers 10 are made to come in contact with them thermally between them, and electric insulating films 11 are made to lie between them. Heat generated from the parts 7 makes an operating liquid enclosed in the heat pipes 8 to evaporate, vapor thereof transfers to the condensing parts 8b at the other ends, heat is taken away by the evaporator 5 constituting the refrigerator 20, and vapor is condensed to be liquefied. Accordingly cooling of the high density heat generating parts is performed safely and effectively.
JP3631881A 1981-03-13 1981-03-13 Cooler Pending JPS57152152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3631881A JPS57152152A (en) 1981-03-13 1981-03-13 Cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3631881A JPS57152152A (en) 1981-03-13 1981-03-13 Cooler

Publications (1)

Publication Number Publication Date
JPS57152152A true JPS57152152A (en) 1982-09-20

Family

ID=12466483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3631881A Pending JPS57152152A (en) 1981-03-13 1981-03-13 Cooler

Country Status (1)

Country Link
JP (1) JPS57152152A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140448U (en) * 1983-03-10 1984-09-19 古河電気工業株式会社 Heat pipe type radiator
JPS60223993A (en) * 1984-04-20 1985-11-08 Nippon Telegr & Teleph Corp <Ntt> Cooling device for highly heating equipment
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas
JPH04196395A (en) * 1990-11-28 1992-07-16 Hitachi Ltd Electronic computer and cooling device thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140448U (en) * 1983-03-10 1984-09-19 古河電気工業株式会社 Heat pipe type radiator
JPS60223993A (en) * 1984-04-20 1985-11-08 Nippon Telegr & Teleph Corp <Ntt> Cooling device for highly heating equipment
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas
JPH04196395A (en) * 1990-11-28 1992-07-16 Hitachi Ltd Electronic computer and cooling device thereof

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