FR2337483A1 - Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces - Google Patents

Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces

Info

Publication number
FR2337483A1
FR2337483A1 FR7540300A FR7540300A FR2337483A1 FR 2337483 A1 FR2337483 A1 FR 2337483A1 FR 7540300 A FR7540300 A FR 7540300A FR 7540300 A FR7540300 A FR 7540300A FR 2337483 A1 FR2337483 A1 FR 2337483A1
Authority
FR
France
Prior art keywords
equipment
condenses
evaporates
heat dissipation
dissipation system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7540300A
Other languages
French (fr)
Other versions
FR2337483B1 (en
Inventor
Roland Saint-Marcoux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROP COMPOSANTS ELECTRON
Original Assignee
EUROP COMPOSANTS ELECTRON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROP COMPOSANTS ELECTRON filed Critical EUROP COMPOSANTS ELECTRON
Priority to FR7540300A priority Critical patent/FR2337483A1/en
Priority to JP16092176A priority patent/JPS52101461A/en
Priority to DD19666076A priority patent/DD128992A5/en
Priority to DE19762659339 priority patent/DE2659339A1/en
Publication of FR2337483A1 publication Critical patent/FR2337483A1/en
Application granted granted Critical
Publication of FR2337483B1 publication Critical patent/FR2337483B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08Cooling arrangements; Heating arrangements; Ventilating arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

The device has a heat transmission element with a cooling medium and a capillary structure. The heat transmission element is mounted in a sealed case (3) and contains the insulating cooling medium (7) the capillary structure (8) and the whole component (1,2) with high heat losses. This component is cooled by the medium change of state. Ribs (4) are provided on the outer surfaces of the case cold part, and the component (1,2) and the capillary structure (8) are at least partly immersed into the cooling medium.
FR7540300A 1975-12-31 1975-12-31 Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces Granted FR2337483A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR7540300A FR2337483A1 (en) 1975-12-31 1975-12-31 Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces
JP16092176A JPS52101461A (en) 1975-12-31 1976-12-27 Heat transmission allowablee loss heavyycurrent element
DD19666076A DD128992A5 (en) 1975-12-31 1976-12-28 COMPONENT WITH GREAT PERMISSIBLE LOSS PERFORMANCE
DE19762659339 DE2659339A1 (en) 1975-12-31 1976-12-29 COMPONENT WITH LARGE PERMISSIBLE POWER LOSS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7540300A FR2337483A1 (en) 1975-12-31 1975-12-31 Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces

Publications (2)

Publication Number Publication Date
FR2337483A1 true FR2337483A1 (en) 1977-07-29
FR2337483B1 FR2337483B1 (en) 1980-01-04

Family

ID=9164386

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7540300A Granted FR2337483A1 (en) 1975-12-31 1975-12-31 Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces

Country Status (4)

Country Link
JP (1) JPS52101461A (en)
DD (1) DD128992A5 (en)
DE (1) DE2659339A1 (en)
FR (1) FR2337483A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132085A1 (en) * 2013-03-01 2014-09-04 Iceotope Limited A module for cooling one or more heat generating components

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009006216B4 (en) * 2009-01-27 2018-11-22 Modine Manufacturing Co. Cooling device and manufacturing process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132085A1 (en) * 2013-03-01 2014-09-04 Iceotope Limited A module for cooling one or more heat generating components

Also Published As

Publication number Publication date
JPS52101461A (en) 1977-08-25
DE2659339A1 (en) 1977-07-14
FR2337483B1 (en) 1980-01-04
DD128992A5 (en) 1977-12-21

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Legal Events

Date Code Title Description
ST Notification of lapse