FR2337483B1 - - Google Patents
Info
- Publication number
- FR2337483B1 FR2337483B1 FR7540300A FR7540300A FR2337483B1 FR 2337483 B1 FR2337483 B1 FR 2337483B1 FR 7540300 A FR7540300 A FR 7540300A FR 7540300 A FR7540300 A FR 7540300A FR 2337483 B1 FR2337483 B1 FR 2337483B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7540300A FR2337483A1 (en) | 1975-12-31 | 1975-12-31 | Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces |
JP16092176A JPS52101461A (en) | 1975-12-31 | 1976-12-27 | Heat transmission allowablee loss heavyycurrent element |
DD19666076A DD128992A5 (en) | 1975-12-31 | 1976-12-28 | COMPONENT WITH GREAT PERMISSIBLE LOSS PERFORMANCE |
DE19762659339 DE2659339A1 (en) | 1975-12-31 | 1976-12-29 | COMPONENT WITH LARGE PERMISSIBLE POWER LOSS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7540300A FR2337483A1 (en) | 1975-12-31 | 1975-12-31 | Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2337483A1 FR2337483A1 (en) | 1977-07-29 |
FR2337483B1 true FR2337483B1 (en) | 1980-01-04 |
Family
ID=9164386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7540300A Granted FR2337483A1 (en) | 1975-12-31 | 1975-12-31 | Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS52101461A (en) |
DD (1) | DD128992A5 (en) |
DE (1) | DE2659339A1 (en) |
FR (1) | FR2337483A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009006216B4 (en) * | 2009-01-27 | 2018-11-22 | Modine Manufacturing Co. | Cooling device and manufacturing process |
GB2511354A (en) * | 2013-03-01 | 2014-09-03 | Iceotope Ltd | A module for cooling one or more heat generating components |
-
1975
- 1975-12-31 FR FR7540300A patent/FR2337483A1/en active Granted
-
1976
- 1976-12-27 JP JP16092176A patent/JPS52101461A/en active Pending
- 1976-12-28 DD DD19666076A patent/DD128992A5/en unknown
- 1976-12-29 DE DE19762659339 patent/DE2659339A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE2659339A1 (en) | 1977-07-14 |
FR2337483A1 (en) | 1977-07-29 |
DD128992A5 (en) | 1977-12-21 |
JPS52101461A (en) | 1977-08-25 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |