FR2681757B1 - COOLING DEVICE FOR ELECTRICAL COMPONENTS. - Google Patents

COOLING DEVICE FOR ELECTRICAL COMPONENTS.

Info

Publication number
FR2681757B1
FR2681757B1 FR9211251A FR9211251A FR2681757B1 FR 2681757 B1 FR2681757 B1 FR 2681757B1 FR 9211251 A FR9211251 A FR 9211251A FR 9211251 A FR9211251 A FR 9211251A FR 2681757 B1 FR2681757 B1 FR 2681757B1
Authority
FR
France
Prior art keywords
rows
corrugation
insert
cooling device
electrical components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9211251A
Other languages
French (fr)
Other versions
FR2681757A1 (en
Inventor
Alexander Prokopp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mahle Behr Industry GmbH and Co KG
Original Assignee
Behr Industrieanlagen GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Behr Industrieanlagen GmbH and Co KG filed Critical Behr Industrieanlagen GmbH and Co KG
Publication of FR2681757A1 publication Critical patent/FR2681757A1/en
Application granted granted Critical
Publication of FR2681757B1 publication Critical patent/FR2681757B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The cavity (34) is formed between two plate-shaped components (31,32), of which at least one is of light metal alloy. An insert (13) is in the form of a corrugated strip. Pref. the insert corrugations extend transversely to the flow direction, i.e. over part of the flow path in the flow direction. Several rows of such corrugation may be formed one behind the other with a preset offset between the rows. The corrugations may be rectangular or trapezoidal. There need not to be any spacing between the corrugation rows. USE/ADVANTAGE - For electric and electronic components, with simple design and high thermal transfer capacity.
FR9211251A 1991-09-24 1992-09-22 COOLING DEVICE FOR ELECTRICAL COMPONENTS. Expired - Fee Related FR2681757B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4131739A DE4131739C2 (en) 1991-09-24 1991-09-24 Cooling device for electrical components

Publications (2)

Publication Number Publication Date
FR2681757A1 FR2681757A1 (en) 1993-03-26
FR2681757B1 true FR2681757B1 (en) 1994-11-25

Family

ID=6441348

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9211251A Expired - Fee Related FR2681757B1 (en) 1991-09-24 1992-09-22 COOLING DEVICE FOR ELECTRICAL COMPONENTS.

Country Status (4)

Country Link
CH (1) CH685140A5 (en)
DE (1) DE4131739C2 (en)
FR (1) FR2681757B1 (en)
IT (1) IT1255588B (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4401607C2 (en) * 1994-01-20 1997-04-10 Siemens Ag Cooling unit for power semiconductors
DE4421025C2 (en) * 1994-06-16 1999-09-09 Abb Patent Gmbh Heatsink with at least one cooling channel
FR2747005B1 (en) * 1996-03-26 1998-06-19 Thomson Csf MICROELECTRONIC PACKAGE WITH COOLING SYSTEM
FR2748800A1 (en) * 1996-05-15 1997-11-21 Ferraz Heat exchanger for electronic component and electric apparatus cooling
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
DE19704934B4 (en) * 1997-02-10 2004-09-23 Daimlerchrysler Ag Cooling rail with two channels
WO2000038488A1 (en) * 1998-12-22 2000-06-29 Otis Elevator Company Liquid cooled elevator machine drive
DE19911204B4 (en) * 1999-03-13 2008-09-11 Behr Gmbh & Co. Kg Arrangement for cooling electronic components
DE19911205A1 (en) * 1999-03-13 2000-09-14 Behr Gmbh & Co Electronic components cooling device for integration with heat exchanger in motor vehicle, uses rubber layer to compensate for unevennesses of fins or plastic box, and avoids soldering of cooling fins
EP1148772B1 (en) * 2000-04-19 2009-12-23 Thermal Form & Function Inc. Cold plate utilizing fin with evaporating refrigerant
JP2002098454A (en) 2000-07-21 2002-04-05 Mitsubishi Materials Corp Liquid-cooled heat sink and its manufacturing method
DE10051338A1 (en) * 2000-10-17 2002-04-18 Daimlerchrysler Rail Systems Liquid-cooling device for high-power semiconductor module, has housing with cooling surface and enclosing a liquid-flowed space
DE10102619A1 (en) * 2001-01-20 2002-05-08 Conti Temic Microelectronic Power module for supplying electric motors has corrugated heat sink attached to underside of thick thermally conductive base
DE10158387B4 (en) * 2001-11-28 2017-01-19 Modine Manufacturing Co. Arrangement for cooling electrical components
JP2005229033A (en) * 2004-02-16 2005-08-25 Hitachi Ltd Liquid-cooled system and electronic apparatus having the same
DE102005025381A1 (en) 2005-05-31 2006-12-07 Behr Industry Gmbh & Co. Kg Device for cooling electronic components
DE102005034998B4 (en) * 2005-07-27 2016-06-23 Behr Industry Gmbh & Co. Kg Method for producing a device for cooling electronic components and device for cooling electronic components
WO2010020438A1 (en) * 2008-08-22 2010-02-25 Siemens Aktiengesellschaft Cooling device
DE202008013351U1 (en) 2008-10-08 2010-03-25 Autokühler GmbH & Co. KG Heat exchanger network and thus equipped heat exchanger
DE102009051864B4 (en) * 2009-11-04 2023-07-13 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Cooling device for electrical equipment
DE102012006122A1 (en) 2012-03-26 2013-09-26 Thesys Gmbh Heat transfer device i.e. heating and/or cooling plate, for maintaining moderate temperature of battery cells of lithium ion battery of vehicle, has gutter-shaped advance channels and return channels extended over entire length of cavity
DE102012107684A1 (en) * 2012-08-21 2014-02-27 Autokühler GmbH & Co KG Heat sink for at least one component to be cooled and method for producing a heat sink
ITBO20130198A1 (en) * 2013-05-03 2014-11-04 Magneti Marelli Spa LIQUID COOLING SYSTEM FOR AN ELECTRONIC COMPONENT AND RELATED PRODUCTION METHOD
DE102014202293A1 (en) * 2014-02-07 2015-08-13 Siemens Aktiengesellschaft heatsink
EP3010321B1 (en) * 2014-10-14 2021-12-01 Magneti Marelli S.p.A. Liquid cooling system for an electronic component
DE102018205568A1 (en) * 2018-04-12 2019-10-17 Volkswagen Aktiengesellschaft Component with improved cooling performance and motor vehicle with at least one component
DE102018208232A1 (en) * 2018-05-24 2019-11-28 Volkswagen Aktiengesellschaft Component with a cooling effect optimized by an insert element and motor vehicle with at least one component
DE102018209586A1 (en) * 2018-06-14 2019-12-19 Volkswagen Aktiengesellschaft Electronic component with improved cooling performance and motor vehicle with at least one electronic component
DE102019202425A1 (en) * 2019-02-22 2020-10-22 Volkswagen Aktiengesellschaft Arrangement for uniform cooling of components and motor vehicle with at least one arrangement
DE102022211794A1 (en) 2022-11-08 2024-05-08 Robert Bosch Gesellschaft mit beschränkter Haftung Heat sink for cooling an electrical and/or electronic assembly

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3261396A (en) * 1963-11-13 1966-07-19 Staver Co Heat dissipator for electronic circuitry
US3327776A (en) * 1965-10-24 1967-06-27 Trane Co Heat exchanger
SE337263B (en) * 1969-03-24 1971-08-02 Asea Ab
SE418223B (en) * 1972-06-02 1981-05-11 Aga Ab VERMEVEXLARE
US3833837A (en) * 1973-07-20 1974-09-03 B West Modular cooling enclosure with expandable cooling cells
US4027206A (en) * 1975-01-27 1977-05-31 L. H. Research Electronic cooling chassis
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same
CS191622B1 (en) * 1977-05-04 1979-07-31 Michal Pellant Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements
DE2902771A1 (en) * 1978-07-21 1980-01-31 Bbc Brown Boveri & Cie COOLING DEVICE FOR SEMICONDUCTOR COMPONENTS
SU860176A1 (en) * 1979-03-11 1981-08-30 Предприятие П/Я А-7992 Coolant,mainly for cooling semiconductor devices
DE3026167A1 (en) * 1980-07-10 1982-02-04 Siemens AG, 1000 Berlin und 8000 München Cylindrical shaped thyristor cooling can - has cooling medium circulating channels through heat exchange layers, having narrower central regions
DE3133485A1 (en) * 1980-09-15 1982-05-06 Peter 2563 Ipsach Herren LIQUID-COOLED ELECTRICAL ASSEMBLY
DE8105233U1 (en) * 1981-02-25 1981-08-13 Steeb, Dieter Christian, 9050 Steinegg-Appenzell "HEAT EXCHANGER WITH FLAT TUBES"
DE8107890U1 (en) * 1981-03-18 1981-08-20 Klöckner-Humboldt-Deutz AG, 5000 Köln HEAT EXCHANGER
CS233062B1 (en) * 1983-04-20 1985-02-14 Vladimir Motycka Liquid cooler for power semiconductor elements cooling
EP0144579B1 (en) * 1983-11-02 1987-10-14 BBC Brown Boveri AG Cooling body for the liquid cooling of power semiconductor devices
DE3408771A1 (en) * 1984-03-09 1985-09-12 Siemens AG, 1000 Berlin und 8000 München Cooling socket for an electrical component
SU1243163A1 (en) * 1984-11-05 1986-07-07 Одесский ордена Трудового Красного Знамени политехнический институт Radio-electronic unit module
DE3504207C2 (en) * 1985-02-07 1987-01-29 Siemens AG, 1000 Berlin und 8000 München Heat exchanger for an electronics cabinet
DE8804742U1 (en) * 1988-04-11 1988-06-09 Siemens AG, 1000 Berlin und 8000 München Heat sink with inserted filler piece for cooling an electrical component with a liquid cooling medium
SU1624566A1 (en) * 1989-02-14 1991-01-30 Всесоюзный Научно-Исследовательский, Проектно-Конструкторский И Технологический Институт Силовых Полупроводниковых Устройств Cooler for heavy duty semiconductor devices
DE9100864U1 (en) * 1991-01-25 1991-04-18 Siemens AG, 8000 München Liquid heat sink

Also Published As

Publication number Publication date
IT1255588B (en) 1995-11-09
FR2681757A1 (en) 1993-03-26
ITMI922105A0 (en) 1992-09-11
DE4131739A1 (en) 1993-04-01
DE4131739C2 (en) 1996-12-19
ITMI922105A1 (en) 1994-03-11
CH685140A5 (en) 1995-03-31

Similar Documents

Publication Publication Date Title
FR2681757B1 (en) COOLING DEVICE FOR ELECTRICAL COMPONENTS.
US4322776A (en) Thermal interconnection
KR940006251A (en) Cooling device for electronic device
FR2341202A1 (en) COOLING DEVICE, ESPECIALLY FOR ELECTRICAL OR ELECTRONIC COMPONENTS GENERATING HEAT
FR2701554B1 (en) Heat exchanger for electronic components and electro-technical equipment.
CA2041629C (en) Thermally controlled equipment cabinet
PT1062852E (en) COOLING ELEMENT FOR ELECTRONIC POWER DEVICE AND ELECTRONIC POWER DEVICE COMPRISING SUCH ELEMENT
DE3372898D1 (en) Heat pipe cooling module for high power circuit boards
DK0654819T3 (en) Process for manufacturing a heat dissipation device
KR890701964A (en) Transport and storage device for heat sensitive products
IT1213116B (en) DEVICE FOR REGULATION RESPECTIVELY THE LIMITATION OF AT LEAST A TEMPERATURE VALUE RESPECTIVELY OF A FIELD OF TEMPERATURES OF HEATING BODIES WITH IRRADIANCE RESPECTIVELY IN CONTACT WITH ELECTRIC STOVES.
FI901582A0 (en) CONSTRUCTION FOER ATT FOERBAETTRA AVKYLNING AV EN EFFEKTTRANSISTOR.
MX151450A (en) IMPROVEMENTS IN THERMAL REGULATION CIRCUIT FOR VEHICLES EQUIPPED WITH AN ELECTRIC SLOW
EP0645804A3 (en) Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient similar to that of semiconductor and method for manufacturing the same.
EP0279601A3 (en) Electrical conductor arrangement
US4558209A (en) Low power electrical heating device
ES2100113B1 (en) POSITIVE CHARACTERISTIC THERMISTOR DEVICE.
IT1227488B (en) LINEARIZED TEMPERATURE VOLTAGE REFERENCE CIRCUIT.
IT1170318B (en) ELECTRONIC HYGROMETER WITH TEMPERATURE COMPENSATION CIRCUIT
HUP0301436A2 (en) Module support for electrical/electronic components
FI874753A0 (en) ANORDNING FOER KYLNING AV HALVLEDARKOMPONENTER.
EP0441572A3 (en) Power semiconductor device with heat dissipating property
EP0986292A3 (en) Thermal transfer mat for electrical or electronic apparatuses
GB1534883A (en) Socket and heat sink for an electronic component
JPH06244324A (en) Integral molding insulation part

Legal Events

Date Code Title Description
ST Notification of lapse