SU1243163A1 - Radio-electronic unit module - Google Patents

Description

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The invention relates to the design of electronic equipment, and can be used in the design of equipment with high heat release. ,

The aim of the invention is to increase the layout density and improve heat transfer due to the possibility of placing radio elements over the entire board area while ensuring the contact of each radio element with the heat sink unit and the possibility of convective heat exchange.

FIG. 1 shows a printed circuit board, side view; in figure 2 - section aa in fig .. 1.

The module of the electronic unit consists of two identical carrier frames 1 and 2 mirrored interconnected through a multilayer plate and two heat-loaded printed circuit boards 3 and 4 with radio elements 5 and 6 installed on the base of frames 1 and 2. Multilayer. The plate consists of two outer layers 7 and 8 of thin-sheet heat-conducting material and separating them internally. The base layer 9 is made of an elastic material, for example, foam rubber. The fastening of each of the printed circuit boards 3 and 4 in the module is carried out by screw connections 10 to the frame opposite to that on which this board is installed. To pass through the internal volume of the cooling air module, windows 11 are made in the frames on opposite sides for the passage of the refrigerant.

The design of the module consists of two frames i and 2, between which there is a multilayer plate. The printed circuit boards 3 and 4 are mounted on frames 1 and 2 so that the radio elements 5 and 6 are provided with their bodies directed towards each other. The fixing of the boards 3 and 4 to the module os0 (is mounted with screws that are screwed into the threaded holes

Frames 1 and 2 are opposite to the one on which this board is installed. Such an attachment allows you to simultaneously assemble the module as a whole, attach the boards 3 and 4 to the MODULE, fix the multilayer plate between frames 1 and 2, and deform the external metal. layers 7 and 8 of the thermally conductive material and the inner layer

1243163-2

9 of elastic material, the upper edges of the shells of radio elements 5 and 6.

The installation of radioelements on printed .5 bulk pates is made with large ones. tolerances. There is also an elevation tolerance for the radio elements themselves. Provide finding the areas of the upper edges of the shells of radio elements 5 and 6

 About on the same plane is impossible. When connecting to the module of printed circuit boards 3 and 4, elastic deformation occurs. metal layers 7 and 8 and layer 9 under the action of opposite loads on them from radio elements 5 and 6. The deformation of the multilayer plate allows thermal contact over the entire plane of the upper edges of radio elements 5 and 6.

20 For reliable and long-term contact of metallic layers 7 and 8 with radio elements 5 and 6, an inner layer 9 of elastic material allowing elastic

25 local deformation in sufficient limits with long-term preservation, elastic properties, such as foam rubber or rubber. The thickness of this layer is determined by the tolerances on the installation dimensions of the radio elements.

The metal layers 7 and 8 serve to remove heat from the radio elements by conduction and simultaneously play the role of a radiator, which

35 washes; ts cooling air

coming through windows 11 in frames.

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Cooling, and the ailing air simultaneously simultaneously laminates the plates, the shells of the radioelements and the printed circuit board on which they are installed. Such a solution for removing the slp from the thermally loaded radio elements makes it possible to avoid using methods that reduce the trace area of the conductors on the printed circuit boards and increase the packing density.

When: the module is large in size for its rigidity, the windows 11 within the framework are interrupted with installation in the following places: breaks in the additional screw connections.

Claims (1)

Invention Formula The module of the electronic unit containing the thermally loaded printed circuit boards with radio elements is fixed Cooling, and the ailing air simultaneously simultaneously laminates the plates, the shells of the radioelements and the printed circuit board on which they are installed. Such a solution for removing the slp from the thermally loaded radio elements makes it possible to avoid using methods that reduce the trace area of the conductors on the printed circuit boards and increase the packing density. When: the module is large in size for its rigidity, the windows 11 within the framework are interrupted with installation in the following places: breaks in the additional screw connections. Invention Formula A radio-electronic module containing heat-loaded printed circuit boards with radio elements mounted on a carrier frame, between which a heat sink is installed, characterized in that, in order to increase the layout density and improve heat transfer, the heat exchanger is designed as a multilayer plate with outer layers of thin-sheet heat-conducting material and the inner layer R Compiled by V.Shershavova Editor G. Volkova. Tehred M. Khodanich Proofreader I. Muska Order 3719/58 Circulation 765 Subscription VNIIPI USSR State Committee for inventions and discoveries; 113035, Moscow, Zh-35, Raushsk nab., 4/5 Production and printing enterprise, Uzhgorod, st. Prorktna, 4 elastic material, and -carrying frames with heat-loaded boards are rigidly interconnected to ensure the thermal contact of the radio elements of the thermally loaded boards with the surface of the heat sink unit, with windows for the passage of the refrigerant in the frames. t FIG. one