CS233062B1 - Liquid cooler for power semiconductor elements cooling - Google Patents

Description

The present invention relates to a liquid cooler for cooling power semiconductor components comprising a chamber flowing through a coolant from an inlet to an outlet opening, the two openings being flush with each other at an arbitrary angle and the cooling chamber communicating with at least one heat transfer surface of the heat generating component. The chamber consists of at least two lids and at least one helical partition, forming! coolant channel together with lids · Alternatively, the cooling channel can be either a spiral baffle wound bifilar or two separate baffles · semiconductor devices

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BACKGROUND OF THE INVENTION The present invention relates to a liquid cooler for cooling power semiconductor devices consisting of a chamber flowing through a cooling medium from an inlet to an outlet opening, the two openings lying flush with each other at any angle.

Liquid coolers are already known for cooling power semiconductor components »Increasing the parameters of semiconductor components is accompanied by the generation of higher heat dissipation and therefore increasing demands on the size and weight of air coolers, in some cases the limitations of air cooling are already reached» # Liquid coolers generally provide a greater reserve of cooling power, they are easier to cope with with impact and transient conditions, as their thermal inertia allows short thermal impulses to be compensated with only a slight increase in temperature # Another advantage of a liquid cooler is limiting and in some cases eliminating the noise generated by the mounted fans in the air cooling system. On the contrary, it should be remembered that liquid cooling is somewhat, more complex and more difficult to maintain. # Coolers are in many cases designed as

233 062 of cylindrical or cuboid body with inlet and outlet pipes. parallel or differently connected channels. Sometimes such ducts are formed directly in the jet bays and in some cases the coolant distribution is carried out by means of formed partitions, or different sets of pins are placed in the path of the liquid stream. All these adjustments are used to increase the heat transfer surface area of the coolant. There are also solutions containing an empty flushed cooling chamber.

All these concepts and constructions are characterized by the common feature of the need to use machining in the manufacture of machinery, which increases production costs. Many designs of liquid coolers are very complex, consisting of several parts and do not need a perfect seal. This problem is, as is well known, compliant with the longevity requirement and can cause sudden failures with extensive consequences. A disadvantage of other solutions is the existence of areas incompletely flushed by the coolant, where a lower cooling effect is achieved with a generally reduced cooling effect. Another drawback is the impossibility of adjusting the angle between the coolant inlet and outlet ports as required to accommodate other auxiliary devices.

These drawbacks are solved by a liquid cooler for cooling power semiconductor devices according to the invention, characterized in that the cooler chamber consists of at least two lids and at least one helical partition forming together with the lids a coolant channel.

Alternatively, the coolant channel is formed by a bifilarly wound helical partition with through holes and at least two lids.

Another alternative is a coolant channel formed by two separate, identical and interposed spiral barriers and at least two lids.

Advantageously, at least one of the lids forms an integral whole with the helical partition. The inner surface of the walls of the coolant duct is enlarged, for example, by roughening or undulating.

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The advantage of the liquid cooler according to the invention lies in the simplicity of design and consumed in a small amount of mechanical engineering and Wrapping paper ₀ Also, the entire heat exchange surface of the cooling medium is perfect. Another advantage is the possibility of arbitrary adjustment of the angle between inlet and outlet nozzle »

The attached drawing shows a liquid cooler according to the invention in several embodiments.

Fig. 1 shows the liquid cooler in cross-section, Fig. 2 shows a design with a bifilax wound spiral bar, in Fig. 3 there is a simple spiral bar, in Fig. 4 the cooling channel consists of two separate, identical and interconnected 5 is a coolant channel in the same embodiment, wherein the side walls of the chamber are formed directly by one of the helical baffles.

The liquid cooler in Figures 1 and 2 consists of a chamber 1 comprising two lids 2, 2, a side wall 4 and a helical partition 11. The helical partition 2 together with the lids 2, 3 form a cooling channel 6. The lower lid 2, the side wall 4 and the helical obstacle 4 form a single unit in this embodiment.

The chamber 1 is provided with an inlet and an outlet formation 8 and 8, with coolant inlets and outlets arranged in one plane. The spiral baffle 3 ^e j bifilarly wound, so in this case it is necessary to ensure the flow of coolant overflow openings £, in the central region of the spiral partition towards the coolant flow is shown in Fig. 2 by arrows.

In case of using a simple spiral baffle 2 U ^e one of the sleeves /obr.3/ extended, passes through all the turns of the partition and the mouth end to the central bulkhead. The flow space around the elongated sleeve must be selected so as not to restrict the flow of coolant.

Fig. 4 shows a liquid cooler whose cooling medium channel 6 is formed by two separate spiral barriers 2 ^and 12 ^, which are positioned so that their ends contact the side wall 4 of the chamber 1 at the inlet 2 and outlet 8 hole.

In Fig. 5 the liquid cooler differs from the solution just described in that only the side wall 4 of the chamber 1 is formed directly

233 062 by one of the helical barriers 8 and 10 and the sleeves at the inlet 2 and outlet 8 of the opening are located tangential to the side wall D of chamber 1 ',

If desired, the liquid cooler chamber 2 may be cuboid in shape. The thickness of the helical partition? 10 is selected so as to provide the necessary mechanical strength and rigidity when coupled to the power semiconductor component. The selected thickness must also suit the heat distribution from the bottom of the chamber. By forming a spiral-like coolant channel, the entire heat transfer surface of the chamber is covered. Particularly preferred is a dual coil assembly wherein the coolant flows on one side through an inlet into the formed labyrinth and flows from the edge of the radiator to the center and then upstream from the center. This achieves a uniform and very perfect rinsing of the entire heat transfer surface with the cooling liquid. The number of turns is suitably selected so that the labyrinth channel formed has the same cross section as the coolant inlet and outlet. This avoids unnecessary disturbance of the coolant flow and decreases or increases the coolant pressure. However, there are special cases in which it is expedient to reduce the duct size at the expense of increasing the pressure of the flowing refrigerant. In order to increase the cooling effect, the inner walls of the duct can be roughened along the length and area in various ways or crimped to enlarge their surface, to increase the contact surface with the base and to disrupt the flow of coolant and thereby achieve turbulent flow.

The liquid cooler of this construction is characterized by very good cooling effects at relatively low coolant flow rate, low material consumption and low production costs.

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The subject of your finding

Claims (5)

le A liquid cooler for cooling power-efficient semiconductor devices consisting of a chamber flowing through the coolant from the inlet to the outlet aperture, the two apertures lying flush with each other at any angle and the cooling chamber is in contact with at least one heat exchanging surface of the heat generating component The chamber (1) consists of at least two lids (2,3) and at least one helical partition (5) forming together with the lids (2,3) a channel (6). for coolants. 2. The liquid cooler according to claim 1, wherein the coolant duct (6) is formed by a bifilar wound helical partition (5) and by through-openings (9) a. at least two lids y2.3 / e 3. Liquid cooler according to claim 1, characterized in that the coolant channel (6) is formed by two self-rotating, coincident and interposed spiral barriers (5, 10) and at least two lids (5). 2,3 / · 4® Liquid cooler according to item 1, 2? 3. ^At least one of the lids (3) forms an integral whole with the helical partition (5). 5® Liquid cooler according to item 1, 2, _tt 3 », 4®, v_y_zji_a.Lč jn_ý e-t ^ i ^ that the inner pcvrcch hundred keniáHu / 6 / coolant is increased e.g. roughening or corrugation. 5 drawings 233 062 0BR.1 233 '062 0BR.2 233 062 0BR.3 233 062 0BR4