TWI755078B - Water cooling device and manifold thereof - Google Patents
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本揭示係關於一種水冷裝置及其集流器。The present disclosure relates to a water cooling device and a current collector thereof.
近年來,伺服器裝置的記憶體需求持續成長,主板上設置的記憶體模組數目也相應地增加。使用水冷的方式對記憶體模組進行散熱時,因各記憶體模組與水冷裝置的入水口距離不同,使得流過各記憶體模組旁與其進行熱交換的水量也不同,造成記憶體模組之間出現溫差。一般而言,距離水冷裝置的入水口較遠的記憶體模組因冷卻效率相對較差而溫度較高。In recent years, the memory demand of server devices has continued to grow, and the number of memory modules provided on the motherboard has also increased accordingly. When using water cooling to dissipate heat from memory modules, due to the different distances between the water inlets of each memory module and the water cooling device, the amount of water that flows through each memory module for heat exchange with it is also different. There is a temperature difference between the groups. Generally speaking, the memory module that is farther from the water inlet of the water cooling device has a higher temperature due to the relatively poor cooling efficiency.
有鑑於此,本揭示之一目的在於提出一種能均勻地冷卻記憶體模組的水冷裝置。In view of this, one objective of the present disclosure is to provide a water cooling device capable of uniformly cooling a memory module.
為達成上述目的,依據本揭示的一些實例,一種水冷裝置包含第一集流器、第二集流器以及複數個第一流體管。第一集流器包含接收腔以及複數個整流腔。接收腔具有入口用以接收工作流體。每一整流腔包含第一壁部及第二壁部,第二壁部與第一壁部相對。第一壁部具有開口與接收腔連接,第二壁部有出口。第一流體管的一端分別對應連接整流腔之出口,第一流體管的另一端連通第二集流器。To achieve the above objective, according to some examples of the present disclosure, a water cooling device includes a first header, a second header, and a plurality of first fluid pipes. The first current collector includes a receiving cavity and a plurality of rectifying cavities. The receiving chamber has an inlet for receiving the working fluid. Each rectifying cavity includes a first wall portion and a second wall portion, and the second wall portion is opposite to the first wall portion. The first wall portion has an opening to be connected with the receiving cavity, and the second wall portion has an outlet. One end of the first fluid pipe is respectively connected to the outlet of the rectifying cavity, and the other end of the first fluid pipe is connected to the second collector.
於本揭示的一或多個實例中,整流腔的開口之尺寸與其距接收腔之入口的距離成正相關。In one or more examples of the present disclosure, the size of the opening of the rectifying cavity is positively related to its distance from the entrance of the receiving cavity.
於本揭示的一或多個實例中,至少一整流腔內更包括凸管,凸管自第一壁部朝向第二壁部突伸。In one or more examples of the present disclosure, at least one of the rectification chambers further includes a protruding tube, and the protruding tube protrudes from the first wall portion toward the second wall portion.
於本揭示的一或多個實例中,當至少二個整流腔內形成有凸管時,凸管具有相異的管徑、截面積、長度或內管壁粗糙度。In one or more examples of the present disclosure, when convex tubes are formed in at least two rectification chambers, the convex tubes have different diameters, cross-sectional areas, lengths or inner tube wall roughnesses.
於本揭示的一或多個實例中,接收腔形成有至少一整流槽道。整流槽道具有第一端部及至少一第二端部,第一端部朝向接收腔之入口,第二端部朝向其中一整流腔之開口。In one or more examples of the present disclosure, the receiving cavity is formed with at least one rectifying channel. The rectifying channel has a first end portion and at least one second end portion, the first end portion faces the inlet of the receiving cavity, and the second end portion faces the opening of one of the rectifying chambers.
於本揭示的一或多個實例中,整流槽道係深入接收腔之一壁部。In one or more examples of the present disclosure, the rectifying channel is deep into a wall of the receiving cavity.
於本揭示的一或多個實例中,整流槽道之數量為兩個以上,整流槽道之尺寸與其所對應之開口距接收腔之入口的距離成正相關;或是,整流槽道之截面積隨著遠離接收腔之入口而增加;或是,第二端部之數量為兩個以上,第二端部之尺寸與其所對應之開口距接收腔之入口的距離成正相關。In one or more examples of the present disclosure, the number of rectification channels is two or more, and the size of the rectification channels is positively related to the distance between the corresponding opening and the entrance of the receiving cavity; or, the cross-sectional area of the rectification channel It increases with the distance from the entrance of the receiving cavity; or, the number of the second ends is two or more, and the size of the second end is positively related to the distance of the corresponding opening from the entrance of the receiving cavity.
於本揭示的一或多個實例中,水冷裝置進一步包含第三集流器以及複數個第二流體管。第一集流器、第二集流器以及第三集流器沿著一方向依序排列。第二流體管用以連通第二集流器與第三集流器。In one or more examples of the present disclosure, the water cooling device further includes a third current collector and a plurality of second fluid pipes. The first current collector, the second current collector and the third current collector are sequentially arranged along one direction. The second fluid pipe is used for connecting the second collector and the third collector.
於本揭示的一或多個實例中,第二集流器具有複數個第一通孔以及複數個第二通孔。第一通孔對應連接第一流體管,且第二通孔對應連接第二流體管。In one or more examples of the present disclosure, the second current collector has a plurality of first through holes and a plurality of second through holes. The first through holes are correspondingly connected to the first fluid pipes, and the second through holes are correspondingly connected to the second fluid pipes.
於本揭示的一或多個實例中,第二集流器相對之兩內壁間具有一或二個以上的隔板,且相鄰兩隔板或任一內壁及與其相鄰之隔板間的區域涵蓋至少一第一通孔及至少一第二通孔。In one or more examples of the present disclosure, there are one or more partitions between two opposite inner walls of the second current collector, and two adjacent partitions or any inner wall and its adjacent partitions The area between covers at least one first through hole and at least one second through hole.
依據本揭示的一些實例,一種集流器包含接收腔以及複數個整流腔。接收腔具有入口用以接收工作流體。每一整流腔包含第一壁部及第二壁部,第二壁部與第一壁部相對。第一壁部具有開口與接收腔連接,第二壁部有出口。According to some examples of the present disclosure, a current collector includes a receiving cavity and a plurality of rectifying cavities. The receiving chamber has an inlet for receiving the working fluid. Each rectifying cavity includes a first wall portion and a second wall portion, and the second wall portion is opposite to the first wall portion. The first wall portion has an opening to be connected with the receiving cavity, and the second wall portion has an outlet.
依據本揭示的一些實例,一種集流器包含殼體,殼體具有入口、複數個出口以及壁部。入口用以接收工作流體。壁部具有至少一整流槽道,整流槽道具有第一端部及至少一第二端部,第一端部朝向入口,第二端部朝向其中一出口。According to some examples of the present disclosure, a current collector includes a housing having an inlet, a plurality of outlets, and a wall. The inlet is used to receive the working fluid. The wall has at least one rectification channel, the rectification channel has a first end and at least a second end, the first end faces the inlet, and the second end faces one of the outlets.
於本揭示的一或多個實例中,整流槽道係深入壁部。In one or more examples of the present disclosure, the fairing channel is deep into the wall.
於本揭示的一或多個實例中,整流槽道之數量為兩個以上,整流槽道之尺寸與其所對應之出口距入口的距離成正相關;或是,整流槽道之截面積隨著遠離入口而增加;或是,第二端部之數量為兩個以上,第二端部之尺寸與其所對應之出口距入口的距離成正相關。In one or more examples of the present disclosure, the number of rectification channels is two or more, and the size of the rectification channels is positively related to the distance between the corresponding outlet and the inlet; The number of the second end portion is more than two, and the size of the second end portion is positively related to the distance between the corresponding outlet and the inlet.
綜上所述,本揭示的集流器係運用整流腔或整流槽道的結構將接收的工作流體分配至出口,藉此均勻化通過各流體管的流體流量。To sum up, the current collector of the present disclosure utilizes the structure of the rectifying cavity or the rectifying channel to distribute the received working fluid to the outlet, thereby uniformizing the fluid flow through each fluid tube.
為使本揭示之敘述更加詳盡與完備,可參照所附之圖式及以下所述各種實例。圖式中之各元件未按比例繪製,且僅為說明本揭示而提供。以下描述許多實務上之細節,以提供對本揭示的全面理解,然而,相關領域具普通技術者應當理解可在沒有一或多個實務上之細節的情況下實施本揭示,因此,該些細節不應用以限定本揭示。For a more detailed and complete description of the present disclosure, reference may be made to the accompanying drawings and the various examples described below. Elements in the figures are not drawn to scale and are provided merely to illustrate the present disclosure. Numerous practical details are described below in order to provide a thorough understanding of the present disclosure, however, one of ordinary skill in the relevant art will understand that the present disclosure may be practiced without one or more of the practical details and, therefore, these details do not applied to define the present disclosure.
在本專利中,「A與B正相關」是指A變大時,B也變大;A變小時,B也變小。In this patent, "A and B are positively correlated" means that when A becomes larger, B also becomes larger; when A becomes smaller, B also becomes smaller.
請參照第1圖以及第2圖。第1圖為繪示依據本揭示一實例之水冷裝置100的立體爆炸圖,而第2圖為繪示第1圖所示之水冷裝置100沿線段1-1’的局部放大剖視圖。水冷裝置100用以導引工作流體(例如:水)與記憶體模組10 (於第1圖中省略未繪出)進行熱交換,以冷卻記憶體模組10。水冷裝置100包含彼此流體連通的第一集流器110、第二集流器120以及複數個第一流體管130,第一流體管130彼此分離並連接於第一集流器110以及第二集流器120之間,且第一流體管130的側表面用以與記憶體模組10熱接觸。於一些實例中,第一流體管130為扁管。於一些實例中,第一流體管130包含金屬或其他合適的導熱材料。Please refer to Figure 1 and Figure 2. FIG. 1 is a three-dimensional exploded view illustrating a
第一集流器110包含殼體111以及蓋體112,殼體111用以容納工作流體,蓋體112覆蓋殼體111。殼體111包含接收腔113以及複數個整流腔114,接收腔113具有入口113a用以接收工作流體,工作流體係由入口113a進入水冷裝置100。整流腔114排列於接收腔113的一側,且整流腔114連通接收腔113,並用以將工作流體分配至每一整流腔114所對應之出口115,並使流出各出口115之流量或流速大致相等。The
具體而言,每一整流腔114包含第一壁部114x以及第二壁部114y,第二壁部114y與第一壁部114x相對,第一壁部114x具有開口116,且開口116與接收腔113連接,第二壁部114y有出口115。Specifically, each rectifying
舉例來說,入口113a與出口115是分別位於殼體111的第一側壁111a及第二側壁111b上,且各出口115與入口113a的距離相異。另外,第一集流器110之入口113a外側也可以額外形成連接管190,第一集流器110可通過連接管190連接外部循環系統(未圖示)。For example, the
第一流體管130的一端分別對應連接整流腔114的出口115,另一端連通第二集流器120,以將工作流體由第一集流器110導引至第二集流器120。One end of the
每一整流腔114或其開口116之尺寸或形式不完全相同,藉此差異讓工作流體通過各出口115時的流體流量或流速達到大體一致的結果,進而讓水冷裝置100之各第一流體管130具有大致相同之解熱效率。如此,水冷裝置100可提供各記憶體模組10大致相同之解熱效率。The size or form of each rectifying
整流腔114的開口116之尺寸較佳是與其距接收腔113之入口113a的距離成正相關,換言之,隨著整流腔114與入口113a的距離增加,整流腔114的開口116的尺寸(例如是開口116的寬度、高度或截面積)會對應增大。在一實例中,,第一集流器110包含第一整流腔114a以及第二整流腔114b,第一整流腔114a以及第二整流腔114b分別具有第一開口116a以及第二開口116b,第一開口116a與入口113a的距離是小於第二開口116b與入口113a的距離,且第一開口116a的截面積A1是小於第二開口116b的截面積A2。The size of the opening 116 of the rectifying
此外,可以依據實際之需要,在至少一整流腔114內形成凸管117。開口116作為此凸管117之入口,並自第一壁部114x朝向第二壁部114y突伸。當至少二個整流腔114內形成有凸管117時,至少二個凸管117具有相異的管徑、截面積、長度或內管壁粗糙度。隨著前述凸管117 與入口113a間的距離增加,凸管117的管徑隨之增加、截面積隨之增加、長度隨之減少或內管壁粗糙度隨之降低。於一些實例中,可同時改變兩個以上的凸管設計參數(例如:凸管的截面積、管徑、長度、內管壁粗糙度等)。In addition, a convex
以一實例為例,當第一整流腔114a以及第二整流腔114b分別具有第一凸管117a及第二凸管117b時,第一凸管117a與入口113a的距離小於第二凸管117b與入口113a的距離,第一凸管117a的管徑D1小於第二凸管117b的管徑D2。Taking an example as an example, when the
除上述設計之外,第一集流器110也可以進一步形成有複數個隔板118,隔板118自整流腔114的第一壁部114x朝向遠離第二壁部114y的方向延伸出。相鄰的兩隔板118間的區域,或隔板118與接收腔113內壁之間的區域,各涵蓋至少一個開口116,且隔板118的排列密度較佳是隨著與入口113a的距離增加而下降以使前述各區域內的流量均勻。在一具體實例中,第一集流器110包含依序遠離入口113a排列的第一隔板118a、第二隔板118b以及第三隔板118c,第一隔板118a與第二隔板118b之間的距離B1是小於第二隔板118b與第三隔板118c之間的距離B2。In addition to the above design, the first
此外,如果有需要,水冷裝置100可以包含第三集流器180以及複數個第二流體管132,第一集流器110、第一流體管130、第二集流器120、第二流體管132以及第三集流器180沿著方向X依序排列。第二流體管132彼此分離並用以連通第二集流器120與第三集流器180,第三集流器180具有出口181用以排出工作流體。在上述配置下,水冷裝置100可用以冷卻分離排列的記憶體模組。In addition, if necessary, the
水冷裝置100的入口113a與出口181可以呈對角設置、同側設置或對側設置。出口181外側也可以額外形成連接管190,水冷裝置100可通過兩連接管190形成循環迴路。The
當出口181不是設於第二集流器120時,第二集流器120具有複數個第一通孔121及複數個第二通孔122,第一通孔121以及第二通孔122分別位於第二集流器120相對的兩側壁123、124。第一通孔121對應連接第一流體管130,且第二通孔122對應連接第二流體管132。When the
如有需要,第二集流器120可以額外形成一或二個以上的隔板125,每一隔板125位於第二集流器120相對之兩內壁126、127間,並連接於側壁123、124之間。隔板125於第二集流器120內隔離出複數個區域,相鄰的兩隔板125間的區域,或任一內壁126、127及與其相鄰之隔板125間的區域,涵蓋至少一第一通孔121及至少一第二通孔122。於所示之實例中,各腔室具有單個第一通孔121以及單個第二通孔122。If necessary, the second
請參照第3圖以及第4圖。第3圖為繪示依據本揭示另一實例之水冷裝置的局部放大俯視透視圖,而第4圖為繪示第3圖所示之水冷裝置沿線段5-5’的剖視示意圖。有別於前述實例運用整流腔分配工作流體的作法,於本實例中,第一集流器610具有至少一整流槽道614以將工作流體分配至複數個出口615。具體而言,第一集流器610的殼體611具有第一側壁611a、異於第一側壁611a的第二側壁611b,以及連接第一側壁611a以及第二側壁611b的壁部611x,第一側壁611a具有入口613a,第二側壁611b具有出口615,壁部611x具有整流槽道614。每一整流槽道614具有第一端部614u以及至少一第二端部614v,第一端部614u朝向入口613a,而第二端部614v朝向其中一個出口615。Please refer to Figure 3 and Figure 4. FIG. 3 is a partial enlarged top perspective view of a water cooling device according to another example of the present disclosure, and FIG. 4 is a schematic cross-sectional view of the water cooling device shown in FIG. 3 along line 5-5'. Different from the method of using the rectifying cavity to distribute the working fluid in the foregoing example, in the present example, the
於一些實例中,壁部611x位於殼體611的底部,換言之,壁部611x為殼體611的底壁。於一些實例中,整流槽道614深入壁部611x,換言之,整流槽道614的側壁614w是從壁部611x的表面下凹。於另一些實例中,整流槽道的側壁可取而代之地從壁部611x的表面上凸以定義出整流槽道。In some examples, the
整流槽道614具有不同的流阻,具體而言,整流槽道614的流阻係隨著其對應的出口615與入口613a之間的距離增加而上升,因此,由入口613a進入第一集流器610的工作流體可以被均勻地分配至各出口615,通過各第一流體管130的流體量也相應地均勻化。The
此外,當整流槽道614之數量為兩個以上時,整流槽道614之尺寸與其所對應之出口615距入口613a的距離成正相關,換言之,隨著出口615與入口613a的距離增加,出口615對應的整流槽道614的尺寸(例如是整流槽道614的寬度、高度或截面積)增大。例如第一集流器610包含第一出口615a、第二出口615b、第一整流槽道614a以及第二整流槽道614b,第一整流槽道614a延伸於入口613a以及第一出口615a之間,第二整流槽道614b延伸於入口613a以及第二出口615b之間,第一出口615a與入口613a的距離是小於第二出口615b與入口613a的距離,且第一整流槽道614a的寬度E1是小於第二整流槽道614b的寬度E2。In addition, when the number of the
此外,殼體611的頂壁為壁部611y,其位置與壁部611x相對,壁部611y上也可以形成有至少一整流槽道614z,整流槽道614z延伸於入口613a以及對應的出口615之間。整流槽道614與整流槽道614z可以同時存在,也可以擇一存在。In addition, the top wall of the
請參照第5圖,其為繪示依據本揭示另一實例之水冷裝置的局部放大俯視透視圖。於本實例中,第一集流器710的整流槽道714之截面積隨著遠離入口613a而增加。具體而言,整流槽道714的第一端部714u (朝向入口613a)之截面積C1小於整流槽道714的第二端部714v (朝向其中一個出口615)的截面積C2。整流槽道714之截面積較佳是隨著遠離入口613a而逐漸增加。Please refer to FIG. 5 , which is a partially enlarged top perspective view illustrating a water cooling device according to another example of the present disclosure. In this example, the cross-sectional area of the
請參照第6圖,其為繪示依據本揭示另一實例之水冷裝置的局部放大俯視透視圖。於本實例中,第一集流器810的整流槽道814具有兩個以上的第二端部814v (圖中以兩個為例),第二端部814v之尺寸與其所對應之出口615距入口613a的距離成正相關,換言之,隨著出口615與入口613a的距離增加,出口615對應的第二端部814v的尺寸(包含第二端部814v的寬度、高度或截面積)增大。具體而言,第一集流器810包含第一出口615a與第二出口615b,整流槽道814之第二端部814v1、814v2分別朝向第一出口615a與第二出口615b。因第一出口615a與入口613a的距離小於第二出口615b與入口613a的距離,故第二端部814v1的截面積F1小於第二端部814v2的截面積F2。Please refer to FIG. 6 , which is a partially enlarged top perspective view illustrating a water cooling device according to another example of the present disclosure. In this example, the rectifying
請參照第7圖,其為繪示依據本揭示另一實例之水冷裝置的局部放大剖視圖。本實例與第2圖所示的實例的差異在於第一集流器910的入口913a與出口115分別設置於相互面對的側壁911c、911b。另外,相較於第2圖所示的實例,於本實例中,接收腔913進一步形成有至少一整流槽道914,整流槽道914具有第一端部914u以及至少一第二端部914v,第一端部914u朝向接收腔913之入口913a,而第二端部914v朝向其中一整流腔114的開口116。Please refer to FIG. 7 , which is a partial enlarged cross-sectional view of a water cooling device according to another example of the present disclosure. The difference between this example and the example shown in FIG. 2 is that the
整流槽道914較佳是深入接收腔913之壁部913x (例如:接收腔913的頂壁或底壁)。此外,接收腔913也可以具有複數個整流槽道914,且整流槽道914之尺寸與其所對應之開口116距接收腔913之入口913a的距離成正相關。例如當一段整流槽道對應之開口距入口913a的距離大於另一段整流槽道對應之開口距入口913a的距離時,此段整流槽道之尺寸大於前述另一段整流槽道914之尺寸。The rectifying
另外,接收腔的整流槽道的形式可以是類似第5圖所示的整流槽道714或第6圖所示的整流槽道814。於一些實例中,接收腔的整流槽道之截面積也可以隨著遠離接收腔之入口913a而增加。於一些實例中,整流槽道具有兩個以上的第二端部,且第二端部之尺寸與其所對應之開口116距接收腔之入口913a的距離成正相關。換言之,前述距離越遠,第二端部尺寸越大。In addition, the form of the rectification channel of the receiving cavity may be similar to the
請參照第8圖,其為繪示依據本揭示另一實例之水冷裝置400的立體爆炸圖。於本實例中,第一集流器410進一步包含回流腔440,回流腔440與接收腔113之間具有隔板441,且回流腔440具有出口442,工作流體經由出口442離開第一集流器410。第一流體管430a的兩端分別連接整流腔114以及第二集流器420,而第一流體管430b的兩端分別連接第二集流器420與回流腔440。Please refer to FIG. 8 , which is a perspective exploded view illustrating a
在上述配置下,工作流體大致上沿著呈U字形的流動路徑通過水冷裝置400。具體而言,工作流體首先由入口113a進入接收腔113,經由整流腔114分配進入第一流體管430a,通過第一流體管430a後進入第二集流器420,再通過第一流體管430b進入回流腔440而回到第一集流器410,最後通過出口442離開水冷裝置400。In the above configuration, the working fluid passes through the
綜上所述,本揭示的集流器係運用整流腔或整流槽道的結構將接收的工作流體分配至出口,藉此均勻化通過各流體管的流體流量。To sum up, the current collector of the present disclosure utilizes the structure of the rectifying cavity or the rectifying channel to distribute the received working fluid to the outlet, thereby uniformizing the fluid flow through each fluid tube.
儘管本揭示已以實例揭露如上,然其並非用以限定本揭示,任何熟習此技藝者,於不脫離本揭示之精神及範圍內,當可作各種之更動與潤飾,因此本揭示之保護範圍當視後附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed above with examples, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure is within the scope of this disclosure. The scope of the patent application attached herewith shall prevail.
10:記憶體模組
100,400:水冷裝置
110,410,610,710,810,910:第一集流器
111,611:殼體
111a,111b,911b,911c:側壁
112:蓋體
113,913:接收腔
113a,613a,913a:入口
114,114a,114b:整流腔
114x:第一壁部
114y:第二壁部
115,615,615a,615b:出口
116,116a,116b:開口
117,117a,117b:凸管
118,118a,118b,118c:隔板
120,420:第二集流器
121:第一通孔
122:第二通孔
123,124:側壁
125:隔板
126,127:內壁
130,430a,430b:第一流體管
132:第二流體管
180:第三集流器
181:出口
190:連接管
440:回流腔
441:隔板
442:出口
611a,611b:側壁
611x,611y,913x:壁部
614,614a,614b,614z,714,814,914:整流槽道
614u,714u,914u:第一端部
614v,714v,814v,814v1,814v2,914v:第二端部
614w:側壁
A1,A2,C1,C2,F1,F2:截面積
B1,B2:距離
D1,D2:管徑
E1,E2:寬度
X:方向
10: Memory module
100,400:
為使本揭示之上述及其他目的、特徵、優點與實例能更明顯易懂,所附圖式之說明如下: 第1圖為繪示依據本揭示一實例之水冷裝置的立體爆炸圖。 第2圖為繪示第1圖所示之水冷裝置沿線段1-1’的局部放大剖視圖。 第3圖為繪示依據本揭示另一實例之水冷裝置的局部放大俯視透視圖。 第4圖為繪示第3圖所示之水冷裝置沿線段5-5’的剖視示意圖。 第5圖為繪示依據本揭示另一實例之水冷裝置的局部放大俯視透視圖。 第6圖為繪示依據本揭示另一實例之水冷裝置的局部放大俯視透視圖。 第7圖為繪示依據本揭示另一實例之水冷裝置的局部放大剖視圖。 第8圖為繪示依據本揭示另一實例之水冷裝置的立體爆炸圖。 In order to make the above and other objects, features, advantages and examples of the present disclosure more clearly understood, the accompanying drawings are described as follows: FIG. 1 is a perspective exploded view illustrating a water cooling device according to an example of the present disclosure. Fig. 2 is a partial enlarged cross-sectional view of the water cooling device shown in Fig. 1 along line 1-1'. FIG. 3 is a partially enlarged top perspective view illustrating a water cooling device according to another example of the present disclosure. Fig. 4 is a schematic cross-sectional view of the water cooling device shown in Fig. 3 along the line 5-5'. FIG. 5 is a partially enlarged top perspective view illustrating a water cooling device according to another example of the present disclosure. FIG. 6 is a partially enlarged top perspective view illustrating a water cooling device according to another example of the present disclosure. FIG. 7 is a partial enlarged cross-sectional view illustrating a water cooling device according to another example of the present disclosure. FIG. 8 is a three-dimensional exploded view illustrating a water cooling device according to another example of the present disclosure.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date and number) without Foreign deposit information (please note in the order of deposit country, institution, date and number) without
10:記憶體模組 10: Memory module
110:第一集流器 110: The first collector
111:殼體 111: Shell
111a,111b:側壁 111a, 111b: side walls
113:接收腔 113: Receiving cavity
113a:入口 113a: Entrance
114,114a,114b:整流腔 114, 114a, 114b: Rectifier cavity
114x:第一壁部 114x: first wall
114y:第二壁部 114y: second wall
115:出口 115: Exit
116,116a,116b:開口 116, 116a, 116b: Openings
117,117a,117b:凸管 117, 117a, 117b: convex tube
118,118a,118b,118c:隔板 118, 118a, 118b, 118c: Separator
130:第一流體管 130: First fluid tube
190:連接管 190: Connecting Tube
A1,A2:截面積 A1, A2: Cross-sectional area
B1,B2:距離 B1,B2: Distance
D1,D2:管徑 D1, D2: pipe diameter
Claims (20)
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TW109133751A TWI755078B (en) | 2020-09-29 | 2020-09-29 | Water cooling device and manifold thereof |
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TW109133751A TWI755078B (en) | 2020-09-29 | 2020-09-29 | Water cooling device and manifold thereof |
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TW202212764A TW202212764A (en) | 2022-04-01 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101600919A (en) * | 2006-11-22 | 2009-12-09 | 约翰逊控制技术公司 | Multi-pass heat exchangers with different multichannel pipelines |
JP2011033314A (en) * | 2009-08-05 | 2011-02-17 | Atago Seisakusho:Kk | Heat exchanger |
US20140048243A1 (en) * | 2012-08-16 | 2014-02-20 | International Business Machines Corporation | Actively controlling coolant-cooled cold plate configuration |
TWI688331B (en) * | 2019-02-01 | 2020-03-11 | 邁萪科技股份有限公司 | Flow uniformized pressured liquid heat dissipation system |
TW202031115A (en) * | 2019-02-01 | 2020-08-16 | 邁萪科技股份有限公司 | Flow uniformized liquid heat dissipation system for cabinet and serial system thereof |
-
2020
- 2020-09-29 TW TW109133751A patent/TWI755078B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101600919A (en) * | 2006-11-22 | 2009-12-09 | 约翰逊控制技术公司 | Multi-pass heat exchangers with different multichannel pipelines |
JP2011033314A (en) * | 2009-08-05 | 2011-02-17 | Atago Seisakusho:Kk | Heat exchanger |
US20140048243A1 (en) * | 2012-08-16 | 2014-02-20 | International Business Machines Corporation | Actively controlling coolant-cooled cold plate configuration |
TWI688331B (en) * | 2019-02-01 | 2020-03-11 | 邁萪科技股份有限公司 | Flow uniformized pressured liquid heat dissipation system |
TW202031115A (en) * | 2019-02-01 | 2020-08-16 | 邁萪科技股份有限公司 | Flow uniformized liquid heat dissipation system for cabinet and serial system thereof |
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