CN114245661A - Heat conduction element and electronic device - Google Patents
Heat conduction element and electronic device Download PDFInfo
- Publication number
- CN114245661A CN114245661A CN202111371541.1A CN202111371541A CN114245661A CN 114245661 A CN114245661 A CN 114245661A CN 202111371541 A CN202111371541 A CN 202111371541A CN 114245661 A CN114245661 A CN 114245661A
- Authority
- CN
- China
- Prior art keywords
- channel
- plate
- sub
- capillary structure
- working medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009833 condensation Methods 0.000 claims abstract description 66
- 230000005494 condensation Effects 0.000 claims abstract description 66
- 238000001704 evaporation Methods 0.000 claims abstract description 61
- 230000008020 evaporation Effects 0.000 claims abstract description 61
- 238000005192 partition Methods 0.000 claims abstract description 53
- 230000017525 heat dissipation Effects 0.000 claims description 22
- 238000004891 communication Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000007791 liquid phase Substances 0.000 abstract description 44
- 239000012071 phase Substances 0.000 abstract description 35
- 230000005540 biological transmission Effects 0.000 abstract description 27
- 230000008859 change Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007792 gaseous phase Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the application discloses a heat conduction element and electronic equipment. The heat conduction element comprises an evaporation end, a condensation end, a connecting section and a first capillary structure, the connecting section comprises a first shell and a partition plate, a first channel is formed in the first shell, the partition plate is located in the first channel and divides the first channel into a first sub-channel and a second sub-channel which are independent of each other, and the first capillary structure is arranged in the first sub-channel. The transmission channel of the gas-phase working medium and the transmission channel of the liquid-phase working medium of the heat conduction element are independent from each other, and the gas-phase working medium cannot enter the first sub-channel, so that the phenomenon that the gas-phase working medium brings up the liquid-phase working medium in the first sub-channel and collides with the inner wall surface of the heat conduction element to generate noise in the high-speed transmission process can be avoided; and because the gas-phase working medium is transmitted to the condensation end through the second sub-channel which is more spacious, the transmission speed is greatly improved, thereby the phase change speed can be accelerated, and the heat conduction efficiency of the heat conduction element is improved.
Description
Technical Field
The present application relates to the field of heat transfer technologies, and in particular, to a heat conduction element and an electronic device.
Background
The heat conduction element generally comprises a shell and a capillary structure arranged in the shell, the heat conduction element is provided with an evaporation end and a condensation end, when the evaporation end is heated, a coolant in the shell can be quickly evaporated to generate high-pressure steam, and at the moment, the steam flows to the condensation end under a slight pressure difference; the vapor at the condensation end is condensed into liquid after releasing heat when meeting cold, and flows back to the evaporation end under the action of the capillary force of the capillary structure, and the heat conduction element can continuously dissipate the heat outwards in such a circulating way.
In the related art, the heat conduction element has large noise in the using process, and the user experience is poor.
Disclosure of Invention
The application provides a heat conduction component and electronic equipment for there is great noise, user experience is relatively poor problem in the heat conduction component in the use of solving correlation technique.
The present application provides a heat conduction element comprising: an evaporation end; the condensation end is arranged at an interval with the evaporation end; the connecting section comprises a first shell and a partition plate, the first shell is connected between the evaporation end and the condensation end, a first channel communicated with the evaporation end and the condensation end is formed in the first shell, the partition plate is located in the first channel and divides the first channel into a first sub-channel and a second sub-channel which are independent of each other, the first sub-channel is communicated with the evaporation end and the condensation end, and the second sub-channel is communicated with the evaporation end and the condensation end; and the first capillary structure is arranged in the first sub-channel.
The utility model provides a heat-conducting element sets the linkage segment to including first casing and the baffle that is located the first passageway of first casing, and the baffle is divided into first subchannel and second subchannel with first passageway, and first capillary structure sets up in first subchannel, so, gaseous phase working medium that the evaporation end produced will be transmitted to the condensation end through the second subchannel that does not set up the capillary structure and is more spacious, and gaseous phase working medium that the heat dissipation of condensation end was changed into will flow back to the evaporation end through the first subchannel that sets up first capillary structure. Namely, the transmission channel of the gas-phase working medium and the transmission channel of the liquid-phase working medium are independent from each other, even if the liquid-phase working medium is gathered at the first sub-channel to form water drops due to the phenomena of uneven thickness distribution, fracture and the like of the first capillary structure in the first sub-channel, the gas-phase working medium cannot enter the first sub-channel, and therefore the phenomenon that the water drops in the first sub-channel are brought up and collide with the inner wall surface of the heat conduction element to generate noise in the high-speed transmission process of the gas-phase working medium can be avoided; and because the gas-phase working medium is transmitted to the condensation end through the second sub-channel which is more spacious, and the gas-phase working medium can not contact and rub with the first capillary structure, the transmission speed is greatly improved, and further the phase change speed can be accelerated, and the heat conduction efficiency of the heat conduction element is improved.
In some embodiments, the condensation end includes a second housing, a second channel is formed in the second housing and communicates with the first channel, and the heat conduction element further includes a second capillary structure disposed in the second channel and connected to the first capillary structure.
Based on the above embodiment: through set up the second capillary structure who is connected with first capillary structure in the condensation end, accessible second capillary structure guides the liquid phase working medium in the condensation end to accelerate the transmission rate of the liquid phase working medium in the condensation end, make the liquid phase working medium flow back to the evaporation end fast, promote heat-conduction efficiency of heat-conducting element.
In some embodiments, the partition plate is plate-shaped, the partition plate has a first plate surface and a second plate surface that are opposite to each other, the first sub-channel is formed between the first plate surface and the inner wall surface of the first casing, and the second sub-channel is formed between the second plate surface and the inner wall surface of the first casing.
Based on the above embodiment: the partition board is arranged to be of a plate-shaped structure, so that the first sub-channel and the second sub-channel are simple in structure, and a first capillary structure is conveniently arranged in the first sub-channel.
In some of these embodiments, the second capillary structure comprises:
a first structure portion attached to an inner wall surface of the second housing and connected to the first capillary structure;
a second structure part attached to an inner wall surface of the second housing;
and a third structure portion connecting the first structure portion and the second structure portion.
Based on the above embodiment: after the gas-phase working medium transmitted by the evaporation end enters the condensation end, the heat can be dissipated by the inner wall surface of the second shell of the condensation end, and the formed liquid-phase working medium can be quickly transmitted to the first capillary structure through the first structure part, the second structure part and the third structure part, so that the transmission speed of the liquid-phase working medium is increased. Meanwhile, the first structure part and the second structure part are attached to the inner wall surface of the second shell, and the third structure part is connected with the first structure part and the second structure part, so that the second capillary structure can be conveniently installed and fixed in the second shell.
In some embodiments, the first casing includes a first plate located on one side of the partition where the first plate is located, and a second plate located on one side of the partition where the second plate is located, the second casing includes a third plate located on the same side of the partition as the first plate, and a fourth plate located on the same side of the partition as the second plate, the first structure portion is attached to the third plate, and the second structure portion is attached to the fourth plate and spaced from the first structure portion.
Based on the above embodiment: the first structure part and the second structure part are arranged at intervals, so that the first structure part and the second structure part are distributed relatively and dispersedly on the second shell, and the absorption effect on the liquid-phase working medium is relatively balanced. The first structure part attached to the third plate body is designed to be close to the first capillary structure on one side of the first plate surface of the partition plate, so that the first structure part is connected with the first capillary structure conveniently.
In some embodiments, the heat dissipation structure is disposed on a side of the fourth board body facing away from the third board body.
Based on the above embodiment: the heat dissipation structure can accelerate the heat dissipation speed of the gas-phase working medium at the condensation end. The heat dissipation structure is located on one side, deviating from the third plate body, of the fourth plate body, the gas-phase working medium can move towards the fourth plate body under the action of the heat dissipation structure after entering the condensation end and dissipate heat, directional heat dissipation near the condensation end is achieved, and arrangement of heat conduction elements in the electronic equipment is facilitated.
In some embodiments, the partition plate is cylindrical, the first sub-channel is formed between an outer circumferential surface of the partition plate and an inner wall surface of the first housing, and the second sub-channel is formed by surrounding an inner circumferential surface of the partition plate.
Based on the above embodiment: the first sub-channel is designed to be annularly provided with the second sub-channel, so that the distribution of the first sub-channel is more dispersed, and thus, the transmission effect of the first capillary structure arranged in the first sub-channel on the liquid-phase working medium is relatively balanced.
In some of these embodiments, the first channel includes opposing first and second ports, the first port in communication with the evaporation end and the second port in communication with the condensation end; two ends of the partition plate extend to the first port and the second port respectively.
Based on the above embodiment: the first sub-channel and the second sub-channel also extend to the first port and the second port, so that the gas-phase working medium directly enters the second sub-channel when entering the first shell and is separated from the liquid-phase working medium, the transmission efficiency is higher, and abnormal sound can be better prevented.
In some embodiments, the evaporation end comprises a third housing, a third channel communicated with the first channel is formed in the third housing, and the heat conduction element further comprises a third capillary structure arranged in the third channel and connected with the first capillary structure.
Based on the above embodiment: the liquid phase working medium transmitted by the first capillary structure can be quickly guided to the evaporation end through the third capillary structure, so that the speed of the liquid phase working medium flowing back to the evaporation end is increased, and the heat conduction efficiency of the heat conduction element is improved.
In a second aspect, the present application provides an electronic device comprising an electronic component generating heat and the above heat conducting element, wherein the evaporation end of the heat conducting element is disposed close to the electronic component.
The electronic equipment comprises the heat conduction element, has the effects of high heat transmission efficiency, difficulty in noise generation and the like, and has a wide use prospect.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a sectional view of a heat transfer member in the related art;
FIG. 2 is a cross-sectional view of a first heat-conducting element provided in an embodiment of the present application;
FIG. 3 is a cross-sectional view of a second heat-conducting element provided by an embodiment of the present application;
FIG. 4 is a cross-sectional view of a third heat-conducting element provided in accordance with an embodiment of the present application;
FIG. 5 is a cross-sectional view of a fourth heat-conducting element provided in accordance with an embodiment of the present application;
FIG. 6 is a perspective view of a fifth heat transfer element provided in an embodiment of the present application;
FIG. 7 is a perspective view of a sixth thermal conduction element provided in an embodiment of the present application;
FIG. 8 is a perspective view of a seventh heat transfer element provided in an embodiment of the present application;
FIG. 9 is a perspective cross-sectional view of the heat-conducting element shown in FIG. 8;
FIG. 10 is another perspective cross-sectional view of the heat-conducting element shown in FIG. 8;
fig. 11 is a block diagram of an electronic device according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.
Referring to fig. 1, in the related art, a heat conduction element 10 includes a housing 11 having a receiving cavity 111 and a capillary structure 12 disposed in the receiving cavity 111, the heat conduction element 10 has an evaporation end 13 and a condensation end 14, when the evaporation end 13 is heated, a coolant in the evaporation end 13 can be rapidly evaporated, and at this time, vapor flows to the condensation end 14 under a slight pressure difference; and the vapor in the condensation end 14 is condensed into liquid after releasing heat when meeting cold, and flows back to the evaporation end 13 under the action of the capillary force of the capillary structure 12 in the shell 11, and the circulation is repeated, so that the condensation end 14 can continuously dissipate heat outwards.
In the related art, the accommodating cavity 111 in the housing 11 is generally a through cavity, and the capillary structure 12 is directly disposed on the inner wall of the housing 11, so that the gas-phase working medium generated by the evaporation end 13 will contact with the capillary structure 12 on the inner wall of the housing 11 during the process of being transported to the condensation end 14. If the thickness distribution of the capillary structure 12 is not uniform or a fracture is generated, when the liquid-phase working medium transmitted through the capillary structure 12 is transmitted to a position with relatively thin thickness or a fracture in the capillary structure 12, part of the liquid-phase working medium is gathered to form water drops because of too small capillary force, so that the liquid-phase working medium is influenced to flow back to the evaporation end 13, and the heat conduction efficiency of the heat conduction element 10 is influenced; and the gathered water drops can be driven by the gas-phase working medium transmitted from the evaporation end 13 at a high speed to impact the inner wall of the shell 11, which is not provided with the capillary structure 12, to generate abnormal sound (similar to sound generated when water drops reach a hot pot), so that the use experience of the heat conduction element 10 is reduced.
The uneven thickness distribution of the capillary structure 12 may be: the capillary structure 12 is thicker at the location of the sections and thinner at the location of the sections 12. The capillary structure 12 may be broken: the middle part of the capillary structure 12 is hollowed out, etc. The uneven thickness distribution or the fractures of the capillary structure 12 may be caused by manufacturing errors, breakage of the capillary structure 12 during use, and the like, which are observed only by means of an X-RAY scanner, but the X-RAY scanning of the entire heat conductive element 10 may result in excessive manufacturing costs.
Based on this, please refer to fig. 2, an embodiment of the present application provides a heat conduction element 20, the cavity in the heat conduction element 20 is split into two independent cavities, so that the gas-phase working medium and the liquid-phase working medium are respectively transmitted in the two cavities, so even if water drops occur in the transmission cavity of the liquid-phase working medium, the gas-phase working medium transmitted at a high speed does not enter the transmission cavity of the liquid-phase working medium, and therefore the water drops in the transmission cavity of the liquid-phase working medium are not driven to collide with the inner wall of the heat conduction element 20, so that the phenomenon that the heat conduction element 20 generates abnormal sound when in use can be eliminated, and the user experience is improved. The heat conduction element 20 may be any element that achieves heat transfer through phase change of a medium, for example, the heat conduction element 20 may be a heat pipe, a vapor chamber, or the like, which is not limited in the embodiments of the present application.
Specifically, the heat conduction member 20 may include an evaporation end 21, a condensation end 22, a connection section 23, and a first capillary structure 24. The evaporation end 21 and the condensation end 22 are arranged at an interval, the connection section 23 may include a first housing 231 and a partition 232, the first housing 231 is connected between the evaporation end 21 and the condensation end 22, a first passage 2311 communicated with both the evaporation end 21 and the condensation end 22 is formed in the first housing 231, the partition 232 is arranged in the first passage 2311 and splits the first passage 2311 into a first sub-passage 2312 and a second sub-passage 2313 which are independent of each other, the first sub-passage 2312 is communicated with both the evaporation end 21 and the condensation end 22, and the second sub-passage 2313 is communicated with both the evaporation end 21 and the condensation end 22; the first capillary structure 24 may be disposed at the first sub-passage 2312.
In the embodiment of the present application, the first capillary structure 24 is disposed in the first sub-channel 2312, so that the gas-phase working medium generated by the evaporation end 21 will be transmitted to the condensation end 22 through the second sub-channel 2313 which is not disposed with the first capillary structure 24 and is wider, and the liquid-phase working medium converted from the gas-phase working medium by heat dissipation through the condensation end 22 will flow back to the evaporation end 21 through the first sub-channel 2312 disposed with the first capillary structure 24. That is, the transmission channel of the gas-phase working medium and the transmission channel of the liquid-phase working medium are independent from each other, and the gas-phase working medium does not enter the first sub-channel 2312, so that the phenomenon that water drops gathered in the first sub-channel 2312 are brought up and collide with the inner wall surface of the heat conduction element 20 to generate noise in the high-speed transmission process of the gas-phase working medium can be avoided; and since the gas phase working medium is transmitted to the condensing end 22 through the second sub-channel 2313 which is more spacious, and will not contact and rub with the first capillary structure 24, the transmission speed will be greatly increased, and further the phase change speed can be increased, and the heat conduction efficiency of the heat conduction element 20 is improved.
The baffle 232 may be of any shape. For example, the separator 232 may have a cylindrical shape, a spiral shape, a plate shape, or the like, and the present embodiment is not limited thereto. Specifically, when the partition 232 has a cylindrical shape, the first sub-passage 2312 may be formed between the outer circumferential surface of the partition 232 and the inner wall surface of the first housing 231, and the second sub-passage 2313 may be surrounded by the inner circumferential surface of the partition 232. The first sub-channel 2312 is designed to be annularly provided with the second sub-channel 2313, so that the distribution of the first sub-channel 2312 is more dispersed, and thus, the transmission effect of the first capillary structure 24 arranged in the first sub-channel 2312 on the liquid-phase working medium is relatively balanced. When the partition 232 is plate-shaped, please refer to fig. 3, the partition 232 may have a first plate surface 2321 and a second plate surface 2322 disposed opposite to each other, a first sub-channel 2312 may be formed between the first plate surface 2321 and an inner wall surface of the first housing 231, and a second sub-channel 2313 may be formed between the second plate surface 2322 and the inner wall surface of the first housing 231, so that the first sub-channel 2312 and the second sub-channel 2313 are simple in structure, and the first capillary structure 24 is conveniently disposed in the first sub-channel 2312.
Optionally, the condensation end 22 may be provided with a second capillary structure 25, so that the second capillary structure 25 can guide the liquid-phase working medium in the condensation end 22 to increase the transmission speed of the liquid-phase working medium in the condensation end 22, so that the liquid-phase working medium can quickly flow back to the evaporation end 21, thereby improving the heat conduction efficiency of the heat conduction element 20. Specifically, the condensation end 22 may include a second housing 221, a second passage 2211 communicating with the first passage 2311 may be formed in the second housing 221, and the second capillary structure 25 may be disposed in the second passage 2211 and connected to the first capillary structure 24, so as to increase a speed at which the liquid-phase working medium in the condensation end 22 flows to the first capillary structure 24, and improve a heat conduction efficiency of the heat conduction element 20.
Further alternatively, referring to fig. 4, the second capillary structure 25 may include a first structure portion 251 attached to an inner wall surface of the second housing 221, a second structure portion 252 attached to an inner wall surface of the second housing 221, and a third structure portion 253 connected to the first structure portion 251 and the second structure portion 252, wherein the first structure portion 251 is connected to the first capillary structure 24. Thus, after the gas-phase working medium transmitted through the evaporation end 21 enters the condensation end 22, the heat can be dissipated through the inner wall surface of the second shell 221 of the condensation end 22, and the formed liquid-phase working medium can be rapidly transmitted to the first capillary structure 24 through the second structure portion 252, the third structure portion 253 and the first structure portion 251, so that the transmission speed of the liquid-phase working medium is increased. Meanwhile, the first structure portion 251 and the second structure portion 252 are both attached to the inner wall surface of the second casing 221, and the third structure portion 253 connects the first structure portion 251 and the second structure portion 252, which is also convenient for the second capillary structure 25 to be mounted and fixed in the second casing 221.
The first structure portion 251 and the second structure portion 252 may be directly connected to each other or may be provided at an interval. Preferably, the first structure portion 251 and the second structure portion 252 are arranged at an interval, so that the first structure portion 251 and the second structure portion 252 are distributed relatively and dispersedly in the second shell 221, and the absorption effect on the liquid-phase working medium in the second shell 221 is relatively balanced. Alternatively, the second casing 221 may include a plurality of plate bodies, the first structure portion 251 and the second structure portion 252 may be disposed on the same plate body and spaced apart from each other, and the first structure portion 251 and the second structure portion 252 may also be disposed on two different plate bodies and spaced apart from each other. Preferably, the first structure portion 251 and the second structure portion 252 may be disposed on two oppositely disposed plate bodies and disposed at an interval, so that the first structure portion 251 and the second structure portion 252 are more dispersed, and the absorption effect on the liquid-phase working medium in the condensation end 22 is better.
Alternatively, when the partition 232 is in a plate shape, the first housing 231 may include a first plate 2314 located on one side of the first plate 2321 of the partition 232 and a second plate 2315 located on one side of the second plate 2322 of the partition 232, and the second housing 221 may include a third plate 2212 located on the same side of the partition 232 as the first plate 2314 and a fourth plate 2213 located on the same side of the partition 232 as the second plate 2315. In this case, the first structure portion 251 of the second capillary structure 25 may be attached to the third plate 2212, and the second structure portion 252 may be attached to the fourth plate 2213 and spaced apart from the first structure portion 251. In this way, the first structure portion 251 attached to the third plate 2212 is designed to be close to the first capillary structure 24 on the side of the partition 232 where the first plate 2321 is located, so as to facilitate connection between the first structure portion 251 and the first capillary structure 24.
And the layout of the heat conduction element 20 in the electronic device 2 is designed, so that the heat dissipated by the heat conduction element 20 is mainly distributed on the side where the fourth board 2213 is located, and the heat of the heat conduction element 20 is directionally dissipated. For example, when the heat conducting element 20 is installed inside the electronic device 2, the fourth plate 2213 of the condensation end 22 can be selectively arranged toward the outside close to the electronic device 2, so that the gaseous working medium entering the condensation end 22 will move toward the fourth plate 2213 in a large amount, and the heat is transferred to the outside of the electronic device 2 through the fourth plate 2213, and then the liquid working medium formed at the fourth plate 2213 can be transferred to the first capillary structure 24 through the second structure portion 252, the third structure portion 253, and the first structure portion 251 in sequence.
It should be noted that the first plate 2314 may be flush with the third plate 2212, and the first plate 2314 may also be located between the partition 232 and the third plate 2212. When the first plate body 2314 is located between the partition 232 and the third plate body 2212, a height difference is formed between the first capillary structure 24 disposed between the first plate body 2314 and the partition 232 and the third plate body 2212. In order to connect the first capillary structure 24 with the first structure portion 251 of the third plate 2212, the first structure portion 251 may be thicker as a whole, or the first structure portion 251 may be thicker only near the first capillary structure 24 and thinner at other portions, so as to save material of the capillary structure and provide sufficient gap in the condensation end 22 for the gas phase working medium to enter.
Alternatively, when the first structure portion 251 is provided thicker at a portion close to the first capillary structure 24 and is provided thinner at other portions, the thickness of the thinner portion in the first structure portion 251 may be kept uniform, and the thickness of the thicker portion may satisfy: gradually increasing from the end connecting the thinner portion to the end connecting the first capillary structure 24. Thus, the thicker portion of the first structure portion 251 is substantially trapezoidal, and the forming is convenient.
The number of the third structure portions 253 included in the second capillary structure 25 may be one or plural. When the number of the third structures 253 is plural, the plural third structures 253 may be spaced apart from each other. By providing a plurality of third structure portions 253 distributed at intervals, liquid-phase working mediums at a plurality of positions on the second structure portion 252 can be conveniently transmitted to the first structure portion 251 through the third structure portions 253 by the third structure portions 253, so that the transmission efficiency of the liquid-phase working mediums at each position on the second structure portion 252 is approximately balanced. Alternatively, the plurality of third structures 253 may be distributed in a matrix, a circumference, or the like, which is not limited in this embodiment. Alternatively, the third structure portion 253 may be attached to the inner wall surface of the second casing 221, or may not be attached to the inner wall surface of the second casing 221, which is not limited in the embodiment of the present application.
Optionally, referring to fig. 5, the heat conduction element 20 may further include a heat dissipation structure 26 connected to the condensation end 22 to increase the heat dissipation speed of the gas-phase working medium at the condensation end 22. The heat dissipation structure 26 may include heat dissipation fins, a heat dissipation fan, and the like, which is not limited in this application. When the first structure portion 251 of the second capillary structure 25 is attached to the third plate 2212 and the second structure portion 252 is attached to the fourth plate 2213, the heat dissipation structure 26 may be located on a side of the fourth plate 2213 away from the third plate 2212, so that the gas-phase working medium enters the condensation end 22 and moves toward the fourth plate 2213 under the action of the heat dissipation structure 26 to dissipate heat, thereby achieving directional heat dissipation of the heat conducting element 20. In this case, the heat dissipation structure 26 may include heat dissipation fins and a heat dissipation fan.
Optionally, the evaporation end 21 may be provided with a third capillary structure 27 connected to the first capillary structure 24, so that the third capillary structure 27 can quickly guide the liquid-phase working substance transmitted by the first capillary structure 24 into the evaporation end 21, speed up the liquid-phase working substance flowing back to the evaporation end 21, and improve the heat conduction efficiency of the heat conduction element 20. Specifically, the evaporation end 21 may include a third housing 211, a third passage 2111 communicating with the first passage 2311 may be formed in the third housing 211, and the third capillary structure 27 may be disposed in the third passage 2111. Further optionally, the third housing 211 may include a fifth plate 2112 located on the same side of the partition 232 as the first plate 2314, and the third capillary structure 27 may be attached to the fifth plate 2112, so that the third capillary structure 27 achieves a better guiding effect on the liquid-phase working medium on the premise of small size and no influence on the circulation of the gas-phase working medium.
It should be noted that first plate 2314 may be flush with fifth plate 2112, and first plate 2314 may also be located between partition 232 and fifth plate 2112. When the first plate body 2314 is located between the partition 232 and the fifth plate body 2112, a height difference is provided between the first capillary structure 24 disposed between the first plate body 2314 and the partition 232 and the fifth plate body 2112. In order to connect the first capillary structure 24 with the third capillary structure 27 on the fifth plate 2112, the third capillary structure 27 may be thicker as a whole, or the third capillary structure 27 may be thicker only at a portion close to the first capillary structure 24 and thinner at other portions, so as to save material of the capillary structure and provide sufficient gap in the evaporation end 21 to facilitate the circulation of the gas-phase working medium.
Alternatively, when the third capillary structure 27 is thicker at a portion close to the first capillary structure 24 and thinner at other portions, the thickness of the thinner portion of the third capillary structure 27 can be kept consistent, and the thickness of the thicker portion can satisfy: gradually increasing from the end connecting the thinner portion to the end connecting the first capillary structure 24. Thus, the thicker portion of the third capillary structure 27 is substantially trapezoidal, which is convenient for molding.
Referring to fig. 2 again, when the separator 232 is cylindrical, the second capillary structure 25 may be disposed around the second housing 221, such that the second capillary structure 25 and the first capillary structure 24 have substantially the same structure, which facilitates connection between the second capillary structure 25 and the first capillary structure 24. Similarly, when the separator 232 is cylindrical, the third capillary structure 27 may be disposed around the third housing 211, so that the third capillary structure 27 and the first capillary structure 24 have substantially the same structure, and the third capillary structure 27 and the first capillary structure 24 are connected conveniently. For example, the inner and/or outer diameters of the first, second and third capillary structures 24, 25, 27 may be substantially the same. When the partition 232 has a cylindrical shape, the heat dissipation structure 26 may include heat dissipation fins around the outer circumference of the second housing 221.
Alternatively, the first capillary structure 24, the second capillary structure 25, and the third capillary structure 27 may be formed by sintering copper powder and have a fixed shape, so that the capillary structure 12 has better capillary performance and is beneficial to improving the installation stability of the capillary structure 12 in the channel. It should be noted that, other metal powders and the like may be used for the first capillary structure 24, the second capillary structure 25 and the third capillary structure 27, which is not limited in the embodiment of the present application.
The material for preparing the first housing 231, the second housing 221 and the third housing 211 may be any heat conducting material, for example, the material may include copper, aluminum, etc., which is not limited in this embodiment of the application.
The heat conduction member 20 may have a substantially flat structure, a cylindrical structure, or the like. Referring to fig. 6 and 7, when the heat conduction element 20 has a substantially flat or cylindrical structure, the first housing 231, the second housing 221, and the third housing 211 can be regarded as partitions of different parts of the same housing. Referring to fig. 8, the heat conduction element 20 may also have a substantially i-shaped structure, which is not limited in the embodiments of the present application.
It should be noted that, when the structures of the evaporation end 21 and the condensation end 22 are relatively large, the heat conduction element 20 may include a plurality of connection sections 23 connected between the same evaporation end 21 and the same condensation end 22. By connecting the connecting sections 23 between the same evaporation end 21 and the same condensation end 22, the size of each connecting section 23 can be designed to be smaller, and compared with the case that one connecting section 23 having a size similar to that of the evaporation end 21 and the condensation end 22 is directly arranged, the connecting sections 23 having smaller sizes can achieve the effect of saving space on the premise of ensuring the heat conduction efficiency of the heat conduction element 20. The number of the connecting segments 23 may be any number of two or more, for example, the number of the connecting segments 23 may be two, three, four, etc.; when the number of the connection segments 23 is plural, the intervals between the adjacent two connection segments 23 may be equal.
Referring to fig. 9, when the number of the connection segments 23 is plural, each connection segment 23 may include a partition 232, so that each connection segment 23 has a first sub-channel 2312, and the first capillary structure 24 may be disposed in each first sub-channel 2312. The first sub-channel 2312 in each connecting section 23 can be positioned at the same side of the partition plate 232 so as to realize smooth transmission of gas-phase working medium and liquid-phase working medium.
Referring to fig. 10, when the number of the connection segments 23 is multiple and each connection segment 23 is provided with the first capillary structure 24, the second capillary structure 25 in the condensation end 22 may include the first structure portions 251 whose number is equal to that of the first capillary structures 24, and each first structure portion 251 may be disposed corresponding to one first capillary structure 24 and connected to the first capillary structure 24, so that each first structure portion 251 may guide the liquid-phase working medium in the condensation end 22 to the first capillary structure 24 in the connection segment 23 correspondingly. In order to make the transport amount of the liquid-phase working medium on each of the first capillary structures 24 substantially equal, the plurality of first structure portions 251 may be uniformly arranged in the condensation end 22. Each first structure portion 251 may be connected to a plurality of third structure portions 253, and the plurality of third structure portions 253 may be uniformly distributed on the first structure portion 251, so as to achieve relatively uniform absorption of the liquid-phase working medium at each position in the condensation end 22 by the second capillary structure 25.
Similarly, when the number of the connection sections 23 is multiple and the first capillary structures 24 are disposed in each connection section 23, the third capillary structure 27 in the evaporation end 21 may include fourth structure portions 271 having the same number as the first capillary structures 24 and fifth structure portions 272 connected to all the fourth structure portions 271, and each fourth structure portion 271 may be disposed corresponding to one first capillary structure 24 and connected to the first capillary structure 24, so that each fourth structure portion 271 may guide the liquid-phase working medium on the corresponding first capillary structure 24 into the evaporation end 21. In order to make the liquid-phase working medium in the evaporation end 21 disperse relatively uniformly, a plurality of fourth structures 271 can be uniformly arranged in the evaporation end 21. The fifth structure portion 272 may be located at the center of the evaporation end 21 and connected to all the fourth structure portions 271.
Referring again to fig. 5, at least one of the two ends of the partition 232 may extend to a port of the first passage 2311. Preferably, the first passage 2311 may include a first port 2113 and a second port 2114 opposite to each other, the first port 2113 is communicated with the evaporation end 21, the second port 2114 is communicated with the condensation end 22, and two ends of the partition 232 may extend to the first port 2113 and the second port 2114, respectively. Therefore, the first sub-channel 2312 and the second sub-channel 2313 also extend to the first port 2113 and the second port 2114, so that the gas-phase working medium directly enters the second sub-channel 2313 when entering the first shell 231 and is separated from the liquid-phase working medium, the transmission efficiency is higher, and abnormal sound can be better prevented.
In a second aspect, the present application provides an electronic device 2. Referring to fig. 11, the electronic device 2 includes an electronic component 30 generating heat and the heat conducting element 20, and the evaporation end 21 of the heat conducting element 20 is disposed near the electronic component 30.
The electronic device 2 comprises the heat conduction element 20, has the effects of high heat transmission efficiency, difficulty in noise generation and the like, and has a wide application prospect.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.
Claims (10)
1. A heat transfer element, comprising:
an evaporation end;
the condensation end is arranged at an interval with the evaporation end;
the connecting section comprises a first shell and a partition plate, the first shell is connected between the evaporation end and the condensation end, a first channel communicated with the evaporation end and the condensation end is formed in the first shell, the partition plate is located in the first channel and divides the first channel into a first sub-channel and a second sub-channel which are independent of each other, the first sub-channel is communicated with the evaporation end and the condensation end, and the second sub-channel is communicated with the evaporation end and the condensation end;
and the first capillary structure is arranged in the first sub-channel.
2. The heat transfer element of claim 1 wherein the condensation end comprises a second housing having a second channel formed therein in communication with the first channel, the heat transfer element further comprising a second capillary structure disposed in the second channel and connected to the first capillary structure.
3. The heat conducting element of claim 2,
the partition board is in a plate shape and provided with a first board surface and a second board surface which are arranged in a back-to-back mode, the first sub-channel is formed between the first board surface and the inner wall surface of the first shell, and the second sub-channel is formed between the second board surface and the inner wall surface of the first shell.
4. The heat conducting element of claim 3, wherein the second capillary structure comprises:
a first structure portion attached to an inner wall surface of the second housing and connected to the first capillary structure;
a second structure part attached to an inner wall surface of the second housing;
and a third structure portion connecting the first structure portion and the second structure portion.
5. The heat transfer element of claim 4, wherein the first housing comprises a first plate located on a side of the partition where the first surface is located, and a second plate located on a side of the partition where the second surface is located, the second housing comprises a third plate located on a same side of the partition as the first plate, and a fourth plate located on a same side of the partition as the second plate, wherein the first structure portion is attached to the third plate, and the second structure portion is attached to the fourth plate and spaced apart from the first structure portion.
6. The heat conducting element of claim 5, further comprising:
and the heat dissipation structure is arranged on one side of the fourth plate body, which deviates from the third plate body.
7. The heat conduction element according to claim 1, wherein the partition plate has a cylindrical shape, the first sub-passage is formed between an outer peripheral surface of the partition plate and an inner wall surface of the first casing, and the second sub-passage is enclosed by an inner peripheral surface of the partition plate.
8. The heat conducting element of claim 1, wherein the first channel includes opposing first and second ports, the first port communicating with the evaporation end and the second port communicating with the condensation end; two ends of the partition plate extend to the first port and the second port respectively.
9. The heat transfer element of any of claims 1-8 wherein the evaporation end comprises a third housing having a third channel formed therein in communication with the first channel, the heat transfer element further comprising a third capillary structure disposed in the third channel and connected to the first capillary structure.
10. An electronic device comprising an electronic component that generates heat and the heat conduction element according to any one of claims 1 to 9, wherein the evaporation end of the heat conduction element is disposed near the electronic component.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111371541.1A CN114245661A (en) | 2021-11-18 | 2021-11-18 | Heat conduction element and electronic device |
| PCT/CN2022/125286 WO2023087994A1 (en) | 2021-11-18 | 2022-10-14 | Heat conduction element and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111371541.1A CN114245661A (en) | 2021-11-18 | 2021-11-18 | Heat conduction element and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114245661A true CN114245661A (en) | 2022-03-25 |
Family
ID=80749961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111371541.1A Pending CN114245661A (en) | 2021-11-18 | 2021-11-18 | Heat conduction element and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114245661A (en) |
| WO (1) | WO2023087994A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023087994A1 (en) * | 2021-11-18 | 2023-05-25 | 深圳海翼智新科技有限公司 | Heat conduction element and electronic device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1967131A (en) * | 2005-11-18 | 2007-05-23 | 富准精密工业(深圳)有限公司 | Heat pipe |
| JP3173270U (en) * | 2011-11-14 | 2012-02-02 | 奇▲こう▼科技股▲ふん▼有限公司 | heat pipe |
| CN205092233U (en) * | 2013-03-27 | 2016-03-16 | 古河电气工业株式会社 | Cooling device |
| JP2018189320A (en) * | 2017-05-09 | 2018-11-29 | 富士通株式会社 | Heat pipe and electronic device |
| US20190353429A1 (en) * | 2014-07-18 | 2019-11-21 | Shanghai Dazhi Heat Dissipation Technology Co. | Heat-wing |
| CN112188809A (en) * | 2020-10-13 | 2021-01-05 | 上海六电电气有限公司 | Composite superconducting flat heat pipe and heat circulation heat dissipation method thereof |
| WO2021018004A1 (en) * | 2019-07-31 | 2021-02-04 | 华为技术有限公司 | Heat conduction device and terminal device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060090882A1 (en) * | 2004-10-28 | 2006-05-04 | Ioan Sauciuc | Thin film evaporation heat dissipation device that prevents bubble formation |
| JP2007113864A (en) * | 2005-10-21 | 2007-05-10 | Sony Corp | Heat transport apparatus and electronic instrument |
| CN100480611C (en) * | 2005-11-17 | 2009-04-22 | 富准精密工业(深圳)有限公司 | Heat pipe |
| CN114245661A (en) * | 2021-11-18 | 2022-03-25 | 深圳海翼智新科技有限公司 | Heat conduction element and electronic device |
-
2021
- 2021-11-18 CN CN202111371541.1A patent/CN114245661A/en active Pending
-
2022
- 2022-10-14 WO PCT/CN2022/125286 patent/WO2023087994A1/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1967131A (en) * | 2005-11-18 | 2007-05-23 | 富准精密工业(深圳)有限公司 | Heat pipe |
| JP3173270U (en) * | 2011-11-14 | 2012-02-02 | 奇▲こう▼科技股▲ふん▼有限公司 | heat pipe |
| CN205092233U (en) * | 2013-03-27 | 2016-03-16 | 古河电气工业株式会社 | Cooling device |
| US20190353429A1 (en) * | 2014-07-18 | 2019-11-21 | Shanghai Dazhi Heat Dissipation Technology Co. | Heat-wing |
| JP2018189320A (en) * | 2017-05-09 | 2018-11-29 | 富士通株式会社 | Heat pipe and electronic device |
| WO2021018004A1 (en) * | 2019-07-31 | 2021-02-04 | 华为技术有限公司 | Heat conduction device and terminal device |
| CN112188809A (en) * | 2020-10-13 | 2021-01-05 | 上海六电电气有限公司 | Composite superconducting flat heat pipe and heat circulation heat dissipation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023087994A1 (en) * | 2021-11-18 | 2023-05-25 | 深圳海翼智新科技有限公司 | Heat conduction element and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023087994A1 (en) | 2023-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20090145581A1 (en) | Non-linear fin heat sink | |
| US20190053403A1 (en) | Liquid cooling heat sink device | |
| TWI768877B (en) | Vapor chamber structure | |
| CN215773996U (en) | Heat sink device | |
| CN108800703B (en) | Semiconductor refrigeration equipment | |
| TW201727171A (en) | Heat exchanger for a vapor compression system | |
| JP2020107885A (en) | Flexible cooling plate with fluid distribution mechanism | |
| CN114245661A (en) | Heat conduction element and electronic device | |
| JP2018190373A (en) | Blade server housing and liquid cooling device for the same | |
| CN216818326U (en) | High-power chip efficient heat dissipation cooling device | |
| CN108387026B (en) | Heat exchange device and semiconductor refrigeration equipment with same | |
| US10989453B2 (en) | Heat exchanger with improved heat removing efficiency | |
| CN101283177A (en) | Blade-thru condenser and heat dissipation system thereof | |
| CN214381914U (en) | Phase change heat dissipation structure and heat dissipation device | |
| TW202043690A (en) | Heat dissipation unit with axial capillary structure | |
| US20220316503A1 (en) | 3d heat exchanger heat transfer enchancement device | |
| CN112739153B (en) | Space synthesis power amplifier and heat dissipation device thereof | |
| CN113347856B (en) | Heat radiator for electronic equipment | |
| CN210900093U (en) | Fin radiator | |
| CN115773681A (en) | Heat dissipation device based on loop heat pipe | |
| JP2012222234A (en) | Electronic apparatus | |
| CN113038787B (en) | Phase change heat dissipation structure and heat dissipation device | |
| CN217719576U (en) | Three-dimensional flat pulsating heat pipe device for radiating and cooling high-power chip | |
| CN218603827U (en) | Two-phase flow heat exchanger and heat exchange core thereof | |
| CN210247364U (en) | Heat conduction module and heat dissipation system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |