JP2007113864A - Heat transport apparatus and electronic instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat transport apparatus which carries out large capacity heat transport while the apparatus is miniaturized and thinned, and also to provide an electronic instrument mounted therewith. <P>SOLUTION: A plurality of first tabular bodies 17 arranged in a direction substantially orthogonal to both of an arrangement direction of a cover plate 9 and a base plate 10, and an arrangement direction of an evaporator 3 and a condenser 5, is provided to form a first gap 18 for communicating a condensed working fluid to the evaporator 3. Accordingly, capillary force is easily increased by narrowing intervals between the first tabular bodies 17, and reducing the first gap 18. It is also easy to reduce a thickness in the arrangement direction of the cover 9 and the base plate 10 comprising a casing 2 by numerously arranging the plurality of first tabular bodies 17 in its arrangement direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heat transport device that absorbs and dissipates heat by a phase change of a working fluid, and an electronic device equipped with the heat transport device.

  In order to cool an electronic device such as a PC (Personal Computer), a heat pipe or the like has been conventionally used as a device for transporting heat generated from a heat generating portion of the electronic device to a heat radiating portion. In these heat transport devices, the vapor phase working fluid evaporated by the heat generated in the high-temperature heat generating part of the electronic equipment moves to the low-temperature heat-dissipating part, condenses in the heat-dissipating part, becomes liquid, and releases heat. As a result, the heating element is cooled.

  A heat pipe contains a working fluid as a refrigerant in a pipe-shaped container made of a metal such as copper, and generates a capillary force provided inside the pipe. For example, a wick with a narrow slit generates a pumping force in the working fluid. I am letting.

  However, in the conventional heat pipe, since the open surface of the slit faces the steam transmission pipe section, the working fluid condenses and evaporates in parts other than the heat receiving and heat radiating section, and the heat from the heat receiving section to the heat radiating section. There were problems such as poor transmission efficiency.

Therefore, the hydraulic fluid transmission conduit portion has a sealed capillary structure, and constitutes a wick that circulates the hydraulic fluid condensed in the vapor condensing portion of the heat radiating portion to the hydraulic fluid evaporation portion of the heat receiving portion. It has been proposed (see, for example, Patent Document 1).
Republished patent WO 01/063195 (from page 8, line 9 to line 7, figure 1)

  However, in the device described in the re-published patent document 1, since the opening of the plate material is the working fluid transmission conduit (liquid phase passage), the capillary as the working fluid (working fluid) passage. Increasing power is not always easy.

  In addition, when a plurality of liquid phase flow path portions are stacked in an attempt to transport a large volume of heat, there is a problem that the thickness increases, and the size and thickness cannot be reduced.

  In view of the circumstances as described above, an object of the present invention is to provide a heat transport device capable of transporting a large volume of heat while reducing the size and thickness, and an electronic apparatus equipped with the heat transport device.

  In order to achieve the above object, a heat transport device according to the present invention comprises a cover plate and a bottom plate, the cover plate and the bottom plate are joined to each other, and a housing that contains a working fluid therein. An evaporation section that is provided in the casing and absorbs heat by evaporating the working fluid; a condensing section that is provided in the casing and releases heat by condensation of the working fluid; and the condensed A direction substantially orthogonal to both the arrangement direction of the cover plate and the bottom plate and the arrangement direction of the evaporation unit and the condensing unit so as to form a first gap for flowing the working fluid to the evaporation unit. And a plurality of first plate-like bodies arranged around each of the first plate-like bodies, and a gas phase flow passage portion formed around each of the first plate-like bodies for circulating the evaporated working fluid to the condensing portion. It is characterized by. Here, the “plate-like body” includes not only a rectangular flat plate, but also includes a plate formed with a plurality of grooves on one side of the flat plate and formed by the side walls of the grooves. In this case, the first gap is formed by the groove.

  In the present invention, the arrangement direction of the cover plate and the bottom plate and the arrangement direction of the evaporation section and the condensation section are substantially orthogonal to each other so as to form a first gap for circulating the condensed working fluid to the evaporation section. A plurality of first plate-like bodies arranged in the direction are provided. Therefore, the first gap can be reduced by narrowing the interval between the first plate-like bodies, and the capillary force can be easily increased. It is also easy to reduce the thickness of the cover plate and the bottom plate in the arrangement direction as a housing by arranging a plurality of first plate-like bodies in the arrangement direction. Furthermore, since the first gap serving as the liquid phase flow path is formed by the plurality of plate-like bodies, the cost can be reduced compared to using the porous body for the liquid phase flow path. Further, the gap formed using the plurality of first plate-like bodies is less resistant to the flow of the condensed working fluid than the porous body, and the supply of the working fluid to the evaporation section is large and the capacity is large. Heat transport is possible.

  According to an aspect of the present invention, at least one of the evaporation unit and the condensation unit further includes a clad material. Thereby, the evaporation efficiency in an evaporation part or the condensation efficiency in a condensation part can be improved by selecting the some material which comprises a clad material suitably.

  According to an aspect of the present invention, the first gap is formed in linear communication with the arrangement direction of the evaporation unit and the condensation unit. Thereby, since the resistance at the time of the working fluid condensed by the condensing part distribute | circulating to an evaporation part can be made extremely small, a heat transport speed can be made faster.

  According to one form of this invention, the said baseplate and each said 1st plate-shaped object are integrally formed with the same material, It is characterized by the above-mentioned. Thus, for example, a plurality of first plate-like bodies can be formed with a plurality of grooves on one side of the plate-like member, and the side walls of the grooves can be used as the first plate-like bodies. Manufacturing is easier.

  According to an aspect of the present invention, a heat insulating member is further provided between the gas phase flow path portion and the first gap. As a result, heat exchange between the gas phase flow path section and the first gap can be prevented, and evaporation of the working fluid in a place other than the evaporation section and condensation of the working fluid in a place other than the condensation section can be prevented. This makes it possible to prevent heat transport efficiency.

  According to one form of this invention, the said evaporation part has several 2nd plate-shaped bodies arranged so that the 2nd clearance gap for distribute | circulating the said condensed working fluid may be formed. Features. As a result, the evaporation speed of the working fluid in the evaporation section can be further increased. For example, even if a large amount of working fluid condensed through the first gap is supplied, if the evaporation speed in the evaporation section is slow, the heat transfer amount of the heat transfer device as a whole is limited. In addition, the manufacturing cost can be reduced as compared with the case where the evaporating part is manufactured with a porous body, for example.

  The arrangement direction of the second plate-like bodies is not particularly limited, and may be arranged obliquely with respect to the arrangement direction of the evaporation unit and the condensation unit, for example.

  According to one form of this invention, each said 2nd plate-shaped object is arranged in the sequence direction of the said evaporation part and the said condensation part, It is characterized by the above-mentioned. As a result, the length in the arrangement direction of the evaporation section and the condensation section of the heat transport device can be shortened, and the first gaps can be connected to all the second gaps, thereby supplying more condensed working fluid. Can be increased.

  According to one aspect of the present invention, the condensing unit has a plurality of third plate-like bodies arranged so as to form a third gap for allowing the condensed working fluid to flow therethrough. Features. Thereby, it becomes possible to make the condensation speed of the working fluid in a condensation part faster. Moreover, manufacturing cost can be reduced compared with the case where a condensation part is manufactured with a porous body, for example. Of course, the arrangement direction of the third plate-like bodies is not particularly limited, and may be arranged obliquely with respect to the arrangement direction of the evaporation section and the condensation section, for example.

  According to one form of this invention, each said 3rd plate-shaped object is arranged in the sequence direction of the said evaporation part and the said condensation part, It is characterized by the above-mentioned. As a result, the length in the arrangement direction of the evaporation section and the condensation section of the heat transport device can be shortened, and the first gap can be connected to all the third gaps. The supply to one gap can be increased.

  According to one aspect of the present invention, the condensing unit has a plurality of third plate-like bodies arranged so as to form a third gap for circulating the condensed working fluid, The second gap is wider than the first and third gaps. As a result, the capillary force in the evaporation section is kept small while improving the evaporation efficiency while increasing the entire capillary force in the first to third gaps, and the supply of condensed working fluid from the first gap is performed. Balances with speed.

  According to an aspect of the present invention, at least one of the first plate-like bodies, the second plate-like bodies, and the third plate-like bodies is made of stainless steel. Thereby, corrosion of each 1st plate-like body by each working fluid, each 2nd plate-like body, and each 3rd plate-like body can be prevented.

  An electronic apparatus according to another aspect of the present invention includes a heating element, a cover plate and a bottom plate, the cover plate and the bottom plate are joined to each other, and a housing that contains a working fluid therein. An evaporation section that is provided in the casing and absorbs the heat of the heating element by evaporating the working fluid; a condensing section that is provided in the casing and releases heat by the condensation of the working fluid; In order to form a first gap for allowing the condensed working fluid to flow to the evaporation unit, the cover plate and the bottom plate are arranged in substantially both directions, and the evaporation unit and the condensation unit. A plurality of first plate-like bodies arranged in a direction orthogonal to each other, and a gas-phase flow path portion formed around each of the first plate-like bodies and circulating the evaporated working fluid to the condensing portion. It is characterized by comprising.

  In the present invention, the arrangement direction of the cover plate and the bottom plate and the arrangement direction of the evaporation section and the condensation section are substantially orthogonal to each other so as to form a first gap for circulating the condensed working fluid to the evaporation section. A plurality of first plate-like bodies arranged in the direction are provided. Accordingly, the capillary force can be easily increased by narrowing the interval between the first plate-like bodies, and the cover plate and the bottom plate serving as the housing can be formed by arranging a plurality of first plate-like bodies in the arrangement direction. The thickness in the arrangement direction can be reduced, and the electronic device can be made thinner and smaller. Furthermore, since the first gap serving as the liquid phase flow path is formed by the plurality of plate-like bodies, the cost of the electronic device can be reduced as compared with the case where the porous body is used for the liquid phase flow path. In addition, the use of a plurality of first plate-like bodies compared to the porous body has less resistance to the flow of the condensed working fluid, can increase the supply amount of the working fluid to the evaporation section, and can generate a large amount of heat. It becomes possible to set it as the electronic device provided with the heat transport apparatus which can be conveyed.

  Here, examples of the “heating element” include an electronic component such as an IC (Integrated Circuit) and a resistor, a projector light source, and the like. “Electronic devices” include computers (in the case of personal computers, laptop computers or desktop computers), PDAs (Personal Digital Assistance), electronic dictionaries, cameras, display devices, audio / visual devices. Mobile phones, game machines, and other electrical appliances.

  As described above, according to the present invention, low-cost and large-capacity heat transport can be realized while achieving miniaturization and thinning.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 is a perspective view showing a heat transport device according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the heat transport device, FIG. 3 is a plan view for explaining the internal structure of the heat transport device, and FIG. FIG. 5 is a cross-sectional view taken along line A-A in FIG.

  As shown in FIGS. 2 and 5, the heat transport device 1 is connected to a housing 2 that depressurizes and seals the working fluid therein, an evaporator 3 that evaporates the working fluid, and the evaporator 3. Endothermic clad material 4, condenser 5 as a condensing part for condensing the working fluid, heat dissipating clad material 6 connected to the condenser 5, and liquid for circulating the working fluid condensed by the condenser 5 to the evaporator 3 The phase flow path 7 and the gas phase flow path 8 as a gas phase flow path section for allowing the working fluid evaporated by the evaporator 3 to flow to the condenser 5 are configured.

  As shown in FIG.1 and FIG.5, the housing 2 consists of the cover board 9 and the baseplate 10, for example, the peripheral part 9a of the cover board 9 is joined to the peripheral part 10a of the bottom plate 10 of one plate-shaped body. . Further, the cover plate 9 can hold the liquid phase channel 7 and the gas phase channel 8 between the inner side of the peripheral edge portion 9a and the bottom plate 10 in the direction opposite to the bottom plate 10 (Z-axis direction in FIG. 1). Indented.

  Further, as shown in FIG. 2, the bottom plate 10 has an opening 11 on the heat absorption side and an opening 12 on the heat dissipation side from the front surface 10b to the back surface 10c.

  Moreover, the evaporator 3 is comprised from the some 2nd plate-shaped body 13 of the substantially rectangular shape which consists of stainless steel, for example, as shown in FIG. Of course, the material is not limited to stainless steel, but may be a metal such as copper, but corrosion can be prevented by using stainless steel. Further, the evaporator 3 is fitted into the opening 11 of the bottom plate 10 as shown in FIGS.

  The plurality of second plate-like bodies 13 are arranged in the direction in which the evaporator 3 and the condenser 5 are arranged as shown in FIG. 6 which is a partially enlarged view around the evaporator in FIGS. 3 and 4 (Y-axis direction in FIG. 3). ). Further, a second gap 14 is formed between the second plate-like bodies 13. The plurality of second gaps 14 generate capillary force in the condensed working fluid as will be described later, and can circulate and hold the working fluid.

  The condenser 5 includes a plurality of substantially rectangular third plate bodies 15 made of stainless steel, for example, as shown in FIG. Further, the condenser 5 is fitted into the opening 12 of the bottom plate 10 as shown in FIGS.

  The plurality of third plate-like bodies 15 are arranged in the direction in which the evaporator 3 and the condenser 5 are arranged (the Y-axis direction in FIG. 3), similarly to the evaporator 3. Further, a third gap 16 is formed between the third plate-like bodies 15. The plurality of third gaps 16 generate capillary force in the condensed working fluid as will be described later, and can circulate and hold the working fluid.

  For example, as shown in FIG. 2, the liquid phase flow path 7 is composed of a plurality of substantially rectangular first plate bodies 17 made of stainless steel. The plurality of first plate-like bodies 17 are arranged in the direction in which the evaporator 3 and the condenser 5 are arranged (the direction in which they are arranged) (Y-axis direction in FIG. 3), and the direction in which the cover plate 9 and the bottom plate 10 are arranged (the direction in which they are arranged). They are arranged in a direction substantially orthogonal to both directions (the Z-axis direction in FIG. 4). In addition, the plurality of first plate-like bodies 17 have a first gap 18 formed between the first plate-like bodies 17.

  Here, the first plate-like body 17 has a substantially rectangular cross section as shown in FIG. 7A, which is a cross-sectional view illustrating the structure of the first plate-like body. Further, the first plate-like body 17 is not limited to having a substantially rectangular cross section, and may have a cross sectional shape as shown in, for example, FIGS. 7B to 7D. In FIG. 7B, each first plate 17 has a convex portion on the side of the one adjacent first plate, and FIG. 7C has a concave portion. Furthermore, FIG.7 (d) combines the 1st plate-shaped body 17 which made the 1st plate-shaped body 17 which has a recessed part mutually face a recessed part, and was cross-sectional rectangular shape in the meantime. Of course, the formation method of the 1st clearance gap 18 is not restricted to the combination of the 1st plate-shaped body 17 mentioned above.

  Further, the plurality of first plate-like bodies 17 project into the openings 11 and 12 as shown in FIGS. 3 and 4, for example, and the surfaces of the second plate-like body 13, the third plate-like body 15, and the bottom plate 10. 10b. Further, as shown in FIGS. 4 and 5, the plurality of first plate-like bodies 17 are just joined to the back surface 9 b of the cover plate 9 on the side opposite to the side joined to the bottom plate 10.

  Further, the liquid phase flow path 7 formed by the first gap 18 communicates linearly in the arrangement direction of the evaporator 3 and the condenser 5 (Y-axis direction in FIG. 3) as shown in FIGS. Is formed. Of course, it is not limited to a straight line, but may be, for example, a curved line. However, if the line is formed in a straight line, the resistance is lower and the flow rate of the working fluid can be increased.

  Further, the ratio of the first to third gaps 18, 14, 16 is, for example, 15 μm, 30 μm, and 15 μm, respectively, and the second gap 14 of the evaporator 3 is formed most widely.

  For example, as shown in FIGS. 3 and 5, the gas phase flow path 8 is formed by a cover plate 9 and a bottom plate 10 that sandwich a plurality of first plate-like bodies 17 in the vertical direction (Z-axis direction in FIG. 5). It consists of a space excluding the plurality of first plate-like bodies 17 in the space. As a result, a large flow path can be secured as the gas phase flow path 8, and the resistance when the working fluid flows can be significantly smaller than that of the first gap 18.

  Further, the gas phase channel 8 is separated from the first gap 18 that becomes the liquid phase channel 7, so that the working fluid is condensed in an unnecessary place or the condensed working fluid that flows through the liquid phase channel 7. Can be prevented from evaporating, and the heat transport efficiency can be improved.

  As the working fluid, for example, pure water, ethanol, methanol, acetone, isopropyl alcohol, alternative chlorofluorocarbon, ammonia or the like is used.

  As shown in FIGS. 5 and 6, for example, the heat-absorbing clad material 4 and the heat-dissipating clad material 6 have a two-layer structure of stainless layers 4a and 6a on the inner side and copper layers 4b and 6b on the outer side, respectively. As shown in FIG. 4, the heat-absorbing clad material 4 and the heat-dissipating clad material 6 are the parts closest to the heating element 19, the heat sink 20, and the like, and therefore, for example, the copper layers 4b and 6b having higher thermal conductivity than the stainless steel layers 4a and 6a. It is preferable to use a clad material.

  In the above description, the first gap 18 is formed using the plurality of first plate-like bodies 17 as the liquid phase flow path 7. However, the present invention is not limited to this, and the condenser 5 is changed to the evaporator 3. Any fluid that can circulate the working fluid by capillary force can be used. For example, a through-hole formed in a straight line from the condenser 5 to the evaporator 3 may be used, or a porous body may be used.

  Operation | movement of the heat transport apparatus 1 comprised as mentioned above is demonstrated.

  FIG. 8 is a perspective view of the heat transport device schematically showing the movement of the working fluid.

  The heat generated by the heating element 19 evaporates the working fluid held by the capillary force in the second gap 14 of the evaporator 3 through the endothermic cladding material 4 as shown in FIGS. At this time, since the evaporated working fluid has a much larger resistance in the first gap 18 of the liquid phase channel 7 than the resistance to the flow of the working fluid in the gas phase channel 8, the working fluid is in the liquid phase channel. Therefore, it moves to the gas phase flow path 8 without flowing back to the flow path 7. When the working fluid held in the second gap 14 of the evaporator 3 decreases, the working fluid condensed from the first gap 18 of the liquid phase flow path 7 is supplied by the capillary force generated by the second gap 14. The Rukoto.

  The evaporated working fluid flows through the gas phase flow path 8 in the direction of arrow D as shown in FIG. 8 and is condensed by the condenser 5 to be radiated from the heat sink 20 via the heat radiating clad material 6. For example, heat is radiated by forced air cooling such as a fan or a Peltier element. The condensed working fluid is held by the plurality of third plate-like bodies 15 by the capillary force generated by the third gap 16 of the condenser 5. The condensed working fluid held by the plurality of third plate-like bodies 15 circulates in the liquid phase flow path 7 by the capillary force due to the first gap 18. The condensed working fluid held by the plurality of first plate-like bodies 17 is caused by the capillary force of the third gap 16 of the evaporator 3 in the direction of arrow C shown in FIG. Be drawn into. By repeating the above operation, the heat of the heating element 19 can be transported to the heat radiating side to cool the heating element 19.

  Next, a method for manufacturing the heat transport device 1 will be briefly described.

  As shown in FIG. 2, for example, the evaporator 3 and the condenser 5 are fitted in the openings 11 and 12 of the bottom plate 10, respectively, and are joined by, for example, electron beam welding or laser beam welding.

  After the evaporator 3 and the condenser 5 are joined to the bottom plate 10, the first gaps 17 and the second and third gaps 14, 16 are placed on the surface 10 b side of the plurality of first plate bodies 17. And so that they connect. At this time, the first plate-like bodies 17 are arranged in a direction (X-axis direction in FIG. 2) perpendicular to the arrangement direction of the evaporator 3 and the condenser 5 (Y-axis direction in FIG. 2). To join. In addition, if the laminar joining of the evaporator 3, the condenser 5, and the liquid phase flow path 7 can be joined, such as electron beam welding or laser beam welding, thermal diffusion joining, thermocompression bonding, adhesive, A general joining method such as brazing may be used. Moreover, you may manufacture by the etching by photolithography.

  Next, the peripheral edge 9 a of the cover plate 9 is joined to the peripheral edge 10 a of the bottom plate 10 so that the plurality of first plate-like bodies 17 are accommodated in the recesses of the cover plate 9. Also in this case, as described above, a general joining method such as electron beam welding, laser beam welding, or, if possible, thermal diffusion welding, thermocompression bonding, adhesive, brazing, or the like may be used.

  For example, after the cover plate 9 is joined to the bottom plate 10, the heat absorbing clad material 4 and the heat radiating clad material 6 are joined so as to close the openings 11 and 12 from the back surface 10 c of the bottom plate 10 as shown in FIGS. 2 and 8. . In this case as well, bonding is performed by electron beam welding, laser beam welding, thermal diffusion bonding, or the like.

  As described above, according to the present embodiment, the arrangement direction of the cover plate 9 and the bottom plate 10, the evaporator 3 and the condensation so as to form the first gap 18 for circulating the condensed working fluid to the evaporator 3. A plurality of first plate-like bodies 17 arranged in a direction substantially perpendicular to both directions with respect to the arrangement direction of the vessel 5 are provided. Therefore, the capillary force can be easily increased by reducing the first gap 18 by narrowing the interval between the first plate-like bodies 17. It is also easy to reduce the thickness of the cover plate 9 and the bottom plate 10 serving as the casing 2 in the arrangement direction by arranging a plurality of first plate-like bodies 17 in the arrangement direction.

  Furthermore, since the first gap 18 serving as the liquid phase flow path 7 is formed by a plurality of plate-like bodies, the cost can be reduced compared to using a porous body for the liquid phase flow path 7. Further, the gap formed using the plurality of first plate-like bodies 17 is less resistant to the flow of the condensed working fluid than the porous body, and the supply of the working fluid to the evaporator 3 is large and large. Capacity heat transport is possible. For example, in the case of a porous body, the working fluid has a flow rate of 2 mm / s, but in a gap formed by a plurality of plate-like bodies, the flow rate can be about 25 mm / s to 30 mm / s. This also applies to the evaporator and the condenser 5. As a result, it is possible to increase the speed of supply of the working fluid and evaporation, and to increase the heat capacity that can be transported.

  Further, since the heat absorbing clad material 4 and the heat radiating clad material 6 are connected to the evaporator 3 and the condenser 5, respectively, the evaporation efficiency in the evaporating unit 3 can be selected by appropriately selecting a plurality of materials constituting the clad material. Alternatively, the condensation efficiency in the condenser 5 can be increased.

  Further, the evaporator 3 has a plurality of second plate bodies 13 arranged so as to form a second gap 14 for allowing the condensed working fluid to flow therethrough. It becomes possible to make the evaporation speed of the working fluid faster. For example, even if a large amount of the working fluid condensed by the first gap 18 is supplied, if the evaporation speed in the evaporator 3 is slow, the heat transport amount as a whole heat transport device is limited. In addition, the manufacturing cost can be reduced as compared with the case where the evaporator 3 is manufactured with a porous body, for example.

  The condenser 5 has a plurality of third plate-like bodies 15 arranged so as to form a third gap 16 for circulating the condensed working fluid, and the second gap 14 is The width is wider than the first and third gaps 18 and 16. Accordingly, the capillary force in the evaporator 3 is suppressed to be small while improving the evaporation efficiency while increasing the entire capillary force of the first to third gaps 18, 14, 16. It is possible to achieve a balance with the supply speed of the condensed working fluid.

  Furthermore, by giving the liquid phase flow path 7 a capillary force, it is advantageous for self-recovery after dryout, and the workability at the time of injecting the working fluid can be remarkably improved.

  9 is a plan view illustrating the internal structure of a heat transport device according to another embodiment of the present invention, FIG. 10 is a cross-sectional view taken along line EE of FIG. 9, and FIG. 11 is a cross-sectional view taken along line FF of FIG. 12 and 12 are partially enlarged views around the evaporator of FIG. In the following description, the same members and functions of the heat transport device 1 according to the above embodiment will be described briefly or omitted, and different points will be mainly described.

  In the heat transport device 101, for example, as shown in FIG. 11, the side 17 a opposite to the bottom plate side of the plurality of first plate bodies 17 forming the liquid phase flow path 7 is joined to the back surface 9 b of the cover plate 9. Absent. That is, the opposite side 17 a is joined to the heat insulating member 121 disposed between the cover plate 9 and the plurality of first plate-like bodies 17. Thereby, for example, a liquid phase flow path is formed by the heat insulating member 121, the first plate-like body 17, and the surface 10 b of the bottom plate 10.

  For example, as shown in FIG. 10, the heat insulating member 121 is formed so as to cover a region 17 b that does not overlap the evaporator 3 and the condenser 5 on the opposite side 17 a of the plurality of first plate-like bodies 17. As shown in FIG. 11, the gas phase flow path 8 is formed not only on the left and right sides of the plurality of first plate-like bodies 17 but also between the heat insulating member 121 and the cover plate 9.

  Thus, according to the present embodiment, the heat insulating member 121 is further provided between the gas phase flow path 8 and the first gap 18. Therefore, the exchange of heat between the gas phase flow path 8 and the first gap 18 can be prevented, the evaporation of the working fluid in a place other than the evaporator 3, and the working fluid in a place other than the condenser 5. Condensation can be prevented, and heat transport efficiency is further improved. Further, since the gas phase flow path 8 is also provided above the first gap 18, the gas phase flow paths 8 provided on the left and right sides can be reduced, and the lateral width of the heat transport device 101 can be further reduced. .

  FIG. 13 is an exploded perspective view of a heat transport device according to still another embodiment, and FIG. 14 is a cross-sectional view of the assembled heat transport device.

  In the heat transport device 201, the condenser 205 is not fitted in the opening 12 of the bottom plate 10, and overlaps the opening 12 via a plurality of first plate-like bodies 217 as shown in FIGS. 13 and 14, for example. It is provided as follows. The condenser 205 has, for example, a plurality of third plate-like bodies 215a and 215b of two layers, and is formed so that the arrangement directions of the third plate-like bodies of the respective layers are substantially orthogonal. Thereby, the 3rd clearance gap 216 as a whole can be made finer, and it becomes possible to enlarge capillary force easily. Of course, the number of layers is not limited to two, and any number of layers may be used.

  Here, as shown in FIG. 13, the plurality of third plate-like bodies 215b are fixed by a frame around the substantially rectangular plate-like bodies, and the arrangement direction of the plate-like bodies is the evaporator 3 and It is formed so as to substantially coincide with the arrangement direction of the condenser 205 (Y-axis direction in FIG. 13). The plurality of third plate-like bodies 215a have plate-like connecting portions 222a for connecting the plate-like bodies as shown in FIGS. The plurality of third plate-like bodies 215a are stacked on the plurality of third plate-like bodies 215b so that the connecting portions 222a are on the back surface 9b side of the cover plate 9. The plurality of third plate-like bodies 215a are arranged so that each plate-like body is substantially orthogonal to the arrangement direction of the plate-like bodies of the plurality of third plate-like bodies 215b (X-axis direction in FIG. 13). It is arranged. Thereby, as shown in FIG. 14, the working fluid that has flowed through the gas-phase flow path 8 from the evaporator side hardly receives resistance, and enters the third gap 216a formed by the plurality of third plate-like bodies 215a. It can be distributed.

  Further, the liquid phase flow path 7 has a connecting portion 217 a that connects each of the substantially rectangular plate-like bodies of the plurality of first plate-like bodies 217. The arrangement direction of the first plate-like bodies 217 integrally connected by the connecting portion 217a is substantially orthogonal to the arrangement direction of the cover plate 9 and the bottom plate 10 (Z-axis direction in FIG. 13). Further, it is formed so as to be in a direction (X-axis direction in FIG. 13) substantially orthogonal to the arrangement direction of the evaporator 3 and the condenser 205 (Y-axis direction in FIG. 13).

  For example, as shown in FIG. 14, the connecting portions 217 a of the plurality of first plate-like bodies 217 are not formed in a region overlapping the opening 11 of the bottom plate 10, and the plurality of first portions of the evaporator 3 fitted in the opening 11 are formed. A plurality of first plate bodies 217 are joined directly to the two plate bodies 13.

  For example, the plurality of first plate-like bodies 217 are manufactured by forming a plurality of parallel grooves by etching a single plate-like member with photolithography, and forming the side wall portions 217b of the grooves into the plurality of first plate-like bodies. Each of the plate-like bodies 217 can be the first gap 218.

  Thus, according to the present embodiment, the plurality of first plate-like bodies 217 can be manufactured very easily, and the manufacturing cost of the heat transport device 201 can be reduced.

  FIG. 15 is an exploded perspective view of a heat transport device according to still another embodiment, and FIG. 16 is a cross-sectional view of the assembled heat transport device.

  In the liquid phase flow path 7 of the heat transport device 301, a plurality of first plate-like bodies 317 are integrally formed of the same material as the bottom plate 310 as shown in FIG. As shown in FIGS. 15 and 16, for example, the plurality of first plate-like bodies 317 are substantially rectangular plate-like bodies so as to cover the openings 11 and 12, and the bottom plate 310 extends from the evaporator side to the condenser side. It is formed on the surface 310b. Accordingly, the plurality of first plate-like bodies 317 do not connect the plate-like bodies at the portions overlapping the openings 11 and 12, and are formed like comb teeth. In addition, the arrangement of the first plate-like bodies 317 is formed so as to be orthogonal to the arrangement direction of the evaporator 3 and the condenser 205 (Y-axis direction in FIG. 15).

  The plurality of first plate-like bodies 317 are manufactured by forming, for example, a plurality of parallel grooves and openings by etching a bottom plate, which is a single plate-like member, by photolithography, and forming the side walls of the grooves into a plurality of first side walls. One plate-like body 317 can be used as each plate-like body, and the groove portion can be a first gap 318.

  Thus, according to the present embodiment, the bottom plate 310 and the plurality of first plate-like bodies 317 can be easily manufactured from one member, and the manufacturing cost of the heat transport device 201 can be reduced.

  The present invention has been described above with reference to preferred embodiments. However, the present invention is not limited to any of the above-described embodiments, and various modifications may be made as appropriate within the scope of the technical idea of the present invention. It can be implemented in combination.

  For example, in the above-described embodiment, the heating element and the heat sink have been described as one, but the present invention is not limited to this, and the liquid phase flow path and the gas phase flow path are branched in the middle to form a plurality of heating elements and heat sinks. You may make it connect. Thereby, even when there are a plurality of heat generation sides and heat dissipation sides of an electronic device (not shown), it is possible to cope with the heat transport device, and it is possible to reduce the manufacturing cost of the electronic device and to reduce the size and thickness.

It is a perspective view which shows the heat transport apparatus which concerns on one Embodiment of this invention. It is a disassembled perspective view of the heat transport apparatus shown in FIG. It is a top view explaining the internal structure of the heat transport apparatus shown in FIG. FIG. 4 is a sectional view taken along line AA in FIG. 3. FIG. 4 is a sectional view taken along line BB in FIG. 3. It is the elements on larger scale of the evaporator periphery of FIG. It is sectional drawing explaining the structure of a 1st plate-shaped object. It is a perspective view of the heat transport apparatus which shows the movement of a working fluid typically. It is a top view explaining the internal structure of the heat transport apparatus which concerns on other embodiment of this invention. It is the EE sectional view taken on the line of FIG. FIG. 10 is a sectional view taken along line FF in FIG. 9. It is the elements on larger scale of the evaporator periphery of FIG. It is a disassembled perspective view of the heat transport apparatus which concerns on another embodiment. FIG. 14 is an assembled cross-sectional view of the heat transport device of FIG. 13. It is a disassembled perspective view of the heat transport apparatus which concerns on another embodiment. FIG. 16 is an assembled cross-sectional view of the heat transport device of FIG. 15.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,101,201,301 ... Heat transport apparatus 2 ... Housing 3 ... Evaporator 4 ... Endothermic clad material 5 ... Condenser 6 ... Radiation clad material 7 ... Liquid phase channel 8 ... Gas phase channel 9 ... Cover plate 10 ... Bottom plate 13 ... second plate-like body 14 ... second gap 15, 215 ... third plate-like body 16, 216 ... third gap 17, 217, 317 ... first plate-like body 18, 218, 318 1st clearance 19 Heating element 20 Heat sink 121 Heat insulation member

Claims (12)

A casing having a cover plate and a bottom plate, the cover plate and the bottom plate being joined together, and housing a working fluid therein;
An evaporation section that is provided in the housing and absorbs heat by evaporating the working fluid;
A condensing part that is provided in the housing and releases heat by the working fluid condensing;
In order to form a first gap for allowing the condensed working fluid to flow to the evaporation unit, the cover plate and the bottom plate are arranged in substantially both directions, and the evaporation unit and the condensation unit. A plurality of first plate-like bodies arranged in an orthogonal direction;
A heat transport apparatus, comprising: a gas phase flow path section formed around each of the first plate-like bodies and allowing the evaporated working fluid to flow to the condensing section. The heat transport device according to claim 1,
At least one of the evaporating part and the condensing part further comprises a clad material. The heat transport device according to claim 1,
The heat transport device according to claim 1, wherein the first gap is formed in linear communication with the direction of arrangement of the evaporation section and the condensation section. The heat transport device according to claim 1,
The heat transport device, wherein the bottom plate and the first plate-like bodies are integrally formed of the same material. The heat transport device according to claim 1,
The heat transport device further comprising a heat insulating member between the gas phase flow path section and the first gap. The heat transport device according to claim 1,
The heat transport device, wherein the evaporating unit has a plurality of second plate-like bodies arranged so as to form a second gap for allowing the condensed working fluid to flow therethrough. The heat transport device according to claim 6,
Each said 2nd plate-shaped object is arranged in the sequence direction of the said evaporation part and the said condensation part, The heat transport apparatus characterized by the above-mentioned. The heat transport device according to claim 1,
The heat transport device, wherein the condensing unit has a plurality of third plate-like bodies arranged so as to form a third gap for allowing the condensed working fluid to flow therethrough. The heat transport device according to claim 8,
Each said 3rd plate-shaped object is arranged in the sequence direction of the said evaporation part and the said condensation part, The heat transport apparatus characterized by the above-mentioned. The heat transport device according to claim 6,
The condensing unit has a plurality of third plate-like bodies arranged so as to form a third gap for circulating the condensed working fluid,
The heat transport device, wherein the second gap is wider than the first and third gaps. The heat transport device according to claim 10,
At least one of the first plate bodies, the second plate bodies, and the third plate bodies is made of stainless steel. A heating element;
A casing having a cover plate and a bottom plate, the cover plate and the bottom plate being joined together, and housing a working fluid therein;
An evaporating part that is provided in the housing and absorbs the heat of the heating element by evaporating the working fluid;
A condensing part that is provided in the housing and releases heat by the working fluid condensing;
In order to form a first gap for allowing the condensed working fluid to flow to the evaporation unit, the cover plate and the bottom plate are arranged in substantially both directions, and the evaporation unit and the condensation unit. A plurality of first plate-like bodies arranged in an orthogonal direction;
An electronic apparatus comprising: a gas-phase flow path section formed around each of the first plate-like bodies and allowing the evaporated working fluid to flow to the condensing section.

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