CN113038787B - Phase change heat dissipation structure and heat dissipation device - Google Patents

Abstract

The invention relates to a phase change heat dissipation structure and a heat dissipation device. The phase-change heat dissipation structure comprises an evaporation part, a condensation part and a transmission part, wherein the evaporation part is provided with an evaporation cavity, phase-change materials are arranged in the evaporation cavity, and the evaporation part is used for being placed in an object to be cooled; the condensing part is provided with a condensing cavity; the transmission portion sets up between evaporation portion and condensing part, and the transmission portion has transfer passage, transfer passage have with higher speed the section and with the variable speed section of accelerating the section intercommunication, the one end and the evaporation chamber intercommunication of variable speed section are kept away from to the section with higher speed, the variable speed section is kept away from the one end and the condensation chamber intercommunication of accelerating the section with higher speed, and the section with higher speed is from the direction of evaporation portion towards condensing part and is the structure that reduces, and the variable speed section is from the direction of evaporation portion towards condensing part and is the structure that gradually expands. The phase change heat dissipation structure and the heat dissipation device provided by the invention utilize the acceleration section in the transfer channel to accelerate the phase change material and the speed change section in the transfer channel to change the speed of the accelerated phase change material, so that the phase change circulation of the phase change material is improved, and the heat dissipation performance is further improved.

Description

Phase change heat dissipation structure and heat dissipation device

Technical Field

The invention relates to the technical field of heat dissipation, in particular to a phase change heat dissipation structure and a heat dissipation device.

Background

Along with the iteration of chip technology, the integration level of the chip is higher and higher, and the computing capability is stronger and stronger, so that the power consumption of the chip is larger, and the heat generated along with the power consumption is larger. The generated high heat can cause the performance reduction of electronic components, even the problem of burning the electronic components occurs, and the service life is shortened. At present, the heat dissipation modes of a high-power chip mainly include a heat pipe radiator, a water-cooled radiator and an immersed radiator. Although the heat pipe radiator has a high thermal response speed, the capacity of transferring heat is basically in direct proportion to the volume of the heat pipe fins, so that the overall volume is large, and the heat pipe radiator is limited in the layout and installation of electronic components. Wherein, water-cooling radiator's radiating effect is better, but the structure is comparatively complicated, and the installation reliability is lower, has the risk of leaking. The immersed heat dissipation is to soak the electronic equipment in the refrigerating fluid and absorb heat through the refrigerating fluid. The refrigerant fluid has good insulativity and corrosion resistance, and although the heat dissipation efficiency is higher, the heat dissipation cost is higher, and the commonality is also poorer. Therefore, how to improve the heat dissipation performance of the high power consumption chip is one of the important issues to be solved urgently.

Disclosure of Invention

Accordingly, it is necessary to provide a phase-change heat dissipation structure for solving the technical problem in the prior art that the heat dissipation performance of the high-power-consumption chip is weak.

A phase change heat dissipation structure comprising:

the evaporation part is provided with an evaporation cavity, a phase change material is arranged in the evaporation cavity, and the evaporation part is used for being placed on an object to be cooled;

a condensing portion having a condensing cavity;

the transmission part is arranged between the evaporation part and the condensation part, the transmission part is provided with a transmission channel, the transmission channel is provided with an acceleration section and a speed change section communicated with the acceleration section, one end of the acceleration section, far away from the speed change section, is communicated with the evaporation cavity, and one end of the speed change section, far away from the acceleration section, is communicated with the condensation cavity; the accelerating section is of a gradually reducing structure from the evaporating part to the condensing part, and the speed changing section is of a gradually expanding structure from the evaporating part to the condensing part.

In one embodiment, the transfer passage further comprises a throat section connected between the acceleration section and the speed change section, and the passage diameter of the acceleration section and the passage diameter of the speed change section are both larger than the passage diameter of the throat section.

Wherein, set up the throat section that the passageway diameter is minimum at accelerating section and variable speed section, the mild transition of section and variable speed section not only is convenient for accelerate, forms the Laval spray tube structure through accelerating section, throat section and variable speed section jointly moreover to improve the phase transition circulation efficiency of phase transition material.

In one embodiment, the number of the condensation chambers is at least two, and at least two condensation chambers are arranged in a crossed manner towards one end of the transfer channel and are communicated with the transfer channel.

Such setting can promote the condensation effect through setting up of a plurality of condensation chambeies, and every condensation chamber homoenergetic forms the laval spray tube structure with transfer passage moreover, improves the phase transition circulation of phase transition material to improve the radiating efficiency.

In one embodiment, the cross-sectional area of the condensation chamber in a horizontal plane increases gradually from the evaporation portion towards the condensation portion.

The arrangement can promote the phase change material in the gaseous form flowing along the transfer channel to continuously move from the transfer channel to the condensation cavity, namely, the phase change material is accelerated to the throat part at one time in the acceleration section of the transfer channel and can extend to the condensation cavity in the speed change process flowing to the speed change section along the throat part, so that the phase change circulation efficiency is improved.

In one embodiment, the evaporation portion includes a first partition plate capable of dividing the evaporation chamber into a plurality of first independent chambers, and each of the first independent chambers is communicated with at least one of the transfer passages and at least one of the condensation chambers.

Such setting can utilize independent phase change circulation in a plurality of first independent chambeies of arranging along server width direction interval, can carry out the adaptability heat dissipation to the intensive region of generating heat of high-power consumption chip, improves the heat dissipation temperature uniformity nature.

In one embodiment, the evaporation portion includes a second partition plate capable of dividing the evaporation chamber into a plurality of second independent chambers, the plurality of second independent chambers are stacked in a direction toward the transfer passage along the condensation chamber, and one of the plurality of second independent chambers, which is far from the object to be heat-dissipated, communicates with the transfer passage.

Such setting can utilize the phase transition circulation in every independent intracavity of second through two independent chambeies of stacking along server direction of height, promotes the heat dissipation demand of high-power consumption chip.

In one embodiment, the number of the transfer channels is multiple, the transfer channels are arranged at intervals in the first direction in the evaporation part, and a spacing space is arranged between any adjacent transfer channels.

The efficiency that phase change material transmitted can be increased through the setting of a plurality of transfer channels to such setting to improve the radiating efficiency, utilize the flow rate that the setting of the interval space between a plurality of transfer channels can improve the air current simultaneously, further improve the radiating efficiency.

In one embodiment, the evaporation part is provided with a plurality of first protrusions, and each first protrusion is coated with a lyophilic coating;

and/or the condensation part is provided with a plurality of second bulges, and each second bulge is coated with a lyophobic coating.

That is to say, first protruding and the second bellied being provided with increases the area of contact of phase change material with evaporation portion and condensing part, utilizes the setting of lyophilic coating and lyophobic coating to further improve evaporation effect and condensation effect simultaneously.

In one embodiment, the phase change heat dissipation structure further includes a fin disposed at the condensation portion.

The arrangement can increase the contact area of the condensing part and the air in the external environment through the fins, improve the condensing efficiency of the condensing part and further improve the heat radiation performance.

In one embodiment, the number of the transfer portions is at least two, at least two transfer portions are arranged at intervals in the evaporation portion along the second direction, and one side of each transfer portion, which faces away from the evaporation portion, is provided with the condensation portion.

The arrangement can increase the contact area of the transfer part in contact with air, so that when the phase change material flows in the transfer channel, the heat carried by the phase change material can be fully in contact with the air to take away part of the heat, and the heat dissipation efficiency is improved.

The invention also provides a heat dissipation device which can solve at least one technical problem.

The heat dissipation device provided by the invention comprises a plurality of phase change heat dissipation structures, wherein the phase change heat dissipation structures are arranged at intervals along a second direction.

The invention has the beneficial effects that:

the invention provides a phase change heat dissipation structure which comprises an evaporation part, a condensation part and a transmission part. Wherein, evaporation department has the evaporation chamber, and is provided with the phase change material in the evaporation chamber. The condensing part has the condensation chamber, and the transfer portion has transfer passage, transfer passage have with higher speed the section and with the variable speed section of accelerating the section intercommunication, the one end and the evaporation chamber intercommunication of variable speed section are kept away from to the section with higher speed, the variable speed section is kept away from the one end and the condensation chamber intercommunication of accelerating the section, and the section with higher speed is the structure that reduces from the direction of evaporation portion towards the condensing part, the variable speed section is the structure that gradually expands from the direction of evaporation portion towards the condensing part. During the in-service use, the phase change material is located the evaporation plant earlier, and after the evaporation plant received the heat of treating the heat dissipation object, the phase change material can absorb the heat and take place the phase transition to flow along transfer passage towards the direction in condensation chamber. When the phase-change material after phase change flows through the acceleration section in the transfer channel, the acceleration section is used for carrying out primary acceleration along the setting of the flow direction reduction structure, and then the flow velocity of the phase-change material is improved through the acceleration section. When the phase-change material after phase change flows to the speed change section after being accelerated by the acceleration section, the speed change can be carried out by utilizing the arrangement of the gradually expanding structure of the speed change section along the flow direction. Wherein, can compare when changing speed and accelerate once more in the section of accelerating after accelerating, promote the self velocity of flow of phase transition material once more promptly to improve the phase transition circulation of phase transition material, thereby promote heat dispersion. Simultaneously, can compare when carrying out the variable speed and slow down in the section with higher speed after accelerating to in the chamber wall fully contact with the condensation chamber, and then at the condensation intracavity rapid condensation, promote the phase transition circulation of phase transition material, thereby promote heat dispersion. Therefore, when the phase change heat dissipation structure is applied to a high-power-consumption chip, the phase change circulation of the phase change material is improved by utilizing the acceleration section in the transfer channel to accelerate the phase change material and the speed change section in the transfer channel to change the speed of the accelerated phase change material, and the heat dissipation performance is further improved.

The heat dissipation device provided by the invention comprises a plurality of phase change heat dissipation structures, wherein the phase change heat dissipation structures are arranged at intervals along the second direction so as to improve the heat dissipation capacity of the high-power-consumption chip.

Drawings

Fig. 1 is a first schematic view of a heat dissipation device according to an embodiment of the invention;

fig. 2 is a second schematic view of a heat dissipation device according to an embodiment of the invention;

fig. 3 is a third schematic view of a heat dissipation device according to an embodiment of the invention;

fig. 4 is a schematic view illustrating an evaporation portion of a phase change heat dissipation structure according to an embodiment of the invention having a first protrusion.

Icon: 10-an evaporation section; 11-a first independent cavity; 12-a second independent cavity; 13-a first bump; 20-a condensation section; 21-a first condensation chamber; 22-a second condensation chamber; 30-a transmission section; 31-a transfer channel; 41-a first separator; 42-a second separator; 51-a first separation space; 52-a second compartment; 60-fins; 71-separation gap.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will recognize without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the second feature or the first and second features may be indirectly contacting each other through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 to 3, fig. 1 shows a first schematic view of a heat dissipation device according to an embodiment of the present invention, fig. 2 shows a second schematic view of the heat dissipation device according to the embodiment of the present invention, and fig. 3 shows a third schematic view of the heat dissipation device according to the embodiment of the present invention. The heat dissipation device provided by an embodiment of the invention comprises a plurality of phase change heat dissipation structures which are arranged at intervals along a second direction. The heat dissipation device is generally used for dissipating heat of a server, and particularly dissipating heat of a high-power-consumption chip in the server. The second direction may be a width direction of the server or a length direction of the server, as long as heat dissipation of the high-power chip in the server can be achieved. The second direction is taken as the longitudinal direction of the server as an example.

When a plurality of phase change heat dissipation structures are arranged at intervals along the second direction, a gap is formed between any two adjacent phase change heat dissipation structures, so that heat can be dissipated conveniently. The phase-change heat dissipation structure adopts a material capable of generating phase change as a heat dissipation medium, and can generate adaptive phase change along with the change of temperature in the process of heat dissipation. The following describes a specific structure of the phase change heat dissipation structure.

Referring to fig. 1 to 3, a phase change heat dissipation structure according to an embodiment of the present invention includes an evaporation unit 10, a condensation unit 20, and a transmission unit 30. Wherein, the evaporation part 10 is provided with an evaporation cavity, and a phase-change material is arranged in the evaporation cavity. The condensing part 20 has a condensing chamber, the transferring part 30 is disposed between the evaporating part 10 and the condensing part 20, and the transferring part 30 has a transferring channel 31. The transfer passage 31 comprises an accelerating section and a speed changing section communicated with the accelerating section, wherein one end of the accelerating section, which is far away from the speed changing section, is communicated with the evaporation cavity, and one end of the speed changing section, which is far away from the accelerating section, is communicated with the condensation cavity. The acceleration section has a decreasing structure in a direction from the evaporation unit 10 to the condensation unit 20, and the transmission section has a gradually expanding structure in a direction from the evaporation unit 10 to the condensation unit 20.

Specifically, this phase transition heat dissipation mechanism installs in the top of CPU (Central Processing Unit), one side that evaporation portion 10 among the phase transition heat dissipation mechanism deviates from condensing part 20 contacts with the top shell of CPU, the heat that electrical components (for example the chip among the integrated circuit) work produced can transmit to the top shell of CPU in the CPU, and transmit evaporation portion 10 among the phase transition heat dissipation mechanism through the top shell, make the evaporation intracavity phase transition material take place the phase transition and flow to the condensation chamber along transfer passage 31, take place the phase transition again under the condensation effect in condensation chamber, then flow back to the evaporation chamber along transfer passage 31, absorb the heat and take place the phase transition again.

Wherein, the phase-change material can adopt water, or the phase-change material adopts freon refrigerant and the like.

In actual use, for example, the phase-change material exists in a liquid state in the evaporation cavity. The phase change heat dissipation structure is arranged at the top of a CPU in the server and is positioned close to a position where a high-power-consumption chip is arranged. When the server is in the operation work of high-power consumption, the high-power consumption chip can produce more heat, and these heat can transmit to phase change heat radiation structure, and with the evaporation portion 10 contact among the phase change heat radiation structure, evaporation portion 10 absorbs heat transfer to evaporation chamber for the phase change material of the liquid form in the evaporation chamber absorbs the heat, and then takes place the phase transition under the effect of high temperature and is the gaseous state, and the phase change material that becomes the gaseous state form reduces for the phase change material density of liquid form, upwards flows gradually. At this time, it is because of the arrangement of the transfer passage 31 that the phase change material in the gaseous form can flow in the transfer passage 31. That is, the evaporation part 10 is disposed at the bottom end of the transfer part 30, and the condensation part 20 is disposed at the top end of the transfer part 30, so that the phase-change material in the gaseous form can move toward the side close to the condensation part 20 along the transfer passage 31. When the phase change material of gaseous form flows to the condensation intracavity, can be in the phase change material of liquid form at the condensation intracavity condensation, the phase change material of liquid form can flow back to the evaporation chamber along transfer passage 31 under the effect of self gravity, utilizes the high temperature in the evaporation chamber to take place the phase change once more and be in the gaseous form, this phase change process of circulation in proper order.

Meanwhile, the phase change material in the gaseous form flows through to the acceleration section of transfer passage 31 from the in-process of evaporation chamber flow direction condensation chamber in transfer passage 31, utilize the reduction structure setting of the flow direction of the phase change material in the gaseous form of acceleration section, make the flow cross section of the phase change material in the gaseous form reduce gradually, make the phase change material in the gaseous form flow velocity in-process grow gradually at the flow, and then the phase change material in the gaseous form accelerates once in transfer passage 31, make the flow velocity of phase change material promote, so that more rapid flow direction condensation chamber. Meanwhile, when the phase change material in the gaseous form flows to the speed change section from the acceleration section, the speed change section is arranged along the gradual expansion structure of the flow direction of the phase change material in the gaseous form, the flow section of the phase change material in the gaseous form is gradually increased, at the moment, the acceleration section has an acceleration effect on the phase change material in the gaseous form, the phase change material in the gaseous form after acceleration flows to the speed change section, the phase change material in the gaseous form generates huge thrust due to the gradual expansion structure of the speed change section, and then the phase change material in the gaseous form can be accelerated for the second time when entering the condensation cavity from the transmission channel 31, and the flow speed of the phase change material is further improved. Namely: promote the speed that phase change material flow direction condensation chamber carries out the condensation through the increase to the phase change material velocity of flow, and then improve the circulation efficiency of phase change material between evaporation chamber, transfer passage 31 and condensation chamber to can take away more heats through the circulation of phase change material, thereby promote heat dispersion.

In yet another embodiment, the phase change material is decelerated once as it passes through the speed change section of the transfer passage 31. That is to say, after the phase change material in the form of liquid in the evaporation cavity absorbs heat and is vaporized, the phase change material in the form of gas flows towards the condensation cavity along the transfer channel 31, and is accelerated once in the acceleration section of the transfer channel 31, so that the flow speed of the phase change material in the form of gas is increased. When the phase change material of gaseous form flows to the variable speed section through the acceleration section of transfer passageway 31, because the divergent structure of variable speed section for the flow cross section of the phase change material of gaseous form grow gradually, when the phase change material of the same volume flows through the variable speed section, impels the velocity of flow of the phase change material of gaseous form to reduce gradually, carries out a speed reduction promptly. Gaseous form's phase change material after the speed reduction flows to the condensation chamber when, because gaseous form's phase change material's velocity of flow reduces, gaseous form's phase change material can increase with the chamber wall's of condensation chamber contact time length to in with the chamber wall full contact of condensation chamber, and then improve gaseous form's phase change material the rate of condensation in the condensation chamber, so that gaseous form's phase change material can condense the phase change material that is liquid form rapidly. That is to say, through promoting the phase change material along transfer passage 31's the velocity of flow and the condensation rate of phase change material in the condensation intracavity, and then improve the circulation efficiency of phase change material between evaporation chamber, transfer passage 31 and condensation chamber to more heats can be taken away in the circulation through the phase change material, thereby promote heat dispersion.

In an alternative embodiment, the transmission channel 31 further includes a throat section connected between the acceleration section and the speed change section, and the channel diameter of the acceleration section and the channel diameter of the speed change section are both larger than the channel diameter of the throat section. That is, the throat section is provided for a smooth transition of the accelerator section toward the variator section, with the throat section having the smallest passage diameter. The diameter of the channel of the accelerating section is gradually reduced from the evaporating part to the condensing part, and after the diameter of the channel is reduced to the throat section, the diameter of the channel of the speed change section is gradually increased from the evaporating part to the condensing part from the joint of the throat section and the speed change section. The arrangement is that the transfer passage 31 forms a Laval nozzle structure, the accelerating section is used as the front half part of the Laval nozzle structure, the speed changing section is used as the rear half part of the Laval nozzle structure, and the front half part is contracted to a narrow throat from big to small to the middle, namely the throat neck. The narrow larynx then flares outward from smaller to larger. Through the arrangement, the flow speed of the phase-change material in the gaseous form in the nozzle structure can be promoted to change along with the change of the sectional area of the nozzle, so that the flow speed of gas flowing to the narrow throat from the front half part can be increased to sonic speed, and then the flow speed is changed into supersonic speed from the narrow throat to the rear half part, and the flow speed of the phase-change material in the gaseous form is improved. Of course, the arrangement can also ensure that the velocity is reduced when the gas flows from the narrow throat to the rear half under the condition that the flow velocity of the gas flowing from the front half to the narrow throat is less than the sound velocity, and the phase-change material in a gaseous form is fully contacted with the cavity walls of the plurality of condensation cavities for condensation, so that the condensation rate is improved.

Specifically, when the gaseous phase-change material moves toward one side of the condensation cavity after being accelerated once through the acceleration section of the transfer channel 31, and the flow velocity flowing from the acceleration section of the transfer channel 31 to the speed change section of the transfer channel 31 is the same as the sound velocity, the gaseous phase-change material flowing along the speed change section of the transfer channel 31 can be accelerated for the second time, so that the flow velocity of the gaseous phase-change material exceeds the sound velocity, that is, the flow velocity is supersonic, and thus the sound velocity limit of the phase-change material is improved, the circulation efficiency of the phase-change material is improved, and the heat dissipation performance of the phase-change heat dissipation structure is improved. Meanwhile, if the flow velocity of the phase change material flowing from the acceleration section of the transfer passage 31 to the speed change section of the transfer passage 31 is less than the sound velocity, the phase change material flowing along the speed change section of the transfer passage 31 in the gaseous form can be decelerated once in the condensation chamber. At this moment, the velocity of flow of the gaseous state form's when getting into the condensation chamber phase change material can reduce gradually, makes the gaseous state form's phase change material and the chamber wall of a plurality of condensation chambers fully contact and condenses to improve condensation efficiency, thereby promote the circulation efficiency of phase change material, improve this phase change heat radiation structure's heat dispersion.

It should be noted that, the size design of the acceleration section, the speed change section and the throat section in the transfer channel 31 are all selected according to actual requirements, and the three all affect the flow speed of the phase-change material in the gaseous form in the transfer channel 31. For example, in the acceleration section, the more the length of the acceleration section is, the more the reduction structure of the acceleration section is obvious, and the acceleration obtained by the phase-change material in the gaseous form in the acceleration section is larger. Of course, the present embodiment is not limited to the above embodiment, and only the phase change cycle can be increased to improve the heat dissipation efficiency.

With reference to fig. 1-3, in some embodiments, the number of the condensation chambers is at least two, and at least two condensation chambers are disposed crosswise toward one end of the transfer channel 31 and both communicate with the transfer channel 31. That is to say, there are at least two condensation chambeies at the top intercommunication of a transfer passage 31, and every condensation chamber homoenergetic forms the Laval spray tube structure with transfer passage 31, and then forms at least two passageways that are used for phase transition material phase transition circulation to improve the radiating efficiency.

The number of the condensation chambers is two for illustration. At this time, the two condensation chambers are respectively a first condensation chamber 21 and a second condensation chamber 22, and the first condensation chamber 21 and the second condensation chamber 22 are arranged in a crossed manner and are both communicated with the transfer passage 31. That is, the top of one transfer channel 31 communicates with two condensation chambers. A laval nozzle is formed between the first condensation chamber 21 and the transmission channel 31, and a laval nozzle is formed between the second condensation chamber 22 and the transmission channel 31, so as to improve the heat dissipation efficiency. That is, in the present embodiment, the transfer passage 31, the first condensation chamber 21 and the second condensation chamber 22 collectively form a "Y" shape. Wherein the inclination angle between the first condensation chamber 21 and the second condensation chamber 22 is between 0 degree and 90 degrees, preferably between 0 degree and 30 degrees. Of course, the number of the condensation chambers may also be three, four, etc., as long as the heat dissipation efficiency can be improved.

Wherein, the increase of condensation chamber quantity can promote the condensation effect. Meanwhile, the arrangement of the plurality of condensation chambers and the transfer channel 31 is at an angle, so that the phase change material in a gaseous form is changed in the flow direction, namely the flow direction in the transfer channel 31 is more inclined to the vertical direction, and the flow direction in the plurality of condensation chambers at an angle is more inclined to the upward direction, thereby improving the heat dissipation performance.

In some embodiments, the cross-sectional area of each condensing chamber along the horizontal plane gradually increases from the evaporation part 10 toward the condensation part 20. That is to say, the cross-sectional area of the condensation cavity along the horizontal plane is gradually increased, and the condensation cavity is also in a gradually expanding structure with the diameter of the channel gradually increased. The end of the condensation chamber facing the evaporation chamber is in communication with the extended end of the speed change section in the transfer passage 31, and the condensation chamber can be adapted to the diverging shape of the speed change section, so that the condensation chamber is used as one of the rear half parts of the laval nozzle structure. This arrangement enables the phase change material in gaseous form flowing along the transfer channel 31 to be caused to move continuously from the transfer channel to the condensation chamber. Namely: the speed change process of the acceleration section in the transfer passage 31, which is once accelerated to the throat part and flows to the speed change section along the throat part, can be extended into the condensation chamber.

With continued reference to fig. 1 and 2, in some embodiments, the evaporation portion 10 includes a first partition plate 41, the first partition plate 41 can partition the evaporation cavity into a plurality of first independent cavities 11, and each of the first independent cavities 11 is correspondingly communicated with at least one transfer channel 31 and at least one condensation cavity.

That is to say, the quantity of first baffle 41 is a plurality of, and a plurality of first baffles 41 are arranged along the width direction interval of server, and then separate into a plurality of first independent chambeies 11 with the evaporation chamber, and a plurality of first independent chambeies 11 are arranged along the width direction of server in proper order, and every first independent chamber 11 all corresponds the intercommunication and has transfer passage 31 and condensation chamber. All be provided with the phase transition material in every first independent chamber 11 to the phase transition that all can utilize the phase transition material in every first independent chamber 11 dispels the heat, and then improves heat dispersion. The number of the first partition plates 41 is two, and the evaporation cavity can be divided into three first independent cavities 11 arranged in sequence by the two first partition plates 41. Namely: the evaporation portion 10 in the phase change heat radiation structure provided in this embodiment utilizes independent phase change circulation in a plurality of first independent chambeies 11 that arrange along server width direction interval, can carry out the adaptability heat dissipation to the intensive region that generates heat of high-power consumption chip, improves the heat dissipation temperature uniformity.

With continued reference to fig. 3, in another embodiment, the evaporation portion 10 includes a second partition plate 42, the second partition plate 42 can divide the evaporation cavity into a plurality of second independent cavities 12, the plurality of second independent cavities 12 are stacked along the direction of the condensation cavity toward the transfer channel 31, and one of the plurality of second independent cavities 12 far away from the object to be cooled is communicated with the transfer channel 31.

That is, in this embodiment, the evaporation chamber is partitioned by the second partition plate 42 in the height direction of the phase-change heat dissipation structure. Wherein, when the quantity of second baffle 42 is one, second baffle 42 separates into two independent chambeies 12 of second with the evaporation chamber, all is provided with the phase transition material in two independent chambeies 12 of second. Wherein one of the two second independent chambers 12 far away from the server is communicated with the transfer channel 31 and the condensation chamber. In the time of practical use, the second independent chamber 12 of bottommost absorbs the heat of high-power consumption chip transmission, make the phase change material in this second independent chamber 12 take place the phase transition, turn into gaseous form's phase change material, gaseous form's phase change material carries the second independent chamber 12 at heat flow direction top, and then with heat transfer to this second independent chamber 12, make the phase change material in this second independent chamber 12 absorb the heat and take place the phase transition, utilize this second independent chamber 12 and transfer passage 31, the intercommunication in condensation chamber, carry out radiating giving off. Namely: the evaporation part 10 in the phase change heat dissipation structure provided by this embodiment utilizes the phase change circulation in each second independent cavity 12 through two second independent cavities 12 stacked along the vertical direction, and the heat dissipation requirement of the high-power chip is improved.

With reference to fig. 1 to fig. 3, in practical use, the number of the transfer channels 31 is plural, the plural transfer channels 31 are arranged at intervals in the first direction in the evaporation portion 10, and a first spacing space 51 is provided between any adjacent transfer channels 31. The first direction is taken as the width direction of the server as an example. Specifically, the plurality of delivery channels 31 are arranged at intervals in the width direction of the server, and a first spacing space 51 is provided between any two adjacent delivery channels 31. A first condensation chamber 21 and a second condensation chamber 22 are arranged at the top end of each transfer channel 31 in a communicating manner, and the bottom end of each transfer channel 31 is communicated with the evaporation chamber. The first spacing space 51 is arranged to enable an air flowing space to be formed between any two adjacent transfer channels 31, so that the flowing speed of air flow is increased, and the heat dissipation performance is further improved. Wherein, a second partition space 52 is provided between the first condensation chamber 21 and the second condensation chamber 22, and the second partition space 52 provides an air flowing space for heat dissipation between the first condensation chamber 21 and the second condensation chamber 22, thereby improving heat dissipation performance.

Referring to fig. 4, fig. 4 is a schematic view illustrating an evaporation portion of a phase change heat dissipation structure according to an embodiment of the present invention having a first protrusion. In an alternative embodiment, the evaporation portion 10 is provided with a plurality of first protrusions 13, and each of the first protrusions 13 is coated with a lyophilic coating. Specifically, the plurality of first protrusions 13 are disposed at the bottom of the evaporation cavity of the evaporation portion 10, and the plurality of first protrusions 13 are disposed to enable the plurality of first grooves to be formed at the bottom of the evaporation cavity, so that the heat dissipation area in the evaporation cavity is increased by the cooperation of the first protrusions 13 and the first grooves. And the setting of lyophilic coating can improve the chamber wall of evaporation chamber to the appeal of the phase change material of liquid form, ensures that the phase change material of liquid form fully contacts with the heat to strengthen the nucleate boiling and the capillary force of the phase change material of packing into the evaporation chamber, improve the boiling limit, and then improve the radiating efficiency. Meanwhile, the condensation part 20 is provided with a plurality of second protrusions, each of which is coated with a lyophobic coating. The bellied setting of second can make the chamber wall in condensation chamber form a plurality of second recesses, and then increases gaseous form's phase change material and condensing part 20's area of contact through the cooperation of second arch and second recess, and then improves condensation efficiency. Moreover, the setting of lyophobic coating can reduce the condensation chamber and be the affinity of the phase change material of liquid form to the condensation, makes the phase change material of liquid form can flow back to the evaporation intracavity rapidly to get into phase change circulation once more, and then improve this phase change heat radiation structure's capillary limit and the limit of condensing.

Wherein, the first protrusion 13 and the second protrusion are both arranged in a pyramid-shaped structure.

In addition, a plurality of first protrusions 13 may be provided only in the evaporation unit 10, or a plurality of second protrusions may be provided only in the condensation unit 20, and in any arrangement, the heat radiation efficiency may be improved.

With continued reference to fig. 1-3, in some embodiments, the phase change heat dissipation structure further includes fins 60, and the fins 60 are disposed on the condensation portion 20. That is, the condensing unit 20 is further provided with fins 60. Specifically, a plurality of fins 60 are fixedly arranged on the outer cavity wall of the plurality of condensation cavities, the contact area of air in the external environment can be increased through the arrangement of the fins 60, the condensation efficiency of the condensation portion 20 is improved, and the heat dissipation performance is further improved. However, the provision of the fins 60 only in the condensation unit 20 can reduce the impedance of the phase change heat dissipation structure, and is more advantageous for heat dissipation of electronic components mounted around the phase change heat dissipation structure.

As a result, the condensation unit 20 is defined based on the plurality of second protrusions provided on the inner cavity wall of the condensation chamber and the fins 60 provided on the outer wall of the condensation chamber. When the transfer passage 31 and the condensation chamber together form a laval nozzle, the portion where the second protrusion is not provided on the inner wall of the nozzle and the fin 60 is not provided on the outer sidewall of the nozzle serves as the transfer portion 30. Of course, when the transfer channel 31 and the condensation chamber form the laval nozzle together, how to divide the transfer channel 31 and the condensation chamber, and finally how to divide the transfer portion 30 and the condensation portion 20 may be in other forms, as long as the phase change material in the gaseous form is accelerated and changed in speed, and finally condensed and returned to the evaporation portion 10, so that the phase change cycle efficiency is improved, and the heat dissipation efficiency is improved.

With continued reference to fig. 1 and fig. 3, in an alternative embodiment, the number of the transmission portions 30 is at least two, at least two transmission portions 30 are arranged at intervals in the second direction on the evaporation portion 10, and a side of each transmission portion 30 facing away from the evaporation portion 10 is provided with the condensation portion 20. The second direction is taken as the length direction of the server as an example. Specifically, when the number of the transmission portions 30 is two, the two transmission portions 30 are arranged at intervals in the length direction of the server with respect to the evaporation portion 10, and a separation gap 71 is provided between the two transmission portions 30, and the separation gap 71 penetrates in the width direction of the server, so that there is a space for airflow to flow in the width direction of the server, and thus, in combination with the first separation space 51, the airflow flow rate is further increased, and the heat dissipation performance is improved. Furthermore, in the present embodiment, the evaporation units 10 are not divided according to the number of the transfer units 30, and a plurality of transfer units 30 are disposed at intervals along the length direction of the server in one evaporation unit 10, so that the evaporation units 10 are continuous when absorbing heat, so as to absorb more heat and transfer the heat to the transfer units 30. Of course, the number of the transmission portions 30 may be three, four, or the like as long as the improvement of the heat radiation efficiency can be achieved.

In still another embodiment, the evaporation portion 10 may be provided in plural, and the plural evaporation portions 10 are arranged at intervals along the length direction of the server, and each evaporation portion 10 corresponds to one transfer portion 30 and one condensation portion 20. No matter which setting mode is adopted, the heat dissipation of the CPU can be realized, and the heat dissipation efficiency is improved.

In actual use, the phase change heat dissipation structure further comprises a heat dissipation shell, the heat dissipation shell is enclosed to form a heat dissipation cavity, the evaporation part 10, the transmission part 30 and the condensation part 20 are all arranged in the heat dissipation cavity, and the bottom wall of the evaporation part 10, the side wall of the transmission part 30 facing the heat dissipation shell and the top wall of the condensation part 20 are all tightly attached to the heat dissipation shell. Alternatively, the bottom wall of the evaporation portion 10, the side wall of the transmission portion 30 facing the heat dissipation housing, and the top wall of the condensation portion 20 enclose the heat dissipation housing. The phase change heat dissipation structure can be conveniently unified management and modularized customization as long as the integrity of the phase change heat dissipation structure can be improved.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (8)

1. A phase change heat dissipation structure, wherein the phase change heat dissipation structure comprises:

the evaporation part (10), the evaporation part (10) is provided with an evaporation cavity, phase-change materials are arranged in the evaporation cavity, and the evaporation part (10) is used for being placed on an object to be cooled;

a condensing part (20), the condensing part (20) having a condensing cavity whose cross-sectional area along a horizontal plane gradually increases from the evaporating part (10) toward the condensing part (20);

a transfer part (30), the transfer part (30) being provided between the evaporation part (10) and the condensation part (20); the transfer part (30) is provided with a transfer channel (31), the transfer channel (31) is provided with an accelerating section, a speed changing section and a throat section, the speed changing section is communicated with the accelerating section, one end of the accelerating section, far away from the speed changing section, is communicated with the evaporation cavity, and one end of the speed changing section, far away from the accelerating section, is communicated with the condensation cavity; the accelerating section is of a tapered structure from the evaporating part (10) to the condensing part (20), the speed changing section is of a tapered structure from the evaporating part (10) to the condensing part (20), the condensing cavity is matched with the tapered shape of the speed changing section, the throat section is connected between the accelerating section and the speed changing section, and the diameter of the channel of the accelerating section and the diameter of the channel of the speed changing section are both larger than the diameter of the channel of the throat section.

2. The phase-change heat dissipation structure according to claim 1, wherein the number of the condensation chambers is at least two; at least two condensing chambers are arranged crosswise towards one end of the transfer channel (31) and are communicated with the transfer channel (31).

3. The phase-change heat dissipation structure according to claim 1, wherein the evaporation portion (10) includes a first partition plate (41), the first partition plate (41) being capable of partitioning the evaporation chamber into a plurality of first independent chambers (11), each of the first independent chambers (11) being in communication with at least one of the transfer channels (31) and at least one of the condensation chambers, respectively.

4. The phase-change heat dissipation structure according to claim 1, wherein the evaporation portion (10) includes a second partition plate (42), the second partition plate (42) being capable of partitioning the evaporation chamber into a plurality of second independent chambers (12), the plurality of second independent chambers (12) being stacked in a direction of the condensation chamber toward the transfer passage (31), and one of the plurality of second independent chambers (12) away from the object to be dissipated (12) being in communication with the transfer passage (31).

5. The phase-change heat dissipation structure according to claim 1, wherein the number of the transfer channels (31) is plural, a plurality of the transfer channels (31) are arranged at intervals in the evaporation portion (10) in the first direction, and a space is provided between any adjacent transfer channels (31).

6. The phase-change heat dissipation structure according to claim 1, wherein the evaporation part (10) is provided with a plurality of first protrusions (13), and each of the first protrusions (13) is coated with a lyophilic coating;

and/or the condensation part (20) is provided with a plurality of second protrusions, and each second protrusion is coated with a lyophobic coating.

7. The phase-change heat dissipation structure according to any one of claims 1 to 6, wherein the number of the transmission portions (30) is at least two, at least two transmission portions (30) are arranged at intervals in the evaporation portion (10) along the second direction, and the side of each transmission portion (30) facing away from the evaporation portion (10) is provided with the condensation portion (20).

8. A heat dissipating device comprising a plurality of phase change heat dissipating structures as claimed in any one of claims 1 to 7, the plurality of phase change heat dissipating structures being arranged at intervals along the second direction.

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